CN209526066U - A kind of gang form of chip package - Google Patents
A kind of gang form of chip package Download PDFInfo
- Publication number
- CN209526066U CN209526066U CN201920470260.3U CN201920470260U CN209526066U CN 209526066 U CN209526066 U CN 209526066U CN 201920470260 U CN201920470260 U CN 201920470260U CN 209526066 U CN209526066 U CN 209526066U
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- CN
- China
- Prior art keywords
- chip
- template
- hole
- packing
- substrate film
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Abstract
The utility model relates to chip packaging mould fields, espespecially a kind of gang form of chip package, including template, packing chip substrate film, adhesive layer, substrate, the template, packing chip substrate film, adhesive layer are successively laminating in upper surface of base plate from top to bottom, the template is equipped with several through-holes in array distribution, and the packing chip substrate film has adhesive layer towards through-hole on one side.The utility model application can not carry out cutting action, the risk of no cutting error after packaging.Specific method be by chip be placed in template on through-hole in, due to blue film (packing chip substrate film) tool stickiness make chip be stained with it is cemented be scheduled in through-hole, then will packaging plastic inject through-hole in, carry out UV solidification, after solidification, blue film is separated with template, at this time, packaged chip product was both completed, it is not necessary to cut separation again, therefore, cutting action can be save using this template construct Flip-Chip Using, relative reduction precision risk increases yield.
Description
Technical field
The utility model relates to chip packaging mould field, espespecially a kind of gang form of chip package.
Background technique
At present flip-chip can wafer cut arrangement after in the case where first carry out packaging operation into whole piece after again into
Row cutting separation, the disadvantage is that complex procedures, precision risk is larger, especially in the slight errors of cutting action, will lead to
The yield of last patch processing finished product declines to a great extent.
Utility model content
To solve the above problems, the utility model provides a kind of gang form of chip package.
To achieve the above object, the utility model adopts the following technical scheme is: a kind of gang form of chip package,
Including template, packing chip substrate film, adhesive layer, substrate, the template, packing chip substrate film, adhesive layer by up to
Under it is successively laminating in upper surface of base plate, the template is equipped with several for chip placement and in the through-holes of array distribution, institute
The packing chip substrate film stated has adhesive layer towards through-hole on one side.
Preferably, the template is plate.
Preferably, the template is made of glass or metal or ceramics or plastics or silica gel.
Preferably, for the via height in 0.2 ~ 1.5mm, the through-hole is square hole or circular hole or other geometric forms
Shape.Shape of through holes and its size make according to client's actual demand.
Preferably, the packing chip substrate film is the blue film that tool draftability and single side are stained with stickiness.
Preferably, the adhesive layer is double-sided adhesive, and the double-sided adhesive is low with the laminating one side of packing chip substrate film
Adhesion face, the double-sided adhesive and the laminating one side of substrate are high adhesion face.
Preferably, the substrate is built-in several identical fixed shape array through hole plates, the upper surface of base plate
Hole or salient point equipped with positioning and fixing.
Preferably, the substrate is made of glass or metal or ceramics or plastics.
The utility model has the beneficial effects that: the utility model application can no longer carry out cutting action after packaging,
Risk without cutting error.
Detailed description of the invention
Fig. 1 is the utility model structure chart.
Fig. 2 is the utility model formwork structure figure.
Mark explanation: 1. templates；11. through-hole；2. packing chip substrate film；3. adhesive layer；4. substrate.
Specific embodiment
It please refers to shown in Fig. 1-2, a kind of gang form 1 of the utility model about chip package, including template 1, chip
Package substrate film, adhesive layer 3, substrate 4, the template 1, packing chip substrate film, adhesive layer 3 are successively laminating from top to bottom
In 4 upper surface of substrate, the template 1 is equipped with several for chip placement and in the through-hole 11 of array distribution, the core
Piece package substrate film has adhesive layer towards 11 one side of through-hole, and packing chip substrate film is for fixed chip in order to rear in through-hole
Continuous dispensing or injecting glue.
Preferably, the template 1 is plate.
Preferably, the template 1 is made of glass or metal or ceramics or plastics or silica gel.
Preferably, for 11 height of through-hole in 0.2 ~ 1.5mm, the through-hole 11 is square hole or circular hole or other several
What shape.11 shape of through-hole and its size make according to client's actual demand.
Preferably, the packing chip substrate film is the blue film that tool draftability and single side are stained with stickiness.
Preferably, the adhesive layer 3 is double-sided adhesive, and the double-sided adhesive is low with the laminating one side of packing chip substrate film
Adhesion face, the double-sided adhesive and the laminating one side of substrate 4 are high adhesion face.
Preferably, the substrate 4 is built-in several identical fixed 11 plates of shape array through hole, on the substrate 4
Surface is equipped with hole or the salient point of positioning and fixing.
Preferably, the substrate 4 is made of glass or metal or ceramics or plastics.
The application method of the utility model: chip is placed in the through-hole 11 in template 1, since blue film tool stickiness makes chip
Be stained with it is cemented be scheduled in through-hole 11, then by packaging plastic inject through-hole 11 in, carry out UV solidification, after solidification, blue film and template 1 are divided
From, at this point, packaged chip product was both completed, be not necessary to cut separation again, therefore, use this template 1 make upside-down mounting core
Piece encapsulation can save cutting action, and relative reduction precision risk increases yield.
The utility model has the beneficial effects that: the utility model application no longer can carry out cutter after packaging
Sequence, the risk of no cutting error.
Embodiment of above is only that preferred embodiments of the present invention are described, not to the utility model
Range be defined, under the premise of not departing from the spirit of the design of the utility model, this field ordinary engineering and technical personnel to this
The various changes and improvements that the technical solution of utility model is made should all fall into the guarantor that claims of the utility model determine
It protects in range.
Claims (7)
1. a kind of gang form of chip package, it is characterised in that: including template, packing chip substrate film, adhesive layer, substrate,
The template, packing chip substrate film, adhesive layer is successively laminating from top to bottom sets on upper surface of base plate, the template
There are several through-holes for being used for chip placement and being distributed in array, the packing chip substrate film has stickiness towards through-hole on one side
Layer.
2. a kind of gang form of chip package according to claim 1, it is characterised in that: the template uses glass
Or plate made of metal or ceramics or plastics or silica gel.
3. a kind of gang form of chip package according to claim 1, it is characterised in that: the via height exists
0.2 ~ 1.5mm, the through-hole are square hole or circular hole or other geometries.
4. a kind of gang form of chip package according to claim 1, it is characterised in that: the packing chip substrate
Film is the blue film that tool draftability and single side are stained with stickiness.
5. a kind of gang form of chip package according to claim 1, it is characterised in that: the adhesive layer is two-sided
Glue, the double-sided adhesive and the laminating one side of packing chip substrate film are low adhesion face, the double-sided adhesive and substrate laminating one
Face is high adhesion face.
6. a kind of gang form of chip package according to claim 1, it is characterised in that: the substrate is built-in number
A identical fixed shape array through hole plate, the upper surface of base plate are equipped with hole or the salient point of positioning and fixing.
7. a kind of gang form of chip package according to claim 1, it is characterised in that: the substrate uses glass
Or metal or ceramics or plastics are made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920470260.3U CN209526066U (en) | 2019-04-09 | 2019-04-09 | A kind of gang form of chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920470260.3U CN209526066U (en) | 2019-04-09 | 2019-04-09 | A kind of gang form of chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209526066U true CN209526066U (en) | 2019-10-22 |
Family
ID=68232640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920470260.3U Active CN209526066U (en) | 2019-04-09 | 2019-04-09 | A kind of gang form of chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209526066U (en) |
-
2019
- 2019-04-09 CN CN201920470260.3U patent/CN209526066U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |