CN107995795A - Monolithic FPC connecting plate paster techniques - Google Patents
Monolithic FPC connecting plate paster techniques Download PDFInfo
- Publication number
- CN107995795A CN107995795A CN201711321999.XA CN201711321999A CN107995795A CN 107995795 A CN107995795 A CN 107995795A CN 201711321999 A CN201711321999 A CN 201711321999A CN 107995795 A CN107995795 A CN 107995795A
- Authority
- CN
- China
- Prior art keywords
- steel disc
- fpc
- monolithic
- support plate
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of monolithic FPC connecting plate paster techniques, comprise the following steps：(1) it is, unit according to single wafer, FPC whole plates is cut into monolithic FPC plates；(2), the card slot consistent with monolithic FPC plate shapes will be outputed on steel disc support plate with laser, and steel disc support plate is arranged on the gauge of chip mounter；(3), by step (1) in monolithic FPC plates be fitted into step one by one (2) in the card slot of middle steel disc slide glass, and paste high temperature gummed tape on monolithic FPC plates in a row or in column；(4), by step (3) in the steel disc support plate for gluing high temperature gummed tape enter chip mounter together, complete positive and negative attachment operation.The present invention program overcomes the problem of FPC whole plate harmomegathus, and monolithic FPC plates are put into the correspondence card slot on steel disc support plate, and easy to scan, patch is efficient, and yields is high.
Description
Technical field
The invention belongs to SMT（Surface mounting technology）Technical field, is related to a kind of monolithic FPC connecting plate paster techniques.
Background technology
At present, high-end camera module in process of production, it is necessary to wafer FPC carry out patch, generally use
Method is that the whole jigsaw of multi-layer board FPC is carried out patch, and the whole jigsaw of FPC uses liquid crystal polymer（LCP）Materials for support, the liquid crystal gather
Compound（LCP）Material make it that the harmomegathus value of the whole jigsaw of FPC is larger, and harmomegathus has seriously affected patch precision, and traditional handicraft patch is
Layout is done small, reduce harmomegathus value, when patch need to scan bad plate sign, also lose time, so that production efficiency is relatively low.
Therefore, how to solve the above problems, be the content to be studied of those skilled in the art.
The content of the invention
To overcome above-mentioned deficiency of the prior art, present invention aims at providing, a kind of solution FPC harmomegathus raising SMT is good
A kind of monolithic FPC connecting plate paster techniques of rate.
In order to achieve the above objects and other related objects, the present invention provides a kind of monolithic FPC connecting plate paster techniques, its feature
It is：Comprise the following steps：
(1) it is, unit according to single wafer, FPC whole plates is cut into monolithic FPC plates；
(2), the card slot consistent with monolithic FPC plate shapes will be outputed on steel disc support plate with laser, and steel disc support plate is arranged on patch
On the gauge of machine；
(3), by step (1) in monolithic FPC plates be fitted into step one by one (2) in the card slot of middle steel disc slide glass, and in a row or in column
High temperature gummed tape is pasted on monolithic FPC plates；
(4), by step (3) in the steel disc support plate for gluing high temperature gummed tape enter chip mounter together, complete positive and negative attachment operation.
In order to achieve the above objects and other related objects, the present invention provides a kind of monolithic FPC connecting plates paster technique patch
Fixture；Including steel disc support plate；The steel disc support plate is equipped with a plurality of card slots, and one is embedded for accommodating inside each card slot
Monolithic FPC plates, each card slot are matched with the appearance and size of the monolithic FPC plates；Further include high temperature gummed tape, the high-temp glue
Band is pasted onto on the steel disc support plate, and the monolithic FPC plates are fixed in the card slot；The steel disc support plate is arranged on patch
On the gauge of piece machine.
In above-mentioned technical proposal, related content is explained as follows：
1st, in such scheme, a wafer is equipped with each monolithic FPC plates.
2nd, in such scheme, each card slot laser cutting, and it is ± 0.02mm to cut tolerance.
Since above-mentioned technical proposal is used, the present invention this have the advantage that compared with prior art：
The present invention, which corresponds to each monolithic FPC plates, to be fixed in each card slot on steel disc support plate, by the steel disc support plate
The one side for being attached with high temperature gummed tape is covered on the fixed jig front of chip mounter so that multiple monolithic FPC plates pass through high-temp glue
Band is fixed on steel disc support plate, carries out front-back two-sided fitting, finally takes out steel disc support plate, you can complete multiple monolithic FPC plates
Patch process, it is easy to operate, steel disc support plate is cut the card slot consistent with FPC external forms, it is necessary to which hi-precision cutting is public using laser
The +/- 0.02mm of difference, ensure that the uniformity of whole plate FPC.The working time is saved, improves production efficiency.
The present invention program overcomes the problem of FPC whole plate harmomegathus, and monolithic FPC plates put into the correspondence card slot on steel disc support plate
Interior, easy to scan, patch is efficient, and yields is high.
Brief description of the drawings
Fig. 1 is the structure diagram of monolithic FPC connecting plate patch fixtures in present invention process flow.
Embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book understands other advantages and effect of the present invention easily.
Please refer to Fig.1.It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., only coordinating
The revealed content of specification, so that those skilled in the art understands and reads, it is enforceable to be not limited to the present invention
Qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size,
Do not influence under the effect of present invention can be generated and the purpose that can reach, should all still fall in disclosed technology contents
Obtain in the range of covering.Meanwhile cited such as " on ", " under ", "left", "right", " centre " and " one " in this specification
Term, be merely convenient to understanding for narration, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or
Adjustment, in the case where changing technology contents without essence, when being also considered as the enforceable category of the present invention.
A kind of as shown in Figure 1, monolithic FPC connecting plates patch fixture；Including steel disc support plate 1；The steel disc support plate 1 is equipped with
A plurality of card slots 2, each inside of card slot 2 are embedded a monolithic FPC plate 3 for accommodating, each card slot 2 and the monolithic
The appearance and size matching of FPC plates 3；High temperature gummed tape 4 is further included, the high temperature gummed tape 4 is pasted onto on the steel disc support plate 1, and will
The monolithic FPC plates 3 are fixed in the card slot 2；The steel disc support plate 1 is arranged on the gauge of chip mounter（Not shown in figure）
On.
A wafer is equipped with each monolithic FPC plates 3.
The each card slot 2 laser cutting, and it is ± 0.02mm to cut tolerance.
A kind of monolithic FPC connecting plate paster techniques, it is characterised in that：Comprise the following steps：
(1) it is, unit according to single wafer, FPC whole plates is cut into monolithic FPC plates；
(2), the card slot consistent with monolithic FPC plate shapes will be outputed on steel disc support plate with laser, and steel disc support plate is arranged on patch
On the gauge of machine；
(3), by step (1) in monolithic FPC plates be fitted into step one by one (2) in the card slot of middle steel disc slide glass, and in a row or in column
High temperature gummed tape is pasted on monolithic FPC plates；
(4), by step (3) in the steel disc support plate for gluing high temperature gummed tape enter chip mounter together, complete positive and negative attachment operation.
The present invention, which corresponds to each monolithic FPC plates, to be fixed in each card slot on steel disc support plate, by the steel disc
Support plate be attached with high temperature gummed tape one side be covered on chip mounter fixed jig front so that multiple monolithic FPC plates pass through height
Warm adhesive tape is fixed on steel disc support plate, carries out front-back two-sided fitting, finally takes out steel disc support plate, you can complete multiple monolithic FPC
The patch process of plate, it is easy to operate, steel disc support plate is cut the card slot consistent with FPC external forms, it is necessary to which high accuracy is cut using laser
The +/- 0.02mm of tolerance is cut, ensure that the uniformity of whole plate FPC.The working time is saved, improves production efficiency.
The present invention program overcomes the problem of FPC whole plate harmomegathus, and monolithic FPC plates put into the correspondence card slot on steel disc support plate
Interior, easy to scan, patch is efficient, and yields is high.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (4)
- A kind of 1. monolithic FPC connecting plate paster techniques, it is characterised in that：Comprise the following steps：(1) it is, unit according to single wafer, FPC whole plates is cut into monolithic FPC plates；(2), the card slot consistent with monolithic FPC plate shapes will be outputed on steel disc support plate with laser, and steel disc support plate is arranged on patch On the gauge of machine；(3), by step (1) in monolithic FPC plates be fitted into step one by one (2) in the card slot of middle steel disc slide glass, and in a row or in column High temperature gummed tape is pasted on monolithic FPC plates；(4), by step (3) in the steel disc support plate for gluing high temperature gummed tape enter chip mounter together, complete positive and negative attachment operation.
- A kind of 2. monolithic FPC connecting plates paster technique patch fixture；It is characterized in that：Including steel disc support plate；The steel disc support plate A plurality of card slots are equipped with, a monolithic FPC plate is embedded for accommodating inside each card slot, each card slot and the list The appearance and size matching of piece FPC plates；High temperature gummed tape is further included, the high temperature gummed tape is pasted onto on the steel disc support plate, and by institute Monolithic FPC plates are stated to be fixed in the card slot；The steel disc support plate is arranged on the gauge of chip mounter.
- 3. monolithic FPC connecting plates paster technique patch fixture according to claim 2, it is characterised in that：Each list A wafer is equipped with piece FPC plates.
- 4. monolithic FPC connecting plates paster technique patch fixture according to claim 2, it is characterised in that：Each card Groove is cut by laser, and it is ± 0.02mm to cut tolerance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711321999.XA CN107995795A (en) | 2017-12-12 | 2017-12-12 | Monolithic FPC connecting plate paster techniques |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711321999.XA CN107995795A (en) | 2017-12-12 | 2017-12-12 | Monolithic FPC connecting plate paster techniques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995795A true CN107995795A (en) | 2018-05-04 |
Family
ID=62036004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711321999.XA Pending CN107995795A (en) | 2017-12-12 | 2017-12-12 | Monolithic FPC connecting plate paster techniques |
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| CN (1) | CN107995795A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111770634A (en) * | 2020-06-08 | 2020-10-13 | 上达电子（深圳）股份有限公司 | Manufacturing method of FPC |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030109170A1 (en) * | 2001-12-11 | 2003-06-12 | Yazaki Corporation | Relay device and relay device mounting structure |
| CN103826394A (en) * | 2008-10-17 | 2014-05-28 | 林克治 | Method and system for mounting component on surface of flexible circuit board as well as magnetic jig |
| CN203697636U (en) * | 2014-01-14 | 2014-07-09 | 湖北三赢兴电子科技有限公司 | Surface mount fixation jig for FPC (flexible printed circuit) of high-end camera shooting module |
| CN206465487U (en) * | 2017-01-09 | 2017-09-05 | 湖北三赢兴电子科技有限公司 | High-end camera module motor welds feeding tool |
-
2017
- 2017-12-12 CN CN201711321999.XA patent/CN107995795A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030109170A1 (en) * | 2001-12-11 | 2003-06-12 | Yazaki Corporation | Relay device and relay device mounting structure |
| CN103826394A (en) * | 2008-10-17 | 2014-05-28 | 林克治 | Method and system for mounting component on surface of flexible circuit board as well as magnetic jig |
| CN203697636U (en) * | 2014-01-14 | 2014-07-09 | 湖北三赢兴电子科技有限公司 | Surface mount fixation jig for FPC (flexible printed circuit) of high-end camera shooting module |
| CN206465487U (en) * | 2017-01-09 | 2017-09-05 | 湖北三赢兴电子科技有限公司 | High-end camera module motor welds feeding tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111770634A (en) * | 2020-06-08 | 2020-10-13 | 上达电子（深圳）股份有限公司 | Manufacturing method of FPC |
| CN111770634B (en) * | 2020-06-08 | 2022-04-29 | 上达电子（深圳）股份有限公司 | Manufacturing method of FPC |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180504 |
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| RJ01 | Rejection of invention patent application after publication |