CN208674090U - Wafer cuts fixed device - Google Patents

Abstract

The utility model is related to a kind of wafer and cuts fixed device, including bottom plate and frame, wherein the bottom plate is for placing wafer to be cut, and the bottom plate in the deformation quantity of the wafer occurred during cutting less than a threshold value, and the bottom plate in the deformation quantity of the wafer occurred during cutting less than a threshold value；The frame is set on the bottom plate, and the region that the frame surrounds limits wafer for placing wafer.Above-mentioned wafer cuts fixed device and uses bottom plate and the fixed wafer to be cut of frame, due to bottom plate in the deformation quantity of the wafer occurred during cutting less than a threshold value, deformation is not susceptible in the process insole board that cuts of the wafer, therefore when the above-mentioned wafer of use cuts fixed device fixation wafer, it can be improved the fixed precision to wafer, to improve the cutting precision of wafer, reduces wafer and shift during cutting, generate a possibility that notch.

Description

Wafer cuts fixed device

Technical field

The utility model relates to wafer productions to manufacture processing equipment field, and in particular to a kind of wafer cuts fixed device.

Background technique

During wafer production manufacture, it is often necessary to be cut to wafer.Before being cut to wafer, need Wafer to be cut is fixed.

In the prior art, by using wafer to be cut is placed into iron hoop area defined, using blue film Wafer is fixed in the method for the fixed wafer.Please referring to Fig. 1 is to cut in the prior art to the wafer after fixation Schematic diagram.Wafer is placed in 101 area defined of iron hoop, and blue film 102 is for fixing wafer 103, and cut-off knife 104 is to wafer 103 are cut.When cutting to wafer 103,104 pairs of cut-off knife blue films 102 have downward thrust, due to blue film 102 Hardness is lower, and thrust will cause blue film 102, and deformation occurs, occurs that the wafer 103 partially relative to blue film 102, iron hoop 101 It moves, so that wafer 103 be made to be also easy to produce notch during cutting.

Utility model content

The purpose of this utility model is to provide a kind of wafers to cut fixed device, can reduce wafer during cutting It shifts, a possibility that notch occur.

In order to solve the above technical problems, the following provide a kind of wafers to cut fixed device, including bottom plate and frame, wherein The bottom plate is for placing wafer to be cut, and the bottom plate is less than in the deformation quantity of the wafer occurred during cutting One threshold value；The frame is set on the bottom plate, and the region that the frame surrounds is carried out for placing wafer, and to wafer Limit.

Optionally, the frame includes at least two cross-talk frames, and the extended line intersection of each sub- frame and sub- frame is surrounded The region that is surrounded as frame of region.

Optionally, the region that the frame surrounds is circle, and the round diameter is consistent with diameter wafer to be cut.

Optionally, when wafer is placed in the region that the frame surrounds, have between crystal round fringes and the frame Gap.

Optionally, the gap is 20 to 40 millimeters.

Optionally, the backplate surface in the region that frame surrounds is additionally provided with adhesive-layer, for wafer to be adhered to On bottom plate.

Optionally, the adhesive-layer includes any one in blue glue-line, EVA hot-melt adhesive layer and glass glue-line.

Optionally, the bottom plate includes any one in glass film plates, rigid plastics bottom plate, timber apron and metal base plate Kind.

Optionally, the frame includes any one in glass frame, plastic frame, Form board frame and metal edge frame.

Above-mentioned wafer cuts fixed device using bottom plate and the fixed wafer to be cut of frame, since bottom plate is in the wafer Cut during occur deformation quantity less than a threshold value, be not susceptible to deformation in the process insole board that cuts of the wafer, because When this cuts fixed device fixation wafer using above-mentioned wafer, the fixed precision to wafer can be improved, to improve wafer Cutting precision reduces wafer and shifts during cutting, generates a possibility that notch.

Detailed description of the invention

Fig. 1 is the schematic diagram for being fixed, cutting to wafer in the prior art.

Fig. 2 is the side view that wafer cuts fixed device in a kind of specific embodiment of the utility model.

When Fig. 3 is that wafer cuts fixed device and is placed with the wafer wait cut in a kind of specific embodiment of the utility model Side view.

Fig. 4 is to be provided with the wafer of adhesive-layer in a kind of specific embodiment of the utility model to cut fixed device and be placed with Side view when wafer wait cut.

When Fig. 5 is that wafer cuts fixed device and is placed with the wafer wait cut in a kind of specific embodiment of the utility model Top view.

When Fig. 6 is that wafer cuts fixed device and is placed with the wafer wait cut in a kind of specific embodiment of the utility model Top view.

Specific embodiment

Below in conjunction with the drawings and specific embodiments to the utility model proposes a kind of wafer cut fixed device into one Step is described in detail.According to following explanation and claims, will be become apparent from feature the advantages of the utility model.

Please referring to Fig. 2 is the side view that wafer described in present embodiment cuts fixed device, including bottom plate 201 and side Frame 202, wherein the bottom plate 201 is for placing wafer 203 to be cut, and the cutting in the wafer 203 of the bottom plate 201 The deformation quantity occurred in the process is less than a threshold value.The frame 202 is set on bottom plate 201, the region that the frame 202 surrounds It is limited for placing wafer 203, and to wafer 203.

In a kind of specific embodiment, when being cut to the wafer 203 being placed on the bottom plate 201, bottom plate 201 It will receive the downward thrust of cut-off knife.Since the deformation quantity that the bottom plate 201 occurs is less than threshold value, wafer 203 is due to bottom plate 201 deformation and the offset that generates improves the cutting precision of wafer 203, reduces during cutting again smaller than corresponding threshold value There is a possibility that notch.

In a specific embodiment, the bottom plate 201 is glass film plates, rigid plastics bottom plate, timber apron and metal Any one in bottom plate etc., user can select as needed, it is only necessary to guarantee that bottom plate 201 cuts process in wafer 203 The deformation quantity of middle generation is less than threshold value.

In a specific embodiment, the frame 202 is glass frame, plastic frame, Form board frame and metal edges Any one in frame, user can select as needed, need to only meet the frame 202 shape and the wafer 203 The adaptable demand of shape.

In a specific embodiment, the region that the frame 202 surrounds is circle.In other specific embodiments In, the region that the frame 202 surrounds can also be other shapes, such as square, diamond shape, triangle, only need to meet and can use In the demand placing wafer 203, being limited to wafer 203.

When 202 area defined of frame is that the round and described circular diameter is consistent with the diameter of wafer 203 When, after the wafer 203 is placed into 202 area defined of frame, the edge of wafer 203 fits in the side completely The inner wall of frame 202, wafer 203 is during cutting relative to bottom plate 201 without offset.Please referring to Fig. 3 is present embodiment The wafer cuts side view when fixed device is placed with the wafer wait cut, and the region that the frame 302 surrounds is circle, And the circular diameter is consistent with the diameter of the wafer 303.The wafer 303 is placed into the frame 302, and institute The edge for stating wafer 303 is bonded the inner wall of the frame 302 completely.When being cut to wafer 303, wafer 303 and bottom plate 301 Between without relative displacement, do not shift.

With continued reference to Fig. 2, when 202 area defined of frame is that the round and described circular diameter is greater than wafer When 203 diameter, after the wafer 203 is placed into 202 area defined of frame, the edge and frame of wafer 203 There are gap between 202 inner wall, wafer 203 occurs during cutting easily with respect to the plane where bottom plate 201 opposite Displacement.At this point it is possible to which adhesive-layer is arranged on region that frame 202 surrounds in the bottom plate 201, prevent wafer 203 from cutting Relative displacement occurs relative to the plane where bottom plate 201 in the process.

Please refer to Fig. 4 be present embodiment described in be provided with adhesive-layer wafer cut fixed device be placed with it is to be cut The side view when wafer cut, wafer 403 are placed into 402 area defined of frame.The frame 402 and wafer 403 it Between there are gap, collide wafer 403 with the inner wall of frame 402 when being placed into the frame 402 and friction occur, causes to grind A possibility that damage, reduces.It, can will be brilliant and since the bottom plate 401 is provided with adhesive-layer 404 in region that frame 401 surrounds Circle 403 is adhered on the adhesive-layer 404, fixes position of the wafer 403 on the bottom plate 401, it is difficult to bottom plate 401 occur relative displacement.In a specific embodiment, the gap is 20mm to 40mm.In other specific embodiment parties In formula, the size in gap can be configured according to the size for the wafer 403 to be cut being put into the frame 402.

In a specific embodiment, the adhesive-layer 404 includes in blue glue-line, EVA hot-melt adhesive layer and glass glue-line Any one.In the actual use process, the also settable adhesive-layer 404 of user is other glue-lines.

With continued reference to Fig. 2, the limit to wafer 203 can be realized by continuous, closure frame 202, can also pass through several sections Sub- frame realizes the limit to wafer 203.

Please referring to Fig. 5 is that wafer described in present embodiment cuts bowing when fixed device is placed with the wafer wait cut The quadrangle that the extended line of view, including two cross-talk frames 501, each cross-talk frame 501 and sub- frame 501 is surrounded is to place Wafer 502 limits wafer 502.

In other specific embodiments, the frame may also include three sections or more sub- frames 501, it is only necessary to meet each The shape of the extended line area defined of sub- frame 501 and sub- frame 501 can be used for placing wafer 502, to wafer 502 into Row limit.

Please referring to Fig. 6 is that wafer described in present embodiment cuts bowing when fixed device is placed with the wafer wait cut View, the frame 601 is continuous, is closed, and the shape of the inner wall area defined of the frame 601 is circle, with wafer 602 Shape match.The shape of the outer wall area defined of the frame 601 is circle, in other specific embodiments In, the shape of the outer wall area defined at the edge 601 can also be rectangle, triangle, diamond shape etc., not with above-mentioned The circle of statement is limited.User can be to the shape self-setting of the outer wall area defined of the frame 601.

Above-mentioned wafer cuts fixed device using bottom plate and the fixed wafer to be cut of frame, since bottom plate is in the wafer Cut during the deformation quantity that occurs deformation is not susceptible to during cutting in the wafer less than a threshold value, therefore adopt When cutting fixed device with above-mentioned wafer and fixing wafer, the fixed precision to wafer can be improved, to improve cutting for wafer Precision reduces wafer and shifts during cutting, generates a possibility that notch.

The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications Also it should be regarded as the protection scope of the utility model.

Claims (9)

1. a kind of wafer cuts fixed device, which is characterized in that including bottom plate and frame, wherein the bottom plate is to be cut for placing The wafer cut, and the bottom plate in the deformation quantity of the wafer occurred during cutting less than a threshold value；The frame setting In the region that on the bottom plate, the frame is surrounded for placing wafer, and wafer is limited.

2. wafer cuts fixed device according to claim 1, which is characterized in that the frame includes at least two cross-talk sides The region that the extended line intersection area defined of frame, each sub- frame and sub- frame is surrounded as frame.

3. wafer cuts fixed device according to claim 1, which is characterized in that the region that the frame surrounds is circle, And the round diameter is consistent with diameter wafer to be cut.

4. wafer cuts fixed device according to claim 1, which is characterized in that when wafer is placed in what the frame surrounded When in region, there is gap between crystal round fringes and the frame.

5. wafer cuts fixed device according to claim 4, which is characterized in that the gap is 20 to 40 millimeters.

6. wafer cuts fixed device according to claim 1, which is characterized in that the bottom plate in the region that frame surrounds Surface is additionally provided with adhesive-layer, for wafer to be adhered to bottom plate.

7. wafer cuts fixed device according to claim 6, which is characterized in that the adhesive-layer includes blue glue-line, EVA heat Any one in melt layer and glass glue-line.

8. wafer cuts fixed device according to claim 1, which is characterized in that the bottom plate includes glass film plates, hard Any one in plastic bottom board, timber apron and metal base plate.

9. wafer cuts fixed device according to claim 1, which is characterized in that the frame includes glass frame, plastics Any one in frame, Form board frame and metal edge frame.