CN218867631U - Heat dissipation device and heat dissipation equipment - Google Patents
Heat dissipation device and heat dissipation equipment Download PDFInfo
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- CN218867631U CN218867631U CN202222833066.1U CN202222833066U CN218867631U CN 218867631 U CN218867631 U CN 218867631U CN 202222833066 U CN202222833066 U CN 202222833066U CN 218867631 U CN218867631 U CN 218867631U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a heat abstractor and heat dissipation equipment relates to chip heat dissipation technical field. A heat dissipation device, comprising: the first side surface of the temperature equalizing plate is connected with the laser chip assembly, and the laser chip assembly transfers the generated heat to the temperature equalizing plate; wherein the thickness of the temperature equalizing plate is 0.35mm-1.00mm; the radiating fin is arranged on one side, away from the laser chip assembly, of the temperature equalizing plate along the first direction, and heat generated by the laser chip assembly is transmitted to the radiating fin through the temperature equalizing plate. The heat dissipation device is provided with the temperature-equalizing plate and the heat dissipation fins, the temperature-equalizing plate can quickly and efficiently transfer heat on the laser chip assembly to the heat dissipation fins, the temperature of the laser chip assembly is controlled and dissipated through natural air cooling, and the problems of slow heat dissipation, low efficiency and high power consumption can be greatly improved.
Description
Technical Field
The utility model relates to a chip heat dissipation technical field especially relates to a heat abstractor and heat dissipation equipment.
Background
The existing temperature control methods include a natural air cooling temperature control method and a semiconductor refrigerating sheet temperature control method. The natural air cooling temperature control method welds the laser chip on the heat-conducting metal or nonmetal, and utilizes natural air to control temperature and dissipate heat, but the efficiency of air heat dissipation is slow, and can not achieve fast enough heat dissipation. The method of this kind of accuse temperature of semiconductor refrigeration piece accuse temperature method is, with the semiconductor refrigeration piece, the welding is on the laser chip, utilize semiconductor refrigeration piece one side to absorb heat, the exothermic characteristic of one side, the heat that sends the laser chip, absorb from the one side, distribute away from the another side fast again, the shortcoming of semiconductor refrigeration piece accuse temperature is, must add power up for the semiconductor refrigeration piece alone with the semiconductor refrigeration piece, the process that causes the accuse temperature needs great power consumption, and the volume that semiconductor refrigeration piece itself occupied also can be very big, the cost is higher, the economic nature is not good.
SUMMERY OF THE UTILITY MODEL
The application provides a heat abstractor and heat dissipation equipment, through the cooperation of samming board and fin, can be fast, high-efficient, the low-cost accuse temperature and heat dissipation, can greatly improve the heat dissipation slow, the inefficiency and the high power consumptive problem.
In order to solve the technical problem, the application adopts a technical scheme that: a heat dissipation device, comprising: the first side surface of the temperature equalizing plate is connected with the laser chip component, and the laser chip component transfers the generated heat to the temperature equalizing plate; wherein the thickness of the temperature equalizing plate is 0.35mm-1.00mm; the radiating fin is arranged on one side, away from the laser chip assembly, of the temperature equalizing plate along the first direction, and heat generated by the laser chip assembly is transmitted to the radiating fin through the temperature equalizing plate.
According to an embodiment provided by the present invention, the heat dissipation device further comprises a fan, the fan is installed at one side of the temperature-uniforming plate and the heat dissipation fins, and the direction of the air flow blown out by the fan is consistent with the first direction; the fan is used for accelerating the cooling of the temperature-uniforming plate and the radiating fins.
According to the utility model provides an embodiment, the fin welds in proper order in the first direction in one side that the laser chip subassembly was kept away from to the samming board.
According to the utility model provides an embodiment, the temperature-uniforming plate includes: the metal shell forms a vacuum cavity; the porous liquid absorption core is arranged on the inner wall of the metal shell; and the working medium is arranged in a vacuum cavity formed by the metal shell.
According to the utility model provides an embodiment, the laser chip subassembly welds on the samming board.
According to the utility model provides an embodiment, laser chip subassembly includes: the laser chip comprises a laser chip and a heat conducting piece, wherein one end of the heat conducting piece is connected with the laser chip, and heat generated by the laser chip is conducted to the heat conducting piece; the fixing piece, the laser chip and the heat conducting piece are fixed on the first side face of the temperature equalizing plate through the fixing piece.
According to the utility model provides an embodiment, the quantity of heat-conducting piece is 2, and 2 heat-conducting pieces set up in laser chip's both sides relatively.
According to the utility model provides an embodiment, the quantity of mounting is 3, and the laser chip is fixed in the first side of temperature-uniforming plate through first mounting; one end of each of the 2 heat conducting pieces, which is far away from the laser chip, is fixedly connected with the first side face of the temperature equalizing plate through a second fixing piece and a third fixing piece respectively.
According to the utility model provides an embodiment, the mounting is the metal mounting, and the heat on heat-conducting member and the laser chip passes through the mounting and transmits to the temperature-uniforming plate.
In order to solve the above technical problem, another technical solution adopted by the present application is: a heat dissipation device comprises the heat dissipation device.
The beneficial effect of this application is: the heat dissipation device is provided with the temperature-equalizing plate and the heat dissipation fins, the temperature-equalizing plate can quickly and efficiently transfer heat on the laser chip assembly to the heat dissipation fins, the temperature of the laser chip assembly is controlled and dissipated through natural air cooling, and the problems of slow heat dissipation, low efficiency and high power consumption can be greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts, wherein:
fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;
FIG. 2 is an exploded view of the heat dissipation device of the embodiment of FIG. 1;
fig. 3 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present application;
FIG. 4 is an exploded view of the heat sink of the embodiment of FIG. 3;
FIG. 5 is an exploded view of a portion of the heat sink of the embodiment of FIG. 3;
FIG. 6 is an exploded view of another portion of the heat sink of the embodiment of FIG. 3;
FIG. 7 is a cross-sectional view illustrating a partial structure of the heat dissipation device of FIG. 3;
FIG. 8 is an exploded view of another portion of the heat sink of the embodiment shown in FIG. 3;
fig. 9 is a schematic structural diagram of a heat dissipation apparatus according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is noted that the terms "first", "second", etc. are used hereinafter for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features.
The words used in this specification are words of description rather than limitation, and are used in describing particular embodiments of the invention. It is also to be understood that, unless otherwise expressly stated or limited, the terms "disposed," "connected," and "connected" are intended to be open-ended, i.e., may be fixedly connected, detachably connected, or integrally connected; they may be mechanically coupled, directly coupled, indirectly coupled through intervening media, or may be interconnected between two elements. Those skilled in the art will specifically understand what is specifically meant by the present invention.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application, and fig. 2 is a schematic exploded structural diagram of the heat dissipation device according to the embodiment shown in fig. 1.
In some embodiments, the heat dissipation device 100 comprises: the first side surface of the temperature equalizing plate 10 is connected with the laser chip component 20, and the laser chip component 20 transfers the generated heat to the temperature equalizing plate 10; wherein, the thickness of the temperature-uniforming plate 10 is 0.35mm-1.00mm; and the heat sink 30 is arranged on one side of the temperature equalizing plate 10 far away from the laser chip assembly 20 along the first direction X, and the heat generated by the laser chip assembly 20 is transferred to the heat sink 30 through the temperature equalizing plate 10.
It is understood that the first side of the vapor chamber 10 is the side of the vapor chamber 10 away from the heat sink 30. The thickness of the vapor chamber 10 is greater than or equal to 0.35mm, and may be 0.40mm, 0.45mm, 0.5mm, 0.55mm, 0.60mm, 0.70mm, 0.80mm, 0.90mm, 1.00mm or thicker.
It is understood that the laser chip assembly 20 is disposed on a first side of the vapor chamber 10, and the heat sink 30 is disposed on the other side of the vapor chamber 10. When the laser chip assembly 20 is powered on to work, the temperature-uniforming plate 10 can uniformly disperse the heat emitted by the laser chip assembly 20 to the plate surface of the whole temperature-uniforming plate 10, and then natural air cooling is utilized to rapidly dissipate the heat; meanwhile, the vapor chamber 10 further transfers heat conducted to the laser chip assembly 20 to the heat sink 30, and then the heat sink 30 radiates the heat using natural air cooling. The uniform temperature plate 10 can realize very high thermal conductivity which can reach 5000W/m.k and far exceeds the heat transfer effect of metal or nonmetal, and the temperature difference of the heat transfer between the uniform temperature plate 10 and the outside can be quickly started to work only under 5 ℃.
Please refer to fig. 3, fig. 4, and fig. 3 are schematic structural diagrams of a heat dissipation device according to another embodiment of the present application, and fig. 4 is a schematic exploded structural diagram of the heat dissipation device according to the embodiment shown in fig. 3.
In some embodiments, the heat dissipation device 100 includes: the first side surface of the temperature equalizing plate 10 is connected with the laser chip component 20, and the laser chip component 20 transfers the generated heat to the temperature equalizing plate 10; wherein, the thickness of the temperature-uniforming plate 10 is 0.35-1.00mm; the heat radiating fin 30 is arranged on one side, away from the laser chip assembly 20, of the temperature equalizing plate 10 along the first direction X, and heat generated by the laser chip assembly 20 is transferred to the heat radiating fin 30 through the temperature equalizing plate 10; a fan 40, wherein the fan 40 is installed at one side of the temperature-uniforming plate 10 and the heat sink 30, and the direction of the airflow blown out by the fan 40 is consistent with the first direction X; the fan 40 is used to accelerate the cooling of the vapor chamber 10 and the heat sink 30.
It can be understood that, when the laser chip assembly 20 is powered on to work, the temperature-uniforming plate 10 can uniformly distribute the heat generated by the laser chip assembly 20 to the plate surface of the whole temperature-uniforming plate 10, and then the heat can be quickly dissipated by natural air cooling; meanwhile, the vapor chamber 10 further transfers the heat conducted from the laser chip assembly 20 to the heat sink 30, and then the heat sink 30 dissipates the heat by natural air cooling; when the heat generated by the laser chip assembly 20 is too large, the fan 40 may be started, the fan 40 is installed on one side of the temperature equalizing plate 10 and the heat sink 30, and the direction of the airflow blown by the fan 40 is consistent with the first direction X; the fan 40 is used for accelerating the cooling of the temperature equalizing plate 10 and the heat sink 30, so as to realize the fast and efficient temperature control and heat dissipation of the laser chip assembly 20, and prevent the performance of the laser chip assembly 20 from being affected by the continuous rise of the working temperature of the laser chip assembly 20, even the laser chip assembly 20 is burnt due to the overhigh temperature.
It is understood that the vapor chamber 10 has a thickness of greater than or equal to 0.35mm, and can have a thickness of 0.40mm, 0.45mm, 0.5mm, 0.55mm, 0.60mm, 0.70mm, 0.80mm, 0.90mm, 1.00mm, or more.
In some embodiments, the heat sink 30 is sequentially soldered to the side of the vapor chamber plate 10 away from the laser chip assembly 20 along the first direction X.
It is understood that, as long as the heat dissipation efficiency of the heat sink 30 can be optimized or the heat dissipation efficiency of the entire heat dissipation device 100 can be optimized when the fan 40 operates, the heat sink 30 can be sequentially welded to the side of the vapor chamber 10 away from the laser chip assembly 20 in any direction; it can be understood that the installation position of the fan 40 needs to refer to the arrangement direction of the heat sink 30 to ensure that the direction of the airflow blown by the fan 40 is consistent with the arrangement direction of the heat sink 30, so as to ensure that the optimal heat dissipation effect is achieved.
It is understood that the heat sink 30 can be connected to the vapor chamber 10 in other suitable connection manners as long as the heat transfer between the vapor chamber 10 and the heat sink 30 is not affected.
In some embodiments, the laser chip assembly 20 is soldered on the side of the thermal plate 10 away from the heat sink 30.
It is understood that the laser chip assembly 20 can be connected to the vapor chamber 10 in other suitable connection manners as long as the heat transmission between the laser chip assembly 20 and the vapor chamber 10 is not affected.
Referring to fig. 5 and 6, fig. 5 is an exploded view of a part of the heat dissipation device of the embodiment shown in fig. 3, and fig. 6 is an exploded view of another part of the heat dissipation device of the embodiment shown in fig. 3.
In some embodiments, the laser chip assembly 20 includes: the laser chip comprises a laser chip 21, a first heat conducting piece 22 and a second heat conducting piece 23, wherein one ends of the first heat conducting piece 22 and the second heat conducting piece 23 are connected with the laser chip 21, and heat generated by the laser chip 21 is conducted to the first heat conducting piece 22 and the second heat conducting piece 23; the first fixing member 24, the second fixing member 25 and the third fixing member 26, and the laser chip 21, the first heat conducting member 22 and the second heat conducting member 23 are fixed on the first side surface of the vapor chamber 10 by the first fixing member 24, the second fixing member 25 and the third fixing member 26, respectively.
In some embodiments, the number of the heat conduction members is 2, and the first heat conduction member 22 and the second heat conduction member 23 are oppositely disposed on both sides of the laser chip 21.
In some embodiments, the number of the fixing members is 3, which are respectively a first fixing member 24, a second fixing member 25 and a third fixing member 26, and the laser chip 21 is fixed on the first side surface of the vapor chamber 10 through the first fixing member 24; the ends of the first heat conducting member 22 and the second heat conducting member 23 away from the laser chip 21 are respectively connected and fixed with the first side surface of the temperature equalizing plate 10 through a second fixing member 25 and a third fixing member 26.
In some embodiments, the first fixing member 24, the second fixing member 25, and the third fixing member 26 are all metal fixing members, and the heat on the first heat conduction member 22, the second heat conduction member 23, and the laser chip 21 is transferred to the vapor chamber 10 through the first fixing member 24, the second fixing member 25, and the third fixing member 26, respectively.
It is understood that the number of the heat conducting members may be one or more as long as the heat generated by the laser chip 21 is not affected and is rapidly and efficiently transferred to the vapor chamber 10; the number of the fixing pieces can also be one or more, and the material of the fixing pieces can be a metal material or other suitable materials; the connection between the heat conducting member and the laser chip 21 may be welding or other suitable connection; the connection between the laser chip 21 and the first fixing member 24 may be soldering or other suitable connection, and the connection between the first and second heat conduction members 22 and 23 and the second and third fixing members 25 and 26 may be soldering or other suitable connection.
Referring to fig. 5 and 7, fig. 7 is a schematic cross-sectional structure diagram of a portion of the heat dissipation device of the embodiment shown in fig. 3.
In some embodiments, the vapor plate 10 includes: a metal shell 12, wherein the metal shell 12 forms a vacuum cavity 14; a porous wick 13, the porous wick 13 being disposed on an inner wall of the metal shell 12; working medium 15, working medium 15 sets up in the vacuum cavity 14 that metal casing 12 formed.
It can be understood that the temperature equalization plate 10 is a porous liquid absorption core 13 disposed on the inner wall of the metal shell 12, a vacuum cavity 14 formed by the metal shell 12 is filled with a working medium 15 (generally water), and the temperature equalization plate 10 utilizes the phase change (the phase change between liquid phase and vapor phase) of the working medium 15 to rapidly transfer heat by the phase-changed working medium under the condition that a temperature difference is formed when the element is heated.
It can be understood that the surface B of the vapor chamber 10 is connected to the laser chip assembly 20 and is the heated surface of the vapor chamber 10; the working medium 15 is heated under the vacuum ultra-low pressure environment and quickly evaporated into hot air, and the process is a heat absorption process; the vapor chamber 10 adopts a vacuum design, hot air flows through more rapidly in a vacuum environment and in the presence of the porous wick 13, namely, heat conduction is faster, the hot air is heated, when encountering a surface a connected with the heat sink 30, the temperature of the heat sink 30 is far lower than that of the laser chip assembly 20, namely, the heat sink 30 is a cold source, and the hot air dissipates heat after encountering the cold source and is condensed into liquid again; the condensed working medium flows back into a vacuum cavity 14 formed by the metal shell 12 through the porous liquid absorption core 13, and the returned working medium is gasified after being heated and finally realizes the temperature control and heat dissipation of the laser chip assembly 20 through the continuous processes of heat absorption, heat conduction and heat dissipation.
It is understood that the working medium 15 filled in the vacuum cavity 14 formed by the metal shell 12 may also be other suitable media such as ethanol.
Referring to fig. 3 and 8, fig. 8 is an exploded view of another part of the heat dissipation device shown in fig. 3.
In some embodiments, the heat sink 30 is mounted on the side of the thermal plate 10 away from the laser chip assembly 20 along the first direction X, wherein the first heat sink 31, the second heat sink 32, the third heat sink 33, and the nth heat sink are sequentially mounted on the side of the thermal plate 10 away from the laser chip assembly 20 along the first direction X.
It can be understood that when the heat dissipation fins 30 are installed, a corresponding gap is left between every two heat dissipation fins, which is convenient for the heat dissipation fins 30 to dissipate heat naturally with cold wind, or when the fan 40 is started, the heat on the heat dissipation fins 30 can be taken away through the gap of the heat dissipation fins 30, so as to accelerate the heat dissipation of the heat dissipation fins 30.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a heat dissipation apparatus according to an embodiment of the present application.
In some embodiments, the heat dissipation apparatus 1000 comprises the heat dissipation device 100 described above.
It is understood that the heat dissipation device may be a detection instrument, a computer, a mobile phone, or a household appliance.
In summary, the heat dissipation device 100 is provided with the temperature equalization plate 10 and the heat dissipation plate 30, the temperature equalization plate 10 can quickly and efficiently transfer heat on the laser chip assembly 20 to the heat dissipation plate 30, and the laser chip assembly 20 is controlled and dissipated by natural air cooling, so that the problems of slow heat dissipation, low efficiency and high power consumption can be greatly improved, and the cost is reduced; furthermore, the fan 40 is arranged on one side of the temperature-uniforming plate 10 and the heat sink 30, so that the temperature of the laser chip assembly 20 can be controlled and dissipated more efficiently and rapidly.
In the description of the present application, the description of the terms "one embodiment," "another embodiment," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above are only embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent structures or equivalent processes performed by the present application and the contents of the attached drawings, which are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A heat dissipating device, comprising:
a temperature-uniforming plate, wherein the first side surface of the temperature-uniforming plate is connected with a laser chip component, the laser chip component transfers the generated heat to the temperature-uniforming plate,
wherein the thickness of the uniform temperature plate is 0.35mm-1.00mm;
the radiating fin, the radiating fin is installed in along the first direction the temperature-uniforming plate is kept away from one side of laser chip subassembly, the heat that the laser chip subassembly produced passes through the temperature-uniforming plate transmits to on the radiating fin.
2. The heat dissipating device of claim 1, further comprising a fan mounted to one side of said vapor chamber and said heat sink, said fan blowing an air stream in a direction that is substantially the same as said first direction; the fan is used for accelerating the cooling of the temperature equalizing plate and the radiating fins.
3. The heat sink of claim 2, wherein the heat sink is sequentially soldered to the side of the thermal plate away from the laser chip assembly along a first direction.
4. The heat dissipating device of claim 3, wherein said vapor chamber comprises:
the metal shell forms a vacuum cavity;
the porous liquid absorption core is arranged on the inner wall of the metal shell;
the working medium is arranged in the vacuum cavity formed by the metal shell.
5. The heat sink of claim 4, wherein the laser chip assembly is soldered to the vapor chamber.
6. The heat dissipation device of claim 5, wherein the laser chip assembly comprises:
the laser chip comprises a laser chip and a heat conducting piece, wherein one end of the heat conducting piece is connected with the laser chip, and heat generated by the laser chip is conducted to the heat conducting piece;
the fixing piece is used for fixing the laser chip and the heat conducting piece on the first side face of the temperature equalizing plate through the fixing piece.
7. The heat dissipation device as claimed in claim 6, wherein the number of the heat conduction members is 2, and 2 of the heat conduction members are disposed opposite to each other on both sides of the laser chip.
8. The heat dissipation device according to claim 7, wherein the number of the fixing members is 3, and the laser chip is fixed to the first side surface of the vapor chamber by a first fixing member; and 2 ends of the heat conducting pieces, which are far away from the laser chip, are respectively connected and fixed with the first side surface of the temperature equalizing plate through a second fixing piece and a third fixing piece.
9. The heat dissipating device of claim 8, wherein the fixing member is a metal fixing member, and the heat from the heat conducting member and the laser chip is transferred to the vapor chamber through the fixing member.
10. A heat sink apparatus, characterized in that the heat sink apparatus comprises the heat dissipating device of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222833066.1U CN218867631U (en) | 2022-10-26 | 2022-10-26 | Heat dissipation device and heat dissipation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222833066.1U CN218867631U (en) | 2022-10-26 | 2022-10-26 | Heat dissipation device and heat dissipation equipment |
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| Publication Number | Publication Date |
|---|---|
| CN218867631U true CN218867631U (en) | 2023-04-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222833066.1U Active CN218867631U (en) | 2022-10-26 | 2022-10-26 | Heat dissipation device and heat dissipation equipment |
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| CN (1) | CN218867631U (en) |
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2022
- 2022-10-26 CN CN202222833066.1U patent/CN218867631U/en active Active
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