CN102581974B - Crystal cutting, positioning and bonding platform - Google Patents
Crystal cutting, positioning and bonding platform Download PDFInfo
- Publication number
- CN102581974B CN102581974B CN201210094287.XA CN201210094287A CN102581974B CN 102581974 B CN102581974 B CN 102581974B CN 201210094287 A CN201210094287 A CN 201210094287A CN 102581974 B CN102581974 B CN 102581974B
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- CN
- China
- Prior art keywords
- crystal
- base
- baffle plate
- bonding platform
- support bar
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- 239000013078 crystal Substances 0.000 title claims abstract description 39
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 15
- 239000010439 graphite Substances 0.000 claims abstract description 15
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 12
- 238000012545 processing Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention belongs to the technical field of crystal processing and relates to a crystal cutting, positioning and bonding platform, in particular to a device for bonding and fixing a crystal before cutting. The device comprises a baffle plate and a base which are fixed together vertically; an elastic pressing component which is perpendicular to the base is fixed on the base; the pressing head of the elastic pressing component is perpendicular to the baffle plate; and one side of the upper surface of the base, which is near to the baffle plate, is provided with a graphite bearing strip. The crystal cutting, positioning and bonding platform can be used to bond the crystal conveniently, and the crystal cutting angle can be controlled within 1/6 degree, so that the process is simplified, the cost is reduced, and the efficiency is improved.
Description
Technical field
The invention belongs to crystal pro cessing technical field, particularly relate to the adhering fixture before crystal-cut.
Background technology
During crystal-cut, very strict to the angle requirement of sliced crystal, generally should control within 10 ', therefore, the method and apparatus of bonding crystal is extremely important.Be generally manual next bonding operation in prior art, can only cut a kind of crystal of angle, block number is at 1-2 block.Defect is: high to the requirement of operating personnel, and process is complicated, poor repeatability, efficiency are low.
Summary of the invention
The technical problem to be solved in the present invention overcomes that the efficiency of existing adhering method is low, the defect of poor repeatability, provides a kind of efficient, accurately, the positioning bonding device of favorable reproducibility.
In order to solve the problems of the technologies described above, the invention provides following technical scheme:
A kind of crystal-cut positioning bonding platform, comprise the baffle plate and base that are vertically fixed on together, base is fixed with the elastic pressed piece vertical with base, its hold-down head is vertical with baffle plate; In described submounts, side close to baffle plate, be provided with graphite support bar.
Described elastic pressed piece comprises column, axle sleeve, hold-down head and spring, and described axle sleeve is vertically fixed on column, and spring is positioned at axle sleeve, and hold-down head one end is located in axle sleeve, and the other end compresses workpiece under the action of the spring.
Described column is connected with base sliding.Because crystal size and variable thickness, be packaged type by column design, be conducive to expanding the scope of application.
The base of described graphite support bar bearing establishes groove, and graphite support bar is positioned at groove, and the upper plane of holder bar is lower than base plane.Graphite support bar in groove and baffle plate form fixed angles, and one is ensure that crystal is not easily pressed partially and makes crystal uniform force, and two is avoid the angle of the crystal in glue process of setting to change.
Operation principle of the present invention is: before crystal is bonding, first the angle that crystal will be processed is polished out, and cylindrical grinding makes the plane of reference.Various angle crystal or multiple crystal are put into cutting binding platform be adhesively fixed, between crystal and crystal, use glue to fix.
Beneficial effect of this cutting binding platform is used to be: bonding crystal is easy to operate, and makes the Angle ambiguity of crystal-cut within 10 ', thus simplifies technique, reduces cost, improves efficiency.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for description, together with embodiments of the present invention for explaining the present invention, is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the structural representation of crystal-cut positioning bonding platform of the present invention;
Fig. 2 is the structural representation of the elastic pressed piece of the binding platform of Fig. 1.
Detailed description of the invention
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein is only for instruction and explanation of the present invention, is not intended to limit the present invention.
As shown in Figure 1, a kind of crystal-cut positioning bonding platform, comprise the baffle plate 3 and base 1 that are vertically fixed on together, base 1 is fixed with the elastic pressed piece vertical with base 1, its hold-down head 21 is vertical with baffle plate 3; On described base 1, close to the side of baffle plate 3, establish groove 4, graphite support bar 5 is positioned at groove 4, and the upper plane of holder bar 5 is lower than base plane.Graphite support bar 5 in groove 4 forms fixed angles with baffle plate 3, and one is ensure that crystal is not easily pressed partially and makes crystal uniform force, and two is avoid the angle of the crystal in glue process of setting to change.
Elastic pressed piece comprises column 24, axle sleeve 22, hold-down head 21 and spring 23, and axle sleeve 22 is vertically fixed on column 24, and spring 23 is positioned at axle sleeve, and hold-down head 21 one end is located in axle sleeve 22, and the other end compresses workpiece 7 under the effect of spring 23.Wherein, column 24 and base 1 are slidably connected.Packaged type column can meet the demand of crystal size and variable thickness.
embodiment 1
When using crystal positioning bonding platform, 0 of milled °, 4 °, 8 ° carborundum crystals are ready to, according to the position of crystal length adjusting post on base, graphite support bar is put into groove, coat epoxide-resin glue (Fig. 16 shown in), again above-mentioned crystal is placed on graphite support bar, then holds out against with hold-down head, cut after 1 hour.Cut and can obtain the wafer of crystal orientation angular deviation within 10 '.00
The detection record table of embodiment 1 method cutting silicon carbide wafer, as shown in table 1:
The detection record table of table 1 embodiment 1 method cutting silicon carbide wafer
| Crystal is numbered | 0311036 | 0711026 | 0311040 | 0311042 | 0411044 | 0411046 |
| The cutting date | 2011.10.13 | 2011.10.13 | 2011.10.15 | 2011.10.15 | 2011.10.20 | 2011.10.20 |
| Angle before cutting | 3°20′ | 4°20′ | 0°15′ | 8°9′ | 8°14′ | 8°13′ |
| Angle after cutting | 3°15′ | 4°15′ | 0°14′ | 8°7′ | 8°11′ | 8°6′ |
embodiment 2
When using crystal positioning bonding platform, the sapphire of milled or the different crystal of GaAs angle are ready to, according to the position of crystal length adjusting post on base, graphite support bar is put into groove, coat epoxide-resin glue (Fig. 16 shown in), above-mentioned crystal is placed in graphite bar, then holds out against with hold-down head, cut after 1 hour.Cut and can obtain the wafer of crystal orientation angular deviation within 10 '.
The detection record table of embodiment 2 method cutting sapphire wafers, as shown in table 2:
The detection record table of table 2 embodiment 2 method cutting sapphire wafers
| Crystal is numbered | 1311034 | 1511042 | 1611038 |
| The cutting date | 2011.10.24 | 2011.10.24 | 2011.10.13 |
| Angle before cutting | A(11-202)±0.2° | A(11-207)±0.2° | A(11-207)±0.2° |
| Angle after cutting | A(11-202)±0.1° | A(11-207)±0.1° | A(11-207)±0.1° |
Last it is noted that the foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although with reference to previous embodiment to invention has been detailed description, for a person skilled in the art, it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. a crystal-cut positioning bonding platform, is characterized in that: comprise the baffle plate and base that are vertically fixed on together, base is fixed with the elastic pressed piece vertical with base, its hold-down head is vertical with baffle plate; In described submounts, side close to baffle plate, be provided with graphite support bar, the base of described graphite support bar bearing establishes groove, and graphite support bar is positioned at groove, and the upper plane of holder bar is lower than base plane, and the graphite support bar in groove and baffle plate form fixed angles.
2. according to the crystal-cut positioning bonding platform described in claim 1, it is characterized in that: described crystal is carborundum, sapphire or VGF GaAs.
3. the crystal-cut positioning bonding platform according to claim 1 or 2, it is characterized in that: described elastic pressed piece comprises column, axle sleeve, hold-down head and spring, described axle sleeve is vertically fixed on column, and spring is positioned at axle sleeve, and hold-down head one end is established
In axle sleeve, the other end compresses workpiece under the action of the spring.
4., according to the crystal-cut positioning bonding platform described in claim 3, it is characterized in that: described column is connected with base sliding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210094287.XA CN102581974B (en) | 2012-04-01 | 2012-04-01 | Crystal cutting, positioning and bonding platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210094287.XA CN102581974B (en) | 2012-04-01 | 2012-04-01 | Crystal cutting, positioning and bonding platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102581974A CN102581974A (en) | 2012-07-18 |
| CN102581974B true CN102581974B (en) | 2015-04-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210094287.XA Active CN102581974B (en) | 2012-04-01 | 2012-04-01 | Crystal cutting, positioning and bonding platform |
Country Status (1)
| Country | Link |
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| CN (1) | CN102581974B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103029226B (en) * | 2012-12-06 | 2015-05-13 | 江苏吉星新材料有限公司 | Forming method of sapphire pipe |
| CN105690239B (en) * | 2014-11-24 | 2018-02-16 | 上海亨通光电科技有限公司 | LiNbO3Integrated optical device chip Ginding process |
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|---|---|---|---|---|
| FR2850048A1 (en) * | 2003-01-22 | 2004-07-23 | Dassault Aviat | Cramp iron plate for fixing of machining piece e.g. sheet metal, has screw driving nail against machining piece to pierce nail into piece and, screw-nut to maintain nail to be driven into interior of machining piece |
| CN101758565A (en) * | 2009-12-15 | 2010-06-30 | 丹东奥龙射线仪器有限公司 | Bonding device of direction-finder |
| CN201677414U (en) * | 2010-05-18 | 2010-12-22 | 云南省玉溪市蓝晶科技有限责任公司 | Directionally bonding device for sapphire crystal |
| CN201677415U (en) * | 2010-05-18 | 2010-12-22 | 云南省玉溪市蓝晶科技有限责任公司 | Sapphire crystal glass fixing strip positioning bonding device |
| CN201784067U (en) * | 2010-11-02 | 2011-04-06 | 宇骏(潍坊)新能源科技有限公司 | Silicon adhesion positioning device |
| CN201856110U (en) * | 2010-10-31 | 2011-06-08 | 东风汽车零部件(集团)有限公司 | Hinged piston head drilling fixture |
| CN202668781U (en) * | 2012-04-01 | 2013-01-16 | 北京华进创威电子有限公司 | Crystalline cutting location adhesion platform |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201456253U (en) * | 2009-06-16 | 2010-05-12 | 宁晋赛美港龙电子材料有限公司 | Special fixture for use in cutting of monocrystalline silicon for making seed crystals |
-
2012
- 2012-04-01 CN CN201210094287.XA patent/CN102581974B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2850048A1 (en) * | 2003-01-22 | 2004-07-23 | Dassault Aviat | Cramp iron plate for fixing of machining piece e.g. sheet metal, has screw driving nail against machining piece to pierce nail into piece and, screw-nut to maintain nail to be driven into interior of machining piece |
| CN101758565A (en) * | 2009-12-15 | 2010-06-30 | 丹东奥龙射线仪器有限公司 | Bonding device of direction-finder |
| CN201677414U (en) * | 2010-05-18 | 2010-12-22 | 云南省玉溪市蓝晶科技有限责任公司 | Directionally bonding device for sapphire crystal |
| CN201677415U (en) * | 2010-05-18 | 2010-12-22 | 云南省玉溪市蓝晶科技有限责任公司 | Sapphire crystal glass fixing strip positioning bonding device |
| CN201856110U (en) * | 2010-10-31 | 2011-06-08 | 东风汽车零部件(集团)有限公司 | Hinged piston head drilling fixture |
| CN201784067U (en) * | 2010-11-02 | 2011-04-06 | 宇骏(潍坊)新能源科技有限公司 | Silicon adhesion positioning device |
| CN202668781U (en) * | 2012-04-01 | 2013-01-16 | 北京华进创威电子有限公司 | Crystalline cutting location adhesion platform |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102581974A (en) | 2012-07-18 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Crystal cutting, positioning and bonding platform Effective date of registration: 20151117 Granted publication date: 20150429 Pledgee: Medium range Leasing Co. Ltd. Pledgor: Beijing Huajin Chuangwei Electronics Co., Ltd. Registration number: 2015990001011 |
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Date of cancellation: 20161201 Granted publication date: 20150429 Pledgee: Medium range Leasing Co. Ltd. Pledgor: Beijing Huajin Chuangwei Electronics Co., Ltd. Registration number: 2015990001011 |
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Effective date of registration: 20170109 Address after: Tonghui trunk road 100176 Beijing city Daxing District economic and Technological Development Zone No. 17 hospital Patentee after: CENTURY GOLDRAY SEMICONDUCTOR CO., LTD. Address before: 100176 Beijing economic and Technological Development Zone, Beijing, sea road, No. 17, No. three, No. Patentee before: Beijing Huajin Chuangwei Electronics Co., Ltd. |
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Date of cancellation: 20200810 Granted publication date: 20150429 |