CN107153236A - Optical module - Google Patents
Optical module Download PDFInfo
- Publication number
- CN107153236A CN107153236A CN201610125459.3A CN201610125459A CN107153236A CN 107153236 A CN107153236 A CN 107153236A CN 201610125459 A CN201610125459 A CN 201610125459A CN 107153236 A CN107153236 A CN 107153236A
- Authority
- CN
- China
- Prior art keywords
- reflected light
- light signal
- circuit board
- optical
- lens subassembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of optical module, including：Circuit board, the first lens subassembly, chip of laser, the first lens subassembly are located at the top of chip of laser；First lens subassembly includes the first optical fiber socket, the first reflecting surface and the second reflecting surface；First optical fiber socket is used to inserting the first optical fiber, and the first optical fiber socket axis projection on circuit boards without the effective light-emitting area of chip of laser center；First reflecting surface is used to receive the first incident optical signal that chip of laser is sent so that the first incident optical signal reflects in the first reflecting surface, obtains the first reflected light signal；Second reflecting surface is used to receive the first reflected light signal so that the first reflected light signal reflects in the second reflecting surface, obtains the second reflected light signal, and the second reflected light signal is passed through after the second lens subassembly by the reception of the first optical fiber.Above-mentioned optical module can realize that transmitting terminal, receiving terminal lens subassembly are individually encapsulated, and then improve the coupling efficiency of optical module transmitting terminal and receiving terminal.
Description
Technical field
The present embodiments relate to technical field of optical fiber communication, more particularly to a kind of optical module.
Background technology
SFP+ optical modules include the light emission secondary module for launching optical signal and the light for receiving optical signal
Secondary module is received, the lens subassembly of optical module encapsulates for integral type, and optical module as shown in Figure 1a includes light
The optical module lens subassembly 300 of emission secondary module 100, light-receiving secondary module 200, and integral type encapsulation,
In optical module lens subassembly 300, transmitting terminal lens subassembly corresponding with light emission secondary module includes driving chip
Drive and laser, receiving terminal lens subassembly corresponding with light-receiving secondary module include driving chip TIA and
Integral type is encapsulated on the circuit board pcb for detector PD, transmitting terminal lens subassembly and receiving terminal lens subassembly.
The integral type of optical module lens subassembly 300 encapsulates the light path coupling for causing light emission secondary module 100 and light-receiving
The light path coupling of secondary module 200 interferes restriction, reduces the overall coupling efficiency of optical module, adds
Couple difficulty.
In order to solve the above-mentioned technical problem, it is necessary to be light emission secondary module 100 and light-receiving on pcb board
The independent package lens component of secondary module 200, transmitting terminal lens subassembly and receiving terminal lens subassembly are on circuit boards
Independent encapsulation design structure schematic diagram as shown in Figure 1 b, but the driving chip in Fig. 1 b on PCB
Relative distance between TIA and driving chip Drive is too small, it is impossible to put the lens subassembly individually encapsulated
In the limited space of circuit board, because being limited by following two aspects factor：
First, in industry standard, transmitting optical port and the light-receiving secondary module 200 of light emission secondary module 100
It is definite value to receive the distance between optical port, in order to meet optical path requirements, as shown in Figure 1 a, 1 b, light hair
Penetrating the central shaft of secondary module 100 should align with the central shaft of laser, i.e., set in light emission secondary module 100
Optical fiber axis center of the projection Jing Guo the effective light-emitting area of chip of laser on circuit boards, laser
Interior signal Pad pin position is alignd with driving chip Drive signal Pad pin position, light-receiving secondary module 200
Central shaft should be alignd with the central shaft of detector, i.e., the axis of the optical fiber set in light-receiving secondary module exists
The signal Pad pin position that projection on circuit board is passed through in the center of the effective test surface of detector chip, detector
Alignd with driving chip TIA signal Pad pin position, due to driving chip TIA/Drive signal Pad pin
Position is not disposed on chip center, and the TIA/Drive of driving chip area is larger so that be encapsulated in printing
The relative distance between driving chip TIA and driving chip Drive on circuit board PCB only has 1.6mm；
Second, be light emission secondary module and the independent package lens component of light-receiving secondary module on pcb board by
Following condition limitation：(1) the part most thin-walled thickness of the encapsulation shield of single lens component is 0.3-0.4mm；
(2) single lens component is that mobile, reserved displacement is 0.6 to 0.8mm in coupling；(3)
Lens subassembly needs to use dispensing needle head to carry out dispensing in encapsulation and fixed, and the diameter of dispensing needle head is about
0.3-0.5mm；
To sum up, the relative distance between the driving chip TIA and driving chip Drive on PCB can not be met
Two lens subassemblies individually encapsulated are placed in limited space, transmitting terminal lens subassembly and receiving terminal are saturating
Mirror assembly can only be packaged as a whole formula on circuit boards.
To sum up, the transmitting terminal lens subassembly and receiving terminal lens subassembly of optical module are there is in the prior art in electricity
Integral type encapsulation is carried out on the plate of road, optical module optical coupling difficulty is increased, causes optical module that there is relatively low light
The technical problem of coupling efficiency.
The content of the invention
The embodiment of the present invention provides a kind of optical module, for solving optical module reflection end present in prior art
Integral type encapsulation is carried out on circuit boards with the lens subassembly of receiving terminal, causes optical module that there is relatively low optocoupler
Close the technical problem of efficiency.
The embodiment of the present invention provides a kind of optical module, at least includes：
Circuit board, the first lens subassembly, chip of laser, the chip of laser are mounted on the circuit board
On, first lens subassembly is located at the top of the chip of laser；First lens subassembly includes
First optical fiber socket, the first reflecting surface and the second reflecting surface；
First optical fiber socket, for inserting the first optical fiber, and first optical fiber axis described
Projection on circuit board without the effective light-emitting area of the chip of laser center；
First reflecting surface, the first incident optical signal for sending the chip of laser incides institute
The first reflecting surface is stated, and occurs reflection in first reflecting surface and obtains the first reflected light signal；
Second reflecting surface, for making first reflected light signal for inciding second reflecting surface exist
The second reflected light signal that reflection obtains entering first optical fiber occurs for second reflecting surface.
The embodiment of the present invention provides a kind of optical module, including：
Circuit board, the second lens subassembly, detector chip, the detector chip are mounted on the circuit board
On, second lens subassembly is located at the top of the detector chip；Second lens subassembly includes
The reflecting surface of second optical fiber socket the 3rd and the 4th reflecting surface；
Second optical fiber socket, for inserting the second optical fiber, and second optical fiber axis described
Projection on circuit board without the effective test surface of the detector chip center；
3rd reflecting surface, the second incident optical signal for receiving second optical fiber socket is incided
3rd reflecting surface, and obtain the 3rd reflected light signal in the 3rd reflecting surface generation reflection；
4th reflecting surface, the 3rd reflected light signal for making to incide the 4th reflecting surface exists
4th reflecting surface occurs reflection and obtains the 4th reflected light signal, and the 4th reflected light signal is through described
Received after second lens subassembly by the detector chip.
In optical module in above-described embodiment, the lens subassembly of transmitting terminal and the lens subassembly of receiving terminal are individually sealed
Dress, respective light path is interference-free, and then improves the coupling efficiency of optical module transmitting terminal and receiving terminal.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, institute in being described below to embodiment
The accompanying drawing needed to use is briefly introduced, it should be apparent that, drawings in the following description are only the present invention's
Some embodiments, for one of ordinary skill in the art, are not paying the premise of creative labor
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 a- Fig. 1 b are a kind of schematic diagram of optical module lens subassembly integral packaging of the prior art；
Fig. 2 is a kind of structural representation of optical module provided in an embodiment of the present invention；
A kind of Fig. 3 a structural representations of optical module provided in an embodiment of the present invention；
Fig. 3 b- Fig. 3 e are the optical module after a kind of transmitting terminal lens subassembly optimization provided in an embodiment of the present invention
Structural representation；
Fig. 4 is the optic path schematic diagram in a kind of first lens subassembly 31 provided in an embodiment of the present invention；
Fig. 5 is the optic path schematic diagram in a kind of first lens subassembly 31 provided in an embodiment of the present invention；
Fig. 6 a are a kind of structural representation of optical module provided in an embodiment of the present invention；
Fig. 6 b- Fig. 6 e are the knot of the receiving terminal lens subassembly 23 after a kind of optimization provided in an embodiment of the present invention
Structure schematic diagram；
Fig. 7 is the optic path schematic diagram in a kind of second lens subassembly 61 provided in an embodiment of the present invention；
Fig. 8 is the optic path schematic diagram in a kind of second lens subassembly 61 provided in an embodiment of the present invention；
Fig. 9 is a kind of structural representation of optical module provided in an embodiment of the present invention.
Embodiment
In order that the object, technical solutions and advantages of the present invention are clearer, below in conjunction with accompanying drawing to this hair
It is bright to be described in further detail, it is clear that described embodiment is only a part of embodiment of the invention,
Rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
Go out all other embodiment obtained under the premise of creative work, belong to the scope of protection of the invention.
In order to solve the lens subassembly of optical module reflection end and receiving terminal present in prior art in circuit board
Upper progress integral type encapsulation, increases optical module optical coupling difficulty, causes optical module to have relatively low optical coupling
The technical problem of efficiency.The embodiments of the invention provide a kind of optical module, the optical port of light emission secondary module is kept
It is definite value with the distance between the optical port of light-receiving secondary module, to laser and/or detector on circuit boards
Position is adjusted so that the center of effective light-emitting area of chip of laser and the effective test surface of detector chip
The distance between center be more than emission secondary module optical port and receive the distance between secondary module optical port, can be achieved
The lens subassembly of transmitting terminal and the lens subassembly of receiving terminal are individually encapsulated on circuit boards, in order to meet optical signal
Optical path requirements in lens subassembly, the structure of the lens subassembly individually encapsulated to transmitting terminal and/or receiving terminal is entered
Optimization is gone, i.e., the reflection in optical signal transmission direction can be changed by being set in the lens subassembly individually encapsulated
Face so that transmission path of the optical signal in lens subassembly meets optical path requirements, and the lens group of transmitting terminal
The lens subassembly of part and receiving terminal is because of individually encapsulation, and respective light path is interference-free, and then improves optical module
The coupling efficiency of transmitting terminal and receiving terminal.
Optical module provided in an embodiment of the present invention is described in detail below.
In the description of the invention, it is to be understood that term " " center ", " on ", " under ", " preceding ",
The orientation or position relationship of the instruction such as " rear ", " top ", " bottom ", " interior ", " outer " " vertical " " parallel " are
Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, without
It is that instruction or the signified system of hint or element must have specific orientation, with specific azimuth configuration and behaviour
Make, therefore be not considered as limiting the invention.In addition, term " first ", " second ", " the 3rd "
The system or element of instructions such as " the 4 " are the system or member with certain function described based on embodiment
Part, is for only for ease of the description present invention and simplifies description, rather than indicate or imply signified system or member
Part must have this name, therefore be not considered as limiting the invention.
As shown in Fig. 2 optical module provided in an embodiment of the present invention includes：On circuit board 20, circuit board 20
Transmitting terminal lens subassembly 21 and light emission secondary module 22, the receiving terminal lens subassembly 23 on circuit board 20
With light-receiving secondary module 24, transmitting terminal lens subassembly 21 is structure as a whole with light emission secondary module 22, receives
End lens subassembly 23 is structure as a whole with light-receiving secondary module 24.The optical port of light emission secondary module 22 is hair
Optical port is penetrated, the optical port of light-receiving secondary module 24 is reception optical port, it is ensured that between transmitting optical port and reception optical port
Distance be the axis of the first optical fiber set in definite value D, i.e. light emission secondary module 22 and light-receiving
The distance between axis of the second optical fiber set in module 24 is definite value, or, transmitting terminal lens group
The axis of first optical fiber socket of part 21 and the axis of the second optical fiber socket of receiving terminal lens subassembly 23
The distance between be the definite value.Transmitting terminal lens subassembly 21, receiving terminal lens subassembly 23 are circuit board 20
On the lens subassembly that individually encapsulates.
In a kind of preferred embodiment, transmitting terminal lens subassembly 21 is the lens subassembly after optimization, such as Fig. 3 a
Shown optical module, transmitting terminal lens subassembly 21, receiving terminal lens subassembly 23 are individually to be encapsulated on circuit board
Lens subassembly, transmitting terminal lens subassembly 21 includes the driving chip 33 of laser 30 and first, laser
Chip of laser 32 is provided with 30.Receiving terminal lens subassembly 23 includes detector 25 and detector
Detector chip is provided with driving chip 26, detector 25.Wherein, transmitting terminal lens subassembly 21 is excellent
The projection of the axis of the optical fiber set in lens subassembly after change, light emission secondary module 22 on circuit boards
It is used to insert without the center of the effective light-emitting area of chip of laser 32, that is, in transmitting terminal lens subassembly 21
Enter the optical fiber set in light emission secondary module 22 optical fiber socket axis projection on circuit boards without
Cross the center of the effective light-emitting area of chip of laser 32.And receiving terminal lens subassembly 23 is the lens group being not optimised
Detector core is passed through in the projection of the axis of the optical fiber set in part, light-receiving secondary module 24 on circuit boards
The center of the effective test surface of piece, that is, it is used to insert light-receiving secondary module 24 in receiving terminal lens subassembly 23
The projection of the axis of the optical fiber socket of the optical fiber of interior setting on circuit boards is effectively visited by detector chip
The center in survey face.Wherein, the optical signal into receiving terminal lens subassembly 23 is sent out in the reflecting surface of lens subassembly
A raw deviation can be received by detector chip, and its light path principle is prior art, is not repeated herein.
As shown in Figure 3 b, the transmitting terminal lens subassembly 21 after optimization includes：First lens subassembly 31, laser
Device chip 32, chip of laser 32 is mounted on circuit board 20, and the first lens subassembly 31 is located at laser
The top of device chip 32.
In Fig. 3 b, transmitting terminal lens subassembly 21 also includes the first driving chip 33, the first driving chip 33
It is mounted on circuit board 20；Chip of laser 32 is located at (attached in Fig. 3 a, Fig. 3 b, Fig. 3 e in laser
Icon be designated as 30 for laser), the first driving chip 33 passes through respective signal Pad with laser 30
Pin position electrical connection, the first lens subassembly 31 is located at the top of the driving chip 33 of laser 30 and first.
In actual applications, the area of the first driving chip 33 is larger, saturating in order to reserve encapsulation on circuit board 20
The space of mirror assembly, it is desirable to the signal Pad pin position of laser 30 and the signal Pad of the first driving chip 33
The alignment of pin position, is connected with most short signal wire, the position of the signal Pad pin position of usual first driving chip 33
Put the one end for being arranged on the first driving chip 33, rather than center.
Specifically, the driving chip 33 of chip of laser 32 and first is arranged on the first lens subassembly 31 and electricity
In the cavity that road plate 20 is constituted, the first incident optical signal that chip of laser 32 is sent enters first through cavity
Lens subassembly 31, such as Fig. 3 a.
In Fig. 3 b, the first lens subassembly 31 includes the first optical fiber socket 311, for inserting the first optical fiber,
And first optical fiber socket 311 projection of the axis on circuit board 20 it is effective without chip of laser 32
The center of light-emitting area；It should be noted that optical signal transmission to the light that the first optical fiber is used to receive is launched
The optical port of secondary module.Projection of the axis of first optical fiber socket 311 on circuit board 20 is without laser
The center of the effective light-emitting area of device chip 32, is by the position by laser device chip attachment on circuit board 20
Projection of the axis away from the first optical fiber socket 311 on circuit board 20 is put to realize, it is therefore an objective to
It is relative between expansion of laser light device driving chip and detector driving chip in the confined space of circuit board 20
Distance, transmitting terminal lens subassembly 21 and receiving terminal lens subassembly 23 are individually encapsulated.
The structure of first lens subassembly 31 is the structure after optimization so that enter the of the first lens subassembly 31
The optical signal that one incident optical signal occurs after multiple deviation, deviation in the first lens subassembly 31 passes through first
Optical fiber socket 311 enters in the first optical fiber.
In order to optimize the biography of the first incident optical signal that chip of laser 32 sends in the first lens subassembly 31
Road is lost, as shown in Figure 3 c, the first lens subassembly 31 includes the first reflecting surface 312 and the second reflecting surface 313,
So that the first incident optical signal into the first lens subassembly 31 successively reflects in the first reflecting surface 312, second
Face 313 occurs the optical signal after deviation, deviation and entered by the first optical fiber socket 311 in the first optical fiber.
First reflecting surface 312, for receiving the first incident optical signal that chip of laser 32 is sent so that the
One incident optical signal reflects in the first reflecting surface 312, obtains the first reflected light signal；
Second reflecting surface 313, for receiving the first reflected light signal so that the first reflected light signal is second
Reflecting surface 313 reflects, and obtains the second reflected light signal, and the second reflected light signal is saturating through described second
Received after mirror assembly by the first optical fiber.
It is preferred that, the first incident optical signal is totally reflected in the first reflecting surface 312, obtains the first reflected light
Signal；First reflected light signal is totally reflected in the second reflecting surface 313, obtains the second reflected light signal.
First incident optical signal is former in the light path that the first reflecting surface 312, the second reflecting surface 313 are totally reflected
Manage and be：The first incident optical signal for inciding the first reflecting surface 312 is totally reflected in the first reflecting surface 312
The first reflected light signal is obtained, the first reflected light signal is transmitted to the second reflecting surface 313, the first reflected light letter
Number occurring total reflection in the second reflecting surface 313 obtains the second reflected light signal, and the second reflected light signal passes through the
One optical fiber socket 311 is received by the first optical fiber.
In order that the reflection that the optical signal being incident on the first reflecting surface 312 and the second reflecting surface 313 occurs is
Total reflection, above-mentioned first lens subassembly 31 also includes the first cavity 314, as shown in Figure 3 c, the first cavity
314 be a groove of the upper surface of the first lens subassembly 31, and the first cavity 314 is saturating in taking-up encapsulation first
Formed during the withdrawing pattern body of mirror assembly 31, the first cavity 314 include multiple withdrawing pattern faces, the first reflecting surface 312,
Second reflecting surface 313 be multiple withdrawing pattern faces in can make into the first lens subassembly 31 the first incident light believe
Number light path occur deviation withdrawing pattern face.
Specifically, the withdrawing pattern face in the first cavity 314 of above-mentioned first lens subassembly 31 is as shown in Figure 3 d,
The bottom of first cavity 314 is included parallel to the first level withdrawing pattern face 511 of circuit board 20 and the second level
Withdrawing pattern face 512, the horizontal withdrawing pattern face 512 in first level withdrawing pattern face 511 and second is separated by a lug boss,
Lug boss side includes three withdrawing pattern faces, wherein, the inclined angle with the place plane of circuit board 20
One side withdrawing pattern face is the first withdrawing pattern face 513, two other side withdrawing pattern face and the phase of the first withdrawing pattern face 513
It is that the two are approximately perpendicular to circuit board 20 close to 90 degree to setting, and with the angle of circuit board 20
It is the second withdrawing pattern face 514, the phase in three sides withdrawing pattern face close to the first optical fiber socket in the withdrawing pattern face of side
Cross surface is the upper surface of lug boss, wherein, the first withdrawing pattern face 513 and the second withdrawing pattern face 514 can make entrance
Deviation occurs for the light path of the first incident optical signal of the first lens subassembly 31, into the first lens subassembly 31
First incident optical signal occurs to be totally reflected for the first time first in the first withdrawing pattern face 513, and reflection light is first anti-
Optical signal is penetrated, the first reflected light signal is incident on the second withdrawing pattern face 514 and in the second withdrawing pattern along reflection direction
Occur to be totally reflected for second on face 514, reflection light is the second reflected light signal, the second reflected light signal leads to
Cross and enter the first optical fiber after the first optical fiber socket 311.To sum up, the first reflecting surface 312 be Fig. 3 d in be located at
The first withdrawing pattern face 513 in first cavity 314, the second reflecting surface 313 is in the first cavity 314
Second withdrawing pattern face 514.
Wherein, the first withdrawing pattern face 513 and the angle of circuit board 20, and the second withdrawing pattern face 514 and circuit
The angle of plate 20, can be configured as needed, and the embodiment of the present invention is to this without limiting.
In a kind of preferred embodiment, as shown in figure 4, the first withdrawing pattern face 513 and the angle of circuit board 20
For 45 °, so that the first incident optical signal is totally reflected in the first withdrawing pattern face 513 so that the first incident light
The optical axis of signal obtains the first reflected light signal along 90 ° of the Plane Rotation perpendicular to circuit board 20, and first is anti-
The optical axis for penetrating optical signal is parallel with circuit board 20.Second withdrawing pattern face 514 is perpendicular to circuit board 20, and with
The angle for the plane that one incident optical signal, the first reflected light signal are constituted is 45 °, so that the first reflected light is believed
Number it is totally reflected in the second withdrawing pattern face 514 so that the optical axis of the first reflected light signal is along parallel to circuit board
20 90 ° of Plane Rotation obtains the second reflected light signal.
In view of in the packaging technology of actual first lens subassembly 31, withdrawing pattern body, second are taken out for convenience
Withdrawing pattern face 514 is tended not to perpendicular to circuit board 20, the second withdrawing pattern face 514 and the mitre joint of circuit board 20
Nearly 90 degree, in order to meet optical path requirements, the first withdrawing pattern face 513 is also corresponding to the angle of circuit board 20
Shift.
In a kind of optional embodiment, as shown in figure 5, the first withdrawing pattern face 513 and the angle of circuit board 20
For 45 ° of+α, so that the first incident optical signal is totally reflected in the first reflecting surface 312 so that first is incident
The optical axis edge of optical signal obtains the first reflected light signal perpendicular to 90 ° of+2 α of Plane Rotation of circuit board 20；The
Two withdrawing pattern faces 514 and the angle of circuit board 20 are 90 ° of+β, and with the first incident optical signal, the first reflected light
The angle for the plane that signal is constituted is 45 °, so that the first reflected light signal occurs entirely in the second withdrawing pattern face 514
Reflection so that the optical axis of the first reflected light signal is obtained along 90 ° of -2 β of Plane Rotation parallel to circuit board 20
Second reflected light signal；Wherein, α=± 3 °, β=± 2 °.
In order to improve the coupling efficiency of the first lens subassembly 31, the optical signal for sending chip of laser 32
The first reflecting surface 312 of the first lens subassembly 31, above-mentioned are incided with the direction perpendicular to circuit board 20
One lens subassembly 31 also includes：First lens 315, as shown in Fig. 3 d or 3e, the first lens subassembly
Small raised as the first lens 315 on 31.First lens 315, positioned at the top of chip of laser 32 (its
In, chip of laser 32 is arranged in Fig. 3 e laser 30), sent out for converging chip of laser 32
The first incident optical signal gone out, the first incident optical signal after convergence is entered with the light path perpendicular to circuit board 20
It is mapped on the first reflecting surface 312.
In order to improve the coupling efficiency of the first lens subassembly 31, make appeared from the first lens subassembly 31
Enter after the convergence of two reflected light signals in the first optical fiber, above-mentioned first lens subassembly 31 also includes：Second is saturating
Mirror.Second lens (not shown in accompanying drawing), at the first optical fiber socket 311, for second to be reflected
The first optical fiber is coupled into after optical signal convergence.
In above-mentioned optical module, meeting transmitting terminal lens subassembly 21, receiving terminal lens subassembly 23 can be in electricity
The condition individually encapsulated on road plate 20 is：Throwing of the axis of first optical fiber socket 311 on circuit board 20
The distance between the center of shadow and the effective light-emitting area of chip of laser 32 d is 0.3-1.2mm, such as Fig. 4 institutes
Show.In above-described embodiment, between the first driving chip 33 and detector driving chip of laser 30 away from
Deviation can reach more than 1.2mm, meet and transmitting terminal lens subassembly 21 is individually encapsulated on circuit board 20, is connect
Receiving end lens subassembly 23.
It is transmitting terminal lens subassembly 21, light emission secondary module 22 after optimizing, unexcellent in above-described embodiment
In the optical module that the receiving terminal lens subassembly 23 and light-receiving secondary module 24 of change are constituted, the transmitting terminal after optimization
Lens subassembly 21 and the receiving terminal lens subassembly 23 being not optimised are the lens subassembly individually encapsulated, by right
The position of chip of laser 32 in transmitting terminal lens subassembly 21 is adjusted, and chip of laser 32 is pasted
Projection of the axis for being located away from the first optical fiber socket 311 on circuit board 20 on circuit board 20,
To realize projection of the axis of the first optical fiber socket 311 on circuit board 20 without chip of laser 32
The center of effective light-emitting area, so that the driving chip 33 of chip of laser 32 and first is on circuit board 20
Integral position is away from transmitting optical port and receives the center line between optical port, so as to increase the of laser
The distance between one driving chip 33 and detector driving chip, larger space is reserved on circuit board 20,
And then realize the transmitting terminal lens subassembly 21 after optimization and the receiving terminal lens subassembly 23 being not optimised in circuit board
Upper individually encapsulation.It is improved by the structure to the first lens subassembly 31 in transmitting terminal lens subassembly 21,
First reflecting surface 312 and the second reflecting surface 313 are set in the first lens subassembly 31, for changing laser
Transmission light path of the first incident optical signal that chip 32 is sent in the first lens subassembly 31 so that enter
First incident optical signal of one lens subassembly 31 successively occurs in the first reflecting surface 312, the second reflecting surface 313
Optical signal after deviation, deviation is entered in the first optical fiber by the first optical fiber socket 311.Transmitting after optimization
End lens subassembly 21 is the lens subassembly individually encapsulated with the receiving terminal lens subassembly 23 being not optimised, each
Light path it is interference-free, and then improve the coupling efficiency of optical module transmitting terminal and receiving terminal.
In second of preferred embodiment, receiving terminal lens subassembly 23 is optimized so that transmitting terminal is saturating
Mirror assembly 21, receiving terminal lens subassembly 23 can individually be encapsulated on circuit board 20.
Optical module as shown in Figure 6 a, transmitting terminal lens subassembly 21, receiving terminal lens subassembly 23 are circuit board
On the lens subassembly that individually encapsulates, transmitting terminal lens subassembly 21 includes laser 28 and laser driving core
Piece 27, receiving terminal lens subassembly 23 includes the driving chip 63 of detector 60 and second.In detector 60
It is provided with detector chip 62, laser 28 and is provided with chip of laser.Wherein, receiving terminal lens group
Part 23 is the axis of the optical fiber set in the lens subassembly after optimization, light-receiving secondary module 24 in circuit board
On projection without the effective test surface of detector chip 62 center, that is, receiving terminal lens subassembly 23
In be used to inserting the axis of the optical fiber socket of the optical fiber set in light-receiving secondary module 24 on circuit boards
Project the center without the effective test surface of detector chip 62.And the light set in light emission secondary module 22
Center of the projection Jing Guo the effective light-emitting area of chip of laser 32 of fine axis on circuit boards, that is,
It is used to insert in the optical fiber socket of the optical fiber set in light emission secondary module 22 in transmitting terminal lens subassembly 21
Center of the projection Jing Guo the effective light-emitting area of chip of laser of axis on circuit boards.Wherein, into transmitting terminal
In the reflecting surface of lens subassembly deviation occurs for the optical signal of lens subassembly 21 can be by light emission secondary module
The optical fiber set in 22 is received, and its light path principle is prior art, is not repeated herein.
Transmitting terminal lens subassembly 21 is the lens subassembly being not optimised in the embodiment, chip of laser transmitting
Optical signal enters lens subassembly, and the first optical fiber can be entered by occurring a deviation in the reflecting surface of lens subassembly
In, projection of the axis of first optical fiber of setting on circuit board 20 is through too drastic in light emission secondary module 22
The center of the effective light-emitting area of light device chip.
In Fig. 6 a to Fig. 6 d, the receiving terminal lens subassembly 23 after optimization includes：
In Fig. 6 a, the second lens subassembly 61, detector chip 62, detector chip 62 are mounted on circuit
On plate 20, the second lens subassembly 61 is located at the top of detector chip 62.Receiving terminal lens subassembly 23
Also include the second driving chip 63, the second driving chip 63 is mounted on circuit board 20, detector chip
62 are located in detector (reference is 60 for detector in Fig. 6 a, Fig. 6 d, Fig. 6 e), and second drives
Dynamic chip 63 is electrically connected with detector 60 by respective signal Pad pin position, and the second lens subassembly 61 covers
It is located at the top of the driving chip 63 of detector 60 and second.In actual applications, the second driving chip 63
Area it is larger, in order to reserve the space of package lens component on circuit board 20, it is desirable to detector 60
Signal Pad pin position is alignd with the signal Pad pin position of the second driving chip 63, is connected with most short signal wire,
The position of the signal Pad pin position of usual second driving chip 63 is arranged on one end of the second driving chip 63,
Rather than center.
Shown in Fig. 6 b, the driving chip 63 of detector chip 62 and second be arranged on the second lens subassembly 61 with
In the cavity that circuit board 20 is constituted, the first incident optical signal that detector chip 62 is sent enters the through cavity
Two lens subassemblies 61.
Second lens subassembly 61 includes the second optical fiber socket 611, the second optical fiber socket 611, for inserting the
Two optical fiber, and the second optical fiber socket 611 projection of the axis on circuit board 20 without detector core
The center of the effective test surface of piece 62；It should be noted that the second optical fiber is used for the optical signal transmission of reception
To the second optical fiber socket 611.Projection of the axis of second optical fiber socket 611 on circuit board 20 without
The center of the effective light-emitting area of detector chip 62, is by the way that detector chip 62 is mounted on into circuit board 20
On the axis that is located away from the second optical fiber socket 611 projection on circuit board 20 realize, mesh
Be in the confined space of circuit board 20, between expansion of laser light device driving chip and detector driving chip
Relative distance, transmitting terminal lens subassembly 21 and receiving terminal lens subassembly 23 are individually encapsulated.
The structure of second lens subassembly 61 is the structure after optimization so that what the second optical fiber socket 611 was received
Second incident optical signal enters after the second lens subassembly 61, occurs multiple deviation in the second lens subassembly 61,
Optical signal after deviation is received by the detector chip 62 positioned at the lower section of the second lens subassembly 61.
In order to optimize the second incident optical signal of the second optical fiber socket 611 reception in the second lens subassembly 61
Transmission light path, as fig. 6 c, the second lens subassembly 61 includes the 3rd reflecting surface 612 and the 4th reflection
Face 613 so that enter the second lens subassembly 61 the second incident optical signal successively the 3rd reflecting surface 612,
The optical signal that 4th reflecting surface 613 occurs after deviation, deviation is received by detector chip 62.
3rd reflecting surface 612, for receiving the second incident optical signal, the second incident optical signal is to pass through second
Optical fiber socket 611 enters the incident optical signal of the second lens subassembly 61 so that the second incident optical signal is the
Three reflectings surface 612 reflect, and obtain the 3rd reflected light signal；4th reflecting surface 613, for receiving the
Three reflected light signals so that the 3rd reflected light signal reflects in the 4th reflecting surface 613, obtains the 4th anti-
Optical signal is penetrated, the 4th reflected light signal is received after passing through the second lens subassembly 61 by detector chip 62.
It is preferred that, the second incident optical signal is totally reflected in the 3rd reflecting surface 612, obtains the 3rd reflected light
Signal；3rd reflected light signal is totally reflected in the 4th reflecting surface 613, obtains the 4th reflected light signal.
Second incident optical signal is former in the light path that the 3rd reflecting surface 612, the 4th reflecting surface 613 are totally reflected
Manage and be：The second incident optical signal for inciding the 3rd reflecting surface 612 is totally reflected in the 3rd reflecting surface 612
The 3rd reflected light signal is obtained, the 3rd reflected light signal is transmitted to the 4th reflecting surface 613, the 3rd reflected light letter
Number occurring total reflection in the 4th reflecting surface 613 obtains the 4th reflected light signal, and the 4th reflected light signal passes through the
Received after two lens subassemblies 61 by detector chip 62.
In order that the reflection that the optical signal being incident on the 3rd reflecting surface 612 and the 4th reflecting surface 613 occurs is
Total reflection, above-mentioned second lens subassembly 61 also includes the second cavity 614, and the second cavity 614 is the second lens
One groove of the upper surface of component 61, the second cavity 614 is to take out pulling out for the second lens subassembly 61 of encapsulation
Formed during die body, the second cavity 614 includes multiple withdrawing pattern faces, the 3rd reflecting surface 612, the 4th reflecting surface
613 be the light path hair for the second incident optical signal that can make to enter the second lens subassembly 61 in multiple withdrawing pattern faces
The withdrawing pattern face of raw deviation.
Specifically, the withdrawing pattern face in the second cavity 614 of above-mentioned second lens subassembly 61 is as shown in fig 6d,
The bottom of second cavity 614 includes the 3rd horizontal level of withdrawing pattern face 811 and the 4th parallel to circuit board 20
Withdrawing pattern face 812, the 3rd horizontal withdrawing pattern face 812 in horizontal withdrawing pattern face 811 and the 4th is separated by a lug boss,
Lug boss side includes three withdrawing pattern faces, wherein, the angle of two sides withdrawing pattern face and to and circuit plate 20
Close to 90 degree, in the two side withdrawing pattern faces approximately perpendicular to circuit board 20, close to the second optical fiber socket
611 for the 3rd withdrawing pattern face 813, another side withdrawing pattern face is oppositely arranged with the two side withdrawing pattern faces,
And be the 4th withdrawing pattern face 814 with the inclined angle of place plane of circuit board 20, and three sides withdrawing pattern face
Intersection is the upper surface of lug boss, wherein, the 3rd withdrawing pattern face 813 and the 4th withdrawing pattern face 814 can make into
Deviation occurs for the light path for entering the second incident optical signal of the second lens subassembly 61, into the second lens subassembly 61
The second incident optical signal first the 3rd withdrawing pattern face 813 occur for the first time be totally reflected, reflection light be the 3rd
Reflected light signal, the 3rd reflected light signal is incident on the 4th withdrawing pattern face 814 along reflection direction and pulled out the 4th
Occur to be totally reflected for second in die face 814, reflection light is the 4th reflected light signal, the 4th reflected light signal
Through after the second lens subassembly 61 enter detector chip 62.To sum up, above-mentioned 3rd reflecting surface 612 is figure
It is located at the 3rd withdrawing pattern face 813 in the second cavity 614 in 6d, the 4th reflecting surface 613 is positioned at the second cavity
The 4th withdrawing pattern face 814 in 614.
Wherein, the 3rd withdrawing pattern face 813 and the angle of circuit board 20, and the 4th withdrawing pattern face 814 and circuit
The angle of plate 20, can be configured as needed, and the embodiment of the present invention is to this without limiting.
In a kind of preferred embodiment, as shown in fig. 7, the 3rd withdrawing pattern face 813 is perpendicular to circuit board 20, and
The angle of the plane constituted with the 4th reflected light signal, the 3rd reflected light signal is 45 °, so that second is incident
Optical signal is totally reflected in the 3rd withdrawing pattern face 813 so that the optical axis of the second incident optical signal is along parallel to electricity
90 ° of the Plane Rotation of road plate 20 obtains the 3rd reflected light signal；4th withdrawing pattern face 814 and circuit board 20
Angle be 45 ° so that the 3rd reflected light signal is totally reflected in the 4th withdrawing pattern face 814 so that the 3rd
The optical axis of reflected light signal obtains the 4th reflected light signal along 90 ° of the Plane Rotation perpendicular to circuit board 20,
The optical axis of 4th reflected light signal is vertical with circuit board 20.
In view of in the packaging technology of actual second lens subassembly 61, withdrawing pattern body, the 3rd are taken out for convenience
Withdrawing pattern face 813 is tended not to perpendicular to circuit board 20, the 3rd withdrawing pattern face 813 and the mitre joint of circuit board 20
Nearly 90 degree, in order to meet optical path requirements, the 4th withdrawing pattern face 814 is also corresponding to the angle of circuit board 20
Shift.
In a kind of optional embodiment, as shown in figure 8, the 3rd withdrawing pattern face 813 and the angle of circuit board 20
For 90 ° of+β, and the angle of the plane constituted with the 4th reflected light signal, the 3rd reflected light signal is 45 °,
So that the second incident optical signal is totally reflected in the 3rd withdrawing pattern face 813 so that the light of the second incident optical signal
Axle obtains the 3rd reflected light signal along 90 ° of -2 β of Plane Rotation parallel to circuit board 20；4th withdrawing pattern face
814 and the angle of circuit board 20 are 45 ° of+α, so that the 3rd reflected light signal occurs in the 4th withdrawing pattern face 814
Total reflection so that the optical axis of the 3rd reflected light signal along 90 ° of+2 α of Plane Rotation perpendicular to circuit board 20,
The 4th reflected light signal is obtained, the optical axis of the 4th reflected light signal is vertical with circuit board 20；Wherein,
α=± 3 °, β=± 2 °.
In order to improve the coupling efficiency of the second lens subassembly 61, make the into the second optical fiber socket 611
Two incident optical signals incide the second lens subassembly with the direction of the axis parallel to the second optical fiber socket 611
On 61 the 3rd reflecting surface 612, above-mentioned second lens subassembly 61 also includes the 4th lens, the 4th lens position
At the second optical fiber socket 611, the second incident optical signal for the second optical fiber socket 611 to be received is converged
After incide the 3rd reflecting surface 612.
In order to improve the coupling efficiency of the second lens subassembly 61, make the 4th through the second lens subassembly 61
Received after reflected light signal convergence by detector chip 62, it is saturating that above-mentioned second lens subassembly 61 also includes the 3rd
Mirror 615.3rd lens 615, positioned at the top of detector chip 62, (wherein, detector chip 62 is arranged on
In detector 60 in Fig. 6 e), for converging the 4th reflected light signal appeared from the second lens subassembly 61,
The 4th reflected light signal after convergence is received by detector chip 62.
In above-mentioned optical module, meeting transmitting terminal lens subassembly 21, receiving terminal lens subassembly 23 can be in electricity
The condition individually encapsulated on road plate 20 is：Throwing of the axis of second optical fiber socket 611 on circuit board 20
The distance between shadow and the center of the effective test surface of detector chip 62 d is that 0.3-1.2mm is as shown in Figure 7.
In above-described embodiment, the distance between second driving chip 63 and laser device driving chip of detector 60
Difference can reach more than 1.2mm, meet individually encapsulation transmitting terminal lens subassembly 21, the reception on circuit board 20
Hold lens subassembly 23.
In above-described embodiment, by the transmitting terminal lens subassembly 21 being not optimised, light emission secondary module 22, optimization
In the optical module that receiving terminal lens subassembly 23, light-receiving secondary module 24 afterwards is constituted, the transmitting terminal being not optimised
Receiving terminal lens subassembly 23 after lens subassembly 21 and optimization is the lens subassembly individually encapsulated, by right
The position of detector chip 62 in receiving terminal lens subassembly 23 is adjusted, and detector chip 62 is pasted
Projection of the axis for being located away from the second optical fiber socket 611 on circuit board 20 on circuit board 20,
To realize projection of the axis of the second optical fiber socket 611 on circuit board 20 without detector chip 62
The center of effective test surface, so that the driving chip 63 of detector chip 62 and second is on circuit board 20
Integral position is away from transmitting optical port and receives the center line between optical port, so as to increase laser driving
The distance between chip and the second driving chip of detector 63, larger space is reserved on circuit board 20,
And then realize the receiving terminal lens subassembly 23 after the transmitting terminal lens subassembly 21 being not optimised and optimization in circuit board
Upper individually encapsulation.It is improved by the structure to the second lens subassembly 61 in receiving terminal lens subassembly 23,
3rd reflecting surface 612 and the 4th reflecting surface 613 are set in the second lens subassembly 61, it is saturating for changing second
The second incident optical signal that second optical fiber socket 611 of mirror assembly 61 is received is in the second lens subassembly 61
Transmit light path so that enter the second incident optical signal of the second lens subassembly 61 successively in the 3rd reflecting surface
612nd, the optical signal that the 4th reflecting surface 613 occurs after deviation, deviation is received by detector chip 62.It is unexcellent
Receiving terminal lens subassembly 23 after the transmitting terminal lens subassembly 21 of change and optimization is the lens group individually encapsulated
Part, respective light path is interference-free, and then improves the coupling efficiency of optical module transmitting terminal and receiving terminal.
In the third preferred embodiment, transmitting terminal lens subassembly 21 is the transmitting after above-described embodiment optimizes
Lens subassembly 21 is held, receiving terminal lens subassembly 23 is that the lens subassembly receiving terminal after above-described embodiment optimizes is saturating
Mirror assembly 23, as shown in figure 9, transmitting terminal lens subassembly 21 includes the driving core of laser 30 and first
Chip of laser 32 is provided with piece 33, laser 30.It is used to insert light in transmitting terminal lens subassembly 21
The projection of the axis of first optical fiber socket of the first optical fiber set in emission secondary module 22 on circuit boards
Without the center of the effective light-emitting area of chip of laser 32.Receiving terminal lens subassembly 23 includes detector 60
With the second driving chip 63, detector chip 62, receiving terminal lens subassembly 23 are provided with detector 60
In be used for the axis for inserting the second optical fiber socket of the second optical fiber set in light-receiving secondary module 24 in electricity
Projection on the plate of road without the effective test surface of detector chip 62 center.Pass through having in circuit board 20
Limit the relative distance between expansion of laser light device driving chip and detector driving chip in space so that transmitting terminal
Lens subassembly 21, receiving terminal lens subassembly 23 can individually be encapsulated on circuit board 20.Transmitting after optimization
The particular content of the receiving terminal lens subassembly 23 after lens subassembly 21 and optimization is held referring to above-described embodiment, this
Place is not repeated.Transmitting terminal lens subassembly 21 after optimization and the receiving terminal lens subassembly 23 after optimization are
The lens subassembly individually encapsulated, respective light path is interference-free, and then improves optical module transmitting terminal and reception
The coupling efficiency at end.
, but those skilled in the art once know base although preferred embodiments of the present invention have been described
This creative concept, then can make other change and modification to these embodiments.So, appended right will
Ask and be intended to be construed to include preferred embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification without departing from this hair to the present invention
Bright spirit and scope.So, if the present invention these modifications and variations belong to the claims in the present invention and
Within the scope of its equivalent technologies, then the present invention is also intended to comprising including these changes and modification.
Claims (10)
1. a kind of optical module, it is characterised in that at least include：
Circuit board, the first lens subassembly, chip of laser, the chip of laser are mounted on the circuit board
On, first lens subassembly is located at the top of the chip of laser；First lens subassembly includes
First optical fiber socket, the first reflecting surface and the second reflecting surface；
First optical fiber socket, for inserting the first optical fiber, the axis of first optical fiber socket is in institute
State center of the projection on circuit board without the effective light-emitting area of the chip of laser；
First reflecting surface, for receiving the first incident optical signal that the chip of laser is sent so that
First incident optical signal reflects in first reflecting surface, obtains the first reflected light signal；
Second reflecting surface, for receiving first reflected light signal so that the first reflected light letter
Number reflected in second reflecting surface, obtain the second reflected light signal, second reflected light signal is saturating
Cross after second lens subassembly by first optical fiber reception.
2. optical module as claimed in claim 1, it is characterised in that first lens subassembly also includes：
First lens, the second lens and the first cavity；
First lens, above the chip of laser, send for converging the chip of laser
First incident optical signal, first incident optical signal after convergence is with perpendicular to the circuit board
Light path is incided on first reflecting surface；
Second lens, at first optical fiber socket, for second reflected light signal to be converged
First optical fiber is coupled into after poly-；
First reflecting surface is the first withdrawing pattern face in first cavity, and second reflecting surface is
The second withdrawing pattern face in first cavity.
3. optical module as claimed in claim 2, it is characterised in that
The angle of the first withdrawing pattern face and the circuit board is 45 °, so that first incident optical signal exists
The first withdrawing pattern face is totally reflected so that the optical axis of first incident optical signal is along perpendicular to the electricity
90 ° of the Plane Rotation of road plate obtains first reflected light signal, the optical axis of first reflected light signal with
The circuit board is parallel；
The second withdrawing pattern face perpendicular to the circuit board, and with first incident optical signal, described first
The angle for the plane that reflected light signal is constituted is 45 °, so that first reflected light signal is pulled out described second
Die face is totally reflected so that plane of the optical axis edge of first reflected light signal parallel to the circuit board
It is rotated by 90 ° and obtains second reflected light signal.
4. optical module as claimed in claim 2, it is characterised in that
The angle of the first withdrawing pattern face and the circuit board is 45 ° of+α, so that first incident optical signal
It is totally reflected in first reflecting surface so that the optical axis of first incident optical signal is along perpendicular to described
90 ° of+2 α of Plane Rotation of circuit board obtains first reflected light signal；
The angle of the second withdrawing pattern face and the circuit board is 90 ° of+β, and with first incident optical signal,
The angle for the plane that first reflected light signal is constituted is 45 °, so that first reflected light signal is in institute
State the second withdrawing pattern face to be totally reflected so that the optical axis of first reflected light signal is along parallel to the circuit
90 ° of -2 β of Plane Rotation of plate, obtains second reflected light signal；Wherein, α=± 3 °, β=± 2 °.
5. the optical module as described in claim 3 or 4, it is characterised in that first optical fiber socket
Axis on the circuit board projection the center of the effective light-emitting area of the chip of laser between away from
From for 0.3-1.2mm.
6. a kind of optical module, it is characterised in that including：
Circuit board, the second lens subassembly, detector chip, the detector chip are mounted on the circuit board
On, second lens subassembly is located at the top of the detector chip；Second lens subassembly includes
The reflecting surface of second optical fiber socket the 3rd and the 4th reflecting surface；
Second optical fiber socket, for inserting the second optical fiber, and the axis of second optical fiber socket exists
Projection on the circuit board without the effective test surface of the detector chip center；
3rd reflecting surface, for receiving the second incident optical signal, second incident optical signal is to pass through
Second optical fiber socket enters the incident optical signal of second lens subassembly so that second incident light
Signal reflects in the 3rd reflecting surface, obtains the 3rd reflected light signal；
4th reflecting surface, for receiving the 3rd reflected light signal so that the 3rd reflected light letter
Number reflected in the 4th reflecting surface, obtain the 4th reflected light signal, the 4th reflected light signal is saturating
Received after crossing second lens subassembly by the detector chip.
7. optical module as claimed in claim 6, it is characterised in that
Second lens subassembly also includes：3rd lens, the 4th lens and the second cavity；
3rd lens, above the detector chip, for converging the 4th reflected light signal,
The 4th reflected light signal after convergence is received by the detector chip；
4th lens, at second optical fiber socket, for second optical fiber socket to be received
Second incident optical signal convergence after incide the 3rd reflecting surface；
3rd reflecting surface is the 3rd withdrawing pattern face in second cavity, and the 4th reflecting surface is
The 4th withdrawing pattern face in second cavity.
8. optical module as claimed in claim 7, it is characterised in that
The 3rd withdrawing pattern face perpendicular to the circuit board, and with the 4th reflected light signal, the described 3rd
The angle for the plane that reflected light signal is constituted is 45 °, so that second incident optical signal is pulled out the described 3rd
Die face is totally reflected so that plane of the optical axis edge of second incident optical signal parallel to the circuit board
It is rotated by 90 ° and obtains the 3rd reflected light signal；
The angle of the 4th withdrawing pattern face and the circuit board is 45 °, so that the 3rd reflected light signal exists
The 4th withdrawing pattern face is totally reflected so that the optical axis of the 3rd reflected light signal is along perpendicular to the electricity
90 ° of the Plane Rotation of road plate obtains the 4th reflected light signal, the optical axis of the 4th reflected light signal with
The circuit board is vertical.
9. optical module as claimed in claim 7, it is characterised in that
The angle of the 3rd withdrawing pattern face and the circuit board is 90 ° of+β, and with the 4th reflected light signal,
The angle for the plane that 3rd reflected light signal is constituted is 45 °, so that second incident optical signal is in institute
State the 3rd withdrawing pattern face to be totally reflected so that the optical axis of second incident optical signal is along parallel to the circuit
90 ° of -2 β of Plane Rotation of plate, obtains the 3rd reflected light signal；
The angle of the 4th withdrawing pattern face and the circuit board is 45 ° of+α, so that the 3rd reflected light signal
It is totally reflected in the 4th withdrawing pattern face so that the optical axis of the 3rd reflected light signal is along perpendicular to described
90 ° of+2 α of Plane Rotation of circuit board, obtains the 4th reflected light signal, the 4th reflected light signal
Optical axis is vertical with the circuit board；Wherein, α=± 3 °, β=± 2 °.
10. optical module as claimed in claim 8 or 9, it is characterised in that second optical fiber socket
Axis on the circuit board projection the center of the effective test surface of the detector chip between away from
From for 0.3-1.2mm.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610125459.3A CN107153236B (en) | 2016-03-04 | 2016-03-04 | Optical module |
| US15/289,333 US10185103B2 (en) | 2016-03-04 | 2016-10-10 | Optical module |
| EP16207471.0A EP3214472B1 (en) | 2016-03-04 | 2016-12-30 | Optical module |
| US16/119,236 US10678003B2 (en) | 2016-03-04 | 2018-08-31 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610125459.3A CN107153236B (en) | 2016-03-04 | 2016-03-04 | Optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107153236A true CN107153236A (en) | 2017-09-12 |
| CN107153236B CN107153236B (en) | 2019-06-14 |
Family
ID=59792278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610125459.3A Active CN107153236B (en) | 2016-03-04 | 2016-03-04 | Optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107153236B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109521519A (en) * | 2018-11-29 | 2019-03-26 | 武汉电信器件有限公司 | A kind of packaging system and optical system of array waveguide grating |
| CN112099159A (en) * | 2019-06-17 | 2020-12-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112492139A (en) * | 2018-12-24 | 2021-03-12 | 华为技术有限公司 | Camera shooting assembly and electronic equipment |
| CN113946021A (en) * | 2020-07-17 | 2022-01-18 | 英属维京群岛商祥茂光电科技股份有限公司 | Optical communication system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030053222A1 (en) * | 2001-09-19 | 2003-03-20 | Togami Chris K. | Compact optical assembly for optoelectronic transceivers |
| US20050175350A1 (en) * | 2004-01-26 | 2005-08-11 | Robert Hartzell | Electronic interface for long reach optical transceiver |
| CN203204202U (en) * | 2013-05-10 | 2013-09-18 | 青岛海信宽带多媒体技术有限公司 | Integrated optical element and optical module |
| US8923670B2 (en) * | 2009-11-11 | 2014-12-30 | Samtec, Inc. | Molded optical structure for optical transceiver |
| CN104375244A (en) * | 2013-08-16 | 2015-02-25 | 鸿富锦精密工业（深圳）有限公司 | Optical communication module |
-
2016
- 2016-03-04 CN CN201610125459.3A patent/CN107153236B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030053222A1 (en) * | 2001-09-19 | 2003-03-20 | Togami Chris K. | Compact optical assembly for optoelectronic transceivers |
| US20050175350A1 (en) * | 2004-01-26 | 2005-08-11 | Robert Hartzell | Electronic interface for long reach optical transceiver |
| US8923670B2 (en) * | 2009-11-11 | 2014-12-30 | Samtec, Inc. | Molded optical structure for optical transceiver |
| CN203204202U (en) * | 2013-05-10 | 2013-09-18 | 青岛海信宽带多媒体技术有限公司 | Integrated optical element and optical module |
| CN104375244A (en) * | 2013-08-16 | 2015-02-25 | 鸿富锦精密工业（深圳）有限公司 | Optical communication module |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109521519A (en) * | 2018-11-29 | 2019-03-26 | 武汉电信器件有限公司 | A kind of packaging system and optical system of array waveguide grating |
| CN109521519B (en) * | 2018-11-29 | 2020-07-14 | 武汉电信器件有限公司 | Packaging device and optical system of array waveguide grating |
| CN112492139A (en) * | 2018-12-24 | 2021-03-12 | 华为技术有限公司 | Camera shooting assembly and electronic equipment |
| US11489993B2 (en) | 2018-12-24 | 2022-11-01 | Huawei Technologies Co., Ltd. | Camera assembly and electronic device |
| CN112099159A (en) * | 2019-06-17 | 2020-12-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113946021A (en) * | 2020-07-17 | 2022-01-18 | 英属维京群岛商祥茂光电科技股份有限公司 | Optical communication system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107153236B (en) | 2019-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100749528B1 (en) | Optical interconnection module and manufacturing method thereof | |
| WO2019184100A1 (en) | Optical module | |
| CN107153236A (en) | Optical module | |
| US8447149B2 (en) | Optoelectronic transmission device | |
| CN106597616A (en) | Optical module | |
| CN202083815U (en) | Photic transmit-receive assembly for parallel transmission | |
| CN101226261A (en) | Method for coupling optical fiber and face type photoelectricity chip as well as structure thereof | |
| CN102169216A (en) | Parallel light transceiver component for broadband high-speed transmission | |
| CN212031793U (en) | Optical module | |
| CN108776373A (en) | Optical module | |
| CN107153235A (en) | A kind of optical network unit | |
| CN104898215A (en) | Simple coupled parallel light transmit-receive engine used for interconnection between boards | |
| CN108646356A (en) | A kind of optical module | |
| CN106443907B (en) | A kind of ipsilateral optical device of transmitting-receiving | |
| CN105093430B (en) | The optical module of optical coupling element and application optical coupling element | |
| CN108072940A (en) | Optical module | |
| CN205193319U (en) | It is passive to smooth engine device of receiving and dispatching of quasi high -speed inter -plate interconnection | |
| CN105137554A (en) | Optical module | |
| CN105589141B (en) | A kind of optical module | |
| CN208140986U (en) | A kind of optical transceiver module for AOC active optical cable | |
| CN110244414A (en) | A kind of optical module | |
| CN206584081U (en) | One kind transmitting-receiving homonymy optical device | |
| JP2003107302A (en) | Optical transmitter/receiver | |
| CN106199859B (en) | Integrating optical transmit-receive module and preparation method thereof | |
| CN106483609A (en) | A kind of optical module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |