CN218849490U

CN218849490U - LED packaging structure, light-emitting device and display device

Info

Publication number: CN218849490U
Application number: CN202223609880.1U
Authority: CN
Inventors: 文昭君; 朋朝明; 张广谱; 丁雨芬
Original assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Current assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-04-11
Anticipated expiration: 2032-12-30

Abstract

The utility model discloses a LED packaging structure, a light-emitting device and a display device, the LED packaging structure comprises a substrate, a first flip-chip LED chip, a second flip-chip LED chip and a packaging colloid, the substrate is provided with a first surface and a second surface which are opposite, and a first circuit layer and a second circuit layer which are respectively positioned on the first surface and the second surface; the first flip LED chip is arranged on the first surface and is electrically connected with the first circuit layer; the second flip-chip LED chip is arranged on the second surface and is electrically connected with the second circuit layer; the first flip LED chip of packaging colloid cladding and second flip LED chip set up, and packaging colloid's at least part be transparent or translucent setting to can transmit out first flip LED chip and the light of second flip LED chip. The utility model provides a technical scheme realizes that two sides light-emitting, multi-angle light-emitting or 360 universes are luminous, and convenient brief, arrange pleasing to the eye.

Description

LED packaging structure, light-emitting device and display device

Technical Field

The utility model relates to the field of semiconductor technology, especially, relate to a LED packaging structure, illuminator and display device.

Background

An LED (Light Emitting Diode), a Light Emitting Diode, is a semiconductor device capable of converting electric energy into visible Light. To protect the LED chips and to complete the electrical interconnections, the LED chips need to be packaged. With the development of LED chip technology, the chip is currently divided into a front-mounted chip and a flip chip, and the LED chip package currently mainly has three structures: the conventional LED is packaged in a forward mounting mode, the conventional LED is packaged in a reverse mounting mode, and the bracket-free LED is packaged in a reverse mounting mode. The vast majority are of the first structure: the conventional LED is packaged normally, a normally-mounted chip is arranged on an LED bracket, PN junction conduction is carried out through a gold wire, and the light emitting direction of a lamp bead is positive light emitting, namely single-side light emitting; with the development of flip chips, a second structure has gradually emerged: conventional LED flip-chip package, flip-chip package chip directly arrange the support in on, no longer need the gold thread to carry out the connection, and lamp pearl light-emitting direction is positive light-emitting, single face light-emitting promptly. The flip chip has a third structure when applied to a certain stage: the LED flip-chip package without the support, the flip-chip package chip is directly arranged on the substrate, the LED flip-chip package chip is covered by colloid/fluorescent colloid/quantum dot colloid, the support is not needed any more, the colloid is completely transparent or semitransparent or partially transparent, the light emitting direction of the lamp bead is changed into five-surface light emitting, the front light emitting direction is the main light emitting direction, and the side wall is the four-direction secondary light emitting direction. To this third structure: the flip-chip packaging of the LED without the support can realize five-side light emitting, and can meet the conventional light emitting direction and requirements.

However, in the scenes that need global light, such as a dome, a mural, a cave and a tunnel, with double-sided display and multi-angle display, light is emitted from the front and back sides of the substrate, even 360-degree global light emission is needed, at present, 2 or more LED lamps are generally arranged towards different directions to meet the complex light emission requirements of multiple directions, the resource utilization rate is low, and the arrangement is not attractive.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a LED packaging structure, illuminator and display device aims at realizing that two sides light-emitting, multi-angle light-emitting or 360 universes are luminous, and is convenient brief, arrange pleasing to the eye.

In order to achieve the above object, the present invention provides an LED package structure, which includes a substrate, a first flip-chip LED chip, a second flip-chip LED chip, and a package adhesive, wherein the substrate has a first surface and a second surface opposite to each other, and a first circuit layer and a second circuit layer respectively located on the first surface and the second surface; the first flip LED chip is arranged on the first surface and is electrically connected with the first circuit layer; the second flip-chip LED chip is arranged on the second surface and is electrically connected with the second circuit layer; the packaging colloid coats the first flip LED chip and the second flip LED chip, and at least part of the packaging colloid is transparent or semitransparent so as to transmit light of the first flip LED chip and the second flip LED chip.

Optionally, the electrode of the first flip LED chip is disposed in a protruding manner toward the substrate; and/or the electrode of the second flip LED chip is arranged in a protruding mode towards the substrate.

Optionally, the encapsulant comprises a fluorescent gel.

Optionally, an end surface of the encapsulant, which is far away from the substrate, is provided with an arc surface.

Optionally, the substrate includes a substrate main body located inside the encapsulation colloid and a protruding portion located outside the encapsulation colloid, and at least two pads are arranged on the protruding portion.

Optionally, the encapsulant includes a free end and a side surface connecting the free end and the substrate, the side surface is disposed in an inclined manner, and an included angle between the side surface and the protruding portion is 15 ° to 20 °.

Optionally, the pad comprises a silver pad.

Optionally, the number of the first flip LED chips is plural; and/or the second flip LED chip is provided with a plurality of flip LED chips.

The utility model also provides a light-emitting device, include as above LED packaging structure.

The utility model also provides a display device, including display panel and as above illuminator.

In the technical scheme of the utility model, LED packaging structure includes base plate, first flip-chip LED chip and second flip-chip LED chip and encapsulation colloid, first flip-chip LED chip with the corresponding setting of second flip-chip LED chip is in the first surface and the second surface of base plate, and first flip-chip LED chip with first circuit layer electricity is connected, second flip-chip LED chip with second circuit layer electricity is connected, at least part of encapsulation colloid is transparent or translucent setting, so as to can with first flip-chip LED chip with the light transmission of second flip-chip LED chip goes out, need not a plurality of LED packaging structure and makes up, singly LED packaging structure just can satisfy the complicated light-emitting demand of a plurality of directions to realize that two-sided light-emitting, multi-angle light-emitting or 360 universes are luminous, convenient brief, arrange beautifully.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural cross-sectional view of an embodiment of an LED package structure provided in the present invention;

fig. 2 is a schematic structural cross-sectional view of another embodiment of an LED package structure provided in the present invention.

The reference numbers indicate:

reference numerals	Name(s)	Reference numerals	Name(s)
				100	LED packaging structure	21	Electrode of first flip LED chip
1	Substrate board	3	Second flip LED chip
				11	First surface	31	Electrode of second flip-chip LED chip
12	Second surface	4	Packaging colloid
				13	Extension part	41	Side surface
2	First flip LED chip	5	Bonding pad

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

An LED (Light Emitting Diode), a Light Emitting Diode, is a semiconductor device capable of converting electric energy into visible Light. To protect the LED chips and to complete the electrical interconnections, the LED chips need to be packaged. With the development of LED chip technology, the chip is currently divided into a front-mounted chip and a flip chip, and the LED chip package currently mainly has three structures: the conventional LED is packaged in a forward mounting mode, the conventional LED is packaged in a reverse mounting mode, and the bracket-free LED is packaged in a reverse mounting mode. The vast majority are of the first structure: the conventional LED is packaged normally, a normally-mounted chip is arranged on an LED bracket, PN junction conduction is carried out through a gold wire, and the light emitting direction of a lamp bead is positive light emitting, namely single-side light emitting; with the development of flip chips, a second structure gradually appeared: conventional LED flip-chip encapsulation, flip-chip package chip directly arrange the support in on, no longer need the gold thread to carry out the coupling, lamp pearl light-emitting direction is positive light-emitting, single face light-emitting promptly. The flip chip has a third structure when applied to a certain stage: the LED flip-chip package without the support, the flip-chip package chip is directly arranged on the substrate, the LED flip-chip package chip is covered by colloid/fluorescent colloid/quantum dot colloid, the support is not needed any more, the colloid is completely transparent or semitransparent or partially transparent, the light emitting direction of the lamp bead is changed into five-surface light emitting, the front light emitting direction is the main light emitting direction, and the side wall is the four-direction secondary light emitting direction. To this third structure: the flip-chip packaging of the LED without the support can realize five-side light emitting, and can meet the conventional light emitting direction and requirements.

In view of this, the utility model provides a LED packaging structure, illuminator and display device aims at realizing that two sides light-emitting, multi-angle light-emitting or 360 universes are luminous, and convenient brief, arrange beautifully. Fig. 1 is an embodiment of the LED package structure of the present invention.

In an embodiment of the present invention, as shown in fig. 1 and 2, the LED package structure 100 includes a substrate 1, a first flip-chip LED chip 2 and a second flip-chip LED chip 3, and a molding compound 4, wherein the substrate 1 has a first surface 11 and a second surface 12 opposite to each other, and a first circuit layer and a second circuit layer (not shown) respectively located on the first surface 11 and the second surface 12; the first flip LED chip 2 and the second flip LED chip 3 are correspondingly arranged on the first surface 11 and the second surface 12, the first flip LED chip 2 is electrically connected with the first circuit layer, and the second flip LED chip 3 is electrically connected with the second circuit layer; the packaging colloid 4 coats the first flip LED chip 2 and the second flip LED chip 3, and at least part of the packaging colloid 4 is transparent or semitransparent, so that the first flip LED chip 2 and the second flip LED chip 3 can be transmitted.

The technical scheme of the utility model, LED packaging structure 100 includes base plate 1, first flip-chip LED chip 2 and second flip-chip LED chip 3 and encapsulation colloid 4, first flip-chip LED chip 2 with second flip-chip LED chip 3 corresponds the setting and is in first surface 11 and second surface 12 of base plate 1, and first flip-chip LED chip 2 with first circuit layer electricity is connected, second flip-chip LED chip 3 with second circuit layer electricity is connected, the at least part of encapsulation colloid 4 is transparent or translucent setting, with can with first flip-chip LED chip 2 with the light of second flip-chip LED chip 3 goes out, need not that a plurality of LED packaging structure make up, and is single LED packaging structure 100 just can satisfy the complicated light-emitting demand of a plurality of directions to realize two-sided light-emitting, multi-angle light-emitting or 360 universes and shine, convenient brief, arrange pleasing to the eye.

It should be added that, in this embodiment, at least a portion of the encapsulant 4 is disposed in a transparent or translucent manner, so as to enable light of the first flip LED chip 2 and the second flip LED chip 3 to be transmitted, which means that the encapsulant 4 is disposed in a transparent or translucent manner in one direction or in a plurality of directions in five light-emitting directions (e.g., above and around in the drawing) of the first flip LED chip 2, and is disposed in a transparent or translucent manner in one direction or in a plurality of directions in five light-emitting directions (e.g., below and around in the drawing) of the second flip LED chip 3, so that a light-emitting angle range is large, when the encapsulant 4 is disposed in a transparent or translucent manner in all five light-emitting directions of the first flip LED chip 2, and is disposed in a transparent or translucent manner in all five light-emitting directions of the second flip LED chip 3, 360 ° light emission can be achieved, and a single LED package structure 100 can meet complex light-emitting requirements in a plurality of directions, therefore, in a double-sided display, multi-angle display, a dome, wall painting, a cave, and a light-emitting device, and the like, and a simple LED package structure can be conveniently disposed in a scene.

Further, base plate 1 includes transparent substrate, promptly base plate 1 is transparent setting, the light-emitting of first flip-chip LED chip 2 meets 4 reflection of packaging colloid or refraction extremely during base plate 1, can pass base plate 1, follow base plate 1 the second surface 12 sends, and is same, the light-emitting of second flip-chip LED chip 3 also can pass base plate 1 is followed base plate 1 the first surface 11 sends, base plate 1 the first surface 11 with the light of second surface 12 can communicate, base plate 1 is few to light absorption, avoids the light of base plate 1 week side weakens, improves optical efficiency.

The utility model discloses it is right the material of base plate 1 does not do the restriction, and any can regard as the PCB base plate to use and can be the base plate of transparent setting all can, and at present, base plates such as aluminium base board, epoxy glass fiber cloth base plate, aluminium oxide ceramic substrate can't accomplish or be difficult to accomplish transparent setting. In one embodiment, the substrate 1 includes a glass substrate, that is, the substrate 1 is a glass substrate, which has high transparency and can be transparent, so as to improve the optical efficiency.

The utility model discloses it is right the number of piles on base plate 1's circuit layer is not restricted, base plate 1 should be at least including being located respectively first surface 11 with two circuit layers of second surface 12, base plate 1 can be four layers of base plates, six layers of base plates etc. in an embodiment, base plate 1 includes double-deck base plate, promptly base plate 1 is the base plate of two sides wiring, when satisfying the setting demand, control cost.

In an embodiment, the electrode 21 of the first flip-chip LED chip protrudes toward the substrate 1, so that the first flip-chip LED chip 2 is electrically connected to the corresponding first circuit layer, and a protrusion is disposed on the first circuit layer, so that the process is simple and the cost is controlled. In another embodiment, the electrode 31 of the second flip-chip LED chip is protruded toward the substrate 1, so that the second flip-chip LED chip 3 is electrically connected to the second circuit layer, and a protrusion is disposed on the second circuit layer, so that the process is simple and the cost is controlled. The two embodiments can exist alternatively or simultaneously, and can be understood and simultaneously exist, so that the best effect is achieved.

Encapsulation colloid 4 cladding first flip-chip LED chip 2 with second flip-chip LED chip 3 sets up, for flip-chip LED chip provides the protection, in this embodiment, encapsulation colloid 4 includes the fluorescence colloid, promptly encapsulation colloid 4 is the colloid that contains phosphor powder, the colour of encapsulation colloid 4 can be yellow (containing yellow phosphor powder), red (containing red phosphor powder), other colours (containing quantum dot powder) etc. to realize secondary optical design, can be for first flip-chip LED chip 2 with second flip-chip LED chip 3 provides the white light and mixes, in order to reach the light efficiency of ideal.

The utility model discloses it is right the restriction is not done to the concrete shape of packaging colloid 4, for example, can be as shown in figure 1, packaging colloid 4 wholly is squarely, in an embodiment, packaging colloid 4 is kept away from the cambered surface setting is personally submitted to the one end of base plate, makes LED packaging structure 100's all directions light-emitting is unanimous, guarantees the light-emitting effect, and is concrete, packaging colloid 4 wholly can be the hemisphere, makes LED packaging structure 100's light-emitting is effectual.

Further, in order to facilitate subsequent wire or plate welding, the substrate 1 includes a substrate main body located in the encapsulant 4 and an extending portion 13 located outside the encapsulant 4, and at least two pads 5 are provided on the extending portion 13. When first flip LED chip 2 with second flip LED chip 3 passes through when the circuit layer realization electricity of base plate 1 connects (parallelly connected or establishes ties), pad 5 can set up two, be convenient for with first flip LED chip 2 with 3 electric connection of second flip LED chip to external electron device, pad 5 can also set up four, first flip LED chip 2 with second flip LED chip 3 corresponds respectively and sets up two pads 5, is convenient for with first flip LED chip 2 with 3 independent electric connection of second flip LED chip to external electron device, thereby realizes first flip LED chip 2 with the independent control of second flip LED chip 3. When the base plate 1 includes the through-hole, the pad 5 can set up in arbitrary surface in the first surface 11 with in the second surface 12 and realize with first flip-chip LED chip 2 with the electric connection of second flip-chip LED chip 3, consequently, the utility model discloses it is right the concrete position of setting of pad 5 does not do the restriction, the pad 5 sets up first surface 11 and/or second surface 12. In one embodiment, as shown in fig. 1, two extending portions 13 are provided, two extending portions 13 are respectively provided with two bonding pads 5 corresponding to the first surface 11 and the second surface 12, the first flip LED chip 2 and the second flip LED chip 3 are respectively electrically connected to the two bonding pads 5, the connection setting is convenient, and the independent control of the first flip LED chip 2 and the second flip LED chip 3 is convenient to realize.

In order to reduce the influence of the pad 5 on the light output, in an embodiment, as shown in fig. 2, the encapsulant 4 includes a free end and a side surface 41 connecting the free end and the substrate 1, the side surface 41 is disposed in an inclined manner, and an included angle between the side surface 41 and the protruding portion 13 is 15 ° to 20 °. So, first flip-chip LED chip 2 with the light of second flip-chip LED chip 3 is being ejaculated during encapsulation colloid 4, because the slope setting of side surface 41 reduces the sheltering from of pad 5 realizes better light-emitting effect.

In one embodiment, the bonding pad is a silver bonding pad, and the conventional copper bonding pad is replaced by a silver bonding pad with higher reflectivity, so that light absorption can be reduced, light reflection is increased, and the light emitting effect is further ensured.

In one embodiment, the number of the first flip LED chips 2 is multiple, so that a larger luminous flux can be realized in a smaller space. In another embodiment, the second flip LED chips 3 are provided in plurality, so that a larger luminous flux can be realized in a smaller space. The two embodiments may exist alternatively or simultaneously, as desired.

The utility model provides a light-emitting device, include as above LED packaging structure 100, LED packaging structure 100's specific structure refers to above-mentioned embodiment, because the utility model discloses a light-emitting device has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is not repeated here one by one. The light-emitting device may be, for example, a lighting device, which may be, for example, various lamps for illumination, and an indicating device, which may be, for example, various indicator lamps for indicating.

The utility model also provides a display device, including display panel and as above light emitting device, light emitting device's concrete structure refers to above-mentioned embodiment, display device adopts light emitting device is convenient for set up light-emitting angle as the backlight, satisfies diversified display demand. The display device may be, for example, a display screen applied to an electronic apparatus, and the electronic apparatus may include any apparatus having a display screen, such as a smart phone, a smart watch, a notebook computer, a tablet computer, a car recorder, a navigator, a Virtual Reality (VR)/Augmented Reality (AR) display, and the like.

The above is only the preferred embodiment of the present invention, and the patent scope of the present invention is not limited thereby, and all the equivalent structures made by the contents of the specification and the drawings are utilized under the idea of the present invention, or directly/indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An LED package structure, comprising:

the circuit board comprises a substrate, a first circuit layer and a second circuit layer, wherein the substrate is provided with a first surface and a second surface which are opposite, and the first circuit layer and the second circuit layer are respectively positioned on the first surface and the second surface;

the first flip LED chip is arranged on the first surface and is electrically connected with the first circuit layer;

the second flip-chip LED chip is arranged on the second surface and is electrically connected with the second circuit layer; and the number of the first and second groups,

and the packaging colloid is coated on the first flip LED chip and the second flip LED chip, and at least part of the packaging colloid is transparent or semitransparent so as to transmit the light of the first flip LED chip and the second flip LED chip.

2. The LED package structure of claim 1, wherein the electrodes of the first flip-chip LED chip are disposed protruding toward the substrate; and/or the presence of a gas in the atmosphere,

and the electrode of the second flip LED chip is arranged towards the substrate in a protruding manner.

3. The LED package structure of claim 1, wherein said encapsulant comprises a fluorescent encapsulant.

4. The LED package structure of claim 1, wherein an end surface of the encapsulant away from the substrate is disposed in a curved surface.

5. The LED package structure of claim 1, wherein the substrate comprises a substrate body located inside the encapsulant and a protrusion located outside the encapsulant, the protrusion having at least two pads disposed thereon.

6. The LED package structure of claim 5, wherein the encapsulant comprises a free end and a side surface connecting the free end and the substrate, the side surface being inclined, and the side surface forming an angle with the protrusion of 15 ° to 20 °.

7. The LED package structure of claim 5, wherein the pads comprise silver pads.

8. The LED package structure of claim 1, wherein said first flip-chip LED chip is provided in plurality; and/or the presence of a gas in the gas,

the second flip-chip LED chip is provided with a plurality of.

9. A light emitting device comprising the LED package structure according to any one of claims 1 to 8.

10. A display device, comprising:

a display panel; and (c) a second step of,

the light emitting device of claim 9.