CN103257414B - For the parallel light transceiver component of broadband high-speed transmission - Google Patents
For the parallel light transceiver component of broadband high-speed transmission Download PDFInfo
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- CN103257414B CN103257414B CN201310164198.2A CN201310164198A CN103257414B CN 103257414 B CN103257414 B CN 103257414B CN 201310164198 A CN201310164198 A CN 201310164198A CN 103257414 B CN103257414 B CN 103257414B
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Abstract
The present invention relates to the parallel light transceiver component for broadband high-speed transmission, one end of first printed circuit board (PCB) forms signal input port, second printed circuit board surface encapsulation TIA trans-impedance amplifier, laser driving chip, PD photodetector array and VCSEL vertical cavity emitting laser array, fiber array front end is placed in optical fiber fixation kit, and fiber array is aimed at PD photodetector array and VCSEL vertical cavity emitting laser array couples; Optical fiber fixation kit comprises pedestal, optical fiber orientation bridgeware base plate and overlay, optical fiber orientation bridgeware backplate surface is provided with sloping platform rank, top bar and be carved with V-type groove, get out of a predicament or an embarrassing situation as plane, the naked fibre of fiber array is placed in V-type groove, it is stamped overlay, and optical fiber orientation bridgeware base plate is connected by fixing glue with overlay and pedestal.Adopt rigid-flex combination technology, adopt active alignment techniques to carry out optical coupled to VCSEL laser array and PD photodetector array.
Description
Technical field
The present invention relates to the parallel light transceiver component of broadband high-speed transmission, particularly relate to a kind of parallel light transceiver component for broadband high-speed transmission and optical fiber fixture thereof.
Background technology
Along with the raising required signal high-speed transfer, parallel light transceiver component arises at the historic moment.Parallel optical module is the mutual conversion realizing multi-channel electric signal and light signal in a monomer structure, thus realizes transmission-receiving function.Because device is integrated and miniaturization brings high bandwidth density and low-power consumption, make the transmission bandwidth of parallel optical module and use power consumption to be greatly better than multiple discrete device, thus improve the transmission performance of system.
But the existence of multiple discrete component makes the rigging error that allows during parallel optical module package less, alignment precision requires higher, ensures that high coupling efficiency is had higher requirement in encapsulation.Existing technology to be equipped with the surface-mounted integrated circuit such as TIA trans-impedance amplifier, Driver driving and to be equipped with the optical assembly final comprising modules with module housing again such as Lens lens arra and other optical conenctors of PD photodetector array, VCSEL vertical cavity emitting laser array, relevant coupled fiber.Encapsulating structure is complicated, and difficulty of processing is large, and the process time is long, and cost is high.
Summary of the invention
The object of the invention is the deficiency overcoming prior art existence, a kind of parallel light transceiver component for broadband high-speed transmission is provided.
Object of the present invention is achieved through the following technical solutions:
For the parallel light transceiver component of broadband high-speed transmission, feature is: comprise the first printed circuit board (PCB), the second printed circuit board (PCB), the soft board connecting the first printed circuit board (PCB) and the second printed circuit board (PCB), TIA trans-impedance amplifier, laser driving chip, PD photodetector array, VCSEL vertical cavity emitting laser array, fiber array and optical fiber fixation kit; One end of described first printed circuit board (PCB) forms the signal input port of a gold-plated board plug structure, second printed circuit board surface encapsulation TIA trans-impedance amplifier, laser driving chip, PD photodetector array and VCSEL vertical cavity emitting laser array, fiber array front end is placed in optical fiber fixation kit, and fiber array is aimed at PD photodetector array and VCSEL vertical cavity emitting laser array couples;
Described optical fiber fixation kit comprises pedestal, optical fiber orientation bridgeware base plate and overlay, optical fiber orientation bridgeware backplate surface is provided with sloping platform rank, top bar and be carved with V-type groove, get out of a predicament or an embarrassing situation as plane, the naked fibre of fiber array is placed in V-type groove, it is stamped overlay, and the naked fine length that the front end of fiber array is exposed is consistent with length of topping bar, and optical fiber orientation bridgeware base plate and overlay and pedestal are glued at one by fixing glue.
Further, the above-mentioned parallel light transceiver component for broadband high-speed transmission, described fiber array comprises more than eight and the optical fiber of parallel equidistant arrangement, and the naked fibre that the front end of optical fiber is exposed is placed in the V-type groove of optical fiber orientation bridgeware base plate.
Further, the above-mentioned parallel light transceiver component for broadband high-speed transmission, described fiber array is divided equally two groups, its coupling surface with man-to-man mode respectively with the active center regional alignment of PD photodetector array and VCSEL vertical cavity emitting laser array.
Again further, the above-mentioned parallel light transceiver component for broadband high-speed transmission, the homonymy of described VCSEL vertical cavity emitting laser array is placed with rectangular parallelepiped pad.
The substantive distinguishing features that technical solution of the present invention is outstanding and significant progress are mainly reflected in:
The present invention devises a kind of simple broadband high-speed transmission parallel light transceiver component, adopt the manufacturing technology that unique rigid-flex combines, active alignment techniques is adopted to carry out optical coupled to VCSEL laser array and PD photodetector array, eliminate the use of optical lens, and make use of optical fiber fixture more easily, achieve the optical package of high coupling efficiency, reduce the technology difficulty of photoelectric component array placement accuracy and photoelectric component and Fiber connection, and improve assembled fault tolerance, cut down finished cost, be more suitable for mass production applications.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, technical solution of the present invention is described further:
Fig. 1: structural representation of the present invention;
Fig. 2: packaging of photoelectric device structural representation;
Fig. 3: the structural representation of optical fiber fixation kit.
Embodiment
As shown in Figure 1, for the parallel light transceiver component of broadband high-speed transmission, comprise the first printed circuit board (PCB) 1, second printed circuit board (PCB) 2, connect the soft board 3 of the first printed circuit board (PCB) 1 and the second printed circuit board (PCB) 2, TIA trans-impedance amplifier 6, laser driving chip 7, PD photodetector array 8, VCSEL vertical cavity emitting laser array 9, fiber array 5 and optical fiber fixation kit 4; One end of first printed circuit board (PCB) 1 forms the signal input port of a gold-plated board plug structure, as shown in Figure 2, second printed circuit board (PCB) 2 surface is by gold thread bonding pattern encapsulation TIA trans-impedance amplifier 6, laser driving chip 7, PD photodetector array 8 and VCSEL vertical cavity emitting laser array 9, fiber array 5 front end is placed in optical fiber fixation kit 4, and fiber array 5 is coupled and aligned with PD photodetector array 8 and VCSEL vertical cavity emitting laser array 9 and carries out Signal transmissions.
As shown in Figure 3, optical fiber fixation kit 4 comprises pedestal 12, optical fiber orientation bridgeware base plate 11 and overlay 13, and pedestal 12 is provided with screw, fixes for pedestal; Optical fiber orientation bridgeware base plate 11 surface is provided with sloping platform rank, top bar and be carved with V-type groove, get out of a predicament or an embarrassing situation as plane, the naked fibre of fiber array 5 is placed in V-type groove, it is stamped overlay 13, the naked fine length that the front end of fiber array 5 is exposed is consistent with length of topping bar, and optical fiber orientation bridgeware base plate 11 is glued at one with overlay 13 and pedestal 12 by fixing glue.During use, first front end is leaked and had the fiber array 5 of naked fibre to be placed on optical fiber orientation bridgeware base plate 11 and be mated, coating UV fixing glue, put overlay 13, and optical fiber orientation is adjusted and the solidification of UV fixing glue simultaneously, and then utilize UV fixing glue to be bonded with pedestal 12 by the optical fiber orientation bridgeware base plate 11 with fiber array 5, and optical fiber orientation is adjusted and the solidification of UV fixing glue, finally pedestal 12 and the rigid-flex that carries photoelectric component are fixed by the draw-in groove place gluing in pedestal front. simultaneously
Wherein, fiber array 5 comprises more than eight and the optical fiber of parallel equidistant arrangement, the naked fibre that the front end of optical fiber is exposed is placed in the V-type groove of optical fiber orientation bridgeware base plate 11, and the high coupling efficiency realized between the center, effective coverage of photoelectric component array and fiber array by optical fiber fixation kit 4 is controlled.
Fiber array 5 is divided equally two groups, its coupling surface with man-to-man mode respectively with the active center regional alignment of PD photodetector array 8 and VCSEL vertical cavity emitting laser array 9, in conjunction with disposal with index matching glue.
The homonymy of VCSEL vertical cavity emitting laser array 9 is placed with rectangular parallelepiped pad 10, prevents optical fiber fixation kit 4 from breaking photoelectric device when being coupled with PD photodetector array 8 and VCSEL vertical cavity emitting laser array 9.
The present invention devises a kind of simple broadband high-speed transmission parallel light transceiver component, adopt the manufacturing technology that unique rigid-flex combines, active alignment techniques is adopted to carry out optical coupled to VCSEL laser array and PD photodetector array, eliminate the use of optical lens, and make use of optical fiber fixture more easily, achieve the optical package of high coupling efficiency, reduce the technology difficulty of photoelectric component array placement accuracy and photoelectric component and Fiber connection, and improve assembled fault tolerance, cut down finished cost, be more suitable for mass production applications.
It is to be understood that: the above is only the preferred embodiment of the present invention; for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (4)
1., for the parallel light transceiver component of broadband high-speed transmission, comprise the first printed circuit board (PCB), the second printed circuit board (PCB), the soft board connecting the first printed circuit board (PCB) and the second printed circuit board (PCB), TIA trans-impedance amplifier, laser driving chip, PD photodetector array, VCSEL vertical cavity emitting laser array, fiber array and optical fiber fixation kit; One end of described first printed circuit board (PCB) forms the signal input port of a gold-plated board plug structure, second printed circuit board surface encapsulation TIA trans-impedance amplifier, laser driving chip, PD photodetector array and VCSEL vertical cavity emitting laser array, fiber array front end is placed in optical fiber fixation kit, and fiber array is aimed at PD photodetector array and VCSEL vertical cavity emitting laser array couples;
Described optical fiber fixation kit comprises optical fiber orientation bridgeware base plate and overlay, and optical fiber orientation bridgeware backplate surface is provided with sloping platform rank, tops bar and is carved with V-type groove, places the naked fibre of fiber array, it is stamped overlay in V-type groove;
It is characterized in that: described optical fiber fixation kit also comprises pedestal, and described pedestal is provided with the draw-in groove fixing the second printed circuit board (PCB), optical fiber orientation bridgeware base plate and overlay and pedestal are glued at one by fixing glue.
2. the parallel light transceiver component for broadband high-speed transmission according to claim 1, it is characterized in that: described fiber array comprises more than eight and the optical fiber of parallel equidistant arrangement, and the naked fibre that the front end of optical fiber is exposed is placed in the V-type groove of optical fiber orientation bridgeware base plate.
3. the parallel light transceiver component for broadband high-speed transmission according to claim 1 and 2, it is characterized in that: described fiber array is divided equally two groups, its coupling surface with man-to-man mode respectively with the active center regional alignment of PD photodetector array and VCSEL vertical cavity emitting laser array.
4. the parallel light transceiver component for broadband high-speed transmission according to claim 1, is characterized in that: the homonymy of described VCSEL vertical cavity emitting laser array is placed with rectangular parallelepiped pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310164198.2A CN103257414B (en) | 2013-05-07 | 2013-05-07 | For the parallel light transceiver component of broadband high-speed transmission |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310164198.2A CN103257414B (en) | 2013-05-07 | 2013-05-07 | For the parallel light transceiver component of broadband high-speed transmission |
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| CN103257414A CN103257414A (en) | 2013-08-21 |
| CN103257414B true CN103257414B (en) | 2015-08-12 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI521248B (en) | 2014-08-07 | 2016-02-11 | 光興國際股份有限公司 | Optical transceiver |
| CN109921199B (en) * | 2019-03-05 | 2021-06-22 | 成都雷电微力科技股份有限公司 | Airtight TR module with double-sided assembled transceiver chip |
| CN114325966B (en) * | 2021-12-29 | 2023-04-28 | 中国电子科技集团公司第四十四研究所 | Balanced photoelectric detector binary array optical fiber coupling structure and manufacturing method |
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| US6712527B1 (en) * | 2000-01-12 | 2004-03-30 | International Business Machines Corporation | Fiber optic connections and method for using same |
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| JP5530332B2 (en) * | 2010-10-27 | 2014-06-25 | 日本航空電子工業株式会社 | Optical module |
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| CN1139984A (en) * | 1993-05-24 | 1997-01-08 | 韦塞尔公司 | Interconnection optical a fibre parallel |
| CN1430732A (en) * | 2000-05-23 | 2003-07-16 | 国际商业机器公司 | Optical device with chip level precision alignment |
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| CN103257414A (en) | 2013-08-21 |
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Effective date of registration: 20190130 Address after: 244002 No. 5555, West Section of Cuihu Fourth Road, Tongling Economic and Technological Development Zone, Anhui Province Patentee after: Tongling Xuchuang Technology Co., Ltd. Address before: 215021 Creative Industry Park 12-A3, 328 Xinghu Street, Suzhou City Park, Jiangsu Province Patentee before: Innolight Technology Ltd. |
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