CN202995094U - Easily packaged parallel transmission optical device - Google Patents

Easily packaged parallel transmission optical device Download PDF

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Publication number
CN202995094U
CN202995094U CN 201220602814 CN201220602814U CN202995094U CN 202995094 U CN202995094 U CN 202995094U CN 201220602814 CN201220602814 CN 201220602814 CN 201220602814 U CN201220602814 U CN 201220602814U CN 202995094 U CN202995094 U CN 202995094U
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China
Prior art keywords
chip
array
optical device
parallel transmission
electrically connected
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Expired - Lifetime
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CN 201220602814
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Chinese (zh)
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曹芳
张德玲
杨昌霖
何明阳
王雨飞
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Wuhan Telecommunication Devices Co Ltd
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Wuhan Telecommunication Devices Co Ltd
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Abstract

The present utility model provides an easily packaged parallel transmission optical device. The device comprises a multi-path emission chip, a multi-path receiving chip, a PCB substrate, an emission driving IC, a receiving amplification IC, a plurality of array lenses and a plurality of multi-core array optical fibers. The multi-path emission chip is electrically connected with the emission driving IC, a luminescence aperture of the multi-path emission chip is aligned with an array lens; the multi-path receiving chip is electrically connected with the receiving amplification IC, a receiving photosensitive surface of the multi-path receiving chip is aligned with the other array lens; the multi-core array optical fibers are connected with a plurality of array optical fiber joints, and the array optical fiber joints are respectively aligned with the array lenses. The array lenses are adopted, pasting precision requirements of the multi-path emission chip and the multi-path receiving chip are reduced, the paster technology is no longer a bottleneck technology, work efficiency of pasters can be enhanced, coupling requirements of the array lenses, the multi-path emission chip and the multi-path receiving chip can be reduced, and the coupling efficiency of the array lenses can be enhanced.

Description

A kind of parallel transmission optical device that is easy to encapsulate
Technical field
The utility model relates to a kind of parallel transmission optical device that is easy to encapsulate, and can be applicable to QSFP+, active optical cable (AOC), CXP and other parallel transmission optical module in data communication applications.
Background technology
At present, in the parallel transmission optical device 100 of high-speed communication, as depicted in figs. 1 and 2, main multichannel array lens 101 and multichannel transmitting chip 102, the multipath reception chip 103 of adopting carries out respectively being coupled and aligned of light path, and then carry out the purpose that is coupled and aligned to realize light path coupling of light path with multicore array fibre 104, finally be fixed on PCB substrate 105, and seal with seal cover board 108.Parallel transmission optical device 100 can be the optical device of 44 transmitting-receiving unifications of receiving, and can be also the ballistic device of multidiameter delay emission, or the receiving device of multidiameter delay reception.Multichannel array lens 101 can be the array lens of 4 passages, 8 passages, 12 passages, 24 passages or other port numbers; Multichannel transmitting chip 102 and multipath reception chip 103 can be 4 the tunnel, the 8 tunnel, the 12 tunnel, the 24 road or the array chip of other ways; Multicore array fibre 104 can be also the array fibre of 4 cores, 8 cores, 12 cores, 24 cores or other core numbers.
but, there is larger technology difficulty in said structure in implementation procedure, be specially: in order to make multichannel array lens 101 and multichannel road transmitting chip 102, multipath reception chip 103 perfect alignment, high-precision requirement is satisfied in the positions that mount with regard to inevitable requirement multichannel transmitting chip 102 and multipath reception chip 103 itself, otherwise multichannel lens arra 101 is difficult to realize simultaneously and the aiming at of multichannel road transmitting chip 102 and multipath reception chip 103, as shown in Figure 2, the relative position placement accuracy of specific requirement multichannel transmitting chip 102 and multipath reception chip 103 reaches in 10 μ m, comprise the spacing between each chip, the dislocation distance of each chip on directions X and Y-direction, all must be controlled in the deviation range of 10 μ m.Mount at present the accuracy of position in order to satisfy multichannel transmitting chip 102 and multipath reception chip 103, usually need to drop into high-precision chip mounter and special-purpose high power contraposition template, carry out pattern alignment after magnification at high multiple, and then adopt suitable tackifier to be fixed.After multichannel transmitting chip 102 and multipath reception chip 103 accurate placements, the spacing of multichannel road transmitting chip 102 and multipath reception chip 103 is very little, only has 1mm, cause subsequent transmission drive IC 106 also to become very compact with the relative position that mounts that receives amplification IC 107, circuit layout is very limited, increase the wiring difficulty of PCB substrate 105 and the difficulty that IC 107 encapsulation are amplified in emission drive IC 106, reception, affected to a certain extent the piece electrical switching performance.
The utility model content
For the deficiencies in the prior art, the utility model provides a kind of parallel transmission optical device that is easy to encapsulate, pass through to adopt this parallel transmission optical device in the utility model, can reduce the placement accuracy requirement of multichannel transmitting chip and multipath reception chip, can satisfy better the coupling requirement with multichannel array lens and multicore array fibre, can be more rational on the PCB substrate layout emission drive IC and receive and amplify IC.
The utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, comprise multichannel transmitting chip, multipath reception chip, PCB substrate, emission drive IC, receive and amplify IC, a plurality of array lens and a plurality of multicore array fibre; Described multichannel transmitting chip is electrically connected to the emission drive IC, and the luminous aperture of this multichannel transmitting chip and an array lens alignment arrange; The multipath reception chip is electrically connected to receiving amplification IC, and the reception photosurface of this multipath reception chip is aimed at setting with another array lens; One end of described multicore array fibre is fixed in the Guang Kouchu of PCB base plate, and the other end connects a plurality of array fibre connectors, and these a plurality of array fibre connectors are aimed at setting with described a plurality of array lenses respectively; Described multichannel transmitting chip, multipath reception chip, emission drive IC, reception are amplified IC, a plurality of array lens and a plurality of multicore array fibre and all are mounted on the PCB substrate.
Further, described multichannel transmitting chip is that gold wire bonding is electrically connected to or the face-down bonding electrical connection with the mode that is electrically connected to of emission drive IC; The mode that described multipath reception chip is electrically connected to reception amplification IC is that gold wire bonding is electrically connected to or face-down bonding is electrically connected to.
Further, described multichannel transmitting chip, multipath reception chip, emission drive IC, reception are amplified IC and are sealed by seal cover board, and the sealing cover plate is fixed on the PCB substrate by tackifier.
Further, the number of described multichannel transmitting chip and multipath reception chip equates and is more than 1.
Further, the number of described multichannel transmitting chip and multipath reception chip is 2～4.
Further, the number sum of described multichannel transmitting chip and multipath reception chip equals the number of array lens, and the number of this array lens equates with the number of array fibre connector.
The utlity model has following advantage:
(1) the utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, array lens that to organize (preferred 2-4 group) fractionation is applied in the structure of this parallel transmission optical device more, can reduce the placement accuracy requirement of multichannel transmitting chip and multipath reception chip, make paster technique no longer become bottleneck technique, and improve the work efficiency of paster.
(2) the utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, array lens that to organize (preferred 2-4 group) fractionation is applied in the structure of this QSFP+ optical module more, can reduce the coupling requirement of array lens and multichannel transmitting chip and multipath reception chip, improve the efficient of array lens coupling.
(3) the utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, the multicore array fibre is loaded onto the fine connector of array that many groups (preferred 2-4 group) split, flexible Application is in the structure of this parallel transmission optical device, can realize respectively plugging with the lens arra of the lens arra of multichannel transmitting chip and multipath reception chip and dock, effectively reduce to dock loss, improve the consistance of each passage.
(4) the utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, the multicore array fibre is loaded onto the fine connector of array that many groups (preferred 2-4 group) split, flexible Application is in the structure of this parallel transmission optical device, because the relative tertiary location of multichannel transmitting chip and multipath reception chip can suitably increase, can realize the rational deployment of circuit, no longer stick to original compacter layout, improve the electrical connection performance of whole module.
(5) the utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, the other end (MPO end) of multicore array fibre is fixed in the light mouth of this parallel transmission optical device, this can stablize for being flexible coupling the plug function that realizes with standard MPO wire jumper.
(6) the utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, because performance accuracy in manufacturing process requires existing the reduction, can make the processing of this optical device more simple and easy to do, and effectively improve the rate that manufactures a finished product.
(7) the utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, array lens is Mould Machining, the more easily realization of array lens processing of low port number, and the lens arra of more port number more has cost advantage.
(8) the utility model proposes a kind of parallel transmission optical device that is easy to encapsulate, the processing of the array fibre that the core number is less more easily realizes, the array fibre more than the core number more has cost advantage.
Description of drawings
Fig. 1 is the light channel structure of parallel transmission optical device in prior art;
Fig. 2 is the schematic diagram that in prior art, array chip and array lens precision mount;
Fig. 3 is the light channel structure of the utility model parallel transmission optical device;
Fig. 4 is the schematic diagram that in the utility model, array chip and array lens mount
Fig. 5 is the schematic diagram that is applied to the QSFP+ optical device of the utility model parallel transmission optical device;
Fig. 6 is the schematic diagram that is applied to the AOC optical device of the utility model parallel transmission optical device;
Fig. 7 is the schematic diagram that is applied to the CXP optical device of the utility model parallel transmission optical device.
In figure: 100-parallel transmission optical device; The 101-array lens; 102-multichannel transmitting chip; 103-multipath reception chip; 104-multicore array fibre; The 105-PCB substrate; 106-launches drive IC; 107-receives and amplifies IC; The 108-seal cover board; The array lens that 201-splits; The array fibre connector that 202-splits; The multicore array fibre that 203-is detachable; The 200-QSFP+ optical device; The 300-AOC optical device; The 400-GCXP optical device.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the utility model and being implemented, but illustrated embodiment is not as to restriction of the present utility model.
The parallel transmission optical device 100 that is easy to encapsulate that the present embodiment proposes, as shown in Figure 3 and Figure 4, comprise multichannel transmitting chip 102, multipath reception chip 103, PCB substrate 105, emission drive IC 106, reception amplification IC 107, the array lens 201 that splits and detachable multicore array fibre 203.
Multichannel transmitting chip 102 and multipath reception chip 103 all are mounted on PCB substrate 105, this multichannel transmitting chip 102 and multipath reception chip 103 can design respectively one or more groups, but the group number of multichannel transmitting chip 102 and multipath reception chip 103 equates.Multichannel transmitting chip 102 and multipath reception chip 103 are in the relative position no requirement (NR) of PCB substrate 105, need not micron-sized high precision die bonder mounts, manually mount and get final product, only need to require take the bulk that satisfies PCB substrate 105 and satisfy emission drive IC 106, receive amplify IC 107 rational deployment as principle.Multichannel transmitting chip 102, multipath reception chip 103 drive chip with described emission drive IC 106(emission respectively), receive and amplify IC 107(and receive across resistance amplification chip TIA) be electrically connected to by gold wire bonding or face-down bonding realization, adopt the array lens 201 that many assembling and dismantling divide to aim at and be arranged on PCB substrate 105 with the aperture of multichannel transmitting chip 102, multipath reception chip 103 respectively.The central point that the array lens 201 that splits and 102 pairs of multichannel transmitting chips are specially the array lens 201 of fractionation on time aims at directions X and Y-direction with the center of circle in the luminous aperture of multichannel transmitting chip 102 respectively that (wherein directions X, Y-direction are the in-plane of PCB substrate 105, the Z direction is the direction perpendicular to PCB substrate 105), but both do not contact in the z direction, both need to get final product in accordance with the requirement aligning of optical design in the vertical range of z direction, then stick with glue agent the array lens 201 that splits is fixed on PCB substrate 105.The array lens 201 that splits is aimed at multipath reception chip 103 and is specially: the central point of the array lens 201 of fractionation is aimed at directions X and Y-direction with the center of circle in the reception photosurface aperture of multipath reception chip 103 respectively, but both do not contact in the Z direction, both vertical ranges in the Z direction need to require to get final product in accordance with optical design, then stick with glue agent the array lens 201 that these assembling and dismantling divide is fixed on PCB substrate 105.Like this, the array lens 201 of fractionation has just installed.Then need the array fibre connector 202 that multicore array fibre 203 and many assembling and dismantling divide is assemblied in one, one end of multicore array fibre 203 is standard MPO joint, the other end connects the array fibre connector 202 of a plurality of fractionations, and the array fibre connector 202 that splits is carried out grinding and polishing, to reach the end face requirement of common MPO wire jumper.next the array fibre connector 202 that many assembling and dismantling is divided is aimed at the array lens 201 that the many assembling and dismantling that assemble divide, owing to being designed with the guide pin of location use in the array lens 201 that splits, and be designed with the pilot hole of location use in the array fibre connector 202 that splits, therefore, only the guide pin in the array lens 201 that splits need to be inserted in the pilot hole in the array fibre connector 202 that splits, can satisfy in the array lens 201 of fractionation each lens apex respectively with the array fibre connector 202 that splits in the center of circle of each root fiber optic aperture aim at one by one, and stick with glue agent the array fibre connector 202 that splits is fixed on PCB substrate 105.To with the other end (MPO end) of the multicore array fibre 203 that splits, be fixed in the Guang Kouchu of PCB base plate 105 at last.
For instance, such as in the application of the active optical cable of the QSFP+ of 4 * 10G optical module and 4 * 10G, in the parallel transmission optical device 100 in the utility model, multichannel transmitting chip 102 is 4 the tunnel, and multipath reception chip 103 is also 4 the tunnel.201 array lenses that adopt 2 group of 4 passage of the array lens that splits so, wherein the array lens 201 of the fractionation of one group of 4 passage is aimed at 4 tunnel multichannel transmitting chip 102, and the array lens 201 of the fractionation of another group 4 passages is aimed at 4 tunnel multipath reception chip 103.Detachable multicore array fibre 203 is the detachable array fibre of 8 cores or 12 cores, if adopt the detachable array fibre of 12 cores, middle 4 cores are on the shelf, only with 1,2, and 3,4 and 9,10, the optical fiber of 11,12 these 8 cores.The multicore array fibre 203 that this is detachable is loaded onto the array fibre connector 202 of 2 group of 4 core, then, with after two group pattern lens 201 are aimed at, sticks with glue agent glue it is individually fixed on PCB substrate 105 respectively.Other end MPO in the 8 core array fibres 203 that at last this band split holds, and is fixed in the Guang Kouchu of optical module.So, multichannel array optical device and optical element are split into the component that many groups (this place is 2 groups) are hanged down port number, the difficulty that the light path of greatly simple and easy multichannel array chip and multichannel array lens and multicore array fibre is coupled and aligned and fixes no longer has been subject to the method that adopts high-precision chip mounter and contraposition template.And greatly promoted the integrated circuit layout of whole device, no longer be subject to very compact arrangement space.Therefore, not only can simple and easyly realize easily being coupled and aligned and fixing of multichannel ballistic device, multipath reception device and multichannel transmitting-receiving unification device, and structurally have better stability.As Fig. 5, Fig. 6, shown in Figure 7, adopt parallel transmission optical device 100 of the present utility model, can realize for example 4*10G QSFP+ optical device 200,4*10G AOC optical device 300, the encapsulation of 12*10G CXP optical device 400 optical devices such as parallel transmission such as grade.After all parts all installed, multichannel transmitting chip 102, multipath reception chip 103, emission drive IC 106, reception were amplified IC107 and are sealed by seal cover board 108, and sealing cover plate 108 is fixed on PCB substrate 105 by tackifier.
The parallel transmission optical device 100 that is easy to encapsulate of the present utility model is also applicable to the fractionation of 3 groups, 4 groups or more groups.Be preferably 2～4 groups of group number scopes.
The above embodiment is the preferred embodiment that proves absolutely that the utility model is lifted, and protection domain of the present utility model is not limited to this.Being equal to that those skilled in the art do on the utility model basis substitutes or conversion, all within protection domain of the present utility model.Protection domain of the present utility model is as the criterion with claims.

Claims (6)

1. a parallel transmission optical device that is easy to encapsulate, is characterized in that, comprises multichannel transmitting chip, multipath reception chip, PCB substrate, emission drive IC, receives and amplify IC, a plurality of array lens and a plurality of multicore array fibre;
Described multichannel transmitting chip is electrically connected to the emission drive IC, and the luminous aperture of this multichannel transmitting chip and an array lens alignment arrange; The multipath reception chip is electrically connected to receiving amplification IC, and the reception photosurface of this multipath reception chip is aimed at setting with another array lens; One end of described multicore array fibre is fixed in the Guang Kouchu of PCB base plate, and the other end connects a plurality of array fibre connectors, and these a plurality of array fibre connectors are aimed at setting with described a plurality of array lenses respectively;
Described multichannel transmitting chip, multipath reception chip, emission drive IC, reception are amplified IC, a plurality of array lens and a plurality of multicore array fibre and all are mounted on the PCB substrate.
2. the parallel transmission optical device that is easy to encapsulate according to claim 1, is characterized in that, the mode that described multichannel transmitting chip is electrically connected to the emission drive IC is that gold wire bonding is electrically connected to or face-down bonding is electrically connected to; The mode that described multipath reception chip is electrically connected to reception amplification IC is that gold wire bonding is electrically connected to or face-down bonding is electrically connected to.
3. the parallel transmission optical device that is easy to encapsulate according to claim 1, it is characterized in that, described multichannel transmitting chip, multipath reception chip, emission drive IC, reception are amplified IC and are sealed by seal cover board, and the sealing cover plate is fixed on the PCB substrate by tackifier.
4. the parallel transmission optical device that is easy to encapsulate according to claim 1, is characterized in that, the number of described multichannel transmitting chip and multipath reception chip equates and is more than 1.
5. the parallel transmission optical device that is easy to encapsulate according to claim 4, is characterized in that, the number of described multichannel transmitting chip and multipath reception chip is 2～4.
6. according to claim 4 or 5 described parallel transmission optical devices that are easy to encapsulate, it is characterized in that, the number sum of described multichannel transmitting chip and multipath reception chip equals the number of array lens, and the number of this array lens equates with the number of array fibre connector.
CN 201220602814 2012-11-15 2012-11-15 Easily packaged parallel transmission optical device Expired - Lifetime CN202995094U (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105093441A (en) * 2015-09-10 2015-11-25 江苏亨通光网科技有限公司 USB interface active optical cable, and manufacturing device, manufacturing method and test method for USB interface active optical cable
CN105403963A (en) * 2015-12-07 2016-03-16 武汉电信器件有限公司 Airtight parallel transmission optical device
CN110376688A (en) * 2019-07-16 2019-10-25 武汉光迅科技股份有限公司 A kind of optical module
CN111142200A (en) * 2019-12-09 2020-05-12 北京航天时代光电科技有限公司 Gold wire bonding structure based on multichannel digital light receiving and transmitting module
CN114137670A (en) * 2020-09-03 2022-03-04 英业达科技有限公司 Electronic component and optical communication element
CN114325966A (en) * 2021-12-29 2022-04-12 中国电子科技集团公司第四十四研究所 Binary array optical fiber coupling structure of balanced photoelectric detector and manufacturing method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105093441A (en) * 2015-09-10 2015-11-25 江苏亨通光网科技有限公司 USB interface active optical cable, and manufacturing device, manufacturing method and test method for USB interface active optical cable
CN105093441B (en) * 2015-09-10 2017-12-05 江苏亨通光网科技有限公司 A kind of USB interface active optical cable and its producing device and preparation method, method of testing
CN105403963A (en) * 2015-12-07 2016-03-16 武汉电信器件有限公司 Airtight parallel transmission optical device
CN105403963B (en) * 2015-12-07 2017-07-18 武汉电信器件有限公司 A kind of air-tightness parallel transmission optical device
CN110376688A (en) * 2019-07-16 2019-10-25 武汉光迅科技股份有限公司 A kind of optical module
CN111142200A (en) * 2019-12-09 2020-05-12 北京航天时代光电科技有限公司 Gold wire bonding structure based on multichannel digital light receiving and transmitting module
CN111142200B (en) * 2019-12-09 2021-10-01 北京航天时代光电科技有限公司 Gold wire bonding structure based on multichannel digital light receiving and transmitting module
CN114137670A (en) * 2020-09-03 2022-03-04 英业达科技有限公司 Electronic component and optical communication element
CN114325966A (en) * 2021-12-29 2022-04-12 中国电子科技集团公司第四十四研究所 Binary array optical fiber coupling structure of balanced photoelectric detector and manufacturing method
CN114325966B (en) * 2021-12-29 2023-04-28 中国电子科技集团公司第四十四研究所 Balanced photoelectric detector binary array optical fiber coupling structure and manufacturing method

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