CN218857929U - Screen plate for brushing glue - Google Patents
Screen plate for brushing glue Download PDFInfo
- Publication number
- CN218857929U CN218857929U CN202222785264.5U CN202222785264U CN218857929U CN 218857929 U CN218857929 U CN 218857929U CN 202222785264 U CN202222785264 U CN 202222785264U CN 218857929 U CN218857929 U CN 218857929U
- Authority
- CN
- China
- Prior art keywords
- screen plate
- glue
- brushing
- chip
- designed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Screen Printers (AREA)
Abstract
The utility model relates to a brush is glued and is used otter board, it includes otter board main part, chip district rubber coating hole, and evenly the design has a plurality of chip district rubber coating holes above the otter board main part, four inboard edges that chip district rubber coating hole designed into quad slit and quad slit design respectively into inside arc chimb. The adhesive tape has the advantages of ingenious design, convenience in use, reasonable and compact structure, reasonable adhesive coating amount and capability of meeting chip bonding.
Description
Technical Field
The utility model relates to a semiconductor production field, concretely relates to brush is glued and is used otter board.
Background
In the production process of the diode, solder paste is required to be coated on the lead frames, and then the two lead frames are combined and welded, so that the chip between the two lead frames is fixed. Because the volume of the chip is smaller and the contact of the lead frame coated with the solder paste is smaller, the requirement on the precision of the sheet combination is higher. The currently used glue brushing mode is mostly manual glue brushing of an artificial steel mesh, and the working efficiency is low; the glue brushing mode is inaccurate in positioning, the condition of offset of the solder paste glue brushing position is easy to occur, the fluctuation range of solder paste points is large, the surface of the lead frame after glue dispensing is not attractive enough, the consistency of glue dispensing quantity on the lead frame cannot be ensured, and the reject ratio is high; and the steel mesh is easy to deform in the using process and needs to be continuously replaced, and the service life of the mesh plate is short. Then, a mechanical device is adopted for glue brushing, the glue yield is stable, the size of each solder paste point is uniform, and the qualification rate is high; the lead frame is not easy to move, and the glue brushing amount at each position is consistent; the whole glue brushing process is mechanically operated, so that the working efficiency is higher; for example, patent CN202021720634.1, a glue brushing mechanism for diode lead frame.
However, chips with a large grain structure are currently produced and processed, and the large grains are 150-180 mil; the common crystal grain is only 130mil, and the screen plate for brushing glue adopts a plurality of square holes to brush glue at the chip welding position, for example, patent CN201521098987.1, a glue brushing device for diode welding process; as the large crystal grains of 150-180 mil are formed, square holes in the original screen plate are small, the glue coating amount is insufficient, corner positions cannot be bonded, the requirement of later welding cannot be met, the square holes are increased in the same proportion, the glue coating amount is too much after glue brushing, glue overflow can be generated, the positions of the crystal grains are prone to shifting, and the requirement of later welding cannot be met.
Disclosure of Invention
In order to solve the technical problem, the utility model provides a brush glues and uses otter board, design benefit, convenient to use, rational in infrastructure compactness ensures the rubber coating volume reasonable to can satisfy the chip bonding.
The technical scheme of the utility model:
the utility model provides a brush is glued and is used otter board, it includes otter board main part, chip district rubber coating hole, evenly designed has a plurality of chip district rubber coating holes above the otter board main part, four inboard edges that chip district rubber coating hole design becomes quad slit and quad slit design respectively into inside arc chimb.
A plurality of jumper area glue coating holes are further designed on the screen plate main body, and one side of each chip area glue coating hole is correspondingly provided with one jumper area glue coating hole.
The screen plate main body is designed into a rectangular body, and five rows and six columns of glue coating holes are designed in the chip areas.
The length and the width of the chip area glue coating hole are the same and are 3.5mm; the curvature radius of the arc convex edge is 1.5mm.
The screen plate for brushing the glue is a frame glue brushing device which is applied and installed on the photovoltaic diode module.
The utility model has the advantages of ingenious design, convenient use, reasonable and compact structure, reasonable gluing amount guarantee, and chip bonding can be satisfied.
Drawings
Fig. 1 is a schematic diagram of the present invention.
Fig. 2 is a partially enlarged schematic view of the present invention.
Detailed Description
Referring to the attached drawings 1-2, the screen plate for brushing glue comprises a screen plate main body 1 and chip area glue coating holes 2, wherein the chip area glue coating holes 2 are uniformly designed on the screen plate main body 1, the chip area glue coating holes 2 are designed into square holes, and four inner side edges of the square holes are respectively designed into inward arc-shaped convex edges 3.
A plurality of jumper area glue coating holes 4 are further designed on the screen plate main body 1, and one jumper area glue coating hole 4 is correspondingly designed on one side of each chip area glue coating hole 2. Jumper district rubber coating hole design is the application design that a single jumper is connected, to what the jumper design can increase corresponding rubber coating hole, and this is prior art, the utility model discloses simple the description.
The screen plate main body 1 is designed to be a rectangular body, and the chip area glue coating holes 2 are designed to be five rows and six columns. This design arranges to the frame of photovoltaic diode module, realizes once a plurality of photovoltaic diode module rubber coating processing of mechanization, raises the efficiency.
The length and the width of the chip area glue coating hole 2 are the same and are 3.5mm; the curvature radius of the arc convex edge 3 is 1.5mm. The specific size design aims at 150-180 mil large grains, the application bonding effect is good, the grains have no deviation and no glue overflow phenomenon, the subsequent welding quality is improved, and the using amount of soldering paste (glue) is also saved.
The screen plate for brushing the glue is a frame glue brushing device which is applied and installed on the photovoltaic diode module. The thickness of the mesh plate main body is designed to be 0.2mm. Mounting holes are formed in the periphery of the screen plate main body, so that the screen plate main body can be conveniently mounted on a glue brushing device, and positioning holes are further designed in the screen plate main body and are conveniently matched with a frame of a photovoltaic diode module in a positioning mode.
The utility model discloses during the use, change the framework of photovoltaic diode module to the otter board main part that designs above the frame glue brushing device, the frame of photovoltaic diode module is located below the otter board main part, scrape about the soldering paste of otter board main part through the scraper, the soldering paste just so scribbles the welding area who corresponds above the frame of photovoltaic diode module through chip district rubber coating hole and jumper wire district rubber coating hole, the regional four corners star's of formation soldering paste shape that the chip district rubber coating hole corresponds, follow-up can ensure the corner to bond completely after placing big crystalline grain on the soldering paste, still not unnecessary soldering paste spills over, big crystalline grain can not squint, still save the soldering paste quantity.
Claims (5)
1. The utility model provides a brush is glued and is used otter board, its characterized in that, it includes otter board main part, chip district rubber coating hole, and evenly designed has a plurality of chip district rubber coating holes above the otter board main part, chip district rubber coating hole designs into four inboard edges of quad slit and designs into inside arc chimb respectively.
2. The screen plate for brushing glue according to claim 1, wherein a plurality of wire jumper zone glue coating holes are further designed on the screen plate main body, and one wire jumper zone glue coating hole is correspondingly designed on one side of each chip zone glue coating hole.
3. The screen plate for brushing glue according to claim 1, wherein the screen plate main body is designed as a rectangular body, and the plurality of chip area glue application holes are designed with five rows and six columns.
4. The screen plate for brushing paste according to claim 1, wherein the length and width of the paste applying hole of the chip area are the same and 3.5mm; the curvature radius of the arc convex edge is 1.5mm.
5. The screen plate for brushing paste according to claim 1, wherein the screen plate for brushing paste is a frame paste brushing device applied and installed on a photovoltaic diode module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222785264.5U CN218857929U (en) | 2022-10-22 | 2022-10-22 | Screen plate for brushing glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222785264.5U CN218857929U (en) | 2022-10-22 | 2022-10-22 | Screen plate for brushing glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218857929U true CN218857929U (en) | 2023-04-14 |
Family
ID=87369876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222785264.5U Active CN218857929U (en) | 2022-10-22 | 2022-10-22 | Screen plate for brushing glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218857929U (en) |
-
2022
- 2022-10-22 CN CN202222785264.5U patent/CN218857929U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208045002U (en) | High contrast integration packaging display module structure | |
| CN218857929U (en) | Screen plate for brushing glue | |
| CN202573248U (en) | Printing steel mesh | |
| CN207367928U (en) | SMT wafer mounting apparatus | |
| CN111029454A (en) | Flip lamp bead die bonding and eutectic all-in-one machine and flip lamp bead packaging process | |
| CN113183566B (en) | Photoelectric glass with film-pasted circuit and production process | |
| CN107272109A (en) | Liquid crystal display module and assemble method, mobile terminal | |
| CN204906329U (en) | Radio frequency surface acoustic wave filter flip chip bonding structure | |
| CN208861972U (en) | Multi-chip welding structure | |
| CN115763270A (en) | IGBT module mounting welding method | |
| CN111086317A (en) | Screen printing device for positive electrode surface of solar cell | |
| CN113370645A (en) | Silk screen for silk screen printing process of DFN product | |
| CN205452353U (en) | Large tracts of land electrode LED array | |
| CN210668379U (en) | Small-spacing color LED display unit driven by TFT | |
| CN210694100U (en) | VCM cell-phone camera module production water line | |
| CN113054071A (en) | Wide lamp belt manufactured by flip LED chip and manufacturing method | |
| CN110185945B (en) | High-density luminescent glass | |
| CN209977759U (en) | COB light bar for backlight and backlight plate | |
| CN113048409A (en) | Wide light bar manufactured by flip LED chip and manufacturing method | |
| CN107995795A (en) | Monolithic FPC connecting plate paster techniques | |
| CN217768374U (en) | High efficiency mini LED packaging hardware | |
| CN117324206A (en) | Printing mechanism suitable for die bonder | |
| CN117747586B (en) | Flexible film type chip packaging structure and packaging method | |
| CN212695150U (en) | LED packaging product | |
| CN220510046U (en) | Battery piece and photovoltaic cell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |