CN204076549U - A kind of silicon wafer cutting device - Google Patents
A kind of silicon wafer cutting device Download PDFInfo
- Publication number
- CN204076549U CN204076549U CN201420511626.4U CN201420511626U CN204076549U CN 204076549 U CN204076549 U CN 204076549U CN 201420511626 U CN201420511626 U CN 201420511626U CN 204076549 U CN204076549 U CN 204076549U
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- CN
- China
- Prior art keywords
- silicon wafer
- glass plate
- cutting device
- limited block
- wafer cutting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of silicon wafer cutting device, comprise work plate, limited block and the glass plate for being fixedly connected with silico briquette, described glass plate is bonded in work plate side, and described limited block is bonded on work plate; Described work plate and glass plate bonding plane are also provided with cooling bath.By the design of cooling bath, reduce temperature in cutter sweep, reduce high temperature to the impact of mortar; Supporting by limited block, balances out the side force produced between silicon chip in cutting process, ensures the stable of silico briquette position, improves the quality of cutting silicon wafer, reduces production cost further by improving yield rate.
Description
Technical field
The utility model relates to silicon chip production and processing field, particularly, relates to a kind of silicon wafer cutting device.
Background technology
In the cutting process of silicon chip, produce a large amount of heats, can chemical reaction be there is in the silicon in mortar and water, the viscosity of mortar is caused sharply to raise, and mobility reduces, thus mortar is clipped in be not easy to drip between adjacent two silicon chips and build up, thus a larger side force is produced at silicon rod two ends, and this side force can add up gradually along silicon rod length direction, the side force that the silicon chip being positioned at silicon rod two ends is subject to is maximum, a large amount of outer collapses limit, even can there is the major accident of part finally to cause silicon chip to occur.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of silicon wafer cutting device, by the design of cooling bath, reduces temperature in cutter sweep, reduces high temperature to the impact of mortar; Supporting by limited block, balances out the side force produced between silicon chip in cutting process, ensures the stable of silico briquette position, improves the quality of cutting silicon wafer, reduces production cost further by improving yield rate.
For solving the problem, the technical scheme that the utility model adopts is as follows:
A kind of silicon wafer cutting device, comprise work plate, limited block and the glass plate for being fixedly connected with silico briquette, described glass plate is bonded in work plate side, and described limited block is bonded on work plate; Described work plate and glass plate bonding plane are also provided with cooling bath.
Preferably, described cooling bath two ends are provided with cooling fluid import and export.
Preferably, be provided with cooling tube in described cooling bath, described cooling tube is provided with cooling fluid and imports and exports at cooling bath two ends.
Preferably, described cooling tube is metal tube.
Preferably, described limited block has 2 pieces, and is set in parallel in the two ends of glass plate symmetry, offsets with glass plate.
Preferably, described limited block centerline parallel is in line of cut traffic direction.
Preferably, described limited block height is not less than 1/2 of sheet thickness and silico briquette thickness sum.
Preferably, described limited block height equals sheet thickness and silico briquette thickness sum.
Preferably, described cooling bath is the linear pattern groove be arranged in parallel.
Preferably, described cooling bath is the S type groove be arranged in parallel.
Compared to existing technology, the beneficial effects of the utility model are:
1, the utility model is by the design of cooling bath, reduces temperature in cutter sweep, reduces high temperature to the impact of mortar; Supporting by limited block, balances out the side force produced between silicon chip in cutting process, ensures the stable of silico briquette position, improves the quality of cutting silicon wafer, reduces production cost further by improving yield rate;
2, the utility model selects the metal cooling-pipe be arranged in parallel, considerably increases contact area, better reaches the effect of cooling.
Accompanying drawing explanation
Fig. 1 is the utility model silicon wafer cutting device structural representation;
Fig. 2 is linear pattern groove structural representation on work plate in the utility model;
Fig. 3 is S type groove structure schematic diagram on work plate in the utility model;
Wherein, 1 is work plate, and 2 is glass plate, and 3 is limited block, and 4 is silico briquette, and 5 is line of cut, and 6 is cooling bath.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 1, for a kind of silicon wafer cutting device, comprise work plate 1, limited block 3 and the glass plate 2 for being fixedly connected with silico briquette 4, glass plate 2 is bonded in work plate 1 side, work plate 1 and glass plate 2 bonding plane are also provided with cooling bath 6, and cooling bath 6 two ends are provided with cooling fluid and import and export; Limited block 3 has 2 pieces, is bonded on work plate 1, and is set in parallel in the two ends of glass plate 2 symmetry, offsets with glass plate 2; Limited block 3 centerline parallel is in line of cut traffic direction.Limited block 3 is highly not less than 1/2 of glass plate 2 thickness and silico briquette 4 thickness sum.
Embodiment 1
Silicon wafer cutting device comprises work plate 1, limited block 3 and the glass plate 2 for being fixedly connected with silico briquette 4, glass plate 2 is bonded in work plate 1 side, work plate 1 and glass plate 2 bonding plane are also provided with the linear pattern cooling bath 6 be arranged in parallel, be provided with metal cooling-pipe in cooling bath 6, cooling tube is provided with cooling fluid and imports and exports at cooling bath 6 two ends; Limited block 3 has 2 pieces, is bonded on work plate 1, and is set in parallel in glass plate 2 two ends, offsets with glass plate 2; Limited block 3 centerline parallel is in line of cut traffic direction; Limited block 3 highly equals 1/2 of glass plate 2 thickness and silico briquette 4 thickness sum.Adopt sticky glass cement mutually bonding between work plate 1 and glass plate 2, between glass plate 2 and silico briquette 4, adopt bar glue mutually bonding.
Embodiment 2
Silicon wafer cutting device comprises work plate 1, limited block 3 and the glass plate 2 for being fixedly connected with silico briquette 4, glass plate 2 is bonded in work plate 1 side, work plate 1 and glass plate 2 bonding plane are also provided with the S type cooling bath 6 be arranged in parallel, be provided with metal cooling-pipe in cooling bath 6, cooling tube is provided with cooling fluid and imports and exports at cooling bath 6 two ends; Limited block 3 has 2 pieces, is bonded on work plate 1, and is set in parallel in glass plate 2 two ends, offsets with glass plate 2; Limited block 3 centerline parallel is in line of cut traffic direction; Limited block 3 highly equals glass plate 2 thickness and silico briquette 4 thickness sum.Adopt sticky glass cement mutually bonding between work plate 1 and glass plate 2, between glass plate 2 and silico briquette 4, adopt bar glue mutually bonding.
During use, silico briquette 4 wide for glass plate 2 between width and limited block 3 is sticked on glass plate 2, starts to pass into cooling fluid in cooling bath 6, carry out for 5 times cutting and obtain stabilised quality silicon chip at line of cut.
To one skilled in the art, according to technical scheme described above and design, other various corresponding change and deformation can be made, and all these change and deformation all should belong within the protection domain of the utility model claim.
Claims (10)
1. a silicon wafer cutting device, it is characterized in that: comprise work plate (1), limited block (3) and the glass plate (2) for being fixedly connected with silico briquette (4), described glass plate (2) is bonded in work plate (1) side, and described limited block (3) is bonded on work plate (1); Described work plate (1) and glass plate (2) bonding plane are also provided with cooling bath (6).
2. silicon wafer cutting device as claimed in claim 1, is characterized in that: described cooling bath (6) two ends are provided with cooling fluid and import and export.
3. silicon wafer cutting device as claimed in claim 2, is characterized in that: described cooling bath is provided with cooling tube in (6), and described cooling tube is provided with cooling fluid and imports and exports at cooling bath (6) two ends.
4. silicon wafer cutting device as claimed in claim 3, is characterized in that: described cooling tube is metal tube.
5. silicon wafer cutting device as claimed in claim 1, is characterized in that: described limited block (3) has 2 pieces, and is set in parallel in the symmetrical two ends of glass plate (2), offsets with glass plate (2).
6. silicon wafer cutting device as claimed in claim 1, is characterized in that: described limited block (3) centerline parallel is in line of cut (5) traffic direction.
7. silicon wafer cutting device as claimed in claim 1, is characterized in that: described limited block (3) is highly not less than 1/2 of glass plate (2) thickness and silico briquette (4) thickness sum.
8. silicon wafer cutting device as claimed in claim 7, is characterized in that: described limited block (3) highly equals glass plate (2) thickness and silico briquette (4) thickness sum.
9. the silicon wafer cutting device as described in any one of claim 1-8, is characterized in that: the linear pattern groove of described cooling bath (6) for be arrangeding in parallel.
10. the silicon wafer cutting device as described in any one of claim 1-8, is characterized in that: the S type groove of described cooling bath (6) for be arrangeding in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420511626.4U CN204076549U (en) | 2014-09-05 | 2014-09-05 | A kind of silicon wafer cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420511626.4U CN204076549U (en) | 2014-09-05 | 2014-09-05 | A kind of silicon wafer cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204076549U true CN204076549U (en) | 2015-01-07 |
Family
ID=52169308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420511626.4U Expired - Fee Related CN204076549U (en) | 2014-09-05 | 2014-09-05 | A kind of silicon wafer cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204076549U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109866347A (en) * | 2019-02-14 | 2019-06-11 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
-
2014
- 2014-09-05 CN CN201420511626.4U patent/CN204076549U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109866347A (en) * | 2019-02-14 | 2019-06-11 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
| CN109866347B (en) * | 2019-02-14 | 2021-08-31 | 厦门芯光润泽科技有限公司 | Multi-wire cutting method for silicon carbide crystal bar |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20210905 |
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| CF01 | Termination of patent right due to non-payment of annual fee |