CN104175408B - A kind of cutting method of silico briquette - Google Patents
A kind of cutting method of silico briquette Download PDFInfo
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- CN104175408B CN104175408B CN201410415503.5A CN201410415503A CN104175408B CN 104175408 B CN104175408 B CN 104175408B CN 201410415503 A CN201410415503 A CN 201410415503A CN 104175408 B CN104175408 B CN 104175408B
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- silico briquette
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- gauze
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- 238000005520 cutting process Methods 0.000 title claims abstract description 186
- 239000004484 Briquette Substances 0.000 title claims abstract description 147
- 238000000034 method Methods 0.000 title claims abstract description 39
- 230000007423 decrease Effects 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000005299 abrasion Methods 0.000 abstract description 5
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
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Abstract
The invention discloses the cutting method of a kind of silico briquette, comprise the following steps: 1) silico briquette is adhesively fixed on the fixing device on the downside of pallet so that the upper side of silico briquette becomes predetermined angular with pallet; 2) gauze of wire cutting machine cuts silico briquette from bottom to top, adjusts cutting speed according to the contact length of gauze with silico briquette. After silico briquette is fixing, the downside of silico briquette becomes predetermined angular with gauze, before cutting phase and later stage, and gauze is less with the contact length of silico briquette, it is possible to the cutting of speed faster; In the mid-term of cutting, gauze is bigger with the contact length of silico briquette, it is necessary to slow down cutting speed. The early stage of cutting and the speed in later stage, compared with prior art, decrease the time used by whole cutting process, and this cutting method not only ensure that cut quality but also decrease consuming time, decreases the abrasion of gauze and the consumption of cutting liquid simultaneously. The invention also discloses the cutter sweep of a kind of silico briquette, this cutter sweep uses above-mentioned cutting mode cutting silico briquette.
Description
Technical field
The present invention relates to field of photovoltaic technology, particularly relate to the cutting method of a kind of silico briquette.
Background technology
Photovoltaic module utilizes form to apply on a large scale as the one of solar energy, and defines huge industry, and increasing photovoltaic module comes into operation, and provides the electric power energy of cleaning for the mankind.
Photovoltaic module utilizes glass plate, backboard and EVA to encapsulate cell piece, and cell piece is made up of silicon chip, is the core of photovoltaic module. Producing silicon ingot through polysilicon casting, silicon ingot produces silico briquette through broken ingot, and silicon chip is formed by silico briquette cutting, is then passed through the techniques such as surface wool manufacturing, diffusion, etching, depositing antireflection film, printing-sintering and makes cell piece. Silico briquette cutting is the important step during photovoltaic module produces, the quality of cut quality, and the length of clipping time and the consumption of cutting consumptive material directly affect the cost of photovoltaic module.
Refer to the structural representation of the cutting method that Fig. 1, Fig. 1 are a kind of typical silico briquette.
The cross section of silico briquette 3 is square, during cutting silico briquette 3, first at one piece of glass 2' of lower side bonds of pallet 1, by the lower side bonds of silico briquette 3 side Yu glass 2'; Then the pallet 1 being stained with silico briquette 3 is put in multi-line cutting machine, the side that now silico briquette 3 is bonding with glass 2' be upper side, upper side and downside all with the gauze keeping parallelism in multi-line cutting machine. Gauze in multi-line cutting machine is supported by guide wheel 5, and gauze is the steel wire 4 that string is parallel. During cutting, gauze moves from bottom to top relative to silico briquette 3.
In cutting process, steel wire 4 is longer with the contact length of silico briquette 3, it is always the length of side of silico briquette 3 cross section, therebetween wear extent is bigger, cut quality is affected in order to avoid the temperature of cutting surfaces raises, require that gauze is with slower speed feeding so that clipping time is longer, and then the consumption of steel wire 4 and cutting liquid is all bigger.
Therefore, how to reduce the time that cutting is used when ensureing cut quality, be that those skilled in the art are badly in need of solving the technical problem that at present.
Summary of the invention
It is an object of the invention to provide the cutting method of a kind of silico briquette, this cutting method can either ensure that cut quality is consuming time less again, decreases the abrasion of steel wire and the consumption of cutting liquid.
In order to realize above-mentioned technical purpose, the invention provides the cutting method of a kind of silico briquette, comprise the following steps:
1) being adhesively fixed on by silico briquette on the fixing device on the downside of pallet so that the upper side of described silico briquette becomes predetermined angular with described pallet, described predetermined angular is more than 0 degree and less than 90 degree;
2) gauze of wire cutting machine cuts described silico briquette from bottom to top, adjusts cutting speed according to the contact length of described gauze with described silico briquette; When described gauze becomes big with the described contact length of described silico briquette, reduce described cutting speed; When the described contact length of described gauze Yu described silico briquette diminishes, increase described cutting speed.
Preferably, step 1) including:
11) fixing device described in the lower side bonds of described pallet, described fixing device has the fixing groove towards downside, and two medial surface of described fixing groove are mutually perpendicular to;
12) two sides making described silico briquette are pasted with two described medial surface of described fixing groove respectively.
Preferably, the top fixing groove described in described fixing device is predetermined distance with described pallet.
Preferably, during described wire cutting machine one described silico briquette of cutting, the described predetermined angular of described silico briquette is 45 degree.
Preferably, when described wire cutting machine cuts silico briquette described in even number simultaneously, the described predetermined angular sum of silico briquette described in each two is 90 degree.
Preferably, described wire cutting machine cuts two described silico briquettes simultaneously, the described predetermined angular of two described silico briquettes respectively 30 degree and 60 degree.
Preferably, step 2) in, in cutting process, the described cutting speed that predetermined described contact length is corresponding predetermined.
Preferably, described cutting speed consecutive variations.
Preferably, described cutting speed changed in stages, described cutting speed has at least two step velocitys.
Present invention also offers the cutter sweep of a kind of silico briquette, described cutter sweep uses the cutting method cutting silico briquette described in any of the above-described item, described cutter sweep includes fixed structure and wire cutting machine, described fixed structure is adhesively fixed described silico briquette, and described wire cutting machine cuts described silico briquette with predetermined cutting speed from bottom to top; Described fixed structure includes pallet and fixing device, described fixing device is bonded on the downside of described pallet, described fixing device has the fixing groove towards downside, two medial surface of described fixing groove are mutually perpendicular to, and the top fixing groove described in described fixing device is predetermined distance with described pallet.
The cutting method of silico briquette provided by the invention, comprises the following steps: 1) be adhesively fixed on by silico briquette on the fixing device on the downside of pallet so that the upper side of silico briquette becomes predetermined angular with pallet, and predetermined angular is more than 0 degree and less than 90 degree; 2) gauze of wire cutting machine cuts silico briquette from bottom to top, adjusts cutting speed according to the contact length of gauze with silico briquette; When gauze becomes big with the contact length of silico briquette, reduce cutting speed; When the contact length of gauze Yu silico briquette diminishes, increase cutting speed.
Pallet level, gauze is level also, and the cross section of silico briquette is square, and after the fixing silico briquette of the mode in step 1, the downside of silico briquette becomes predetermined angular with gauze, and in whole cutting process, the contact length of gauze and silico briquette first changes from small to big, more from large to small.In early stage and the later stage of cutting, gauze is less with the contact length of silico briquette, it is possible to the cutting of speed faster; After the contact length of the mid-term of cutting, gauze and silico briquette becomes larger, in order to ensure cut quality, slow down gradually cutting speed. In cutting process, although the speed cutting mid-term is slower, but the speed in the early stage of cutting and later stage, compared with prior art, decrease the time that whole cutting process consumes, this cutting method not only ensure that cut quality but also decrease consuming time, decreases the abrasion of gauze and the consumption of cutting liquid simultaneously.
Present invention also offers the cutter sweep of a kind of silico briquette, described cutter sweep uses above-mentioned cutting method cutting silico briquette, and this cutting mode has above-mentioned technique effect, therefore this cutter sweep also has corresponding technique effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of the cutting method of a kind of typical silico briquette;
Fig. 2 is the structural representation of a kind of detailed description of the invention of cutting method of silico briquette provided by the present invention;
Fig. 3 is the structural representation of the cutting method another kind detailed description of the invention of silico briquette provided by the present invention;
Fig. 4 is the structural representation of a kind of detailed description of the invention of the fixed structure in the cutter sweep of silico briquette provided by the present invention.
Wherein, the corresponding relation between accompanying drawing labelling and the component names in Fig. 1 to Fig. 4 is as follows:
Pallet 1; Glass 2'; Fixing device 2; Silico briquette 3; Steel wire 4; Guide wheel 5; Glue-line 6; Predetermined angle.
Detailed description of the invention
The core of the present invention is to provide the cutting method of a kind of silico briquette, and this cutting method can either ensure that cut quality is consuming time less again, decreases the abrasion of steel wire and the consumption of cutting liquid.
In order to make those skilled in the art be more fully understood that the present invention program, below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Refer to the structural representation of a kind of detailed description of the invention of cutting method that Fig. 2 and Fig. 3, Fig. 2 are silico briquette provided by the present invention, Fig. 3 is the structural representation of the cutting method another kind detailed description of the invention of silico briquette provided by the present invention.
In a kind of specific embodiment, the invention provides the cutting method of a kind of silico briquette, comprise the following steps:
Step S1: silico briquette 3 is adhesively fixed on the fixing device 2 on the downside of pallet 1 so that 1 one-tenth predetermined angle of the upper side of described silico briquette 3 and described pallet, described predetermined angle is more than 0 degree and less than 90 degree;
Step S2: the gauze of wire cutting machine cuts described silico briquette 3 from bottom to top, adjusts cutting speed according to the contact length of described gauze with described silico briquette 3; When described gauze becomes big with the described contact length of described silico briquette 3, reduce described cutting speed; When the described contact length of described gauze Yu described silico briquette 3 diminishes, increase described cutting speed.
Gauze is supported by guide wheel 5, and gauze is the steel wire 4 that string is parallel. After fixing silico briquette 3 by fixing device 2, the downside making silico briquette 3 becomes predetermined angle with gauze, and then make in whole cutting process, gauze is first with the contact length of silico briquette 3 to be become larger by little, after reaching maximum, again by tapering into greatly, it is possible to adjust cutting speed according to the change of gauze with the contact length of silico briquette 3.
The early stage of cutting, gauze is less with the contact length of silico briquette 3, it is possible to use cutting speed faster; In the mid-term of cutting, gauze is relatively big with the contact length of silico briquette 3, and in order to ensure cut quality, slow down gradually cutting speed;The contact length of the later stage of cutting, gauze and silico briquette 3 tapers into, it is possible to accelerate cutting speed gradually.
In cutting process, the early stage of cutting and the speed in later stage, the speed in cutting mid-term is slower, compared with prior art, shortening the time used by whole cutting process, this cutting method not only ensure that cut quality but also reduce consuming time, decreases the abrasion of gauze and the consumption of cutting liquid simultaneously.
In another kind of specific embodiment, the invention provides the cutting method of a kind of silico briquette, comprise the following steps:
Step S11: fixing device 2 described in the lower side bonds of described pallet 1, described fixing device 2 has the fixing groove towards downside, and two medial surface of described fixing groove are mutually perpendicular to;
Step S12: make two sides of described silico briquette 3 paste with two described medial surface of described fixing groove respectively.
Step S2: the gauze of wire cutting machine cuts described silico briquette 3 from bottom to top, adjusts cutting speed according to the contact length of described gauze with described silico briquette 3; When described gauze becomes big with the described contact length of described silico briquette 3, reduce described cutting speed; When the described contact length of described gauze Yu described silico briquette 3 diminishes, increase described cutting speed.
Owing to the cross section of silico briquette 3 is square, institute, so that two medial surface fixing groove are mutually perpendicular to, and makes one of them medial surface and 1 one-tenth of pallet predetermined angle. Fixing device 2 can also be able to be split type for monoblock type, it is possible to is bonded on the downside of pallet 1 by glass or resin material and is formed, then again that silico briquette 3 is bonding with fixing device 2. Fixing device 2 is bonding with pallet 1, and silico briquette 3 is bonding with fixing device 2, all can use epoxide-resin glue, as it is shown on figure 3, fixing device 2 and pallet 1 have glue-line 6, silico briquette 3 and fixing device 2 also have glue-line 6.
When silico briquette 3 is fixed in fixing groove, two sides making silico briquette 3 are pasted with two medial surface of fixing groove respectively, as shown in Figures 2 and 3, after fixing silico briquette 3, the upper side of silico briquette 3 and 1 one-tenth of pallet predetermined angle so that the downside of silico briquette 3 becomes predetermined angle with gauze, it is possible to ensure in line cutting process, the contact length of gauze and silico briquette 3 first changes from small to big, more from large to small; Then adjust cutting speed according to contact length, shorten clipping time when ensureing cut quality.
In further specific embodiment, the top fixing groove in fixing device 2 is predetermined distance with pallet 1.
The top of fixing groove refers to the intersection of fixing two medial surface of groove, owing to fixing groove is towards downside, here for position closest with pallet 1 in fixing groove, during fixing silico briquette 3, and the top of the top contact silico briquette 3 of fixing groove.
Cut to the last silico briquette 3 needed being bonded on fixing device 2 fully penetrated, it is necessary to cutting position exceedes silico briquette 3, so, reserved certain distance between the top of fixing groove and pallet 1. During fixing silico briquette 3, the top of the top contact silico briquette 3 of fixing groove, preset distance can ensure that in cutting process, it is possible to cuts through whole silico briquette 3 and does not switch to pallet 1.
Concrete, in step sl, when predetermined angle is more than 0 degree and less than 90 degree, all disclosure satisfy that the contact length of gauze and silico briquette 3 first changes from small to big, more from large to small, be all capable of this cutting method.
One preferred embodiment in, described wire cutting machine cutting one described silico briquette 3 time, the described predetermined angle of described silico briquette 3 is 45 degree.
During one silico briquette 3 of cutting, when predetermined angle is 45 degree, the cutting time used is minimum, and cut quality is best, concrete as in figure 2 it is shown, the maximum that cornerwise length is contact length of silico briquette 3 square sectional.
In cutting process, contact length is gradually increased by zero, reaches maximum when arriving diagonal positions, and after diagonal, contact length is gradually reduced; Corresponding, starting with bigger cutting speed and cut, cutting speed is gradually reduced, and reaches minima, after diagonal, then be gradually increased cutting speed when arriving diagonal positions.
In another preferred embodiment, when described wire cutting machine cuts silico briquette 3 described in even number simultaneously, the described predetermined angle sum of silico briquette 3 described in each two is 90 degree.
When this cutting method cuts multiple silico briquette 3 simultaneously, the quantity of preferred silico briquette 3 is even number, and make each two silico briquette 3 predetermined angle and be 90 degree, so enable in first half term and the second half equal to the contact length of the equidistant position at cutting midpoint, namely in cutting first half term, the change of contact length is symmetrical with the change of contact length in cutting the second half, and the maximum that enables to contact length is less, make total clipping time shorter.
In further specific embodiment, described wire cutting machine cuts two described silico briquettes 3 simultaneously, the described predetermined angle of two described silico briquettes 3 respectively 30 degree and 60 degree.
If the predetermined angle of two silico briquettes 3 is 45 degree, then the maximum of contact length is bigger so that the speed cutting mid-term is too low. As shown in Figure 3, the predetermined angle of two silico briquettes 3 respectively 30 degree and 60 degree time, and be compared with in the of 45 degree, reduce the maximum of contact length, shorten and cut the consuming time of mid-term, further, under this state, cutting early stage and the contact length in later stage are also less, so, simultaneously cutting two pieces of silico briquettes 3 time, the predetermined angular of two silico briquettes 3 respectively 30 degree and 60 degree time, clipping time is the shortest.
For NTC442, when using steel wire to coordinate recovery mortar cutting silico briquette 3, the cutting duration of above-mentioned several cutting methods is as shown in the table:
| Cutting equipment model | The predetermined angular of two pieces of silico briquettes | Cutting duration | |
| Prior art | NTC442 | Without predetermined angular | 12 hours |
| The application | NTC442 | 45 degree and 45 degree | 8 hours 45 points |
| The application | NTC442 | 30 degree and 60 degree | 8 hours 15 points |
In the respective embodiments described above, in cutting process, the described cutting speed that predetermined described contact length is corresponding predetermined.
In step S2, adjust cutting speed according to the contact length of gauze with silico briquette 3, namely when gauze becomes big with the contact length of silico briquette 3, reduce cutting speed; When the contact length of gauze Yu silico briquette 3 diminishes, increase cutting speed.
Concrete, setting corresponding cutting speed according to contact length, set multiple predetermined length, each predetermined length has corresponding cutting speed, when contact length is equal to certain predetermined length, with corresponding speed cutting; In cutting process, contact length constantly changes, and cutting speed also constantly changes.
In a kind of specific embodiment, in cutting process, the change of cutting speed can be continuous print. Contact length be changed to continuous print, it is possible to make the change of corresponding cutting speed also for continuous print, and the Changing Pattern according to contact length change, cutting speed and the inversely proportional relation of contact length. In another kind of specific embodiment, in cutting process, cutting speed changed in stages, it is possible to set the separation of several speed change, when contact length is positioned at certain length of interval, cut with corresponding speed.
Concrete, cutting speed has at least two step velocitys, the contact length that every grade of cutting speed is corresponding predetermined respectively.
When cutting speed is two-stage, set a predetermined length, cut early stage, when contact length is less than predetermined length, with higher speed cutting; When contact length is equal to predetermined length, regulate the speed, with relatively low speed cutting; In the cutting later stage, when contact length is again equal to predetermined length, regulate the speed, continue with higher speed cutting.
When cutting speed is N level, setting N-1 predetermined length, N is the integer more than 2, and every grade of corresponding length of interval of cutting speed, the change procedure of cutting speed is similar to the above process.
Refer to the structural representation of a kind of detailed description of the invention of fixed structure in the cutter sweep that Fig. 4, Fig. 4 are silico briquette provided by the present invention.
Present invention also offers the cutter sweep of a kind of silico briquette, described cutter sweep uses above-mentioned cutting method cutting silico briquette 3, cutter sweep includes fixed structure and wire cutting machine, and fixed structure is adhesively fixed silico briquette 3, and wire cutting machine is from bottom to top with predetermined cutting speed cutting silico briquette 3; Fixed structure includes pallet 1 and fixing device 2, and fixing device 2 is bonded on the downside of pallet 1, and fixing device 2 has the fixing groove towards downside, and two medial surface of fixing groove are mutually perpendicular to, and the top fixing groove in fixing device 2 is predetermined distance with pallet 1.
Fixing device 2 is bonded on the downside of pallet 1, as shown in Figure 4, in fixing device 2, two medial surface of fixing groove are mutually perpendicular to, the intersection of two medial surface is the top of fixing groove, the two of silico briquette 3 sides are bonding with the two of fixing groove medial surface respectively, the top of the top contact silico briquette 3 of fixing groove. In fixing device 2, the top making fixing groove is distance away with pallet 1, it is ensured that in cutting process, it is possible to cut through whole silico briquette 3 and do not switch to pallet 1.
After fixing silico briquette 3, the upper side of silico briquette 3 and 1 one-tenth of pallet predetermined angle so that the downside of silico briquette 3 becomes predetermined angle with gauze, it is possible in guarantee line cutting process, the contact length of gauze and silico briquette 3 first changes from small to big, more from large to small; Then the cutting speed of wire cutting machine is adjusted according to contact length, it is ensured that while cut quality, clipping time can be shortened.
Wire cutting machine in this cutter sweep refer to prior art, repeats no more herein.
Above the cutting method of silico briquette provided by the present invention is described in detail. Principles of the invention and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method and the core concept thereof of the present invention. It should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to the present invention carries out some improvement and modification, these improve and modify in the protection domain also falling into the claims in the present invention.
Claims (5)
1. the cutting method of a silico briquette, it is characterised in that comprise the following steps:
1) being adhesively fixed on by silico briquette on the fixing device on the downside of pallet so that the upper side of described silico briquette becomes predetermined angular with described pallet, described predetermined angular is more than 0 degree and less than 90 degree;
2) gauze of wire cutting machine cuts described silico briquette from bottom to top, adjusts cutting speed according to the contact length of described gauze with described silico briquette; When described gauze becomes big with the described contact length of described silico briquette, reduce described cutting speed; When the described contact length of described gauze Yu described silico briquette diminishes, increase described cutting speed;
Step 1) including:
11) fixing device described in the lower side bonds of described pallet, described fixing device has the fixing groove towards downside, and two medial surface of described fixing groove are mutually perpendicular to;
12) two sides making described silico briquette are pasted with two described medial surface of described fixing groove respectively;
The top fixing groove described in described fixing device is predetermined distance with described pallet;
When described wire cutting machine cuts silico briquette described in even number simultaneously, the described predetermined angular of silico briquette described in each two respectively 30 degree and 60 degree.
2. the cutting method of silico briquette as claimed in claim 1, it is characterised in that step 2) in, in cutting process, the described cutting speed that predetermined described contact length is corresponding predetermined.
3. the cutting method of silico briquette as claimed in claim 2, it is characterised in that described cutting speed consecutive variations.
4. the cutting method of silico briquette as claimed in claim 2, it is characterised in that described cutting speed changed in stages, described cutting speed has at least two step velocitys.
5. the cutter sweep of a silico briquette, it is characterized in that, described cutter sweep uses cutting method cutting silico briquette (3) described in any one of claim 1 to 4, described cutter sweep includes fixed structure and wire cutting machine, described fixed structure is adhesively fixed described silico briquette (3), and described wire cutting machine cuts described silico briquette (3) with predetermined cutting speed from bottom to top; Described fixed structure includes pallet (1) and fixing device (2), described fixing device (2) is bonded in described pallet (1) downside, described fixing device (2) has the fixing groove towards downside, two medial surface of described fixing groove are mutually perpendicular to, and the top fixing groove described in described fixing device (2) is predetermined distance with described pallet (1).
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| TWI620840B (en) * | 2017-03-15 | 2018-04-11 | 環球晶圓股份有限公司 | Slicing apparatus for silicon carbide ingot and slicing method for silicon carbide ingot |
| CN106956375B (en) * | 2017-04-12 | 2019-12-13 | 隆基乐叶光伏科技有限公司 | cutting method of silicon wafer with polygonal structure size and rod sticking tool |
| CN107457924B (en) * | 2017-08-30 | 2019-03-22 | 宁晋松宫电子材料有限公司 | A kind of polysilicon dicing method |
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