CN203811852U - Chip array and parallel optical fiber passive coupled optical assembly - Google Patents
Chip array and parallel optical fiber passive coupled optical assembly Download PDFInfo
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- CN203811852U CN203811852U CN201420183477.3U CN201420183477U CN203811852U CN 203811852 U CN203811852 U CN 203811852U CN 201420183477 U CN201420183477 U CN 201420183477U CN 203811852 U CN203811852 U CN 203811852U
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Abstract
The utility model discloses a chip array and parallel optical fiber passive coupled optical assembly. The optical assembly comprises an optical fiber array component, a coupling alignment locating block, a lens array, a chip carrier and a photoelectric chip array. The optical fiber array component comprises a fixed base and a plurality of parallel optical fibers. The lens array comprises a lens body, a second lens array surface, a first lens array surface and a reflecting surface. The photoelectric chip array is pasted on the chip carrier. The coupling alignment locating block is located on the chip carrier. The lens array is located at one side of the optical fiber array component. The lens array and the optical fiber array component are located on the coupling alignment locating block together. The lens array and the coupling alignment locating block, and the lens array and the fixed base are located in a way that a guide column and a guide hole are fixed in an insertion way. The optical assembly is simple in structure and is low in manufacturing cost. Rapid coupling with high precision and high quality can be achieved through the optical assembly. The optical assembly is suitable for various products employing the parallel optical fiber technology.
Description
Technical field
The utility model relates to active optical cable technology field, specifically relates to the optical assembly of a kind of chip array and the passive coupling of parallel optical fibre.
Background technology
In order to adapt to the day by day increase of people to communication bandwidth requirements, increase transmission capacity and reduce the most important thing that power consumption is fiber optic communication field, parallel optical fibre technology is growing thus.Utilize at present parallel optical fibre technology major product to have QSFP optical module, thunder and lightning (Thunderbolt) cable, the active HDMI cable of light etc.The principal character of parallel optical technology is in an independent device or module, to have multi-path laser diode or photodiode to aim at multi-channel optical fibre.Therefore, how multi-channel optical fibre is aimed at multi-path laser diode or photodiode simultaneously, this just relates to coupling alignment method.
As Fig. 8 has disclosed the classic method that a kind of chip array and parallel optical fibre are coupled and aligned: multi-channel optical fibre utilizes V-type grain or MPO/MT lock pin to be processed into optical-fiber array assembly 1, the lens arra 3 that first fiber array is coupled and aligned is fixing, and lens arra is made up of two groups of lens and one 45 degree catoptron.Chip array 5 is fixed on chip carrier, and at transmitting terminal, light signal that VCSEL chip array sends is coupled to and in multidiameter delay optical fiber, realizes electric light conversion through lens arra; Receiving end face, the light signal of multidiameter delay optical fiber is coupled in PD chip array through lens arra, realizes opto-electronic conversion.
In technique scheme, due to can not high-precision positioning optical waveguides array, chip array and lens arra, so fiber array, being coupled and aligned between chip array and lens arra substantially all adopts active coupling method (Active alignment) to realize, at emitting facet by VCSEL chip array is switched on, make its work send light signal, photodetection instrument by being connected to multidiameter delay optical fiber detects the light intensity receiving in real time as light power meter, adjust platform fixture by multidimensional and repeatedly adjust the relative position between VCSEL chip array and lens arra, make the light signal strength receiving reach maximum, then use method fixed lens array and the fiber arrays such as UV glue or laser bonding, realize being accurately coupled and aligned of multidiameter delay optical fiber and VCSEL chip array.In like manner, be coupled and aligned by real-time detection PD chip array light stream intensity at reception end face.Be coupled and aligned although this method can reach the high precision of photoelectric chip array and multidiameter delay optical fiber, shortcoming is also apparent: complex process, the number of working processes is long, poor reliability etc.
Summary of the invention
In order to solve the problems of the technologies described above, the utility model proposes the optical assembly of a kind of chip array and the passive coupling of parallel optical fibre, this optical assembly is simple in structure, and cost of manufacture is low, can realize the high-quality quick coupling of high precision by this optical assembly, solve the existing parallel optical fibre complex process that initiatively coupling alignment method exists, the problem of length consuming time, and alignment precision is high, and coupling efficiency is high, be easy to realize, be applicable to the product of various employing parallel optical fibre technology.
The technical solution of the utility model is achieved in that
An optical assembly for chip array and the passive coupling of parallel optical fibre, comprises an optical-fiber array assembly, be coupled and aligned locating piece, a lens arra, a chip carrier and at least one photoelectric chip array with multiple photoelectric conversion regions, described optical-fiber array assembly comprises that a holder and positioned at intervals are arranged in the multidiameter delay optical fiber in described holder, described lens arra comprises that a lens body, vertical direction are embedded in second lens arra face, the horizontal direction corresponding with multiple photoelectric conversion regions in described lens body and are embedded in and between described the second lens arra face and described first lens array surface, roll over first lens array surface corresponding to multidiameter delay optical fiber and the light path that makes being embedded in described lens body the reflecting surface turning 90 degrees in described lens body, multiple photoelectric conversion regions of described photoelectric chip array are mounted on described chip carrier upward, described photoelectric chip array and the required drive circuit chip electrical connection being connected on described chip carrier, the described locating piece that is coupled and aligned is positioned on described chip carrier, described lens arra is positioned a side of described optical-fiber array assembly, described in being positioned jointly, described lens arra and described optical-fiber array assembly be coupled and aligned on locating piece, and described lens arra and described in be coupled and aligned between locating piece, between described lens arra and described holder, position by guide posts and the guide hole fixing mode of planting, multiple photoelectric conversion regions second lens arra face corresponding with it is coupled and aligned, the first lens array surface that multidiameter delay optical fiber is corresponding with it is coupled and aligned.
As further improvement of the utility model, described lens arra is provided with two the first guide posts towards a side of described holder, corresponding each the first guide posts, described holder is provided with first guide hole matching with described the first guide posts towards a side of described lens arra, two described the first guide holes are positioned at the both sides of multidiameter delay optical fiber, two described the first guide posts are positioned at the both sides of described first lens array surface, and multidiameter delay optical fiber matches at a distance of the distance of two the first guide posts at a distance of distance and the first lens array surface of two the first guide holes, described the first guide posts is inserted in described the first guide hole, and fix by glue bond.
As further improvement of the utility model, described lens arra is provided with two the second guide posts towards a side of the described locating piece that is coupled and aligned, corresponding each the second guide posts, the described locating piece that is coupled and aligned is provided with second guide hole matching with described the second guide posts towards a side of described lens arra, two described the second guide posts are positioned at the both sides of described the second lens arra face, two described the second guide holes are positioned at the both sides of photoelectric chip array, multiple photoelectric conversion regions of photoelectric chip array match at a distance of the distance of two the second guide posts with the second corresponding lens arra face at a distance of the distance of two the second guide holes, described the second guide posts is inserted in described the second guide hole, and fix by glue bond.
As further improvement of the utility model, the described locating piece that is coupled and aligned is provided with four the 3rd guide posts towards four jiaos an of side of described chip carrier, corresponding each the 3rd guide posts, described chip carrier is provided with the 3rd guide hole matching with described the 3rd guide posts, described the 3rd guide posts is inserted in described the 3rd guide hole, and fixes by glue bond.
As further improvement of the utility model, the described locating piece that is coupled and aligned comprises spaced two stop blocks, is connected in spaced two back-up blocks and two fixed blocks between two described stop blocks, two described fixed blocks are fixed in the wherein intersection of a back-up block and two described stop blocks, and two described fixed blocks are positioned at a side of another back-up block dorsad, and each fixed block is provided with described second guide hole; Described lens arra and described optical-fiber array assembly are located on two described back-up blocks, and the both sides backstop of described lens arra and described optical-fiber array assembly is between two described stop blocks; The bottom interval of each described stopper is provided with two described the 3rd guide posts.
As further improvement of the utility model, large 2 microns to 9 microns than the radial dimension of described the first guide posts of the radial dimensions of described the first guide hole, large 2 microns to 9 microns than the radial dimension of described the second guide posts of the radial dimensions of described the second guide hole.
The beneficial effects of the utility model are: the utility model provides the optical assembly of a kind of chip array and the passive coupling of parallel optical fibre, lens arra and being coupled and aligned between locating piece, between lens arra and holder, position by guide posts and the guide hole fixing mode of planting, can make multiple photoelectric conversion regions second lens arra face corresponding to it be coupled and aligned, the first lens array surface that multidiameter delay optical fiber is corresponding with it is coupled and aligned; And by guide posts being inserted to the selection of the degree of depth in guide hole, can realize adjustment and the optimization of distance between photoelectric chip array and lens arra, to reach optimistic coupling efficiency.Such as realizing adjustment and the optimization of distance between the luminous zone of VCSEL chip array or PD chip array induction zone and first lens array surface.Therefore, what the utility model can be simple realizes being coupled and aligned of photoelectric chip array and multidiameter delay optical fiber, and alignment precision is high, and coupling efficiency is high, is easy to realize, and is applicable to the product of various employing parallel optical fibre technology.Compare existing parallel optical fibre coupling alignment method, the utility model photoelectric chip array and multidiameter delay optical fiber adopt the method for passive coupling, have production technology simple, without extra instrument and equipment, cost of manufacture is low, and reliability is high, and the multiple advantage such as short consuming time is coupled and aligned.Preferably, lens arra is provided with two the first guide posts towards a side of holder, holder is provided with one and first the first guide hole that match of guide posts towards a side of described lens arra, owing to thering is the first guide posts and coordinating of the first guide hole guiding and positioning action, when assembling lens array and holder, only two the first guide posts need be inserted in two corresponding the first guide holes and can realize being coupled and aligned of multidiameter delay optical fiber and first lens array surface, therefore, can reduce being coupled and aligned the time of multidiameter delay optical fiber and lens arra.Preferably, lens arra is provided with two the second guide posts towards a side of the locating piece that is coupled and aligned, the locating piece that is coupled and aligned is provided with one and second the second guide hole that match of guide posts towards a side of lens arra, owing to thering is the second guide posts and coordinating of the second guide hole guiding and positioning action, assembling lens array is when being coupled and aligned locating piece, only two the second guide posts need be inserted in two corresponding the second guide holes and can realize multiple photoelectric conversion regions of photoelectric chip array and being coupled and aligned of first lens array surface, therefore, can reduce being coupled and aligned the time of lens arra and photoelectric chip array.Preferably, the locating piece that is coupled and aligned is provided with four the 3rd guide posts towards four jiaos an of side of chip carrier, chip carrier is provided with four the 3rd guide holes that match with the 3rd guide posts, cooperation by four the 3rd guide posts with corresponding the 3rd guide hole, and fix and can realize the locating piece that will be coupled and aligned and be positioned on chip carrier by glue bond.When concrete enforcement, four of the locating piece that is coupled and aligned the 3rd guide posts are aimed at and are inserted in four the 3rd guide holes of chip carrier, then fixing with epoxy glue.Preferably, can realize the function of positioning lens array and optical-fiber array assembly by two stop blocks and two back-up blocks.Like this, assembling lens array is when being coupled and aligned locating piece, only the second guide posts of lens arra need be inserted in the second guide hole being coupled and aligned on locating piece, then fix with glue, the high precision that can complete between photoelectric chip array and lens arra is coupled and aligned, insert the degree of depth in the second guide hole by adjusting the second guide posts, can realize adjustment and the optimization of distance between the luminous zone/light-sensitive surface of photoelectric chip array and the second lens arra face of lens arra, thereby obtain optimum coupling efficiency.Preferably, large 2 microns to 9 microns than the radial dimension of the first guide posts of the radial dimensions of the first guide hole, large 2 microns to 9 microns than the radial dimension of the second guide posts of the radial dimensions of the second guide hole.Like this, can make the first guide posts and the first guide hole, the quality of fit between the second guide posts and the second guide hole reaches a micron utmost point, so that make the first guide posts penetrate smoothly the first guide hole and the second guide posts penetrates the second guide hole smoothly.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model decomposition texture schematic diagram;
Fig. 3 is the utility model chips carrier and the locating piece assembling schematic diagram that is coupled and aligned;
Fig. 4 is photoelectric chip array and drive circuit chip assembling schematic diagram in the utility model;
Fig. 5 is optical-fiber array assembly and lens arra assembling schematic diagram in the utility model;
Fig. 6 is lens arra and the locating piece assembling schematic diagram that is coupled and aligned in the utility model;
Fig. 7 is the index path of the utility model chip array and multidiameter delay coupling fiber;
Fig. 8 is the schematic diagram that prior art chip array and parallel optical fibre are coupled and aligned.
By reference to the accompanying drawings, make the following instructions:
1---optical-fiber array assembly 11---holder
111---first guide hole 12---multidiameter delay optical fiber
2---locating piece 21 is coupled and aligned---second guide hole
22---the 3rd guide posts 23---stop block
24---back-up block 25---fixed block
3---lens arra 31---lens body
32---second lens arra face 33---first lens array surface
34---reflecting surface 35---first guide posts
36---second guide posts 4---chip carrier
41---drive circuit chip 42---the 3rd guide hole
5---photoelectric chip array 51---photoelectric conversion region
Embodiment
As depicted in figs. 1 and 2, an optical assembly for chip array and the passive coupling of parallel optical fibre, comprise an optical-fiber array assembly 1, be coupled and aligned locating piece 2, a lens arra 3, a chip carrier 4 and at least one have multiple photoelectric conversion region 51(as the luminous zone of VCSEL chip array or/and the photosensitive area of PD chip array) photoelectric chip array 5(as VCSEL chip array or/and PD chip array), described optical-fiber array assembly comprises that a holder 11 and positioned at intervals are arranged in the multidiameter delay optical fiber 12 in described holder, described lens arra comprises that a lens body 31, vertical direction are embedded in second lens arra face 32, the horizontal direction corresponding with multiple photoelectric conversion regions in described lens body and are embedded in and between described the second lens arra face and described first lens array surface, roll over first lens array surface 33 corresponding to multidiameter delay optical fiber and the light path that makes being embedded in described lens body the reflecting surface 34 turning 90 degrees in described lens body, multiple photoelectric conversion regions of described photoelectric chip array are mounted on described chip carrier upward, and described photoelectric chip array is electrically connected with the required drive circuit chip being connected 41 on described chip carrier, the described locating piece that is coupled and aligned is positioned on described chip carrier, described lens arra is positioned a side of described optical-fiber array assembly, described in being positioned jointly, described lens arra and described optical-fiber array assembly be coupled and aligned on locating piece, and described lens arra and described in be coupled and aligned between locating piece, between described lens arra and described holder, position by guide posts and the guide hole fixing mode of planting, multiple photoelectric conversion regions second lens arra face corresponding with it is coupled and aligned, the first lens array surface that multidiameter delay optical fiber is corresponding with it is coupled and aligned.In said structure, lens arra and being coupled and aligned between locating piece, between lens arra and holder, position by guide posts and the guide hole fixing mode of planting, can make multiple photoelectric conversion regions second lens arra face corresponding to it be coupled and aligned, the first lens array surface that multidiameter delay optical fiber is corresponding with it is coupled and aligned; And by guide posts being inserted to the selection of the degree of depth in guide hole, can realize adjustment and the optimization of distance between photoelectric chip array and lens arra, to reach optimistic coupling efficiency.Such as realizing adjustment and the optimization of distance between the luminous zone of VCSEL chip array or PD chip array induction zone and first lens array surface.Can be by the relative position of high precision die bonder control photoelectric chip array and the locating piece that is coupled and aligned when concrete enforcement, then coordinate (reaching a micron utmost point) by the guide posts on the locating piece that is coupled and aligned, lens arra, optical-fiber array assembly with guide hole high precision between any two, reach being coupled and aligned between photoelectric chip array and multidiameter delay optical fiber.Therefore, what the utility model can be simple realizes being coupled and aligned of photoelectric chip array and multidiameter delay optical fiber, and alignment precision is high, and coupling efficiency is high, is easy to realize, and is applicable to the product of various employing parallel optical fibre technology.Compare existing parallel optical fibre coupling alignment method, the utility model photoelectric chip array and multidiameter delay optical fiber adopt the method for passive coupling, have production technology simple, without extra instrument and equipment, cost of manufacture is low, and reliability is high, and the multiple advantage such as short consuming time is coupled and aligned.
Preferably, described lens arra is provided with two the first guide posts 35 towards a side of described holder, corresponding each the first guide posts, described holder is provided with first guide hole 111 matching with described the first guide posts towards a side of described lens arra, two described the first guide holes are positioned at the both sides of multidiameter delay optical fiber, two described the first guide posts are positioned at the both sides of described first lens array surface, and multidiameter delay optical fiber matches at a distance of the distance of two the first guide posts at a distance of distance and the first lens array surface of two the first guide holes, described the first guide posts is inserted in described the first guide hole, and fix by glue bond.Like this, owing to thering is the first guide posts and coordinating of the first guide hole guiding and positioning action, when assembling lens array and holder, only two the first guide posts need be inserted in two corresponding the first guide holes and can realize being coupled and aligned of multidiameter delay optical fiber and first lens array surface, therefore, can reduce being coupled and aligned the time of multidiameter delay optical fiber and lens arra.
Preferably, described lens arra is provided with two the second guide posts 36 towards a side of the described locating piece that is coupled and aligned, corresponding each the second guide posts, the described locating piece that is coupled and aligned is provided with second guide hole 21 matching with described the second guide posts towards a side of described lens arra, two described the second guide posts are positioned at the both sides of described the second lens arra face, two described the second guide holes are positioned at the both sides of photoelectric chip array, multiple photoelectric conversion regions of photoelectric chip array match at a distance of the distance of two the second guide posts with the second corresponding lens arra face at a distance of the distance of two the second guide holes, described the second guide posts is inserted in described the second guide hole, and fix by glue bond.Like this, owing to thering is the second guide posts and coordinating of the second guide hole guiding and positioning action, assembling lens array is when being coupled and aligned locating piece, only two the second guide posts need be inserted in two corresponding the second guide holes and can realize multiple photoelectric conversion regions of photoelectric chip array and being coupled and aligned of first lens array surface, therefore, can reduce being coupled and aligned the time of lens arra and photoelectric chip array.
Preferably, the described locating piece that is coupled and aligned is provided with four the 3rd guide posts 22 towards four jiaos an of side of described chip carrier, corresponding each the 3rd guide posts, described chip carrier is provided with the 3rd guide hole 42 matching with described the 3rd guide posts, described the 3rd guide posts is inserted in described the 3rd guide hole, and fixes by glue bond.Like this, the cooperation by four the 3rd guide posts with corresponding the 3rd guide hole, and fix and can realize the locating piece that will be coupled and aligned and be positioned on chip carrier by glue bond.When concrete enforcement, four of the locating piece that is coupled and aligned the 3rd guide posts are aimed at and are inserted in four the 3rd guide holes of chip carrier, then fixing with epoxy glue.In order to control cost, the dimensional accuracy of these four the 3rd guide posts and four the 3rd guide holes does not need too high, within be controlled at ± 0.1mm, is advisable.
Preferably, the described locating piece that is coupled and aligned comprises spaced two stop blocks 23, is connected in spaced two back-up blocks 24 and two fixed blocks 25 between two described stop blocks, two described fixed blocks are fixed in the wherein intersection of a back-up block and two described stop blocks, and two described fixed blocks are positioned at a side of another back-up block dorsad, and each fixed block is provided with described second guide hole; Described lens arra and described optical-fiber array assembly are located on two described back-up blocks, and the both sides backstop of described lens arra and described optical-fiber array assembly is between two described stop blocks; The bottom interval of each described stopper is provided with two described the 3rd guide posts.Can realize the function of positioning lens array and optical-fiber array assembly by two stop blocks and two back-up blocks.Like this, assembling lens array is when being coupled and aligned locating piece, only the second guide posts of lens arra need be inserted in the second guide hole being coupled and aligned on locating piece, then fix with glue, the high precision that can complete between photoelectric chip array and lens arra is coupled and aligned, insert the degree of depth in the second guide hole by adjusting the second guide posts, can realize adjustment and the optimization of distance between the luminous zone/light-sensitive surface of photoelectric chip array and the second lens arra face of lens arra, thereby obtain optimum coupling efficiency.
Preferably, large 2 microns to 9 microns than the radial dimension of described the first guide posts of the radial dimensions of described the first guide hole, large 2 microns to 9 microns than the radial dimension of described the second guide posts of the radial dimensions of described the second guide hole.Like this, can make the first guide posts and the first guide hole, quality of fit between the second guide posts and the second guide hole reaches a micron utmost point, so that make the first guide posts penetrate smoothly the first guide hole and the second guide posts penetrates the second guide hole smoothly, the too small guide posts of guide hole cannot be inserted, excessive words guide posts and guide hole cannot accurately be located, cause coupling efficiency poor or inconsistent, the core diameter of the multimode optical fiber that the general experienced slip-stick artist of the industry can be coupled as required and VCSEL luminous zone diameter and angle also have the diameter of PD light-sensitive surface specifically to determine diameter and the tolerance of circular hole.
The assemble method of the optical assembly of the utility model chip array and the passive coupling of parallel optical fibre, comprises the steps:
A) make described optical-fiber array assembly, the locating piece that is coupled and aligned, lens arra, chip carrier and photoelectric chip array;
B) four of the locating piece that is coupled and aligned the 3rd guide posts are inserted in four the 3rd guide holes corresponding on chip carrier, and be glued fixing;
C), taking two the second guide holes of the fixed block that is coupled and aligned as benchmark, adopt high precision die bonder that photoelectric chip array and drive circuit chip are fixed on the desired location of chip carrier; And by the mode of gold thread bonding, photoelectric chip array is electrically connected with drive circuit chip;
D) two of lens arra the first guide posts are inserted in two the first guide holes corresponding on holder, and be glued fixing;
E) the second guide posts of lens arra is inserted in the second guide hole corresponding on the locating piece that is coupled and aligned, and is glued fixing.
By as above step, can realize the passive of optical assembly is coupled and aligned, compared with being initiatively coupled and aligned with traditional optical assembly, major advantage has: the relative position by high precision die bonder control photoelectric chip array with the locating piece that is coupled and aligned, then coordinate (reaching a micron utmost point) by the guide posts on the locating piece that is coupled and aligned, lens arra, optical-fiber array assembly with guide hole high precision between any two, reach being coupled and aligned between photoelectric chip array and multidiameter delay optical fiber.Whole process production technology is simple, high conformity, and reliability is high, without extra instrument and equipment, has reduced the time of being coupled and aligned greatly.
Preferably, described in be coupled and aligned locating piece and described lens arra form by high-precision mold injection molding, material is engineering plastics.
Preferably, described holder is the MPO joints of optical fibre, forms by high-precision mold injection molding, and material is engineering plastics.
Taking VCSEL chip array and multidiameter delay coupling fiber as example, further illustrate by reference to the accompanying drawings the manufacturing process of the passive coupling light assembly of the utility model chip array and parallel optical fibre below:
The first step, referring to Fig. 4, aims at four the 3rd guide posts 22 of the locating piece 2 that is coupled and aligned to insert in four the 3rd guide posts 42 of chip carrier 4, and fixes with epoxy glue.
Second step, referring to Fig. 5, taking two the second guide holes 21 of the locating piece 2 that is coupled and aligned as benchmark, use high precision die bonder drive circuit chip 41 and VCSEL chip array 5 to be mounted to the desired location of chip carrier 4, be that VCSEL chip array 5 is between two fixed blocks 25 of the locating piece 2 that is coupled and aligned, while mounting, make the luminous zone of VCSEL chip array 5 upward, and by the mode of gold thread bonding, VCSEL chip array 5 chips and drive circuit chip 41 are electrically connected.
The 3rd step, referring to Fig. 6, the holder 11 of optical-fiber array assembly 1 is to utilize high-precision mold injection molding to form, material is engineering plastics, be provided with the circular hole that fixing multidiameter delay optical fiber is used above, the diameter of circular hole is for coordinating the design of bare fibre diameter, as bare fibre diameter be 0.125mm, Circularhole diameter is generally advisable with 0.126-0.127mm, and spacing and VCSEL chip array 5 channel pitch between circular hole are consistent.When multidiameter delay optical fiber 12 and holder 11 are assembled, first multidiameter delay optical fiber 12 is decorticated, cutting, then skinned bare fibre is penetrated in the circular hole on holder 11, and fix with epoxy glue, in order to improve light path coupling efficiency, reduce reflection, further can grind fiber end face, even plate anti-reflection film.
In the time of lens arra 3 profile modular design, adjust distance (controlling the distance between first lens array surface 33 and multidiameter delay optical fiber 12 end faces) between first lens array surface 33 and lens body 31 outside surfaces to reach optimistic coupling efficiency according to optical coupling efficiency analog result.When assembling lens array 3 and optical-fiber array assembly 1, the first guide posts 35 of lens arra 3 one sides is inserted in the first guide hole 111 corresponding on the holder 11 of optical-fiber array assembly 1, and fix with glue, make between multidiameter delay optical fiber 12 and the each passage of lens arra 3 corresponding being coupled and aligned one by one, reach optimistic coupling efficiency.
The 4th step, referring to Fig. 7, the second guide posts 36 of lens arra 3 opposite sides is inserted in second guide hole 21 of upper correspondence of the locating piece 2 that is coupled and aligned, and fix with glue, the high precision that can complete between photoelectric chip array 5 and multidiameter delay optical fiber 12 is coupled and aligned, can realize the distance between luminous zone and the second lens arra face 32 of lens arra 3 of adjusting VCSEL chip array 5 by the be coupled and aligned hole depth (i.e. distance between the baseplane of the second guide hole 21 and chip carrier 4 upper surfaces) of the second guide hole 21 on locating piece 2 of adjustment, thereby obtain optimum coupling efficiency.
Referring to Fig. 3, for VCSEL chip array 5 and the index path of multidiameter delay optical fiber 12 passive couplings, the light that VCSEL chip array 5 sends collimates after the second lens arra face 32 of lens arra, after the reflecting surface 34 of lens arra 3, light path folding turn 90 degrees, then by focusing on the end face of multidiameter delay optical fiber 12 after first lens array surface 33, thereby reach being coupled and aligned of VCSEL chip array 5 and multidiameter delay optical fiber 12.
Above embodiment is with reference to accompanying drawing, and preferred embodiment of the present utility model is elaborated.Those skilled in the art is by above-described embodiment being carried out to amendment or the change on various forms, but do not deviate from the situation of essence of the present utility model, within all dropping on protection domain of the present utility model.
Claims (6)
1. an optical assembly for chip array and the passive coupling of parallel optical fibre, is characterized in that: comprise an optical-fiber array assembly (1), be coupled and aligned locating piece (2), a lens arra (3), a chip carrier (4) and at least one photoelectric chip array (5) with multiple photoelectric conversion regions (51), described optical-fiber array assembly comprises that a holder (11) and positioned at intervals are arranged in the multidiameter delay optical fiber (12) in described holder, described lens arra comprises that a lens body (31), vertical direction are embedded in second lens arra face (32), the horizontal direction corresponding with multiple photoelectric conversion regions in described lens body and are embedded in and between described the second lens arra face and described first lens array surface, roll over first lens array surface (33) corresponding to multidiameter delay optical fiber and the light path that makes being embedded in described lens body the reflecting surface (34) turning 90 degrees in described lens body, multiple photoelectric conversion regions of described photoelectric chip array are mounted on described chip carrier upward, described photoelectric chip array and the required drive circuit chip being connected (41) electrical connection on described chip carrier, the described locating piece that is coupled and aligned is positioned on described chip carrier, described lens arra is positioned a side of described optical-fiber array assembly, described in being positioned jointly, described lens arra and described optical-fiber array assembly be coupled and aligned on locating piece, and described lens arra and described in be coupled and aligned between locating piece, between described lens arra and described holder, position by guide posts and the guide hole fixing mode of planting, multiple photoelectric conversion regions second lens arra face corresponding with it is coupled and aligned, the first lens array surface that multidiameter delay optical fiber is corresponding with it is coupled and aligned.
2. the optical assembly of chip array according to claim 1 and the passive coupling of parallel optical fibre, it is characterized in that: described lens arra is provided with two the first guide posts (35) towards a side of described holder, corresponding each the first guide posts, described holder is provided with first guide hole (111) matching with described the first guide posts towards a side of described lens arra, two described the first guide holes are positioned at the both sides of multidiameter delay optical fiber, two described the first guide posts are positioned at the both sides of described first lens array surface, and multidiameter delay optical fiber matches at a distance of the distance of two the first guide posts at a distance of distance and the first lens array surface of two the first guide holes, described the first guide posts is inserted in described the first guide hole, and fix by glue bond.
3. the optical assembly of chip array according to claim 2 and the passive coupling of parallel optical fibre, it is characterized in that: described lens arra is provided with two the second guide posts (36) towards a side of the described locating piece that is coupled and aligned, corresponding each the second guide posts, the described locating piece that is coupled and aligned is provided with second guide hole (21) matching with described the second guide posts towards a side of described lens arra, two described the second guide posts are positioned at the both sides of described the second lens arra face, two described the second guide holes are positioned at the both sides of photoelectric chip array, multiple photoelectric conversion regions of photoelectric chip array match at a distance of the distance of two the second guide posts with the second corresponding lens arra face at a distance of the distance of two the second guide holes, described the second guide posts is inserted in described the second guide hole, and fix by glue bond.
4. the optical assembly of chip array according to claim 3 and the passive coupling of parallel optical fibre, it is characterized in that: described in the locating piece that is coupled and aligned be provided with four the 3rd guide posts (22) towards four jiaos an of side of described chip carrier, corresponding each the 3rd guide posts, described chip carrier is provided with the 3rd guide hole (42) matching with described the 3rd guide posts, described the 3rd guide posts is inserted in described the 3rd guide hole, and fixes by glue bond.
5. the optical assembly of chip array according to claim 4 and the passive coupling of parallel optical fibre, it is characterized in that: described in the locating piece that is coupled and aligned comprise spaced two stop blocks (23), be connected in spaced two back-up blocks (24) and two fixed blocks (25) between two described stop blocks, two described fixed blocks are fixed in the wherein intersection of a back-up block and two described stop blocks, and two described fixed blocks are positioned at a side of another back-up block dorsad, and each fixed block is provided with described second guide hole; Described lens arra and described optical-fiber array assembly are located on two described back-up blocks, and the both sides backstop of described lens arra and described optical-fiber array assembly is between two described stop blocks; The bottom interval of each described stopper is provided with two described the 3rd guide posts.
6. the optical assembly of chip array according to claim 5 and the passive coupling of parallel optical fibre, it is characterized in that: large 2 microns to 9 microns than the radial dimension of described the first guide posts of the radial dimensions of described the first guide hole, large 2 microns to 9 microns than the radial dimension of described the second guide posts of the radial dimensions of described the second guide hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420183477.3U CN203811852U (en) | 2014-04-15 | 2014-04-15 | Chip array and parallel optical fiber passive coupled optical assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420183477.3U CN203811852U (en) | 2014-04-15 | 2014-04-15 | Chip array and parallel optical fiber passive coupled optical assembly |
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| CN203811852U true CN203811852U (en) | 2014-09-03 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103780199A (en) * | 2014-01-24 | 2014-05-07 | 江苏大学 | Developable roofing automatic sunny type solar energy utilization system |
| CN103885140A (en) * | 2014-04-15 | 2014-06-25 | 昆山柯斯美光电有限公司 | Chip array and parallel optical fiber passively-coupled optical assembly and assembling method of chip array and parallel optical fiber passively-coupled optical assembly |
| CN109633837A (en) * | 2019-02-01 | 2019-04-16 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2014
- 2014-04-15 CN CN201420183477.3U patent/CN203811852U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103780199A (en) * | 2014-01-24 | 2014-05-07 | 江苏大学 | Developable roofing automatic sunny type solar energy utilization system |
| CN103885140A (en) * | 2014-04-15 | 2014-06-25 | 昆山柯斯美光电有限公司 | Chip array and parallel optical fiber passively-coupled optical assembly and assembling method of chip array and parallel optical fiber passively-coupled optical assembly |
| CN103885140B (en) * | 2014-04-15 | 2016-05-11 | 昆山柯斯美光电有限公司 | The optical assembly of chip array and the passive coupling of parallel optical fibre and assemble method thereof |
| CN109633837A (en) * | 2019-02-01 | 2019-04-16 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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