CN105895591A - Heat sink component and mounting method for positioning and mounting chips - Google Patents
Heat sink component and mounting method for positioning and mounting chips Download PDFInfo
- Publication number
- CN105895591A CN105895591A CN201610456769.3A CN201610456769A CN105895591A CN 105895591 A CN105895591 A CN 105895591A CN 201610456769 A CN201610456769 A CN 201610456769A CN 105895591 A CN105895591 A CN 105895591A
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- China
- Prior art keywords
- heat sink
- chip
- groove
- sink substrate
- sink component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention provides a heat sink component and mounting method for positioning and mounting chips. The heat sink component comprises a heat sink base board. Multiple grooves are arranged on the heat sink base board and are used for mounting multiple chips. The shapes and sizes of the grooves match with the shapes and sizes of the laser chips needing to be mounted. Through adoption of the heat sink component and the mounting method, the mounting and positioning precision, and the mounting efficiency of the chips are improved.
Description
Technical field
The present invention relates to semiconductor applications, be specifically related to a kind of heat sink component for chip positioning paster
And pasting method.
Background technology
Along with the quick growth of broadband traffic, optic communication device is just sent out towards the direction of Highgrade integration
Exhibition.Integrated multipath laser instrument the most on a single chip, paster Comparision is simple, but laser instrument
Wavelength and power concordance hardly result in satisfied, be not suitable with the demand for development of device, it is therefore desirable to mixed
The multichannel discrete lasers chip that intersection becomes, but the paster of chip of laser is also proposed newly by this simultaneously
Requirement.As long as traditional single-chip integration alignment paster can realize luminescence, and the multichannel of hybrid integrated
Chip of laser must assure that each separate chip will be alignd, and being continuing with traditional method will be to paster
Experience and technology the highest requirement is proposed, and use traditional method precision poor, relatively costly.
Summary of the invention
(1) to solve the technical problem that
In view of above-mentioned technical problem, the invention provides a kind of heat sink component for chip positioning paster
And pasting method, improve positioning precision and the paster efficiency of chip paster.
(2) technical scheme
According to an aspect of the invention, it is provided a kind of heat sink component for chip positioning paster.
Described heat sink component includes a heat sink substrate, and this heat sink substrate has multiple groove, is respectively used to attachment
The shape of the chip of laser that multiple chips, the shape of described groove and size mount with needs and size
Match.
According to a further aspect in the invention, it is provided that a kind of pasting method for chip positioning paster.
The chip needing attachment includes P face and N face.This pasting method, needs the chip of attachment to include P
Face and N face, comprise the following steps: with vacuum cups, gold soldering tablet is inhaled the heat sink substrate being placed on
In groove；To need the chip of attachment with vacuum cups, P faces up, and inhales and is placed on gold soldering tablet,
N face contacts with gold soldering tablet；The heat sink substrate heating of gold soldering tablet and chip will be placed with, if
Determining heating-up temperature is gold tin solder melting temperature, after gold tin solder is completely melt, light with vacuum cups
Pressure chip upper surface, utilizes surface tension and the wettability of gold tin solder, makes chip complete with heat sink substrate
Full laminating.
(3) beneficial effect
From technique scheme it can be seen that be used for chip positioning paster compared to prior art
Heat sink component and pasting method have the advantages that
(1) multiple groove is set on heat sink component, matches with chip form and size, its position
The position consistency estimated with corresponding chip, chip, when paster, is directly placed on corresponding arriving
In groove, patch location determines, improves the degree of accuracy of chip positioning；
(2) groove medial surface is domatic, it is ensured that in groove during chip placement, it is possible to smoothly
Location is placed, it addition, the Pocket Machining that medial surface is domatic is convenient, reduces manufacturing cost；
(3) multiple grooves are set to string, and parallel with heat sink substrate, it is ensured that location
The efficiency of paster.
Accompanying drawing explanation
Fig. 1 is the embodiment of the present invention solid for the heat sink component of multiple path laser chip positioning paster
Structural representation；
Fig. 2 (a), Fig. 2 (b) are that the heat sink component in Fig. 1 puts into gold soldering tablet and laser instrument core
Cross-sectional view after sheet；
Fig. 3 is the embodiment of the present invention flow chart for multiple path laser chip positioning pasting method.
[main element]
1-heat sink substrate；11,12,13,14-groove；21,22,23,24-chip of laser.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with concrete real
Execute example, and referring to the drawings, the present invention is described in further detail.
As it is shown in figure 1, the embodiment of the present invention provides a kind of for multiple path laser chip positioning paster
Heat sink component, described heat sink component includes a heat sink substrate 1, this heat sink substrate 1 has four recessed
Groove 11,12,13,14, groove position in heat sink substrate 1 and the chip of laser needing attachment
21, the position of 22,23,24 is corresponding, and the laser that the shape of groove and size also mount with needs
Shape and the size of device chip match, and are directly correspondingly placed at the most recessed during chip of laser attachment
In groove, improve setting accuracy during attachment laser chip.
The medial surface of groove 11,12,13,14 is domatic, it is ensured that place laser instrument at groove
During chip, it is possible to position placement smoothly, and the Pocket Machining that medial surface is domatic is convenient, fall
Low manufacturing cost, the medial surface of described groove 11,12,13,14 all with described heat sink base
Plate surface is at an angle, it is preferred that this angle is 40～80 degree of angles, and optimum is 60 degree.
Those grooves 11,12,13,14 are set to string, and parallel with heat sink substrate,
To ensure the efficiency of site.
In view of the exiting surface of chip of laser 21,22,23,24 is in its side, described rectangle is recessed
Groove 11,12,13,14 depth design is less than chip of laser 21,22,23,24 thickness
1/3rd, stopped by groove medial surface with the light avoiding laser instrument to send.
It will be apparent to those skilled in the art that in the present embodiment, four grooves are that correspondence four is to be installed
Chip of laser, if chip of laser is other numbers, the number of this groove also can become therewith
Change.Generally, the number of groove is 3～10, it is preferable that be 3～5, optimum for 4
Individual.
In the present embodiment, the preferably rectangular groove of groove, heat sink substrate is preferably rectangular, this area skill
Art personnel are it should be clear that they can also select other conventional shapes, such as circular, semicircle, triangle
Shape, polygon etc..
The embodiment of the present invention also provides for a kind of pasting method for multiple path laser chip positioning paster,
The described chip of laser 21,22,23,24 needing attachment, as shown in Fig. 2 (a), 2 (b),
All including N face, P face and emitting cavity face, pasting method as shown in Figure 3, comprises the following steps:
Step A: the heat sink substrate 1 with multiple grooves 11,12,13,14 is put into acetone,
In any one organic solvent such as isopropanol and ethanol, carry out ultrasonic waves for cleaning, after cleaning up, use
Heat sink substrate 1 is dried up by nitrogen gun；
Step B: gold soldering tablet 31,32,33,34 suction is placed on heat sink substrate 1 with vacuum cups
Groove 11,12,13,14 in, gold soldering tablet THICKNESS CONTROL in 5-10 μm；
Step C: the chip of laser 21,22,23,24 of attachment, P face will be needed with vacuum cups
Upward, inhaling and be placed on gold soldering tablet 31,32,33,34, N face contacts with gold soldering tablet；
Step D: will be placed with gold soldering tablet 31,32,33,34 and chip of laser 21,22,
23, the heat sink substrate 1 of 24 heats, set heating-up temperature as gold tin solder melting temperature, about 300 DEG C,
After gold tin solder is completely melt, gently press on chip of laser 21,22,23,24 with vacuum cups
Surface, utilizes the gold surface tension of tin solder and wettability, can make chip of laser 21,22,23,
24 fit completely with heat sink substrate；
Step E: make chip of laser 21,22,23,24 rapid with heat sink substrate 1 by nitrogen gun
Cooling, completes paster.
The pasting method precision using the present invention is higher, can reach ± 1 μm, simple to operate efficiently,
Cost is relatively low.
Although the heat sink component that it will be apparent to those skilled in the art that in the embodiment of the present invention and paster side
Method is both for the site of chip of laser and states, the heat sink component of the present invention and pasting method
It is equally applicable to the site of other chips.
So far, already in connection with accompanying drawing to the present invention have been described in detail.According to above description, ability
The present invention should be had by field technique personnel for heat sink component and the pasting method of chip positioning paster
Clearly recognize.
It should be noted that in accompanying drawing or description text, the implementation not illustrating or describing,
It is form known to a person of ordinary skill in the art in art, is not described in detail.Additionally,
The above-mentioned definition to each element and method is not limited in various concrete structures, the shape mentioned in embodiment
Shape or mode, it can be changed or replace by those of ordinary skill in the art simply.
Additionally, can provide herein the demonstration of the parameter comprising particular value, but these parameters are without definite etc.
In corresponding value, but analog value can be similar in acceptable error margin or design constraint.Real
Execute the direction term mentioned in example, such as " on ", D score, "front", "rear", "left", "right" etc.,
It is only the direction with reference to accompanying drawing, is not used for limiting the scope of the invention.Additionally, unless especially
Describe or the step that must sequentially occur, the order of above-mentioned steps there is no be limited to listed above, and can
Change according to required design or rearrange.
Particular embodiments described above, is carried out the purpose of the present invention, technical scheme and beneficial effect
Further describe it should be understood that the foregoing is only the specific embodiment of the present invention,
Be not limited to the present invention, all within the spirit and principles in the present invention, any amendment of being made,
Equivalent, improvement etc., should be included within the scope of the present invention.
Claims (10)
1. the heat sink component for chip positioning paster, it is characterised in that: described heat sink portion
Part includes a heat sink substrate, this heat sink substrate has multiple groove, is respectively used to pasting chip, described
Shape and the size of the chip that the shape of groove and size mount with needs match.
Heat sink component the most according to claim 1, it is characterised in that: described groove interior
Side is domatic.
Heat sink component the most according to claim 2, it is characterised in that: described medial surface with
The surface angulation of described heat sink substrate is between 40 °～80 °.
Heat sink component the most according to claim 3, it is characterised in that: described medial surface with
The surface angulation of described heat sink substrate is 60 °.
Heat sink component the most according to claim 1, it is characterised in that: described groove is arranged
For string and parallel with heat sink substrate.
6. according to described heat sink component arbitrary in claim 1 to 5, it is characterised in that: described
Chip is rectangular dies, and the groove of its correspondence is rectangular recess.
Heat sink component the most according to claim 6, it is characterised in that: described chip is sharp
Light device chip, the described rectangular recess degree of depth is less than 1/3rd of chip of laser thickness.
8. according to described heat sink component arbitrary in claim 1 to 5, it is characterised in that: described
Number of recesses is 3-10.
9. for the pasting method of chip positioning paster, need the chip of attachment include P face and
N face, it is characterised in that including:
Step B: the suction of gold soldering tablet is placed on institute any one of claim 1 to 8 with vacuum cups
In the groove of the heat sink substrate stated；
Step C: will need the chip of attachment with vacuum cups, P faces up, inhales and is placed on gold tin solder
On sheet, N face contacts with gold soldering tablet；
Step D: will be placed with gold soldering tablet and chip heat sink substrate heating, set heating-up temperature as
Gold tin solder melting temperature, after gold tin solder is completely melt, gently presses chip upper surface with vacuum cups,
Utilize surface tension and the wettability of gold tin solder, make chip fit completely with heat sink substrate.
Pasting method the most according to claim 9, it is characterised in that:
Also include before described step B: step A: third will be put into the heat sink substrate of multiple grooves
In any one organic solvent of ketone, isopropanol and ethanol, carry out ultrasonic waves for cleaning, after cleaning up,
By nitrogen gun, heat sink substrate is dried up；And/or
Also include after described step D: step E: make chip the coldest with heat sink substrate by nitrogen gun
But, paster is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610456769.3A CN105895591A (en) | 2016-06-22 | 2016-06-22 | Heat sink component and mounting method for positioning and mounting chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610456769.3A CN105895591A (en) | 2016-06-22 | 2016-06-22 | Heat sink component and mounting method for positioning and mounting chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105895591A true CN105895591A (en) | 2016-08-24 |
Family
ID=56718043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610456769.3A Pending CN105895591A (en) | 2016-06-22 | 2016-06-22 | Heat sink component and mounting method for positioning and mounting chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105895591A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107623248A (en) * | 2017-07-25 | 2018-01-23 | 昂纳信息技术（深圳）有限公司 | The method for packing and array laser device of a kind of array laser device |
| CN109917353A (en) * | 2019-04-23 | 2019-06-21 | 上海禾赛光电科技有限公司 | The laser beam emitting device and laser radar of laser radar |
| CN111146690A (en) * | 2020-01-06 | 2020-05-12 | 常州纵慧芯光半导体科技有限公司 | Laser module and preparation method thereof |
| CN111805082A (en) * | 2020-07-14 | 2020-10-23 | 大连藏龙光电子科技有限公司 | Surface mounting and welding method for controlling tracking error of coaxial optical device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007333838A (en) * | 2006-06-13 | 2007-12-27 | Matsushita Electric Ind Co Ltd | Image display device |
| CN102332507A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Chip attaching method |
-
2016
- 2016-06-22 CN CN201610456769.3A patent/CN105895591A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007333838A (en) * | 2006-06-13 | 2007-12-27 | Matsushita Electric Ind Co Ltd | Image display device |
| CN102332507A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Chip attaching method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107623248A (en) * | 2017-07-25 | 2018-01-23 | 昂纳信息技术（深圳）有限公司 | The method for packing and array laser device of a kind of array laser device |
| CN109917353A (en) * | 2019-04-23 | 2019-06-21 | 上海禾赛光电科技有限公司 | The laser beam emitting device and laser radar of laser radar |
| CN109917353B (en) * | 2019-04-23 | 2020-05-19 | 上海禾赛光电科技有限公司 | Laser emitting device of laser radar and laser radar |
| CN111146690A (en) * | 2020-01-06 | 2020-05-12 | 常州纵慧芯光半导体科技有限公司 | Laser module and preparation method thereof |
| CN111146690B (en) * | 2020-01-06 | 2021-09-07 | 常州纵慧芯光半导体科技有限公司 | Laser module and preparation method thereof |
| CN111805082A (en) * | 2020-07-14 | 2020-10-23 | 大连藏龙光电子科技有限公司 | Surface mounting and welding method for controlling tracking error of coaxial optical device |
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| PB01 | Publication | ||
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Application publication date: 20160824 |