CN102700020A - Crystal support for cutting silicon stick - Google Patents
Crystal support for cutting silicon stick Download PDFInfo
- Publication number
- CN102700020A CN102700020A CN2012101976394A CN201210197639A CN102700020A CN 102700020 A CN102700020 A CN 102700020A CN 2012101976394 A CN2012101976394 A CN 2012101976394A CN 201210197639 A CN201210197639 A CN 201210197639A CN 102700020 A CN102700020 A CN 102700020A
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- Prior art keywords
- glass plate
- groove
- steel wire
- silicon rod
- cutting
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Abstract
The invention discloses a crystal support for cutting a silicon stick. The crystal support comprises a crystal support plate and a glass plate, wherein one side face of the glass plate is adhered to the crystal support plate through an adhesive layer; a groove is formed on the other side face of the glass plate; and the extension direction of the groove is perpendicular to the length direction of a steel wire during cutting. When the silicon stick is adhered on the crystal support and cut, the steel wire is broken difficultly, so that the fluctuation and the stress of the steel wire are reduced, and a silicon slice can be adhered firmly.
Description
Technical field
The present invention relates to a kind of brilliant holder, be meant that especially a kind of silicon rod cutting is with brilliant holder.
Background technology
Solar silicon wafers generally is that silicon rod is carried out on automatic clinical microtome, and it mainly is to utilize finer wire cutting, and gauge of wire generally adopts φ 0.1mm; The thickness of silicon chip generally is the thin slice at 0.2mm, and silicon rod generally is fixed in the brilliant holder through viscose glue, and the crystalline substance holder of adopting at present comprises brilliant supporting plate and glass plate; A side of glass plate is bonded on the brilliant supporting plate through adhesive-layer, and silicon rod is bonded in through adhesive-layer on the another side of glass plate, and is right; The side of glass plate and silicon rod bonding all is a smooth plane, and can there be problem in this structure: 1. because glass plate and silicon rod bond all is smooth plane, therefore; But the adhesive-layer energy is not enough, and silicon chip is extremely thin, causes the cohesive force of silicon chip and glass plate after the cutting not enough like this; The phenomenon that possibly occur coming off and separate causes silicon chip to damage.2. because because the hardness of glass plate is low than silicon rod hardness; Steel wire cutting silicon rod is to cut; Just be cut in the glass plate, enter into suddenly from silicon rod in when cutting and occur steel wire in the glass plate the most easily and beat, the phenomenon that broken string and silicon chip collapse the limit very easily takes place.3. because the plane of glass plate is bigger, steel wire is cut the silicon rod at adhesive glass plate middle part difficult, and the steel wire that possibly occur the silicon rod two ends was sometimes cut and taken an advanced study into broken string.
Summary of the invention
Technical problem to be solved by this invention is: provide the cutting of a kind of silicon rod with brilliant holder, silicon rod is bonded in brilliant holder when going up cutting, steel wire is difficult for broken string, reduces beating with stressed of steel wire, and the silicon chip bonding firmly.
For solving the problems of the technologies described above; Technical scheme of the present invention is: a kind of silicon rod cutting is with brilliant holder; Comprise brilliant supporting plate and glass plate; A side of this glass plate is bonded on the brilliant supporting plate through adhesive-layer, and the another side of said glass plate is provided with groove, and the bearing of trend of this groove is vertical with the steel wire length direction when cutting.
Wherein, described groove is rectangular recess or trapezoidal groove.
As a kind of preferred scheme, the number of described groove is three and evenly distributes.
As a kind of preferred scheme, be provided with the plug adaptive in the described groove with groove.
After having adopted technique scheme, effect of the present invention is: because the another side of said glass plate is provided with groove, the bearing of trend of this groove is vertical with the steel wire length direction when cutting.At first the more memory space of viscose glue is given in the existence of groove, and the viscose glue amount that is is enough, the just firm difficult drop-off of silicon chip bonding; Secondly, the existence of groove, the face of glass plate is just few with contacting of steel wire, and steel wire is stressed little, and steel wire cutting glass plate middle part just is more prone to, and beating reduces, and steel wire broken string phenomenon reduces.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 is the structure cutaway view of the embodiment of the invention;
Fig. 2 is the structural perspective of embodiment of the invention glass plate;
Fig. 3 is the structural perspective of the another kind of glass plate of the embodiment of the invention;
Fig. 4 is the structure cutaway view of the embodiment of the invention along the steel wire length direction;
In the accompanying drawing: 1. brilliant supporting plate; 2. adhesive-layer; 3. glass plate; 31. groove; 32. plug; 4. silicon rod; 5. steel wire.
The specific embodiment
Through specific embodiment the present invention is made further detailed description below.
Extremely shown in Figure 4 like Fig. 1; A kind of silicon rod cutting is with brilliant holder; Comprise brilliant supporting plate 1 and glass plate 3; A side of this glass plate 3 is bonded on the brilliant supporting plate 1 through adhesive-layer 2, and the another side of said glass plate 3 is provided with groove 31, and the bearing of trend of this groove 31 is vertical with steel wire 5 length directions when cutting.Wherein, described groove 31 is rectangular recess or trapezoidal groove.The number of described groove 31 is three and evenly distributes.Certainly, the number of groove 31 and size dimension confirm that according to the specification of different silicon rods 4 and glass plate 3 a strict requirement and a regulation is not arranged
Be provided with the plug 32 adaptive in the described groove 31 with groove 31.This plug 32 its mainly to act on be to groove 31 encapsulatings the time, plug 32 can guarantee that viscose glue is stored in the groove 31, after viscose glue solidifies slightly, can plug 32 be extracted out, thereby the viscose glue amount of guaranteeing groove 31 is enough.
During work, silicon rod 4 is bonded on the glass plate 3, steel wire 5 operations, the length direction of the steel wire 5 just bearing of trend with groove 31 is vertical; Brilliant supporting plate 1 drives silicon rod 4 and from top to bottom moves, and silicon rod 4 lateral surfaces contact steel wire 5 cuts, and after cutting silicon rod 4, further cuts certain depth glass plate 3 again, and silicon rod 4 is cut; Because the existence of groove 31, steel wire 5 diminishes stressed reducing with the contact-making surface of glass plate 3; Cut easily at glass plate 3 middle parts, and steel wire 5 is beated little, is difficult for broken string.
Claims (4)
1. a silicon rod cutting is with brilliant holder; Comprise brilliant supporting plate and glass plate; A side of this glass plate is bonded on the brilliant supporting plate through adhesive-layer, and it is characterized in that: the another side of said glass plate is provided with groove, and the bearing of trend of this groove is vertical with the steel wire length direction when cutting.
2. a kind of silicon rod cutting as claimed in claim 1 is with brilliant holder, and it is characterized in that: described groove is rectangular recess or trapezoidal groove.
3. a kind of silicon rod cutting as claimed in claim 2 is characterized in that with brilliant holder: the number of described groove is three and evenly distributes.
4. a kind of silicon rod cutting as claimed in claim 3 is characterized in that: be provided with the plug adaptive with groove in the described groove with brilliant holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101976394A CN102700020A (en) | 2012-06-15 | 2012-06-15 | Crystal support for cutting silicon stick |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101976394A CN102700020A (en) | 2012-06-15 | 2012-06-15 | Crystal support for cutting silicon stick |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102700020A true CN102700020A (en) | 2012-10-03 |
Family
ID=46893225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101976394A Pending CN102700020A (en) | 2012-06-15 | 2012-06-15 | Crystal support for cutting silicon stick |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102700020A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103710762A (en) * | 2013-11-27 | 2014-04-09 | 江苏美科硅能源有限公司 | Glass filler strip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11151716A (en) * | 1997-09-11 | 1999-06-08 | Wacker Siltronic G Fuer Halbleitermaterialien Ag | Work plate for fixing crystal |
| US20060060180A1 (en) * | 2004-09-17 | 2006-03-23 | Sumco Corporation | End supporting plate for single crystalline ingot |
| CN201350670Y (en) * | 2008-12-31 | 2009-11-25 | 嘉兴嘉晶电子有限公司 | Silicon chip deglue protection device after silicon chip being cut by multi-fretsaw |
| CN101934558A (en) * | 2010-08-13 | 2011-01-05 | 上海超日(洛阳)太阳能有限公司 | Silicon rod slicing method |
| CN102152425A (en) * | 2011-03-29 | 2011-08-17 | 胡林宝 | Fixing device assisting multi-wire cutting machine in cutting of silicon single crystal rods |
| CN102229213A (en) * | 2011-06-23 | 2011-11-02 | 英利能源（中国）有限公司 | Silicon block wire saw machine tool and silicon block fixing device thereof |
-
2012
- 2012-06-15 CN CN2012101976394A patent/CN102700020A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11151716A (en) * | 1997-09-11 | 1999-06-08 | Wacker Siltronic G Fuer Halbleitermaterialien Ag | Work plate for fixing crystal |
| US20060060180A1 (en) * | 2004-09-17 | 2006-03-23 | Sumco Corporation | End supporting plate for single crystalline ingot |
| CN201350670Y (en) * | 2008-12-31 | 2009-11-25 | 嘉兴嘉晶电子有限公司 | Silicon chip deglue protection device after silicon chip being cut by multi-fretsaw |
| CN101934558A (en) * | 2010-08-13 | 2011-01-05 | 上海超日(洛阳)太阳能有限公司 | Silicon rod slicing method |
| CN102152425A (en) * | 2011-03-29 | 2011-08-17 | 胡林宝 | Fixing device assisting multi-wire cutting machine in cutting of silicon single crystal rods |
| CN102229213A (en) * | 2011-06-23 | 2011-11-02 | 英利能源（中国）有限公司 | Silicon block wire saw machine tool and silicon block fixing device thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103710762A (en) * | 2013-11-27 | 2014-04-09 | 江苏美科硅能源有限公司 | Glass filler strip |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121003 |