CN102229213A - Silicon block wire saw machine tool and silicon block fixing device thereof - Google Patents
Silicon block wire saw machine tool and silicon block fixing device thereof Download PDFInfo
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- CN102229213A CN102229213A CN2011101716250A CN201110171625A CN102229213A CN 102229213 A CN102229213 A CN 102229213A CN 2011101716250 A CN2011101716250 A CN 2011101716250A CN 201110171625 A CN201110171625 A CN 201110171625A CN 102229213 A CN102229213 A CN 102229213A
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Abstract
The invention discloses a silicon block fixing device, which comprises a tray, an adhesive plate and a glass plate, wherein the upper end face of the adhesive plate is connected with the lower end face of the tray; the upper end face of the glass plate is connected with the lower end face of the adhesive plate; and the lower end face of the glass plate is connected with a silicon block through an adhesive layer, and the plane of the lower end face of the adhesive layer is crossed with the plane of the upper end of the tray. Through the silicon block fixing device, the cutting point of a cutting wire falls on the silicon block when the cutting is to finish, and the problem of saw trace of a silicon chip because the belt sticking slurry on the cutting wire is filtered by the adhesive layer is effectively avoided. The invention also discloses a silicon block wire saw machine tool comprising the silicon block fixing device.
Description
Technical field
The present invention relates to the silico briquette processing technique field, particularly a kind of silico briquette scroll saw lathe and silico briquette fixture thereof.
Background technology
Solar energy is maximum free of contamination renewable resource, and is inexhaustible, nexhaustible, is one of emphasis of human using energy source from now on.Since last century end, along with the sharp increase of the whole world to energy resource consumption, the threat of traditional energy exhaustion, and the development of polysilicon, monocrystalline silicon generation technology, the photovoltaic industry is in the ascendant.
The silico briquette cutting is as the important step in the silico briquette process, and prior art generally adopts the scroll saw lathe that silico briquette is cut.
Please refer to Fig. 1, Fig. 1 is silico briquette fixture and a silico briquette assembly structure schematic diagram in the prior art.
The silico briquette fixture comprises pallet 01, adhesive sheet 02 and glass plate 03.Before the scroll saw cutting silico briquette 05, need at first adhesive sheet 02 to be connected on the pallet 01, again glass plate 03 is bonded in above the adhesive sheet 02.Then, ready silico briquette 05 is bonded in above the glass plate 03 by glue-line 04.At last, on the lower surface of silico briquette 05, be stained with gib block 06.
Those skilled in the art are understandable that gib block 06 is used to guide steel wire cutting silico briquette.Gib block 06 plays an important role in cutting process.Line of cut needs to find cutting into position accurately on gib block 06, can cut silico briquette 15.Therefore, the effect of 06 pair of held stationary feed of gib block position is very outstanding.
After silico briquette 05 was fixed to the silico briquette fixture, with the workbench the inside that pallet 01 inserts the scroll saw lathe, by the driven by motor workbench, silico briquette 05 can move up and down with workbench.
In the cutting process, line of cut 07 not stall at a high speed is moving, and silico briquette 05 cuts along with workbench slowly descends.When cutting end soon, when promptly line of cut 07 began to be cut into glass plate 03, general line of cut 07 can ready-madely have the line bow of certain radian in point of penetration and between cutting out a little.
In the prior art, when cutting will finish, 07 pair of glass plate 03 of line of cut, glue-line 04, silico briquette 05, glue-line 04, glass plate 03 cut successively.Yet, need to prove that line of cut 07 need speckle with the slurry that silicon carbide powder and suspension mix before incision, otherwise, the silicon chip generation kerf that cuts out.
Yet in the prior art, when cutting will finish, the line of cut that speckles with slurry at first cut glass plate 03 and glue-line 04, then arrives silico briquette 05.So the slurry that speckles with on the line of cut has quite a few to be filtered out by glue-line 04, and then there is the defective of knife saw trace in the silicon chip that causes cutting out.
Therefore, how to evade the defective that silicon chip goes out the knife saw trace, become those skilled in the art's important technological problems to be solved.
Summary of the invention
In view of this, the invention provides a kind of silico briquette fixture, go out the problem of knife saw trace to evade silicon chip.The present invention also provides a kind of silico briquette scroll saw lathe that comprises above-mentioned silico briquette fixture.
For achieving the above object, the invention provides a kind of silico briquette fixture, comprising:
Pallet;
The adhesive sheet that the upper surface is connected with the lower surface of described pallet;
The glass plate that the upper surface is connected with the lower surface of described adhesive sheet,
The lower surface of described glass plate is connected with silico briquette by glue-line, the last transverse plane place Plane intersects of the plane, place, lower surface of described glue-line and described pallet.
Preferably, the last transverse plane place Plane intersects of the plane, place, lower surface of described pallet and described pallet.
Preferably, the last transverse plane place plane parallel of the plane, place, lower surface of described pallet and described pallet, and the last transverse plane place Plane intersects of the plane, following transverse plane place of described adhesive sheet and described pallet.
Preferably, the last transverse plane place plane parallel of the plane, place, lower surface of described adhesive sheet and described pallet, and the last transverse plane place Plane intersects of the plane, following transverse plane place of described glass plate and described pallet.
The present invention also provides a kind of silico briquette scroll saw lathe, comprises workbench, is used to cut the line of cut of silico briquette and the silico briquette fixture that is connected with described workbench, and described silico briquette fixture is above-mentioned each described silico briquette fixture.
Preferably, the point of penetration of described line of cut and cut out a little between line segment place straight line and the last transverse plane place Plane intersects of described pallet, and the two intersection point is close to described cutting out a little.
Preferably, the upper surface of described pallet is provided with draw-in groove, and described silico briquette fixture is placed in described workbench by described draw-in groove.
The invention provides a kind of silico briquette fixture, comprise pallet, adhesive sheet, glass plate, wherein the lower surface of pallet is connected with the upper surface of adhesive sheet, and the upper surface of glass plate is connected with the lower surface of adhesive sheet.The lower surface of glass plate is connected with the silico briquette of required cutting by glue-line.It is to be noted, silico briquette fixture provided by the invention, the last transverse plane place Plane intersects of the plane, place, lower surface of its glue-line and pallet, be that the lower surface of glue-line and the last transverse plane of pallet have certain angle, if during the upper surface horizontal positioned of pallet, the lower surface of glue-line is the inclined plane.In addition, it is pointed out that above-mentioned " upper surface ", " lower surface " mean when pallet, adhesive board, glass plate are in stacked successively state from top to bottom the upper surface of indication, lower surface.So be provided with, silico briquette fixture provided by the invention, when the silico briquette cutting will finish, because plane, glue-line place is a clinoplain, with respect to prior art, the point of penetration of line of cut can be avoided dropping down onto on glue-line or the glass plate, and drops on the silico briquette.And then silico briquette fixture provided by the invention can make cutting will finish the time, and the point of penetration of line of cut drops on the silico briquette, and then the slurry of effectively having evaded because of the line of cut adhesive tape filtered out by glue-line, and causes silicon chip to have the problem of kerf.
The present invention also provides a kind of silico briquette scroll saw lathe, comprises workbench, is used to cut the line of cut of silico briquette and the silico briquette fixture that is connected with described workbench, and described silico briquette fixture is above-mentioned described silico briquette fixture.Because silico briquette scroll saw lathe provided by the invention, its silico briquette fixture has adopted above-mentioned silico briquette fixture, so silico briquette scroll saw lathe provided by the invention, the slurry that can effectively evade because of the line of cut adhesive tape is filtered out by glue-line, and causes silicon chip to have the problem of kerf.The derivation of the beneficial effect that its concrete derivation and above-mentioned silico briquette fixture are brought is similar substantially, so this paper repeats no more.
In the preferred version of the present invention, the point of penetration of described line of cut and cut out a little between line segment place straight line and the last transverse plane place Plane intersects of described pallet, and the two intersection point is close to described cutting out a little.Need to prove, the point of penetration of above-mentioned line of cut and cut out a little between line segment place straight line and the joining of the last transverse plane of pallet be close to cutting out a little of line of cut, system for the point of penetration of line of cut, promptly the point of penetration of above-mentioned line of cut and cut out a little between line segment place straight line and the joining of the last transverse plane of pallet away from the point of penetration of line of cut.So be provided with, on the basis at the angle of inclination of the glue-line that changes above-mentioned silico briquette fixture, the present invention also can be by changing the angle of inclination of line of cut, can further make the point of penetration of line of cut away from glue-line.
Description of drawings
In order to be illustrated more clearly in embodiment of the present invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is silico briquette fixture and a silico briquette assembly structure schematic diagram in the prior art;
Fig. 2 is silico briquette fixture and a silico briquette assembly structure schematic diagram in the specific embodiment of the invention;
Fig. 3 is pallet and an adhesive sheet syndeton schematic diagram in the specific embodiment of the invention.
The specific embodiment
The invention discloses a kind of silico briquette fixture, go out the problem of knife saw trace to evade silicon chip.The present invention also provides a kind of silico briquette scroll saw lathe that comprises above-mentioned silico briquette fixture.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiments.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
Please refer to Fig. 2 and Fig. 3, Fig. 2 is silico briquette fixture and a silico briquette assembly structure schematic diagram in the specific embodiment of the invention; Fig. 3 is pallet and an adhesive sheet syndeton schematic diagram in the specific embodiment of the invention.
This specific embodiment provides a kind of silico briquette fixture, comprises pallet 11, adhesive sheet 12, glass plate 13, and wherein the lower surface of pallet 11 is connected with the upper surface of adhesive sheet 12, and the upper surface of glass plate 13 is connected with the lower surface of adhesive sheet 12.The lower surface of glass plate 13 is connected with the silico briquette 15 of required cutting by glue-line 14.
It is pointed out that above-mentioned " upper surface ", " lower surface " mean when pallet, adhesive board, glass plate are in stacked successively state from top to bottom, " upper surface " of indication, " lower surface ".
In addition, the silico briquette fixture that this specific embodiment provides, with respect to prior art, the last transverse plane place Plane intersects of the plane, place, lower surface of its glue-line 14 and pallet 11, be that the lower surface of glue-line 14 and the last transverse plane of pallet 11 have certain angle, this angle can specifically be set as the case may be.If during the upper surface horizontal positioned of pallet, the lower surface of glue-line is the inclined plane.
Because when the workbench of pallet 11 and scroll saw lathe was in connection status, the upper surface of pallet 11 and worktable displacement direction were perpendicular, are datum level so the present invention adopts the upper surface of pallet 11.Certainly, silico briquette fixture provided in the present embodiment, also can adopt other face is benchmark, only needs it and the worktable displacement direction is perpendicular gets final product.
So be provided with, silico briquette fixture provided by the invention, when the silico briquette cutting will finish, because plane, glue-line 14 place is a clinoplain, with respect to prior art, the point of penetration of line of cut can be avoided dropping down onto on glue-line 14 or the glass plate 13, and drops on the silico briquette 15.And then silico briquette fixture provided by the invention can make cutting will finish the time, and the point of penetration of line of cut drops on the silico briquette 15, and then the slurry of effectively having evaded because of line of cut 17 adhesive tapes filtered out by glue-line, and causes silicon chip to have the problem of kerf.
Certainly, in this specific embodiment, line of cut 17 is before cutting silico briquette 15, and the lower surface of silico briquette 15 need fixedly install gib block 16.Those skilled in the art are understandable that gib block 16 has very important effect in cutting process.Line of cut 17 needs to find cutting into position accurately on gib block 16, can cut silico briquette 15.So gib block provided in the present embodiment, it can effectively determine the cutting into position of line of cut 17, with the uneven problem of the silicon wafer thickness of avoiding cutting.
In order to make the plane, place, lower surface of glue-line 14 and the last transverse plane place Plane intersects of pallet 11, promptly the last transverse plane of the lower surface of glue-line 14 and pallet 11 has certain angle, and this specific embodiment can be accomplished in several ways.
For example, silico briquette fixture provided in the present embodiment can be set to the inclined plane by the lower surface of pallet 11, i.e. the last transverse plane place Plane intersects of the plane, place, lower surface of pallet 11 and pallet 11.Certainly, the lower surface of pallet 11 is set to after the inclined plane, and the coupled adhesive sheet 12 and the upper surface of glass plate 13 or lower surface can not need change, and promptly adhesive sheet 12 and glass plate 13 are same as the prior art still is rectangular structure.
So be provided with, only need to change the lower surface of pallet 11, can realize that glue-line 14 relative prior aries are the purpose of clinoplain, and then when cutting will finish, the point of penetration of line of cut can be avoided dropping down onto on glue-line 14 or the glass plate 13, and drops on the silico briquette 15.
Silico briquette fixture provided in the present embodiment also can realize that by the structure that changes adhesive sheet 12 lower surface of glue-line 14 is the purpose on inclined plane.For example, can the plane, last transverse plane place of its plane, place and pallet 11 be had a certain degree by changing the upper surface or the lower surface of adhesive sheet 12, this angle can specifically be set as the case may be.The relative prior art in the upper and lower end face of the lower surface of pallet 11 and glass plate 13 can not change.
So be provided with, silico briquette fixture provided in the present embodiment, when the cutting of silico briquette 15 will finish, the point of penetration that also can effectively evade line of cut dropped on glue-line 14 or the glass plate 13, and the silicon chip that causes cutting out has the problem of kerf.
Silico briquette fixture provided in the present embodiment also can realize that by the structure that changes glass plate 13 lower surface of glue-line 14 is the purpose on inclined plane.Its concrete set-up mode is identical substantially with the set-up mode of above-mentioned adhesive sheet 12, so this paper repeats no more.
Certainly, silico briquette fixture provided in the present embodiment also can realize that the lower surface of glue-line 14 is the purpose on inclined plane by changing pallet 11 lower surfaces, adhesive sheet 12 and glass plate 13 simultaneously, certainly, can change wherein any two, the present invention does not do concrete qualification yet.
The present invention also provides a kind of silico briquette scroll saw lathe, comprise workbench, be used to cut the line of cut 17 of silico briquette and the silico briquette fixture that is connected with workbench, it is pointed out that this silico briquette fixture is the silico briquette fixture described in above-mentioned arbitrary specific embodiment.
Because silico briquette scroll saw lathe provided in the present embodiment, its silico briquette fixture has adopted silico briquette fixture in above-mentioned each specific embodiment, so silico briquette scroll saw lathe provided in the present embodiment, the slurry that can effectively evade because of the line of cut adhesive tape is filtered out by glue-line 14, and causes silicon chip to have the problem of kerf.The derivation of the beneficial effect that the silico briquette fixture is brought in its concrete derivation and the above-mentioned specific embodiment is similar substantially, so this paper repeats no more.
In addition, when making that cutting will finish, further enlarge the point of penetration of line of cut 17 and the distance of glue-line, the possibility that is filtered out by glue-line 14 with the slurry of evading the line of cut adhesive tape.Scroll saw lathe provided in the present embodiment, the point of penetration of its line of cut 17 and cut out a little between line segment place straight line and the last transverse plane place Plane intersects of pallet 11, and the two intersection point is close to cutting out a little of line of cut 17.Promptly, intersect with point of penetration and the glue-line 14 of avoiding line of cut 17 by changing the angle of inclination of line of cut 17.
Need to prove, the point of penetration of above-mentioned line of cut 17 and cut out a little between line segment place straight line and the joining of the last transverse plane of pallet be close to cutting out a little of line of cut, system for the point of penetration of line of cut, promptly the point of penetration of above-mentioned line of cut and cut out a little between line segment place straight line and the joining of the last transverse plane of pallet away from the point of penetration of line of cut.
So be provided with, on the basis at the angle of inclination of the glue-line that changes above-mentioned silico briquette fixture, the present invention also can be by changing the angle of inclination of line of cut, can further make the point of penetration of line of cut away from glue-line 14, further evaded the possibility that line of cut 17 and glue-line 14 intersect.
In addition, silico briquette scroll saw lathe provided in the present embodiment, its pallet 11 can be connected to the workbench of lathe by the mode of clamping.For example, the upper surface of pallet 11 can be provided with draw-in groove 111, and the silico briquette fixture is placed in the workbench of lathe by this draw-in groove 111.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed all is and the difference of other embodiments that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of disclosed embodiment, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiments will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments.Therefore, the present invention will can not be restricted to these embodiments shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (7)
1. silico briquette fixture comprises:
Pallet;
The adhesive sheet that the upper surface is connected with the lower surface of described pallet;
The glass plate that the upper surface is connected with the lower surface of described adhesive sheet,
The lower surface of described glass plate is connected with silico briquette by glue-line, it is characterized in that the last transverse plane place Plane intersects of the plane, place, lower surface of described glue-line and described pallet.
2. silico briquette fixture as claimed in claim 1 is characterized in that, the last transverse plane place Plane intersects of the plane, place, lower surface of described pallet and described pallet.
3. silico briquette fixture as claimed in claim 1, it is characterized in that, the last transverse plane place plane parallel of the plane, place, lower surface of described pallet and described pallet, and the last transverse plane place Plane intersects of the plane, following transverse plane place of described adhesive sheet and described pallet.
4. silico briquette fixture as claimed in claim 1, it is characterized in that, the last transverse plane place plane parallel of the plane, place, lower surface of described adhesive sheet and described pallet, and the last transverse plane place Plane intersects of the plane, following transverse plane place of described glass plate and described pallet.
5. a silico briquette scroll saw lathe comprises workbench, is used to cut the line of cut of silico briquette and the silico briquette fixture that is connected with described workbench, it is characterized in that described silico briquette fixture is as each described silico briquette fixture of claim 1-4.
6. silico briquette scroll saw lathe as claimed in claim 5 is characterized in that, the point of penetration of described line of cut and cut out a little between line segment place straight line and the last transverse plane place Plane intersects of described pallet, and the two intersection point is close to described cutting out a little.
7. silico briquette scroll saw lathe as claimed in claim 6 is characterized in that the upper surface of described pallet is provided with draw-in groove, and described silico briquette fixture is placed in described workbench by described draw-in groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101716250A CN102229213A (en) | 2011-06-23 | 2011-06-23 | Silicon block wire saw machine tool and silicon block fixing device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101716250A CN102229213A (en) | 2011-06-23 | 2011-06-23 | Silicon block wire saw machine tool and silicon block fixing device thereof |
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| CN102229213A true CN102229213A (en) | 2011-11-02 |
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| CN2011101716250A Pending CN102229213A (en) | 2011-06-23 | 2011-06-23 | Silicon block wire saw machine tool and silicon block fixing device thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102514107A (en) * | 2011-11-22 | 2012-06-27 | 江苏金晖光伏有限公司 | Method for cutting polycrystalline large ingot |
| CN102700020A (en) * | 2012-06-15 | 2012-10-03 | 苏州晶樱光电科技有限公司 | Crystal support for cutting silicon stick |
| CN102729342A (en) * | 2012-06-06 | 2012-10-17 | 海润光伏科技股份有限公司 | Preparation method used in manufacturing of efficient polycrystalline silicon wafer |
| CN103085178A (en) * | 2011-11-04 | 2013-05-08 | 上海日进机床有限公司 | Slicing machine for cutting sapphire silicon rods |
| CN103273580A (en) * | 2013-06-05 | 2013-09-04 | 英利能源（中国）有限公司 | Fretsaw and tray thereof |
| CN107457924A (en) * | 2017-08-30 | 2017-12-12 | 宁晋松宫电子材料有限公司 | A kind of polysilicon dicing method |
| CN110871507A (en) * | 2019-12-04 | 2020-03-10 | 焦作市通发电子产品有限公司 | Crystal inclination cutting method and positioning fixture |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103085178A (en) * | 2011-11-04 | 2013-05-08 | 上海日进机床有限公司 | Slicing machine for cutting sapphire silicon rods |
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| CN107457924A (en) * | 2017-08-30 | 2017-12-12 | 宁晋松宫电子材料有限公司 | A kind of polysilicon dicing method |
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| CN110871507B (en) * | 2019-12-04 | 2021-11-23 | 焦作市通发电子产品有限公司 | Crystal inclination cutting method and positioning fixture |
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Application publication date: 20111102 |