CN216057627U

CN216057627U - Miniature SMT electronic components

Info

Publication number: CN216057627U
Application number: CN202122472898.0U
Authority: CN
Inventors: 刘豹
Original assignee: Suzhou Chenwang Electronic Technology Co ltd
Current assignee: Suzhou Chenwang Electronic Technology Co ltd
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2022-03-15
Anticipated expiration: 2031-10-14

Abstract

The utility model discloses a miniature SMT electronic component, which comprises a circuit board and a component body, wherein the component body is arranged on the outer surface of the circuit board, two positioning grooves are symmetrically and fixedly connected to one side of the outer surface of the circuit board, and a plurality of mounting grooves are symmetrically and fixedly connected to one side of the outer surface of the circuit board. According to the utility model, the original tin soldering connection is changed through the positioning grooves, the positioning blocks, the patch glue, the mounting grooves and the connecting pins, so that the connection is quicker, the product percent of pass is improved, and meanwhile, the area required by the mounting is reduced, thereby reducing the area of the circuit board.

Description

Miniature SMT electronic components

Technical Field

The utility model relates to the technical field of electronic components, in particular to a miniature SMT electronic component.

Background

The electronic components are components of electronic elements and small machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general name of electronic devices such as capacitor, transistor, balance spring and spiral spring. Commonly, there are diodes, etc.;

most designs for straight type at present among the miniature SMT electronic components, not only occupies great area to increased the area of circuit board, its connected mode all connects through the tin soldering basically simultaneously, and the quality of tin soldering is subject to external conditions, often appears the poor problem of leg rosin joint and last tin infiltration nature, and welding defect rate is higher, thereby the qualification rate of lower product.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a micro SMT electronic component.

In order to achieve the purpose, the utility model adopts the following technical scheme: a micro SMT electronic component comprises a circuit board and a component body, wherein the component body is arranged on the outer surface of the circuit board, two positioning grooves are symmetrically and fixedly connected to one side of the outer surface of the circuit board, and a plurality of mounting grooves are symmetrically and fixedly connected to one side of the outer surface of the circuit board;

the equal a plurality of connection feet of surface both sides fixedly connected with of components and parts body, and it is corresponding with the mounting groove to connect the foot, surface one side fixedly connected with locating piece of components and parts body, and the locating piece is corresponding with the constant head tank, a plurality of paster of one side fixedly connected with of components and parts body are kept away from to the locating piece are glued.

Further, a plurality of sponge blocks are installed on one side, close to the locating block, of the outer surface of the component body, the sponge blocks correspond to the connecting feet, the sponge blocks have certain elastic performance, and the laminating tightness between the bottoms of the connecting feet and the inner bottoms of the mounting grooves is guaranteed.

Furthermore, a plurality of sponge pieces are connected with the component body through adhesive, so that the sponge pieces can be conveniently installed.

Furthermore, the paster is glued and is the stripe design, can remain certain clearance between the paster is glued, is favorable to the air to pass through to increase heat dispersion.

Furthermore, the mark points are arranged on one side of the outer surface of the circuit board and located between the two positioning grooves, so that the mark points can be conveniently positioned by the installation equipment, and the accurate installation of the component body is guaranteed.

Furthermore, it is a plurality of the bottom width of connecting the foot is less than the opening width of mounting groove, is convenient for connect the foot bottom and inserts the mounting groove, improves the convenience of installation.

Further, connect the foot and make by carbide, not only the conducting capacity is strong, connects the foot moreover and is difficult for taking place to warp after processing is accomplished to can guarantee the effect of connecting foot and mounting groove laminating, also guarantee the signal transmission performance between components and parts body and the circuit board simultaneously, improve the product percent of pass.

The utility model has the beneficial effects that:

when the miniature SMT electronic component is used, the original tin soldering connection is changed through the positioning grooves, the positioning blocks, the surface mount adhesive, the mounting grooves and the connecting pins, the connection is quicker, the product percent of pass is improved, and meanwhile, the area required by mounting is reduced, so that the area of a circuit board is reduced.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic diagram of a circuit board structure according to the present invention;

fig. 3 is a schematic structural diagram of a component body according to the present invention.

Illustration of the drawings:

1. a circuit board; 11. mounting grooves; 12. marking points; 13. positioning a groove; 2. a component body; 21. a connecting pin; 22. a sponge block; 23. pasting a piece of adhesive; 24. and (5) positioning the blocks.

Detailed Description

Fig. 1, fig. 2 and fig. 3 show that a micro SMT electronic component is disclosed, which includes a circuit board 1 and a component body 2, the component body 2 is disposed on the outer surface of the circuit board 1, two positioning grooves 13 are symmetrically and fixedly connected to one side of the outer surface of the circuit board 1, and a plurality of mounting grooves 11 are symmetrically and fixedly connected to one side of the outer surface of the circuit board 1;

the equal a plurality of connection feet 21 of surface both sides fixedly connected with of components and parts body 2, and it is corresponding with mounting groove 11 to connect foot 21, and surface one side fixedly connected with locating piece 24 of components and parts body 2, and locating piece 24 is corresponding with constant head tank 13, and a plurality of paster of fixedly connected with of one side of components and parts body 2 are glued 23 to locating piece 24.

One side of the outer surface of the circuit board 1 is provided with a marking point 12, and the marking point 12 is positioned between two positioning grooves 13.

The width of the bottom of the plurality of connecting legs 21 is smaller than the opening width of the mounting groove 11.

The connecting feet 21 are made of hard copper alloy.

As shown in fig. 2, a marking point 12 is disposed on one side of the outer surface of the circuit board 1, and the marking point 12 is located between two positioning slots 13.

As shown in fig. 3, a plurality of sponge blocks 22 are mounted on one side of the outer surface of the component body 2 close to the positioning block 24, and the sponge blocks 22 correspond to the connecting pins 21.

The plurality of sponge blocks 22 are connected with the component body 2 through adhesive.

The patch glue 23 is in a striped design.

When using miniature SMT electronic components, aim at locating piece 24 during the installation and insert locating slot 13, then glue 23 laminating through the paster, connect simultaneously foot 21 and the interior bottom of mounting groove 11 and laminate mutually, sponge piece 22 can guarantee the compactness of connecting foot 21 and the laminating of mounting groove 11.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a miniature SMT electronic components, includes circuit board (1) and components and parts body (2), its characterized in that: the outer surface of the circuit board (1) is provided with a component body (2), one side of the outer surface of the circuit board (1) is symmetrically and fixedly connected with two positioning grooves (13), and one side of the outer surface of the circuit board (1) is symmetrically and fixedly connected with a plurality of mounting grooves (11);

the surface of components and parts body (2) both sides equal fixedly connected with a plurality of connection feet (21), and connect foot (21) corresponding with mounting groove (11), surface one side fixedly connected with locating piece (24) of components and parts body (2), and locating piece (24) are corresponding with constant head tank (13), a plurality of paster of one side fixedly connected with of components and parts body (2) are glued (23) are kept away from in locating piece (24).

2. A micro SMT electronic component as claimed in claim 1, wherein: a plurality of sponge blocks (22) are installed on one side, close to the positioning blocks (24), of the outer surface of the component body (2), and the sponge blocks (22) correspond to the connecting pins (21).

3. A micro SMT electronic component as claimed in claim 2, wherein: the sponge blocks (22) are connected with the component body (2) through adhesive.

4. A micro SMT electronic component as claimed in claim 1, wherein: the patch adhesive (23) is designed in a stripe mode.

5. A micro SMT electronic component as claimed in claim 1, wherein: one side of the outer surface of the circuit board (1) is provided with a mark point (12), and the mark point (12) is positioned between the two positioning grooves (13).

6. A micro SMT electronic component as claimed in claim 1, wherein: the width of the bottoms of the connecting feet (21) is smaller than the width of the opening of the mounting groove (11).

7. A micro SMT electronic component as claimed in claim 1, wherein: the connecting pin (21) is made of hard copper alloy.