CN110871507B - Crystal inclination cutting method and positioning fixture - Google Patents
Crystal inclination cutting method and positioning fixture Download PDFInfo
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- CN110871507B CN110871507B CN201911228721.7A CN201911228721A CN110871507B CN 110871507 B CN110871507 B CN 110871507B CN 201911228721 A CN201911228721 A CN 201911228721A CN 110871507 B CN110871507 B CN 110871507B
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- crystal
- cutting
- slide glass
- dicing saw
- height
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- 239000013078 crystal Substances 0.000 title claims abstract description 124
- 238000005520 cutting process Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 45
- 238000012545 processing Methods 0.000 claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 230000000670 limiting effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000012797 qualification Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a crystal inclination cutting method and a positioning fixture, relating to the technical field of crystal cutting, wherein the inclination cutting method comprises the following steps: adhering the crystal to a slide by using an adhesive; cutting the crystal on the slide into crystal strips by using a dicing saw; placing the slide glass with the crystal strips on a positioning fixture capable of positioning the slide glass, wherein the upper surface of the positioning fixture is an inclined surface so that the slide glass has an inclined angle relative to the processing table surface of the dicing saw; cutting the crystal strip on the slide into crystal grains with inclination by using a dicing saw; because the crystal material does not need to be bonded twice, the operation steps are simpler, and the production efficiency of crystal inclination cutting is improved; when the cutter is used for cutting a plurality of crystal strips, the materials on the same cutting plane are the same, so that the hardness of the same cutting plane is ensured to be the same, the use requirement of the cutter is reduced, the production cost of crystal inclination cutting is reduced, the conditions of crystal deformation, edge breakage and the like are reduced, and the cutting qualified rate is improved.
Description
Technical Field
The invention relates to the technical field of crystal cutting, in particular to a crystal inclination cutting method and a positioning fixture.
Background
In recent years, with the continuous development of optical communication technology, especially the commercial application of 5G technology, the requirements for modules are higher and higher, and the requirements for free space isolators as the technical guarantee of modules are also higher, so the problem of chip slope cutting is also promoted.
The existing crystal inclination cutting method is realized by cutting a crystal into strips, then turning the crystal strips by 90 degrees and placing the crystal strips in an inclined manner, and then cutting the crystal strips. The crystal material is needed to be bonded twice, the operation steps are complicated, the production efficiency of crystal inclination cutting is limited, the crystal is generally composed of three layers of materials, after the crystal is turned over, because the hardness of each layer of material is different, the same cutter is used for cutting the materials with different hardness at the same time, the requirement on the cutter is very high, the production cost is increased, and the conditions of deformation, edge breakage and the like of the cutting part of the crystal are easy to generate, so that the problems of low cutting efficiency, low cutting qualification rate and high cutting cost are caused.
Disclosure of Invention
The invention aims to provide a crystal slope cutting method, which aims to solve the problems of low cutting efficiency, low cutting qualified rate and high cutting cost of the crystal slope cutting method in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
a method of slope cutting of a crystal, comprising the steps of:
s1, adhering the crystal to the slide by using an adhesive;
s2, cutting the crystal on the slide into crystal strips by a dicing saw;
s3, placing the slide glass with the crystal strips on a positioning clamp capable of positioning the slide glass, wherein the upper surface of the positioning clamp is an inclined surface so that the slide glass has an inclined angle relative to the processing table surface of the dicing saw;
and S4, cutting the crystal strips on the slide into grains with slopes by using a dicing saw.
As a further scheme of the invention: the adhesive in the S1 is a UV adhesive.
As a further scheme of the invention: and S1, after the crystal is adhered to the slide by the UV adhesive, enabling at least one side edge of the crystal to be parallel to at least one side edge of the slide to realize the positioning of the crystal, and then irradiating and curing by using a UV lamp for 8-10 seconds.
As a further scheme of the invention: and after the wafer carrier in the S3 is placed on the positioning fixture, measuring the height of the lowest point of the crystal strip relative to the processing table surface of the dicing saw by using a height meter, and taking the crystal strip with the height of the lowest point as the initial processing position of the dicing saw in the S4.
As a further scheme of the invention: the method for determining the lowest point height comprises the following steps: and selecting a straight line on the upper surface of the slide as a straight line A, wherein the straight line A is coincided with the side edge of the lowest height position of the crystal strip, and measuring the heights of at least two points of the straight line A by using a height meter, wherein the point with the minimum height value is the height of the lowest point.
As a further scheme of the invention: in the step S4, the crystal bar with the lowest point height is used as the initial processing position of the dicing saw, the crystal bar with the highest point height is used as the final processing position of the dicing saw, and the dicing saw performs cutting from the initial processing position to the final processing position by using the height compensation value.
As a further scheme of the invention: the height compensation value is a height difference value in the vertical direction corresponding to the inclined plane of the positioning clamp.
As a further scheme of the invention: and in the S4, when the dicing saw is used for cutting the crystal strips on the slide glass, cutting is firstly carried out once and then the cutting is stopped, whether the crystal strips are cut thoroughly is observed, if the crystal strips are not cut thoroughly, the cutting depth value of the dicing saw is adjusted, if the crystal strips are cut thoroughly, the slide glass is taken down and is observed under a microscope to observe whether the cut is deformed or not and the edge is cracked, and if the cut is not deformed or not, the slide glass is clamped on the positioning clamp again and is continuously cut by the dicing saw.
Another object of the present invention is to provide a positioning jig for crystal slope cutting, comprising:
the upper surface of the placing body is an inclined plane, and a slide glass with crystals adhered to the upper surface is placed on the upper surface of the placing body;
and the limiting mechanism is used for limiting the side surface of the slide glass so that the slide glass can be fixed on the placing body.
As a further scheme of the invention: stop gear is including seting up place the recess of body upper surface, set up at the dog of placing the side of the body and be used for connecting the dog and the screw thread spare of placing the body, the tip that the recess is close to the dog link up to the edge side of placing the body so that a side edge that the slide glass of recess was gone into to the messenger card can spill.
Compared with the prior art, the invention has the beneficial effects that:
1. because the crystal material does not need to be bonded twice, the operation steps are simpler, and the production efficiency of crystal inclination cutting is improved;
2. when the cutter is used for cutting a plurality of crystal strips, the materials on the same cutting plane are the same, so that the hardness of the same cutting plane is ensured to be the same, the use requirement of the cutter is reduced, the production cost of crystal inclination cutting is reduced, the conditions of crystal deformation, edge breakage and the like are also effectively reduced, and the cutting qualified rate is improved.
Drawings
Fig. 1 is a front view of the positioning jig for holding a carrier sheet according to the present invention.
Fig. 2 is a top view of fig. 1.
Fig. 3 is a plan view of the positioning jig of the present invention.
FIG. 4 is a top view of a slide and crystal in the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to specific embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The existing crystal inclination cutting method is realized by cutting a crystal into strips, then turning the crystal strips by 90 degrees and placing the crystal strips in an inclined manner, and then cutting the crystal strips. The crystal material is needed to be bonded twice, the operation steps are complicated, the production efficiency of crystal inclination cutting is limited, the crystal is generally composed of three layers of materials, after the crystal is turned over, because the hardness of each layer of material is different, the same cutter is used for cutting the materials with different hardness at the same time, the requirement on the cutter is very high, the production cost is increased, and the conditions of deformation, edge breakage and the like of the cutting part of the crystal are easy to generate, so that the problems of low cutting efficiency, low cutting qualification rate and high cutting cost are caused.
In an embodiment of the present invention, a method for cutting a slope of a crystal includes the steps of:
s1, adhering the crystal 2 to a slide 1 by using an adhesive, wherein the slide 1 is a glass sheet;
s2, cutting the crystal 2 on the slide glass 1 into crystal strips by a dicing saw;
s3, placing the slide glass 1 with the crystal strips on a positioning clamp 3 capable of positioning the slide glass 1, wherein the upper surface of the positioning clamp 3 is an inclined surface so that the slide glass 1 has an inclined angle relative to the processing table of the dicing saw;
s4, dicing the crystal strip on the slide 1 into grains having a pitch by a dicing saw.
After cutting the crystal 2 bonded on the slide glass 1 into crystal strips, directly clamping the slide glass 1 on a positioning fixture 3 to ensure that the slide glass 1 and the crystal strips have a certain inclination angle, and then placing the positioning fixture 3 with the slide glass 1 on a processing table surface of a dicing saw for cutting, thus obtaining crystal grains with inclination; because the crystal material does not need to be bonded twice, the operation steps are simpler, and the production efficiency of crystal inclination cutting is improved; when the cutter is used for cutting a plurality of crystal strips, the materials on the same cutting plane are the same, so that the hardness of the same cutting plane is ensured to be the same, the use requirement of the cutter is reduced, the cutting can be realized by adopting a domestic cutter with higher cost performance, the production cost of crystal inclination cutting is reduced, the conditions of crystal deformation, edge breakage and the like are also effectively reduced, and the cutting qualification rate is improved.
In a specific embodiment of the present invention, after the crystal 2 is adhered to the carrier sheet 1 by the UV adhesive in S1, at least one side of the crystal 2 is parallel to at least one side of the carrier sheet 1 to position the crystal 2, and then the crystal 2 is irradiated and cured by the UV lamp for 8 to 10 seconds, and the adhesion and fixation effect of the crystal 2 on the carrier sheet 1 is ensured by using the UV adhesive.
In an embodiment of the present invention, after the slide 1 in S3 is placed on the positioning fixture 3, a height meter is used to measure the lowest point height of the crystal bar relative to the processing table of the dicing saw, and the crystal bar with the lowest point height is the starting processing position of the dicing saw in S4, and the method for determining the lowest point height includes: selecting a straight line on the upper surface of the slide 1 as a straight line A, wherein the straight line A is coincided with the side edge of the lowest height position of the crystal strips, measuring the heights of at least two positions of the straight line A by using a height meter, wherein the point with the smallest height value is the lowest point height, in the S4, the crystal strip with the lowest point height is taken as the initial processing position of the dicing saw, the crystal strip with the highest point height is taken as the terminal processing position of the dicing saw, and the dicing saw cuts downwards from the initial processing position to the terminal processing position by using a height compensation value which is the height difference value in the vertical direction corresponding to the inclined plane of the positioning clamp 3; and in the cutting process of the scribing machine, the feed depth of the lower cutter is increased every time the lower cutter is cut, so that the scribing machine can cut through the crystal strips and cannot excessively cut the carrier glass 1.
In a specific embodiment of the present invention, in S4, when the dicing saw is used to cut the crystal strip on the carrier sheet 1, the cutting is stopped after a cut is made, whether the crystal strip is cut thoroughly is observed, if the crystal strip is not cut thoroughly, the cutting depth value of the dicing saw is adjusted, if the crystal strip is cut thoroughly, the carrier sheet 1 is taken down and the situations of deformation and edge breakage of the cut are observed under a microscope, and if the cut has no deformation and edge breakage, the carrier sheet 1 is clamped onto the positioning fixture 3 again and is continuously cut by the dicing saw; before the dicing saw continuously cuts, whether the crystal strip is cut thoroughly, deformed or edge-broken and the like are observed, parameters and the like of the dicing saw are correspondingly adjusted when the conditions exist, and continuous slope cutting is carried out when the conditions do not exist, so that the cutting quality can be further improved.
A positioning fixture for crystal slope cutting, as shown in fig. 1-4, comprising: the device comprises a placing body 4, wherein the upper surface of the placing body 4 is an inclined plane, and a slide glass 1 with a crystal 2 adhered to the upper surface is placed on the upper surface of the placing body 4; and the limiting mechanism 3 is used for limiting the side surface of the slide glass 1 so that the slide glass 1 can be fixed on the placing body 4.
Specifically, stop gear 3 is including seting up place the recess 31 of body 4 upper surface, set up at the dog 32 of placing 4 side and be used for connecting dog 32 and the screw 33 of placing 4, the tip that recess 31 is close to dog 32 link up to the edge side of placing 4 so that the slide glass 1's that the recess 31 was gone into to the card one side can leak.
The slide glass 1 bonded with the crystal 2 is placed in the groove 31, the groove 31 limits three side faces of the slide glass 1, and then the stop dog 32 limits the rest side face of the slide glass 1 by rotating the threaded piece 33, so that the clamping limiting effect on the slide glass 1 is realized.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A method of slope cutting of a crystal, comprising the steps of:
s1, adhering the crystal (2) to the slide (1) by using an adhesive;
s2, cutting the crystal (2) on the slide glass (1) into crystal strips by a dicing saw;
s3, placing the slide glass (1) with the crystal strips on a positioning clamp capable of positioning the slide glass (1), wherein the upper surface of the positioning clamp is an inclined plane so that the slide glass (1) has an inclined angle relative to the processing table surface of the dicing saw, after the slide glass (1) is placed on the positioning clamp, measuring the height of the lowest point of the crystal strips relative to the processing table surface of the dicing saw by using a height gauge, and taking the crystal strips with the height of the lowest point as the initial processing position of the dicing saw in S4; the method for determining the lowest point height comprises the following steps: selecting a straight line on the upper surface of the slide glass (1) as a straight line A, wherein the straight line A is superposed with the side edge of the lowest height position of the crystal strip, and measuring the heights of at least two points of the straight line A by using a height meter, wherein the point with the smallest height value is the height of the lowest point;
s4, cutting the crystal strips on the slide glass (1) into crystal grains with inclination by a dicing saw;
the positioning jig includes:
the device comprises a placing body (4), wherein the upper surface of the placing body (4) is an inclined plane, and a slide glass (1) with a crystal (2) adhered to the upper surface is placed on the upper surface of the placing body (4);
the limiting mechanism (3) is used for limiting the side surface of the slide glass (1) so that the slide glass (1) can be fixed on the placing body (4);
stop gear (3) are including seting up place recess (31) of body (4) upper surface, set up in dog (32) of placing body (4) side and be used for connecting dog (32) and screw thread spare (33) of placing body (4), recess (31) tip near dog (32) link up to the edge side of placing body (4) so that the card leaks to a side of slide glass (1) of recess (31).
2. The method for pitch cutting of a crystal according to claim 1, wherein the adhesive in S1 is a UV adhesive.
3. The method for cutting the slope of the crystal according to claim 2, wherein the crystal (2) is adhered to the slide (1) by using a UV adhesive in S1, at least one side of the crystal (2) is parallel to at least one side of the slide (1) to position the crystal (2), and then the crystal is irradiated and cured by using a UV lamp for 8 to 10 seconds.
4. The method for cutting a slope of a crystal according to claim 1, wherein the crystal bar with the lowest point height is used as a starting processing position of the dicing saw in the step S4, the crystal bar with the highest point height is used as an end processing position of the dicing saw, and the dicing saw cuts downward from the starting processing position to the end processing position by using the height compensation value.
5. The method of claim 4, wherein the height compensation value is a vertical height difference corresponding to the inclined surface of the positioning jig.
6. The method for cutting the inclination of the crystal according to any one of claims 1 to 5, wherein the dicing saw is used for cutting the crystal strip on the slide glass (1) in S4, the cutting is firstly performed once and then stopped, whether the crystal strip is cut completely is observed, if the crystal strip is not cut completely, the cutting depth value of the dicing saw is adjusted, if the crystal strip is cut completely, the slide glass (1) is taken down and the microscope is used for observing whether the cut is deformed or broken, and if the cut is not deformed or broken, the slide glass (1) is clamped on the positioning fixture again and is continuously cut by the dicing saw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911228721.7A CN110871507B (en) | 2019-12-04 | 2019-12-04 | Crystal inclination cutting method and positioning fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911228721.7A CN110871507B (en) | 2019-12-04 | 2019-12-04 | Crystal inclination cutting method and positioning fixture |
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| Publication Number | Publication Date |
|---|---|
| CN110871507A CN110871507A (en) | 2020-03-10 |
| CN110871507B true CN110871507B (en) | 2021-11-23 |
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| CN201911228721.7A Expired - Fee Related CN110871507B (en) | 2019-12-04 | 2019-12-04 | Crystal inclination cutting method and positioning fixture |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11235718A (en) * | 1998-02-20 | 1999-08-31 | Hitachi Cable Ltd | Method for cutting semiconductor ingot |
| CN102056712A (en) * | 2008-06-30 | 2011-05-11 | 信越半导体股份有限公司 | Method for cutting work |
| CN102229213A (en) * | 2011-06-23 | 2011-11-02 | 英利能源（中国）有限公司 | Silicon block wire saw machine tool and silicon block fixing device thereof |
| CN102581970A (en) * | 2012-03-06 | 2012-07-18 | 英利能源（中国）有限公司 | Adjusting device for crystalline silicon block for solar battery component and cutting method |
| CN104441276A (en) * | 2014-11-06 | 2015-03-25 | 江苏协鑫硅材料科技发展有限公司 | Cutting method of crystalline silicon ingot |
| US10201914B2 (en) * | 2015-01-20 | 2019-02-12 | Park Industries, Inc. | Material loading apparatus |
-
2019
- 2019-12-04 CN CN201911228721.7A patent/CN110871507B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11235718A (en) * | 1998-02-20 | 1999-08-31 | Hitachi Cable Ltd | Method for cutting semiconductor ingot |
| CN102056712A (en) * | 2008-06-30 | 2011-05-11 | 信越半导体股份有限公司 | Method for cutting work |
| CN102229213A (en) * | 2011-06-23 | 2011-11-02 | 英利能源（中国）有限公司 | Silicon block wire saw machine tool and silicon block fixing device thereof |
| CN102581970A (en) * | 2012-03-06 | 2012-07-18 | 英利能源（中国）有限公司 | Adjusting device for crystalline silicon block for solar battery component and cutting method |
| CN104441276A (en) * | 2014-11-06 | 2015-03-25 | 江苏协鑫硅材料科技发展有限公司 | Cutting method of crystalline silicon ingot |
| US10201914B2 (en) * | 2015-01-20 | 2019-02-12 | Park Industries, Inc. | Material loading apparatus |
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| CN110871507A (en) | 2020-03-10 |
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