CN205193319U - It is passive to smooth engine device of receiving and dispatching of quasi high -speed inter -plate interconnection - Google Patents
It is passive to smooth engine device of receiving and dispatching of quasi high -speed inter -plate interconnection Download PDFInfo
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- CN205193319U CN205193319U CN201521030820.1U CN201521030820U CN205193319U CN 205193319 U CN205193319 U CN 205193319U CN 201521030820 U CN201521030820 U CN 201521030820U CN 205193319 U CN205193319 U CN 205193319U
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Abstract
The utility model relates to an it is passive to smooth engine device of receiving and dispatching of quasi high -speed inter -plate interconnection, it includes active device, is used for to fix active device to eka silicon platform device and optical interface device, active device's light is received and dispatched the passageway and is four -channel, active device includes: laser dipole and photoelectric detector, include eka silicon platform device: plus lens and the fiber alignment silicon platform that is used for fixed fiber array, fiber alignment silicon platform with the optical interface device will fiber array is fixed, fiber array sends light, process the plus lens assembles, through logical unthreaded hole to eka silicon platform device arrives the light -receiving is accomplished to the last receipts unthreaded hole of photoelectric detector. The device adopts the very high silicon technology of integrated level, and the NULL of silicon can very effectual control design tolerance, brings very big facility for the assembly for passive coupling scheme enable.
Description
Technical field
The utility model belongs to optical communication field, is specifically related to the light transmitting-receiving engine apparatus that interconnects between a kind of packaging passive alignment High-Speed-Board.
Background technology
In recent years along with the development of Internet technology, global range also proposes requirements at the higher level to network transfer speeds; Bandwidth also promotes steadily under the promotion of demand and technology, comes into operation in increasing data center.Therefore, these Iarge-scale system integrated required light transmitting-receiving engine also faces more challenges.Along with improving constantly of data center systems integrated level, on board, data transmission chip size requires more and more less, transfer rate is more and more higher, power consumption is more and more lower, price is more and more lower, flat-type package structure becomes main trend, and the photo engine size of traditional plug type is large, is not suitable with the growth requirement of following short-distance transmission.
Utility model content
For solving the problems of the technologies described above, the utility model provides the light transmitting-receiving engine apparatus that to interconnect between microminiature, extendible packaging passive alignment High-Speed-Board, this device adopts the silicon technology that integrated level is very high, the micro-processing technology of silicon can very effective control design case tolerance, bring great convenience to assembling, make passive coupling scheme become possibility.
For achieving the above object, the technical solution of the utility model is as follows:
Interconnect between a kind of packaging passive alignment High-Speed-Board light transmitting-receiving engine apparatus, it comprise active device, for fixing described active device to eka-silicon platform device and optical interface device, the light transceiver channel of described active device is four-way, and described active device comprises: laser dipole and photodetector; Describedly to comprise eka-silicon platform device: plus lens and the optical fiber align silicon platform for fixed fiber array, described fiber array is fixed by described optical fiber align silicon platform and described optical interface device; Described fiber array sends light, converges through described plus lens, is arrived the receipts unthreaded hole on described photodetector, complete light-receiving by the described light hole to eka-silicon platform device.
Preferably, described eka-silicon platform device to be comprised: the surface of active device silicon platform, described active device silicon platform is provided with plus lens silicon platform and described optical fiber align silicon platform, described plus lens silicon platform is provided with described plus lens, one side end face of described active device silicon platform is provided with described laser dipole, photodetector, one end of described fiber array fixed by described optical fiber align silicon platform, and the other end of described fiber array connects described optical interface device.
Preferably, the two ends of a side end face of described active device silicon platform are provided with fixation guide pin, and described fixation guide pin is separately positioned on the side of described laser dipole and photodetector; Also described fixation guide pin is provided with at the two ends of described plus lens and described optical fiber align silicon platform; Described laser dipole, photodetector, plus lens and fiber array align by described fixation guide pin, realize their packaging passive alignment.
Preferably, also be provided with the first PCB, described first PCB is provided with groove, and described active device is arranged in described groove, and the driving chip of described laser dipole and the driving chip of described photodetector are all connected in described first PCB by bonding gold thread.
Preferably, also be provided with the second PCB, the driving chip of described laser dipole and the equal face-down bonding of driving chip of described photodetector are encapsulated in described second PCB, the silicon platform of described second PCB plate and the described laser dipole of placement or photodetector is furnished with circuit, and driver is connected with corresponding described laser dipole or photodetector by described circuit.
Preferably, the wavelength of described laser dipole is 850nm, and described laser dipole is by vertical plane Emission Lasers, and described laser dipole is VECEL laser instrument, and the centre wavelength of described photodetector is 850nm; The silicon platform placing VECEL laser instrument and photodetector is provided with 12 described light holes, described light hole and four-way VECEL laser instrument and four-way photodetector one_to_one corresponding; The light-emitting area of described VECEL laser instrument just and the surface of described plus lens on parallel surface, the laser that described VECEL laser instrument sends is not turned and is directly converged by described plus lens, and the light that described plus lens sends also will directly by described photoelectric detector.
Preferably, described optical interface device is MT tail optical fiber or MPO tail optical fiber, and the centre wavelength of described optical interface device is 850nm, and described optical interface device adopts four tunnels to receive the pattern of Guang He tetra-tunnel luminescence.
The beneficial effects of the utility model are:
One, device of the present utility model adopt the silicon processing technique that accessible site degree is very high, and the effective dimensions of whole device can be narrowed down to a millimeter magnitude by applying silicon process technology, improves the integrated level of device.
Two, device of the present utility model adopts passive passive coupling scheme, greatly simplify the complexity of assembling, has saved cost.
Three, device of the present utility model adopts technique of alignment, can expand in the scheme of more speed, and transplanting performance is good, effectively can solve a high-speed communication difficult problem for narrow space.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment technology, be briefly described to the accompanying drawing used required in the description of embodiment technology below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of engine apparatus in Fig. 1 embodiment 1.
The structural representation of engine apparatus in Fig. 2 embodiment 2.
Fig. 3 is light path packaging passive alignment schematic diagram in Fig. 1 and Fig. 2.
Fig. 4 is the index path of Fig. 1 and Fig. 2 horizontal direction.
Wherein, 1-active device, 2-is to eka-silicon platform device, 3-optical interface device, 4-fiber array, the driving chip of 11-laser dipole, the driving chip of 12-photodetector, 13-bonding gold thread, 21-plus lens silicon platform, 22-optical fiber align silicon platform, 23-active device silicon platform, 24-light hole, 25-fixation guide pin, 210-plus lens, 101-first PCB, 201-second PCB, 110-laser dipole, 120-photodetector.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment 1
As shown in Figure 1, disclose the light transmitting-receiving engine apparatus that to interconnect between a kind of packaging passive alignment High-Speed-Board in the present embodiment, the engine apparatus in embodiment 1 is adapted to the transmission speed of middling speed, such as 40Ghz.
Above-mentioned engine apparatus its mainly include source device 1, for fixing above-mentioned active device 1 to eka-silicon platform device 2 and optical interface device 3, the light transceiver channel of above-mentioned active device 1 is four-way, and above-mentioned active device 1 comprises: laser dipole 110 and photodetector 120; In the present embodiment, the wavelength of above-mentioned laser dipole 110 is 850nm, and above-mentioned laser dipole 110 is by vertical plane Emission Lasers, and the centre wavelength of above-mentioned photodetector 120 is 850nm.
Further, above-mentioned optical interface device 3 is MT tail optical fiber or MPO tail optical fiber, and the centre wavelength of above-mentioned optical interface device 3 is 850nm, and above-mentioned optical interface device 3 adopts four tunnels to receive the pattern of Guang He tetra-tunnel luminescence.
Concrete, as shown in Figure 3, above-mentioned eka-silicon platform device to be comprised: the surface of active device silicon platform 23, above-mentioned active device silicon platform 23 is provided with plus lens silicon platform 21 and optical fiber align silicon platform 22, above-mentioned plus lens silicon platform 21 is provided with above-mentioned plus lens 210, one side end face of above-mentioned active device silicon platform 23 is provided with above-mentioned laser dipole 110, photodetector 120, one end of above-mentioned fiber array 4 fixed by above-mentioned optical fiber align silicon platform 22, and the other end of above-mentioned fiber array 4 connects above-mentioned optical interface device 3.
When only there being above-mentioned fiber array 3 to send, converging through above-mentioned plus lens 210, being arrived the receipts unthreaded hole on above-mentioned photodetector 120 by the above-mentioned light hole 24 to eka-silicon platform device, completing light-receiving.
The two ends of one side end face of above-mentioned active device silicon platform 23 are provided with fixation guide pin 25, and above-mentioned fixation guide pin 25 is separately positioned on the side of above-mentioned laser dipole 110 and photodetector 120.
Meanwhile, described fixation guide pin 25 is also provided with at the two ends of described plus lens 210 and described optical fiber align silicon platform 22; Described laser dipole 110, photodetector 120, plus lens 210 and fiber array 4 align by described fixation guide pin 25, realize their packaging passive alignment.
Because the engine apparatus in embodiment 1 is adapted to middling speed transfer rate, therefore in the present embodiment, adopt bonding gold thread 13 to couple together the optical device part assembled and PCB, specifically as shown in fig. 1, also be provided with the first PCB 101, above-mentioned first PCB 101 is provided with latent groove, above-mentioned active device 1 is arranged in above-mentioned groove, and the driving chip 11 of above-mentioned laser dipole and the driving chip 12 of above-mentioned photodetector are all connected in above-mentioned first PCB 101 by bonding gold thread 13.
Technical scheme in embodiment 1, owing to using gold thread bonding technology, is applicable to the opto-electronic conversion of transfer rate as 40Ghz, adopts gold thread bonding technology to link the optical device part assembled and PCB.On high speed device, the height of routing is serious on high frequency performance impact, and too high bonding gold thread 13 radian can increase inductance and make impedance mismatch.In the present embodiment, under the prerequisite not changing standard wafer thickness, design shallow slot to offset difference in height in the first PCB 101, make bonding gold thread 13 radian minimum.
Embodiment 2
The light transmitting-receiving engine apparatus that to interconnect between a kind of packaging passive alignment High-Speed-Board is disclosed in the present embodiment, as shown in Figures 2 and 3, above-mentioned engine apparatus its mainly include source device 1, for fixing above-mentioned active device 1 to eka-silicon platform device 2 and optical interface device 3, the light transceiver channel of above-mentioned active device 1 is four-way, and above-mentioned active device 1 comprises: laser dipole 110 and photodetector 120; In the present embodiment, the wavelength of above-mentioned laser dipole 110 is 850nm, and above-mentioned laser dipole 110 is by vertical plane Emission Lasers, and the centre wavelength of above-mentioned photodetector 120 is 850nm.
Described laser dipole 110 is VECEL laser instrument, the silicon platform placing VECEL laser instrument 110 and photodetector 120 is provided with 12 described light holes 24, described light hole 24 and four-way VECEL laser instrument 110 and four-way photodetector 120 one_to_one corresponding; The light-emitting area of described VECEL laser instrument 110 just and the surface of described plus lens on parallel surface, the laser that described VECEL laser instrument sends is not turned and is directly converged by described plus lens, and the light that described plus lens sends also will directly by described photoelectric detector.
Further, above-mentioned optical interface device 3 is MT tail optical fiber or MPO tail optical fiber, and the centre wavelength of above-mentioned optical interface device 3 is 850nm, and above-mentioned optical interface device 3 adopts four tunnels to receive the pattern of Guang He tetra-tunnel luminescence.
Concrete, as shown in Figure 3, above-mentioned eka-silicon platform device to be comprised: the surface of active device silicon platform 23, above-mentioned active device silicon platform 23 is provided with plus lens silicon platform 21 and optical fiber align silicon platform 22, above-mentioned plus lens silicon platform 21 is provided with above-mentioned plus lens 210, one side end face of above-mentioned active device silicon platform 23 is provided with above-mentioned laser dipole 110, photodetector 120, one end of above-mentioned fiber array 4 fixed by above-mentioned optical fiber align silicon platform 22, and the other end of above-mentioned fiber array 4 connects above-mentioned optical interface device 3.
When only there being above-mentioned fiber array 3 to send, converging through above-mentioned plus lens 210, being arrived the receipts unthreaded hole on above-mentioned photodetector 120 by the above-mentioned light hole 24 to eka-silicon platform device, completing light-receiving.
Better be mechanically connected eka-silicon platform device 2 in order to above-mentioned, the two ends of a side end face of above-mentioned active device silicon platform 23 are provided with fixation guide pin 25, and above-mentioned fixation guide pin 25 is separately positioned on the side of above-mentioned laser dipole 110 and photodetector 120.
Engine apparatus in embodiment 2 adopts face-down bonding packaging technology, is applicable to the project organization of high speed device transmission line, can carry out high speed, superfast transmission.As shown in Figure 2, this engine apparatus is also provided with the second PCB 201, and the driving chip 11 of above-mentioned laser dipole and the driving chip 12 of above-mentioned photodetector all face-down bonding are encapsulated in above-mentioned second PCB 11.Greatly improve transfer rate.
The aim that engine apparatus in above-described embodiment 1 and embodiment 2 runs in line with stabilizing device, adopt the mentality of designing that electricity is turned, by the high precision silicon platform that vertical plane emitting laser VCSEL face-down bonding is processed in autonomous Design, realize horizontal optical path, as shown in Figure 4, active device 1 light out becomes horizontal optical path through plus lens 210 to fiber array 3.Adopt this silicon platform effectively can regulate light path, reduce the hot spot angle of divergence.In addition, the design of this light hole 24 can avoid the direct crosstalk of each passage completely, reduces error code, improves the quality of communication.
In the above-described embodiments, the very high silicon technology of machining precision is adopted to realize packaging passive alignment.All light path part all rely on the mechanical linkages of high precision silicon platform, accurately control active part, the alignment precision (as Fig. 3) of lens assemblying part and fiber section.
Device of the present utility model adopts the silicon processing technique that accessible site degree is very high, and the effective dimensions of whole device can be narrowed down to a millimeter magnitude by applying silicon process technology, improves the integrated level of device.Said apparatus adopts passive passive coupling scheme, greatly simplify the complexity of assembling, has saved cost.And device of the present utility model adopts technique of alignment, can expand in the scheme of more speed, transplanting performance is good, effectively can solve a high-speed communication difficult problem for narrow space.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. the light that interconnects between packaging passive alignment High-Speed-Board transmitting-receiving engine apparatus, it comprise active device, for fixing described active device to eka-silicon platform device and optical interface device, it is characterized in that, the light transceiver channel of described active device is four-way, and described active device comprises: laser dipole and photodetector; Describedly to comprise eka-silicon platform device: plus lens and the optical fiber align silicon platform for fixed fiber array, described fiber array is fixed by described optical fiber align silicon platform and described optical interface device; Described fiber array sends light, converges through described plus lens, is arrived the receipts unthreaded hole on described photodetector, complete light-receiving by the described light hole to eka-silicon platform device.
2. the light that interconnects between packaging passive alignment High-Speed-Board according to claim 1 transmitting-receiving engine apparatus, it is characterized in that, described eka-silicon platform device to be comprised: active device silicon platform, the surface of described active device silicon platform is provided with plus lens silicon platform and described optical fiber align silicon platform, described plus lens silicon platform is provided with described plus lens, one side end face of described active device silicon platform is provided with described laser dipole, photodetector, one end of described fiber array fixed by described optical fiber align silicon platform, the other end of described fiber array connects described optical interface device.
3. the light that interconnects between packaging passive alignment High-Speed-Board according to claim 2 transmitting-receiving engine apparatus, it is characterized in that, the two ends of one side end face of described active device silicon platform are provided with fixation guide pin, and described fixation guide pin is separately positioned on the side of described laser dipole and photodetector; Also described fixation guide pin is provided with at the two ends of described plus lens and described optical fiber align silicon platform; Described laser dipole, photodetector, plus lens and fiber array align by described fixation guide pin, realize their packaging passive alignment.
4. the light that interconnects between packaging passive alignment High-Speed-Board according to claim 1 and 2 transmitting-receiving engine apparatus, it is characterized in that, also be provided with the first PCB, described first PCB is provided with groove, described active device is arranged in described groove, and the driving chip of described laser dipole and the driving chip of described photodetector are all connected in described first PCB by bonding gold thread.
5. the light that interconnects between packaging passive alignment High-Speed-Board according to claim 1 and 2 transmitting-receiving engine apparatus, it is characterized in that, also be provided with the second PCB, the driving chip of described laser dipole and the equal face-down bonding of driving chip of described photodetector are encapsulated in described second PCB, the silicon platform of described second PCB and the described laser dipole of placement or photodetector is furnished with circuit, and driver is connected with corresponding described laser dipole or photodetector by described circuit.
6. the light that interconnects between packaging passive alignment High-Speed-Board according to claim 1 transmitting-receiving engine apparatus, it is characterized in that, the wavelength of described laser dipole is 850nm, described laser dipole is by vertical plane Emission Lasers, described laser dipole is VECEL laser instrument, and the centre wavelength of described photodetector is 850nm; The silicon platform placing described VECEL laser instrument and photodetector is provided with 12 described light holes, described light hole and four-way VECEL laser instrument and four-way photodetector one_to_one corresponding; The light-emitting area of described VECEL laser instrument just and the surface of described plus lens on parallel surface, the laser that described VECEL laser instrument sends is not turned and is directly converged by described plus lens, and the light that described plus lens sends also will directly by described photoelectric detector.
7. the light that interconnects between packaging passive alignment High-Speed-Board according to claim 1 transmitting-receiving engine apparatus, it is characterized in that, described optical interface device is MT tail optical fiber or MPO tail optical fiber, and the centre wavelength of described optical interface device is 850nm, and described optical interface device adopts four tunnels to receive the pattern of Guang He tetra-tunnel luminescence.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521030820.1U CN205193319U (en) | 2015-12-11 | 2015-12-11 | It is passive to smooth engine device of receiving and dispatching of quasi high -speed inter -plate interconnection |
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| CN201521030820.1U CN205193319U (en) | 2015-12-11 | 2015-12-11 | It is passive to smooth engine device of receiving and dispatching of quasi high -speed inter -plate interconnection |
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| CN205193319U true CN205193319U (en) | 2016-04-27 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109254363A (en) * | 2018-11-08 | 2019-01-22 | 武汉光迅科技股份有限公司 | A kind of coupling packaging structure and method of upside-down mounting silicon optical chip |
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113534366A (en) * | 2021-08-13 | 2021-10-22 | 亨通洛克利科技有限公司 | High-density CPO silicon optical engine |
| CN114252965A (en) * | 2021-12-21 | 2022-03-29 | 中航光电科技股份有限公司 | Optical module |
-
2015
- 2015-12-11 CN CN201521030820.1U patent/CN205193319U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109254363A (en) * | 2018-11-08 | 2019-01-22 | 武汉光迅科技股份有限公司 | A kind of coupling packaging structure and method of upside-down mounting silicon optical chip |
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113534366A (en) * | 2021-08-13 | 2021-10-22 | 亨通洛克利科技有限公司 | High-density CPO silicon optical engine |
| CN114252965A (en) * | 2021-12-21 | 2022-03-29 | 中航光电科技股份有限公司 | Optical module |
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