CN202278672U - Device for enhancing qualification rate of tails of silicon bars - Google Patents
Device for enhancing qualification rate of tails of silicon bars Download PDFInfo
- Publication number
- CN202278672U CN202278672U CN2011204130311U CN201120413031U CN202278672U CN 202278672 U CN202278672 U CN 202278672U CN 2011204130311 U CN2011204130311 U CN 2011204130311U CN 201120413031 U CN201120413031 U CN 201120413031U CN 202278672 U CN202278672 U CN 202278672U
- Authority
- CN
- China
- Prior art keywords
- silicon rod
- silicon
- glass plate
- tails
- enhancing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 60
- 239000010703 silicon Substances 0.000 title claims abstract description 60
- 230000002708 enhancing effect Effects 0.000 title abstract 5
- 238000012797 qualification Methods 0.000 title abstract 4
- 239000011521 glass Substances 0.000 claims abstract description 40
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 abstract description 2
- 230000002411 adverse Effects 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- -1 limit Chemical compound 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model relates to a device for enhancing the qualification rate of the tails of silicon bars, which comprises glass plates and at least one silicon bar which is connected to the surfaces of the glass plates in a bonding way and can be used for cutting slices, wherein the bonding connection positions of the glass plates and the tail of each silicon bar are connected with at least one small glass plate in a bonding way. According to the device for enhancing the qualification rate of the tails of the silicon bars, which is disclosed by the utility model, a method of connecting the glass plates to the tails of the silicon bars in a bonding way is adopted, and the adverse phenomena of slice falling, slice collapsing and corner lacking, which are generated when slices are cut at the tails of crystal bars are cut into slices, can be greatly improved so as to lower the proportion of unqualified slices (cutting damage, edge collapsing and edge lacking) and achieve the effects of enhancing the qualification rate of slice cutting and enhancing the slice output rate.
Description
Technical field
The utility model relates to the adhering method of silicon rod, especially a kind of device that improves silicon rod afterbody yield.
Background technology
The sticking excellent workshop section of solar silicon wafers section industry is more and more big to the influence of section effect; The bonding way (as shown in Figure 1) of the silicon rod that adopts at present; Two silicon rods are adhered on the same glass plate, and the afterbody of two silicon rods does not have any protection, at this moment; The sheet phenomenon appears falling easily after the silicon rod afterbody is cut end; And the silicon chip of afterbody occurs collapsing bad silicon chips such as limit, unfilled corner mostly, causes silicon chip yield and silicon chip piece rate to be a greater impact, and existing domestic and international industry does not have the bad method of good solution silicon rod afterbody yet.
The utility model content
The technical problem that the utility model will solve is: in order to overcome in the silicon chip cutting; The silicon rod afterbody receives the impulsive force of the outward force and the mortar of steel wire; These power will produce one " extrapolability " to silicon chip; Make silicon chip broken, produce sheet during section, collapse the limit, the bad phenomenon of unfilled corner, a kind of device that improves section yield and the raising silicon rod afterbody yield that improves piece rate is provided.
The utility model solves the technical scheme that its technical problem adopted: a kind of device that improves silicon rod afterbody yield; Comprise glass plate and be bonded at least one on glass pane surface silicon rod that can be used for cutting into slices; Described glass plate is bonded with at least one block of pieces of glass plate with each silicon rod afterbody abutting edge; Because the Mohs' hardness of crystalline silicon is 7; The Mohs' hardness of the Sic that cutting is used is 9.5, is as the material that is bonded in the silicon rod afterbody that with glass the hardness (Mohs' hardness of glass is 6) of glass is suitable with the Mohs' hardness of crystalline silicon, does not push glass and fragmentation when glass plate can not cause silicon chip " outer " owing to hardness excessively by force when cutting; " extrapolability " that opposite glass plate produces in the time of can slowing down cutting; Can play a very good protection to silicon rod, can also utilize the underproof glass plate of phenomenon to draw materials in addition, reach the effect of twice laid.
In order conveniently to cut silicon rod exactly, the length of described pieces of glass plate equates that with the silicon rod length of side width of pieces of glass plate is 1/4 of the silicon rod length of side.
In order once to cut a plurality of silicon rods simultaneously, be bonded with two silicon rods on the described glass pane surface.
Described silicon rod is monocrystalline or the polycrystalline silicon rod that the silicon chip cutting is used.
The beneficial effect of the utility model is: the device of the raising silicon rod afterbody yield of the utility model; Adopt the method for silicon rod afterbody adhering glass plate; Can improve the crystal bar afterbody produces sheet, disintegrating tablet, unfilled corner when section bad phenomenon greatly; And then reduce the ratio of bad (cut damage, collapse the limit, lack the limit), reach and improve section yield and the effect that improves piece rate.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is the prior art constructions sketch map;
Fig. 2 is the structural representation of the utility model.
1. glass plates among the figure, 2. silicon rod, 3. pieces of glass plate.
The specific embodiment
Combine accompanying drawing that the utility model is done further detailed explanation now.These accompanying drawings are the sketch map of simplification, the basic structure of the utility model only is described in a schematic way, so it only show the formation relevant with the utility model.
The device of raising silicon rod afterbody yield as shown in Figure 2; Comprise glass plate 1 and be bonded in same glass plate 1 lip-deep two monocrystalline that can be used for cutting into slices or polycrystalline silicon rod 2; Glass plate 1 is bonded with a pieces of glass plate 3 with each silicon rod 2 afterbody abutting edge; The length of pieces of glass plate 3 equates with silicon rod 2 length of sides; The width of pieces of glass plate 3 is 1/4 of silicon rod 2 length of sides, makes silicon rod 2 and pieces of glass plate 3 all accept the steel wire cutting, utilizes pieces of glass plate 3 to make two silicon rod 2 afterbodys be protected effect.
The embodiment of the device of the raising silicon rod afterbody yield of the utility model: the silicon rod on the adhering glass plate 12 is installed on carries out silicon rod 2 cuttings on the various model slicers such as MB-264, MB271, PV800 and HCT and use normal slice process and battery process; Adopt the method for this kind silicon rod 2 afterbody adhering glass plates 1; The section of silicon chip is fallen bad ratio such as sheet, disintegrating tablet, unfilled corner and is reduced, and yield and piece rate are improved.
With above-mentioned desirable embodiment according to the utility model is enlightenment, and through above-mentioned description, the related work personnel can carry out various change and modification fully in the scope that does not depart from this utility model technological thought.The technical scope of this utility model is not limited to the content on the specification, must confirm its technical scope according to the claim scope.
Claims (4)
1. device that improves silicon rod afterbody yield; Comprise glass plate (1) and be bonded in the lip-deep at least one silicon rod that can be used for cutting into slices of glass plate (1) (2), it is characterized in that: described glass plate (1) and each silicon rod (2) afterbody abutting edge are bonded with at least one block of pieces of glass plate (3).
2. the device of raising silicon rod afterbody yield according to claim 1 is characterized in that: the length of described pieces of glass plate (3) equates that with silicon rod (2) length of side width of pieces of glass plate (3) is 1/4 of silicon rod (2) length of side.
3. the device of raising silicon rod afterbody yield according to claim 1 is characterized in that: described glass plate (1) is bonded with two silicon rods (2) on the surface.
4. the device of raising silicon rod afterbody yield according to claim 1 is characterized in that: described silicon rod (2) is monocrystalline or polycrystalline silicon rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204130311U CN202278672U (en) | 2011-10-26 | 2011-10-26 | Device for enhancing qualification rate of tails of silicon bars |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204130311U CN202278672U (en) | 2011-10-26 | 2011-10-26 | Device for enhancing qualification rate of tails of silicon bars |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202278672U true CN202278672U (en) | 2012-06-20 |
Family
ID=46224853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204130311U Expired - Lifetime CN202278672U (en) | 2011-10-26 | 2011-10-26 | Device for enhancing qualification rate of tails of silicon bars |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202278672U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109747057A (en) * | 2019-02-14 | 2019-05-14 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
| CN109808087A (en) * | 2019-01-30 | 2019-05-28 | 无锡中环应用材料有限公司 | A kind of sticky stick method of silicon rod |
-
2011
- 2011-10-26 CN CN2011204130311U patent/CN202278672U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109808087A (en) * | 2019-01-30 | 2019-05-28 | 无锡中环应用材料有限公司 | A kind of sticky stick method of silicon rod |
| CN109747057A (en) * | 2019-02-14 | 2019-05-14 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213031 Tianhe Road 2, Xinbei Electronic Industrial Park, Changzhou, Jiangsu Patentee after: trina solar Ltd. Address before: 213031 Tianhe Road 2, Xinbei Electronic Industrial Park, Changzhou, Jiangsu Patentee before: CHANGZHOU TRINA SOLAR ENERGY Co.,Ltd. Address after: 213031 Tianhe Road 2, Xinbei Electronic Industrial Park, Changzhou, Jiangsu Patentee after: TRINASOLAR Co.,Ltd. Address before: 213031 Tianhe Road 2, Xinbei Electronic Industrial Park, Changzhou, Jiangsu Patentee before: trina solar Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120620 |
|
| CX01 | Expiry of patent term |