CN102514107A - Method for cutting polycrystalline large ingot - Google Patents

Method for cutting polycrystalline large ingot Download PDF

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Publication number
CN102514107A
CN102514107A CN2011103721338A CN201110372133A CN102514107A CN 102514107 A CN102514107 A CN 102514107A CN 2011103721338 A CN2011103721338 A CN 2011103721338A CN 201110372133 A CN201110372133 A CN 201110372133A CN 102514107 A CN102514107 A CN 102514107A
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CN
China
Prior art keywords
polycrystalline
soft glass
large ingot
cutting
ingot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011103721338A
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Chinese (zh)
Inventor
袁华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU JINVINPV CO Ltd
Original Assignee
JIANGSU JINVINPV CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU JINVINPV CO Ltd filed Critical JIANGSU JINVINPV CO Ltd
Priority to CN2011103721338A priority Critical patent/CN102514107A/en
Publication of CN102514107A publication Critical patent/CN102514107A/en
Pending legal-status Critical Current

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Abstract

The invention provides a method for cutting a polycrystalline large ingot, and relates to the technology for cutting the polycrystalline large ingot. In the invention, a soft glass is bonded on a workpiece plate; and then the polycrystalline large ingot is positioned on the soft glass and is cut. In the invention, the soft glass is arranged between the polycrystalline large ingot and the workpiece plate so as to form insulation, so that the electric conductivity between the polycrystalline large ingot and the workpiece plate can be effectively isolated; a false grounding alarm phenomenon is avoided; production risks can be reduced; and the safety of production equipment can be effectively protected.

Description

The cutting method of the big ingot of polycrystalline
Technical field
The present invention relates to the cutting technique of the big ingot of polycrystalline.
Background technology
For the polycrystalline that is shaped is divided into the rectangle polycrystalline silicon rod that some sections are square, production technology directly being bonded on the work plate, placing on the cutting machine then and directly cuts apart mostly between the cutting car of the big ingot of polycrystalline.This cutting process will run into cutting machine " grounding alarm " prompting, and all belongs to wrong report mostly.As for fear of false alarm takes place; Before the big ingot cutting of polycrystalline, cutting machine has been carried out " grounding alarm " shielding; But owing to taking this measure but not report to the police when machine needs " grounding alarm " because of real fault afterwards; Therefore also cut the big ingot of the polycrystalline that given up, even the damage that also can cause equipment that has.It more than is the long-term problem that never solves of colleague.
Summary of the invention
The object of the invention is to propose a kind of cutting method that the big ingot of polycrystalline of mechanical false alarm can not take place in the big ingot cutting process of polycrystalline.
The technological means that proposes in order to overcome the above problems, the present invention is first at bonding block of soft glass of work plate, and then the big ingot of polycrystalline is placed on the soft glass, cuts again.
The present invention is provided with soft glass between big ingot of polycrystalline and work plate; Formed insulation, the electric conductivity between interval big ingot of polycrystalline and the work plate is avoided the phenomenon of " grounding alarm " by mistake effectively; Not only reduced production risk, simultaneously also to having protected the security of production equipment effectively.
The thickness of soft glass according to the invention is 3~8mm.
The thickness of preferred soft glass is 5mm.
The specific embodiment
The production operation step:
1, at bonding block of thick rectangle soft glass of a 3~8mm of work plate, the thickness of preferred soft glass is 5mm.
2, the big ingot of polycrystalline is placed on the soft glass.
3, open the big ingot of polysilicon cutting machine,, the big ingot of each piece is cut into four rectangle polycrystalline silicon rods by technological requirement.

Claims (3)

1. the cutting method of the big ingot of polycrystalline is characterized in that elder generation at bonding block of soft glass of work plate, and then the big ingot of polycrystalline is placed on the soft glass, cuts again.
2. according to the cutting method of the big ingot of the said polycrystalline of claim 1, the thickness that it is characterized in that said soft glass is 3~8mm.
3. according to the cutting method of the big ingot of the said polycrystalline of claim 1, the thickness that it is characterized in that said soft glass is 5mm.
CN2011103721338A 2011-11-22 2011-11-22 Method for cutting polycrystalline large ingot Pending CN102514107A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011103721338A CN102514107A (en) 2011-11-22 2011-11-22 Method for cutting polycrystalline large ingot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011103721338A CN102514107A (en) 2011-11-22 2011-11-22 Method for cutting polycrystalline large ingot

Publications (1)

Publication Number Publication Date
CN102514107A true CN102514107A (en) 2012-06-27

Family

ID=46285309

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011103721338A Pending CN102514107A (en) 2011-11-22 2011-11-22 Method for cutting polycrystalline large ingot

Country Status (1)

Country Link
CN (1) CN102514107A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101722582A (en) * 2009-12-23 2010-06-09 常州亿晶光电科技有限公司 Revolving binding platform special for cutting silicon chip
JP2011153059A (en) * 2010-01-04 2011-08-11 Asahi Glass Co Ltd Cut-line working device for plate glass, and cut-line working method
CN201941093U (en) * 2010-12-28 2011-08-24 浙江昱辉阳光能源有限公司 Filter tank support structure and filter tank thereof for cutting crystalline silicon blocks
CN201989250U (en) * 2011-01-25 2011-09-28 上海超日(洛阳)太阳能有限公司 Silicon rod cutting base
CN102229213A (en) * 2011-06-23 2011-11-02 英利能源(中国)有限公司 Silicon block wire saw machine tool and silicon block fixing device thereof
CN102229210A (en) * 2011-06-14 2011-11-02 山东大学 Brittle large-size single crystal cutting and fixing equipment and working method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101722582A (en) * 2009-12-23 2010-06-09 常州亿晶光电科技有限公司 Revolving binding platform special for cutting silicon chip
JP2011153059A (en) * 2010-01-04 2011-08-11 Asahi Glass Co Ltd Cut-line working device for plate glass, and cut-line working method
CN201941093U (en) * 2010-12-28 2011-08-24 浙江昱辉阳光能源有限公司 Filter tank support structure and filter tank thereof for cutting crystalline silicon blocks
CN201989250U (en) * 2011-01-25 2011-09-28 上海超日(洛阳)太阳能有限公司 Silicon rod cutting base
CN102229210A (en) * 2011-06-14 2011-11-02 山东大学 Brittle large-size single crystal cutting and fixing equipment and working method thereof
CN102229213A (en) * 2011-06-23 2011-11-02 英利能源(中国)有限公司 Silicon block wire saw machine tool and silicon block fixing device thereof

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120627