CN202213067U - Multi-wire wafer cutting tooling - Google Patents
Multi-wire wafer cutting tooling Download PDFInfo
- Publication number
- CN202213067U CN202213067U CN2011203236380U CN201120323638U CN202213067U CN 202213067 U CN202213067 U CN 202213067U CN 2011203236380 U CN2011203236380 U CN 2011203236380U CN 201120323638 U CN201120323638 U CN 201120323638U CN 202213067 U CN202213067 U CN 202213067U
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- silicon
- silicon ingot
- work piece
- ingot
- bonded
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a multi-wire wafer cutting tooling comprising a silicon ingot or a silicon stick which are bonded on a work piece connecting board, and a dovetail seat which is connected to the work piece connecting board; as improvement, fixing boards for fixing the silicon ingot or the silicon stick are bonded on both side surfaces of the silicon ingot or the silicon stick which are in parallel with the cutting wires of a wire mesh; and the upper end surfaces of the fixing boards are connected to the work piece connecting board. According to the multi-wire wafer cutting tooling, the fixing boards are bonded on and connected to both side surfaces of the silicon ingot or the silicon stick which is bonded on the work piece connecting board, the top end surfaces of the fixing boards are fixedly connected to the work piece connecting board, the two fixing boards support and reinforce wafers produced on both side surfaces of the silicon ingot or the silicon stick, and the multi-wire wafer cutting tooling has the beneficial effects that: the two fixing boards overcome the gravity of the wafers and buffer the jumping power of the wire mesh, so that the wafers are effectively prevented from being broken.
Description
Technical field
The utility model relates to the multi-thread cutting tool of a kind of silicon chip.
Background technology
Silicon ingot or silicon rod slice processing mode mainly adopt multi-thread cutting mode processing at present, in multi-thread cutting processing process, because silicon ingot or silicon rod both sides are vacant, unsettled; The silicon chip that silicon ingot or silicon rod both sides produce is along with processing; It is more and more littler to connect area, and the silicon chip that silicon ingot or silicon rod both sides produce connects power and constantly reduces, up to connection power less than the gravity of silicon chip self or gauze beating a little power of generation down; The silicon chip that silicon ingot or silicon rod both sides produce will produce part, has reduced yield rate.In batch process, will produce huge waste, still not have effective method or this problem of device elimination at present.
Summary of the invention
The utility model is for solving prior art in use, and the problem of part appears in silicon chip that silicon ingot or silicon rod both sides produce easily, and a kind of multi-thread cutting tool of silicon chip of eliminating silicon ingot or silicon rod both sides silicon chip fragmentation problem is provided.
The technical scheme that the utility model solves existing issue is: the multi-thread cutting tool of a kind of silicon chip; Comprise the silicon ingot or the silicon rod that are adhered on the workpiece connecting plate; Be connected in the dovetail mount of workpiece connecting plate; As the improvement of the utility model, described silicon ingot or the silicon rod two sides parallel with the gauze line of cut all are bonded with the fixed head of fixing silicon ingot or silicon rod, and described fixed head upper surface is connected on the workpiece connecting plate.
As the further improvement of the utility model, described fixed head upper surface is adhered on the workpiece connecting plate.Above-mentioned fixed head adopts the resin of transparent material.
As the further improvement of the utility model, the described fixed head and silicon ingot or silicon rod adhesive surface height ratio of being adhered to be greater than 1/3, less than with 1; Width ratio is greater than 1/2, less than 1.
The utility model compared with prior art; At the bonding connection fixed head that is provided with in two sides that is adhered to silicon ingot on the workpiece connecting plate or silicon rod; The fixed head top end face is fixedly connected on the workpiece connecting plate; The silicon chip that two fixed head support reinforcing silicon ingots or silicon rod two sides produce, beneficial effect is the power of beating that two fixed heads overcome the gravity and the alignment buffer net of silicon chip, prevents that effectively silicon chip from producing part.
Description of drawings
Fig. 1 is the structural representation of the utility model.
The specific embodiment
Referring to Fig. 1; This case study on implementation comprises silicon ingot or the silicon rod 2 that is adhered on the workpiece connecting plate 1; Be connected in the dovetail mount 3 of workpiece connecting plate 1; Silicon ingot or silicon rod 2 two sides parallel with gauze 4 lines of cut all are bonded with the fixed head 5 of fixing silicon ingot or silicon rod 2, and fixed head 5 upper surfaces are bonding or be bolted on the workpiece connecting plate 1.
Be adhered to fixed head 5 and silicon ingot or silicon rod 2 adhesive surface height ratios greater than 1/3, less than with 1; Width ratio is greater than 1/2, less than 1.For the ease of producing and not influencing operation, fixed head 5 adopts the resin of transparent material.
Claims (3)
1. multi-thread cutting tool of silicon chip; Comprise the silicon ingot or the silicon rod that are adhered on the workpiece connecting plate; Be connected in the dovetail mount of workpiece connecting plate; It is characterized in that: described silicon ingot or the silicon rod two sides parallel with the gauze line of cut all are bonded with the fixed head of fixing silicon ingot or silicon rod, and described fixed head upper surface is connected on the workpiece connecting plate.
2. the multi-thread cutting tool of silicon chip as claimed in claim 1 is characterized in that: described fixed head upper surface is adhered on the workpiece connecting plate.
3. according to claim 1 or claim 2 the multi-thread cutting tool of silicon chip is characterized in that: the described fixed head and silicon ingot or silicon rod adhesive surface height ratio of being adhered to be greater than 1/3, less than with 1; Width ratio is greater than 1/2, less than 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203236380U CN202213067U (en) | 2011-08-31 | 2011-08-31 | Multi-wire wafer cutting tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203236380U CN202213067U (en) | 2011-08-31 | 2011-08-31 | Multi-wire wafer cutting tooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202213067U true CN202213067U (en) | 2012-05-09 |
Family
ID=46012336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203236380U Expired - Fee Related CN202213067U (en) | 2011-08-31 | 2011-08-31 | Multi-wire wafer cutting tooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202213067U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107457931A (en) * | 2017-10-12 | 2017-12-12 | 江苏秉宸科技有限公司 | A kind of silicon rod cutting fixed seat |
| CN109747057A (en) * | 2019-02-14 | 2019-05-14 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
| CN109866347A (en) * | 2019-02-14 | 2019-06-11 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
| CN110271109A (en) * | 2018-03-15 | 2019-09-24 | 小松Ntc株式会社 | Preparation method and wire saw before the processing of wire saw |
-
2011
- 2011-08-31 CN CN2011203236380U patent/CN202213067U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107457931A (en) * | 2017-10-12 | 2017-12-12 | 江苏秉宸科技有限公司 | A kind of silicon rod cutting fixed seat |
| CN110271109A (en) * | 2018-03-15 | 2019-09-24 | 小松Ntc株式会社 | Preparation method and wire saw before the processing of wire saw |
| CN109747057A (en) * | 2019-02-14 | 2019-05-14 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
| CN109866347A (en) * | 2019-02-14 | 2019-06-11 | 厦门芯光润泽科技有限公司 | Silicon carbide crystal bar multi-line cutting method |
| CN109866347B (en) * | 2019-02-14 | 2021-08-31 | 厦门芯光润泽科技有限公司 | Multi-wire cutting method for silicon carbide crystal bar |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120509 Termination date: 20130831 |