TW546452B - Illuminator using light emitting diode - Google Patents

Illuminator using light emitting diode Download PDF

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Publication number
TW546452B
TW546452B TW90110644A TW90110644A TW546452B TW 546452 B TW546452 B TW 546452B TW 90110644 A TW90110644 A TW 90110644A TW 90110644 A TW90110644 A TW 90110644A TW 546452 B TW546452 B TW 546452B
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TW
Taiwan
Prior art keywords
transparent
light
emitting diode
led
lighting device
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Application number
TW90110644A
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Chinese (zh)
Inventor
Satoshi Tamaoki
Masanori Minato
Original Assignee
Rabo Sufia Kk
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Publication of TW546452B publication Critical patent/TW546452B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

The present invention relates to a type of illuminator in which light emitting diode (LED) is applied. The present invention mainly consists of an insulated transparent substrate (13), a light emitting diode (LED) chip (14), a metal wire (16), two lead wires (17, 18), and a transparent resin unit (19). The insulated transparent substrate (13) is equipped with a first and a second transparent conductors (11, 12) for wiring and installation. The LED chip (14) connects the electrode on the back of the present invention to the first transparent conductor (11) to secure the first transparent conductor (11) on the transparent substrate (13). The metal wire (16) is used for connecting the surface electrode (15) of the LED chip (14) to the second transparent conductor (12). The two lead wires (17, 18) are connected to the terminals of the first and the second transparent conductors. The transparent resin unit (19) covers the transparent substrate of the LED chip (14) and parts of the lead wires (17, 18) and can provide lens effects for all directional (360 degree) illumination.

Description

546452 A7 B7 五、發明説明（彳） 【發明所屬之技術領域】 (請先閱讀背面之注意事項再填寫本頁) 本發明係關於一種使用發光二極體（LED)之照明裝置 ’特別是有關使用朝360度方向發光的LED之照明裝置。 【先前技術】 將LED利用其較習知消耗電力少、壽命極長幾乎可永 久使用的特點，使用在聖誕樹用的燈泡、及舉行慶典時用 來裝飾的燈飾上、或者把LED以矩陣狀排列後用在道路及 車站的指示板等上面。 第6圖係表示習知LED燈泡70，而前述LED燈泡70 係由：具有硏缽狀反射面7丨之金屬性固定構件72 ;及於前 述固定構件72上通過且安裝電極之LED晶片73 ;及與前 述固定構件72以一體或各體形成之第1引線74 ;及一端連 接在與電極75接合之金屬線76的另一端之第2引線77 ; 及前述第1、與第2引線74、77所貫穿之絕緣性基板78 ; 經濟部智慈財產句員工消費合作社印製 及以圓頂狀將包含前述LED晶片7 3的前述固定構件7 2等 密封之透明樹脂層79所構成。而在前述LED晶片73通上 電流後’就能如圖不一*般發光。 但是，有關此種LED燈泡70，其光只能如圖示一般朝 同一方向發光，而不能朝前述絕緣性基板7 8及與紙面垂直 的方向發光。 本發明的目的，即在提供一種使用可以朝全方向、也 就是朝360度方向發光的LED之照明裝置。 而本發明的另一目的，則爲提供一種使用小型、省電 本紙張尺度適用中國國家標準（CNS ) A4規格（210/:297公釐） -4- 546452 A7 B7 五、發明説明（2 ) 、且壽命長的LED之照明裝置。 (請先閲讀背面之注意事項再填寫本頁) 【發明之揭示】 使用發光二極體之照明裝置係由：透明的絕緣性基板 ;及設置在前述絕緣性基板上之透明導體部；及設置在前 述透明導體部上，由表面、背面及兩側面放射光之發光二 極體晶片；及連接於前述發光二極體晶片之引線；及以覆 蓋含有前述發光二極體晶片的前述基板和前述引線的一部 份而設置之透明或者半透明樹脂體所構成。又，亦可藉由 在球狀絕緣體的表面安裝複數個發光二極體晶片，將前述 發光一極體晶片串聯連接，於兩端的導體部上設置引線， 以覆蓋前述發光二極體晶片及前述引線的一部份，而形成 球狀的透明或半透明樹脂體，於前述透明或半透明樹脂體 中混入Al、Au、W、Ti、Mo等的粉末或線狀的光散射物質 所構成。 【圖面之簡單說明】 經濟部智慧財產苟肖工消費合作社印製 第1圖係模式地表示利用本發明之一實施例的丨個 LED之照明裝置的剖面圖。 第2圖係模式地表示利用本發明之實施例的複數個 LED之照明裝置的剖面圖。 第3圖係模式地表示利用本發明之實施例於球狀絕緣 體的表面上，安裝複數個LED晶片之照明裝置的剖面圖。 第4圖係模式地表示利用本發明之實施例於長方形絕 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -5- 546452 A7 __ B7 經濟部智慈財/lGa(工消費合作社印製 五、發明説明（3 ) 緣基板的兩表面上，安裝複數個LEI)晶片之照明裝置的剖 面圖。 第5圖係模式地表示利用本發明之實施例於透明基板 上，安裝複數個LED晶片且將每個LED晶片以透明或半透 明樹脂覆蓋之照明裝置的剖面圖。 第6圖係模式地表示習知之LED晶片的剖面圖。 主要 :元 件 對 眧 y\\\ 表 10 使 用 LED 之照 ί明裝 置 11 第 1 透 明 導體 部 12 第 2 透 明 導體 部 13 透 明 基 板 14 LED 晶 片 15 表 面 電 極 16 金 屬 線 17、 18 引 線 19 半 透 明 樹 脂體 20 使 用 LED 之照 :明裝 置 21 透 明 絕 緣 22 第 1 透 明 導體 部 23 第 2 透 明 導體 部 24 第 3 透 明 導體 部 25、 26 27 LED 晶片 28、 29 金 屬 線 —I— -.1 .....- §^1 H - - m ϋϋ 1^1 I!I (請先閱讀背面之注意事項存填寫本頁) 訂 f 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -6- 546452 A7 B7 五、發明説明（4 ) 經濟部智楚財產^7員工消費合作社印製 30 第4 透 明 導 體 31 金屬 線 32、 33 引 線 34 半透 明 樹 脂 體 41 球狀 絕 緣 體 42 LED 晶 片 4 3、 44 引 線 45 半透 明 樹 脂 體 5 1 絕緣 基 板 52 LED 晶 片 5 3、 54 引 線 55 半透 明 樹 脂 體 5 6 反射 面 61 透明 絕 緣 62 LED 晶 片 63 凸透 鏡 64、 65 引 線 70 LED 燈 泡 71 反射 面 72 固定 構 件 73 LED 晶 片 74 第1 引 線 75 電極 76 金屬 線 (請先閱讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 546452 A7 B7 五、發明説明（5 ) 77 第2引線 78 絕緣性基板 (請先閲讀背面之注意事項再填寫本頁) 79 透明樹脂層 【發明之最佳實施形態】 第1圖係本發明實施例之一發光體，例如模式地表示 使用發光二極體（LED)之照明裝置1〇。而使用前述LED 之照明裝置1 0係由，含有配線與安裝用的第1及第2透明 導體部1 1、1 2之絕緣性透明基板1 3 ;及將背面電極（圖未 表示）連接於前述第1透明導體部11，使其安裝於前述透 明基板13上之LED晶片14 ;及連接前述LED晶片14的 表面電極1 5和前述第2透明導體部1 2之金屬線1 6 ;及連 接於前述第1及第2透明導體部1 1、1 2的各端部之引線1 7 、18 ;及以覆蓋含有前述LED晶片14之前述透明基板13 和前述引線1 7、1 8的一部份，而設置的具有透鏡作用之透 明或半透明樹脂體1 9所構成。 經濟部智慧財/i^7a (工消費合作社印製 於前述引線1 7、1 8間施加電壓使電流通過前述LED晶 片1 4，因此可以有效的利用來自前述LED晶片1 4的上面 、背面及兩側所發射的光，且可以獲得使用朝全方向，也 就是朝360度方向發光的LED之照明裝置。 第2圖係模式地表示使用複數個，例如3個發光體， 亦即使用LED之照明裝置20。而使用前述3個LED之照 明裝置20係由：於絕緣性透明基板2 1上所形成之第1至 第3透明導體部22、23、24上使其各別安裝3個LED晶片 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8 - 546452 A7 B7 五、發明説明（6 ) 25、26、27’將則述3個LED晶片串聯連接，使與前述各 LED晶片的表面電極鄰接之LED晶片的前述第2及第3導 體部23、24，藉由金屬線28、29連接一起，並且，前述 LED晶片27的表面電極與在前述透明基板21的端部所形 成之第4透明導體部30,使其藉由金屬線31連接在一起， 另外於前述第1及第4透明導體部22、30上設置引線32、 33，且具有透鏡作用、橢圓形透明或半透明樹脂體34，係 以覆蓋含有前述LED晶片25、26、27之前述透明基板21 ’與前述引線3 2、3 3的一部份而形成。 第1圖及第2圖所表示之照明裝置，至少有1個LED 晶片是藉由透明導體部安裝於透明基板上，且以橢圓形之 透明或半透明樹脂體來覆蓋，然而如第3圖所示，在通常 非透明之球狀絕緣體4 1的表面上安裝複數個LED晶片42 ，經由圖未表示之導體部及金屬線，將前述LED晶片42串 聯連接，於兩端導體部設置引線43、44，且可以構成將前 述LED晶片42及前述引線43、44的一部份覆蓋使其形成 球狀之透明或半透明樹脂體45之照明裝置。這種情況下， 在前述透明或半透明樹脂體45中，即使混入較光的波長大 且由微米級到數毫米程度的Al 、Au、W、Ti、Mo等粉末 或線狀的光散射物質也可行。546452 A7 B7 V. Description of the invention (彳) [Technical field to which the invention belongs] (Please read the precautions on the back before filling out this page) The present invention relates to a lighting device using a light emitting diode (LED), and is particularly relevant Lighting device that uses LEDs that emit light in a 360-degree direction. [Previous technology] LEDs are used in the light bulbs used for Christmas trees and the lights used for decoration during celebrations, or they are arranged in a matrix, taking advantage of their lower power consumption and long life. It is used on roads and station signs. FIG. 6 shows a conventional LED light bulb 70, and the aforementioned LED light bulb 70 is composed of: a metal fixing member 72 having a bowl-shaped reflecting surface 7; and an LED chip 73 passing through the fixing member 72 and mounting electrodes; And a first lead 74 formed integrally or individually with the aforementioned fixing member 72; and a second lead 77 connected at one end to the other end of the metal wire 76 joined to the electrode 75; and the aforementioned first and second leads 74, The insulating substrate 78 penetrated by 77; the transparent resin layer 79, which is printed by a consumer cooperative of the Ministry of Economy and the Intellectual Property Co., Ltd. and is sealed in a dome shape, including the aforementioned fixing member 72 of the LED chip 73. After the LED chip 73 is supplied with current, it can emit light as shown in FIG. However, the light from such an LED bulb 70 can only emit light in the same direction as shown in the figure, and cannot emit light toward the aforementioned insulating substrate 78 and a direction perpendicular to the paper surface. An object of the present invention is to provide a lighting device using an LED that can emit light in all directions, that is, in a 360-degree direction. Yet another object of the present invention is to provide a small-sized, power-saving paper size that is applicable to the Chinese National Standard (CNS) A4 specification (210 /: 297 mm) -4- 546452 A7 B7 5. Description of the invention (2) And long-life LED lighting device. (Please read the precautions on the back before filling this page) [Disclosure of the invention] The lighting device using light-emitting diodes consists of: a transparent insulating substrate; and a transparent conductor portion provided on the aforementioned insulating substrate; and A light-emitting diode chip that emits light from the front, back, and both sides of the transparent conductor portion; and a lead connected to the light-emitting diode chip; and covering the substrate and the substrate including the light-emitting diode chip. A part of the lead is made of transparent or translucent resin. In addition, by mounting a plurality of light-emitting diode chips on the surface of the spherical insulator, the light-emitting diode chips may be connected in series, and leads may be provided on the conductor portions at both ends to cover the light-emitting diode chip and the foregoing. A part of the lead wire is formed into a spherical transparent or translucent resin body, and the transparent or translucent resin body is mixed with powder of Al, Au, W, Ti, Mo, or the like, or a linear light scattering material. [Brief description of the drawing] Printed by Gou Xiaogong Consumer Co., Ltd., a smart property of the Ministry of Economic Affairs, FIG. 1 is a cross-sectional view schematically showing an LED lighting device using one embodiment of the present invention. Fig. 2 is a cross-sectional view schematically showing a lighting device using a plurality of LEDs according to an embodiment of the present invention. Fig. 3 is a cross-sectional view schematically showing a lighting device in which a plurality of LED chips are mounted on the surface of a spherical insulator according to an embodiment of the present invention. FIG. 4 is a diagram schematically showing the application of the embodiment of the present invention to the rectangular rectangular paper size to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) -5- 546452 A7 __ B7 Ministry of Economy Zhicicai / lGa (industrial consumption Printed by the cooperative V. Description of the invention (3) A cross-sectional view of a lighting device in which a plurality of LEI) chips are mounted on both surfaces of the edge substrate. Fig. 5 is a cross-sectional view schematically showing a lighting device using an embodiment of the present invention on a transparent substrate, mounting a plurality of LED chips, and covering each LED chip with a transparent or semi-transparent resin. Fig. 6 is a sectional view schematically showing a conventional LED chip. Main: Component pairings Table 10 Illumination device using LED 11 First transparent conductor 12 Second transparent conductor 13 Transparent substrate 14 LED chip 15 Surface electrode 16 Metal wire 17, 18 Lead 19 Translucent resin Body 20 Photo using LED: bright device 21 transparent insulation 22 first transparent conductor section 23 second transparent conductor section 24 third transparent conductor section 25, 26 27 LED chip 28, 29 metal wire—I— -.1 ... ..- § ^ 1 H--m ϋϋ 1 ^ 1 I! I (Please read the notes on the back and fill in this page first) Order f This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm)- 6- 546452 A7 B7 V. Description of the invention (4) Intellectual property of the Ministry of Economic Affairs ^ 7 Printed by employee consumer cooperatives 30 Fourth transparent conductor 31 Metal wire 32, 33 Lead 34 Translucent resin 41 Spherical insulator 42 LED chip 4 3 , 44 lead 45 translucent resin body 5 1 insulating substrate 52 LED chip 5 3, 54 lead 55 translucent resin Body 5 6 reflective surface 61 transparent insulation 62 LED chip 63 convex lens 64, 65 lead 70 LED bulb 71 reflective surface 72 fixing member 73 LED chip 74 first lead 75 electrode 76 metal wire (please read the precautions on the back before filling this page ) This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) 546452 A7 B7 V. Description of invention (5) 77 2nd lead 78 Insulating substrate (Please read the precautions on the back before filling this page) 79 Transparent resin layer [Best Embodiment of the Invention] FIG. 1 is a light emitting body according to an embodiment of the present invention, and schematically illustrates, for example, a lighting device 10 using a light emitting diode (LED). The lighting device 10 using the aforementioned LED is composed of an insulating transparent substrate 1 3 including first and second transparent conductor portions 11 and 12 for wiring and mounting, and a back electrode (not shown) is connected to The first transparent conductor portion 11 is mounted on the LED chip 14 on the transparent substrate 13; and the surface electrode 15 connecting the LED chip 14 and the metal wire 16 on the second transparent conductor portion 12 are connected; and Leads 1 7 and 18 at respective ends of the first and second transparent conductor portions 11 and 12; and a portion covering the transparent substrate 13 containing the LED chip 14 and a portion of the leads 17 and 18 It is composed of a transparent or translucent resin body 19 having a lens function. The Ministry of Economic Affairs's smart money / i ^ 7a (printed by the Industrial and Consumer Cooperatives applies voltage between the leads 17 and 18 to pass current through the LED chip 14, so it can effectively use the top, back, and The light emitted from both sides can be obtained by using LEDs that emit light in all directions, that is, 360 degrees. Figure 2 schematically shows the use of a plurality of, for example, three light-emitting bodies, that is, the use of LEDs. Lighting device 20. The lighting device 20 using the three LEDs described above is formed by mounting three LEDs on the first to third transparent conductor portions 22, 23, and 24 formed on the insulating transparent substrate 21, respectively. The paper size of the chip applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) -8-546452 A7 B7 V. Description of the invention (6) 25, 26, 27 'will be described in series connected three LED chips, so as to connect with the aforementioned The second and third conductor portions 23 and 24 of the LED chip adjacent to the surface electrode of each LED chip are connected together by metal wires 28 and 29, and the surface electrode of the LED chip 27 and the end of the transparent substrate 21 are connected. The fourth transparent conductor portion 30, They are connected together by a metal wire 31, and in addition, lead wires 32 and 33 are provided on the first and fourth transparent conductor portions 22 and 30, and have a lens function, and an oval transparent or translucent resin body 34, which is covered with The transparent substrate 21 ′ of the LED chip 25, 26, and 27 is formed as part of the lead wires 3 2, 3 3. At least one LED chip is used for the lighting device shown in FIGS. 1 and 2. The transparent conductor is mounted on a transparent substrate and is covered with an oval transparent or translucent resin. However, as shown in FIG. 3, a plurality of LED chips are mounted on the surface of a generally non-transparent spherical insulator 41. 42. The aforementioned LED chip 42 is connected in series through a conductor portion and a metal wire not shown in the figure, and leads 43 and 44 are provided at the conductor portions at both ends, and can form a part of the LED chip 42 and the leads 43, 44 The illuminating device covering the transparent or translucent resin body 45 in a spherical shape is covered in this case. Al, Au, W, Ti Mo powder or other linear light scattering material is also possible.

第3圖中把前述絕緣體4 1及前述透明或半透明樹脂體 45的形狀作成球狀，而如第4圖所示，亦可以構成由使用 長方形絕緣基板5 1 ;及於前述絕緣基板5 1的兩表面上安裝 複數個LED晶片52 ;及經由圖未表示之導體部將前述LED 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） AW— (請先閲讀背面之注意事項再填寫本頁) 訂 f 經濟部智慈財產岣：貝工消費合作社印製 -9- 546452 A7 B7 經濟部智慧財產工消費合作社印製 五、發明説明（7 ) 晶片52串聯連接，於其兩端導體部上設置引線53、54 ;及 以覆蓋前述LED晶片52及前述引線53、54的一部份，而 形成的長方形透明或半透明樹脂體55之照明裝置。此時， 也可以構成在前述透明或半透明樹脂體55的一表面上，依 A 1等單層或多層的反射膜所形成的反射面來使光聚集之照 明裝置。 又，如第2圖所示之照明裝置係，藉由透明導體部於 透明基板上安裝複數個LED晶片，且以橢圓形的透明或半 透明樹脂體來覆蓋，但如第5圖所示，也可在每一個安裝 於透明基板61上的各個LED晶片62 ’形成以透明或半透 明樹脂體覆蓋的凸透鏡63或凹透鏡而設置引線64、65。此 時，亦能將前述LED晶片62以與前述透明或半透明樹脂體 不同折射率之物質覆蓋後，以前述透明或半透明樹脂體來 覆蓋。再者，在第4圖及第5圖中，省略欲使LED晶片串 聯連接之透明導體部及金屬線。 另外，在前述各實施例中，是將至少1個LED晶片安 裝於具有透明導體部之透明基板上，且以透明或半透明樹 脂體來包覆前述透明基板，但亦可在至少1個角部上具有 電極部的透明或半透明殼內設置前述LED晶片，將前述外 殼配置於具有配線用的導體部之丙烯等的透明構件’且將 全體以透明或半透明樹脂覆蓋，構成使用朝全方向’亦即 朝3 60度方向發光的LED之照明裝置。 在前述各實施例中，前述透明基板是使用青玉、鑽石 、丙儲樹脂、I n p、G a p等的化合物半導體而形成’且前述 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) L0 訂 P. 10- 546452 A7 _B7_ 五、發明説明（8 ) (請先閲讀背面之注意事項再填寫本頁) LED晶片可以應用紅色、綠色、藍色眾所周知的晶片。又 ，前述透明導電部可採用ITO (氧化銦•錫）、氧化鋅、氧 化錫等而形成。此外，前述透明導電部也可由不妨礙發光 的範圍內之幅窄的普通導電體所形成。另外，前述透明或 半透明樹脂體能夠使用丙烯樹脂、石英玻璃、碳酸鈉石灰 玻璃、硼矽酸玻璃、鉛玻璃、或氧化鋅、硫化鋅、碳化矽 等結晶性材料、及含有螢光材料之物質與有色材料。且， 透明或半透明樹脂體能夠依所預定的模型而形成圓形、橢 圓形、及其他各種形狀。 甚至，LED晶片的尺寸爲數毫米見方，或數毫米見方 以下，雖然安裝或接合前述LED晶片之透明導體部的面積 很小，但欲形成照明裝置、及顯示器等，而需於數公分、 數十公分見方或在其以上大小的基板上，搭載數十個、數 百個或其以上的LED晶片。所以，多數使用LED晶片之裝 置，決不會無視透明導體部全體的面積，爲有效地利用來 自各LED晶片的光，因而透明導體部是不可欠缺的。 經濟部智慧財/IA:貝工消費合作社印製 【產業上之利用可能性】 依本發明因可將LED晶片安裝於形成透明基板上的透 明導體部，且以覆蓋前述透明基板而設置具有透鏡作用之 透明或半透明樹脂體，所以不只是前述LED晶片的上面， 就連由背面及兩側所發射出的光也能夠有效地利用’因而 可獲得一種使用朝全方向，即朝360度方向發光之小型、 省電、壽命長的LED之照明裝置。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -11 -In Fig. 3, the shapes of the insulator 41 and the transparent or translucent resin body 45 are made into a spherical shape, and as shown in Fig. 4, a rectangular insulating substrate 5 1 may be used; and the insulating substrate 5 1 A plurality of LED chips 52 are installed on both surfaces of the LED; and the aforementioned LED is applied to the Chinese paper standard (CNS) A4 specification (210X297 mm) AW— (Please read the precautions on the back before using the conductor part not shown in the figure) (Fill in this page) Order f Intellectual Property of the Ministry of Economic Affairs 印: Printed by Shellfish Consumer Cooperatives-9- 546452 A7 B7 Printed by the Intellectual Property Workers Consumer Cooperatives of the Ministry of Economy Lead wires 53 and 54 are provided on the conductor portion; and a rectangular transparent or translucent resin body 55 is formed to cover the LED chip 52 and a part of the leads 53 and 54. In this case, it is also possible to constitute a lighting device for condensing light on one surface of the transparent or translucent resin body 55 according to a reflecting surface formed by a single-layer or multi-layer reflective film such as A1. In the lighting device shown in FIG. 2, a plurality of LED chips are mounted on a transparent substrate through a transparent conductor portion, and are covered with an oval transparent or translucent resin body. However, as shown in FIG. 5, Each of the LED wafers 62 ′ mounted on the transparent substrate 61 may be formed with a convex lens 63 or a concave lens covered with a transparent or translucent resin body, and the leads 64 and 65 may be provided. At this time, the LED chip 62 may be covered with a substance having a refractive index different from that of the transparent or translucent resin body, and then covered with the transparent or translucent resin body. In Figs. 4 and 5, transparent conductor portions and metal wires to be connected in series to the LED chip are omitted. In addition, in each of the foregoing embodiments, at least one LED chip is mounted on a transparent substrate having a transparent conductor portion, and the transparent substrate is covered with a transparent or translucent resin body, but it may be at least one corner. The LED chip is provided in a transparent or translucent case having an electrode portion on the top, and the case is disposed on a transparent member such as acrylic having a conductor portion for wiring. Direction 'is the lighting device of LED which emits light in the direction of 360 degrees. In each of the foregoing embodiments, the transparent substrate is formed using a compound semiconductor such as sapphire, diamond, acrylic resin, I np, G ap, and the like, and the aforementioned paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ) (Please read the notes on the back before filling this page) L0 Order P. 10- 546452 A7 _B7_ V. Description of the invention (8) (Please read the notes on the back before filling this page) LED chips can be applied in red and green , Blue well-known chip. The transparent conductive portion may be formed using ITO (indium tin oxide), zinc oxide, tin oxide, or the like. In addition, the transparent conductive portion may be formed of a general conductive body having a narrow width in a range that does not hinder light emission. In addition, as the transparent or translucent resin body, acrylic resin, quartz glass, sodium carbonate lime glass, borosilicate glass, lead glass, or crystalline materials such as zinc oxide, zinc sulfide, and silicon carbide, and fluorescent materials can be used. Matter and non-ferrous materials. In addition, the transparent or translucent resin body can be formed into a circular shape, an oval shape, and various other shapes according to a predetermined model. In addition, the size of the LED chip is a few millimeters square or less. Although the area of the transparent conductor portion where the aforementioned LED chip is mounted or bonded is small, it is necessary to use a few centimeters to calculate the lighting device and display. Ten centimeters or more, on a substrate of a size larger than that, tens, hundreds, or more LED chips are mounted. Therefore, most devices using LED chips never neglect the entire area of the transparent conductor portion, and in order to effectively use the light from each LED chip, the transparent conductor portion is indispensable. Printed by Intellectual Property of the Ministry of Economic Affairs / IA: Printed by Cooper Consumer Cooperative [Industrial use possibility] According to the present invention, the LED chip can be mounted on a transparent conductor portion forming a transparent substrate, and a lens is provided to cover the transparent substrate. The transparent or translucent resin body is used, so not only the above LED chip, but also the light emitted from the back and both sides can be effectively used. Therefore, it can be used in all directions, that is, 360 degrees Light-emitting small, power-saving, long-life LED lighting device. This paper size applies to China National Standard (CNS) A4 (210X297 mm) -11-

Claims (1)

546452 A8 B8 C8 D8 六、申請專利範圍 1· 一種使用發光二極體之照明裝置，其特徵爲：具 備透明的絕緣性基板；及設於前述絕緣性基板上之透明導 體部；及設於前述透明導體部上，從表面、背面及兩側面 放射光之發光二極體晶片；及連接於前述發光二極體晶片 之引線；及以覆蓋具有前述發光二極體晶片的前述基板與 前述引線的一部份而設置之透明或半透明樹脂體。 2 · 如申請專利範圍第1項所記載之照明裝置，其中 ，複數個發光二極體晶片係藉由前述透明導體部而設置於 前述基板上。 3 · 一種照明裝置，其特徵爲：於球狀絕緣體的表面 安裝複數個發光二極體晶片，將前述發光二極體晶片串聯 連接，於兩端導體部設置引線，以覆蓋前述發光二極體晶 片及前述引線的一部份，而形成球狀的透明或半透明樹脂 體，於前述透明或半透明樹脂體中混入A 1、Au、W、Τι、 Mo等粉末或線狀的光散射物質。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局Μ工消費合作社印製 本紙張尺度適用中國國家榡準（CNS ) Α4規格（210 X 297公釐） -12-546452 A8 B8 C8 D8 6. Scope of Patent Application 1. A lighting device using a light-emitting diode, which is characterized by: having a transparent insulating substrate; and a transparent conductor portion provided on the aforementioned insulating substrate; and A light-emitting diode wafer that emits light from the front, back, and both sides of a transparent conductor portion; and a lead connected to the light-emitting diode wafer; and a cover that covers the substrate and the lead having the light-emitting diode wafer. Part of a transparent or translucent resin body. 2. The lighting device according to item 1 of the scope of the patent application, wherein the plurality of light emitting diode chips are provided on the substrate through the transparent conductor portion. 3. A lighting device characterized in that a plurality of light emitting diode wafers are mounted on the surface of a spherical insulator, the light emitting diode wafers are connected in series, and leads are provided at the conductor portions at both ends to cover the light emitting diodes. The wafer and a part of the lead are formed into a spherical transparent or translucent resin body, and the transparent or translucent resin body is mixed with powders such as A1, Au, W, Tm, Mo, or linear light-scattering substances. . (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, M Industrial Consumer Cooperative, This paper size applies to China National Standard (CNS) Α4 size (210 X 297 mm) -12-
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