CN209169172U - A kind of light-emitting diode encapsulation structure and light emitting diode - Google Patents
A kind of light-emitting diode encapsulation structure and light emitting diode Download PDFInfo
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- CN209169172U CN209169172U CN201821914980.6U CN201821914980U CN209169172U CN 209169172 U CN209169172 U CN 209169172U CN 201821914980 U CN201821914980 U CN 201821914980U CN 209169172 U CN209169172 U CN 209169172U
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- light
- emitting diode
- accommodating chamber
- encapsulation structure
- silica gel
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Abstract
The utility model relates to LED technology fields, it is intended to improve the low problem of light-emitting diode luminance in the prior art, provide a kind of light-emitting diode encapsulation structure and light emitting diode.Light-emitting diode encapsulation structure provided by the utility model comprising pedestal, luminescence component and silica gel.Accommodating chamber is offered on pedestal, the bottom of accommodating chamber is arranged in luminescence component, and silicone filler is in accommodating chamber, so that luminescence component is sealed in silica gel.Silica gel has the fold positioned at accommodating chamber opening, when the light of luminescence component transmitting is open by accommodating chamber to be projected, needs guiding through the fold.Due to the light direct beam Silica Surface of luminescence component transmitting, more existing light-emitting diode encapsulation structure can effectively reduce total reflection, light extraction efficiency be improved, to improve the brightness of light emitting diode by setting fold for the surface.
Description
Technical field
The utility model relates to encapsulating structure technical field, in particular to a kind of light-emitting diode encapsulation structure and
Light emitting diode.
Background technique
Light emitting diode (LED) is the semiconductor devices for converting electrical energy into luminous energy.Since light emitting diode has the service life
Long, small in size, high vibration strength, fever degree are small and the advantages such as power consumption is low, light emitting diode have been widely used in household electrical appliances
The indicator light and light source of product and various instruments.Light emitting diode has a vast market foreground.
Existing light emitting diode is simply possible to use in signal lamp etc. since brightness is not high, for further expansion light-emitting diodes
The application range of pipe meets user to the different demands of LED light, and the brightness for how improving LED light is studied as light emitting diode
Important directions.
Utility model content
The purpose of this utility model includes providing a kind of light-emitting diode encapsulation structure, to improve in the prior art shine
The low problem of LED lightness.
The purpose of this utility model further includes providing a kind of light emitting diode comprising above-mentioned LED package knot
Structure.
The embodiments of the present invention are achieved in that
A kind of light-emitting diode encapsulation structure comprising pedestal, the pedestal have accommodating chamber open at one end；
The luminescence component at the accommodating chamber bottom is set；And
The silica gel being filled in the accommodating chamber, the surface that the silica gel is located at the opening are provided with fold.
In one embodiment of the utility model:
Above-mentioned silica gel has the protrusion that the opening is arranged in, to form the fold.
In one embodiment of the utility model:
The section of above-mentioned protrusion is triangle, and along the direction far from the luminescence component, the width of the protrusion reduces.
In one embodiment of the utility model:
The section of above-mentioned protrusion is semicircle.
In one embodiment of the utility model:
Fluorescent powder is mixed in above-mentioned silica gel.
In one embodiment of the utility model:
Above-mentioned luminescence component includes for being fixedly connected on the luminescence chip of accommodating chamber bottom and connecting with luminescence chip
One conducting wire and the second conducting wire；The luminescence chip is electrically connected by first conducting wire and the second conducting wire with the external world.
In one embodiment of the utility model:
Above-mentioned first conducting wire and second conducting wire are sticked on the luminescence chip by crystal-bonding adhesive.
In one embodiment of the utility model:
The section of above-mentioned accommodating chamber is gradually to increase along the direction width dimensions from the bottom surface of the accommodating chamber to the opening
Big is trapezoidal.
In one embodiment of the utility model:
Above-mentioned pedestal is made from a material that be thermally conductive.
A kind of light emitting diode, the light emitting diode include any one of the above light-emitting diode encapsulation structure.
The beneficial effect of the utility model embodiment includes:
The light-emitting diode encapsulation structure that the embodiments of the present invention provide comprising pedestal, luminescence component and silica gel.
Accommodating chamber is offered on pedestal, the bottom of accommodating chamber is arranged in luminescence component, and silicone filler is in accommodating chamber, thus by luminous group
Part is sealed in silica gel.Silica gel has the fold positioned at accommodating chamber opening, when the light of luminescence component transmitting passes through accommodating chamber
When opening projects, the fold is needed guiding through.Due to the light direct beam Silica Surface of luminescence component transmitting, more existing light emitting diode envelope
Assembling structure can effectively reduce total reflection, light extraction efficiency be improved, to improve light-emitting diodes by the way that fold is arranged on the surface
The brightness of pipe.
The light emitting diode that the embodiments of the present invention provide, including above-mentioned light-emitting diode encapsulation structure, therefore
Also there is light extraction efficiency height, beneficial effect of high brightness.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not be by
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is the overall structure diagram for the light-emitting diode encapsulation structure that the utility model embodiment 1 provides；
Fig. 2 is the partial structural diagram for the light-emitting diode encapsulation structure that the utility model embodiment 1 provides；
Fig. 3 is the overall structure diagram for the light-emitting diode encapsulation structure that the utility model embodiment 3 provides.
Icon: 010- light-emitting diode encapsulation structure；100- pedestal；110- accommodating chamber；111- opening；112- reflective layer；
200- luminescence component；210- luminescence chip；The first conducting wire of 220-；The second conducting wire of 230-；300- silica gel；310- protrusion.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and
The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below
The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the utility model embodiment, it should be noted that term " first ", " second " etc. are only used for distinguishing
Description, is not understood to indicate or imply relative importance.
In the description of the utility model embodiment, it is also necessary to which explanation is unless specifically defined or limited otherwise, art
Language " setting ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect
It connects；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
Embodiment 1
Fig. 1 is the overall structure diagram of light-emitting diode encapsulation structure 010 provided in this embodiment.Fig. 1 is please referred to, this
Embodiment provides a kind of light-emitting diode encapsulation structure comprising pedestal 100, luminescence component 200 and silica gel 300.Pedestal 100
On offer accommodating chamber 110, the bottom of accommodating chamber 110 is arranged in luminescence component 200, and silica gel 300 is filled in accommodating chamber 110,
To which luminescence component 200 is sealed in silica gel 300.Silica gel 300 has the fold at the opening of accommodating chamber 110 111, when
When the light that luminescence component 200 emits is projected by the opening of accommodating chamber 110 111, the fold is needed guiding through.Due to luminescence component 200
300 surface of light direct beam silica gel of transmitting, more existing light-emitting diode encapsulation structure 010, by the way that fold is arranged on the surface,
Total reflection can be effectively reduced, light extraction efficiency is improved, to improve the brightness of light emitting diode.
Light-emitting diode encapsulation structure provided in this embodiment is further described below:
Please continue to refer to Fig. 1, in the present embodiment, the substantially box-shaped of pedestal 100 offers receiving on pedestal 100
One end perforation pedestal 100 of chamber 110, accommodating chamber 110 is in communication with the outside, and forms opening 111.The setting of luminescence component 200 is accommodating
110 bottom of chamber, the light that luminescence component 200 issues are extraneous by 111 directives of opening.
It should be noted that do not limit the concrete shape of pedestal 100 herein, it is possible to understand that, it is specific at other
In embodiment, other shapes can also be set by pedestal 100, such as cylindrical according to the demand of user.
Further, the section of accommodating chamber 110 is substantially along from the bottom of accommodating chamber 110 to the direction of opening 111, width
What is be gradually increased is trapezoidal.
In order to improve the radiating efficiency of light emitting diode, further, pedestal 100 is made of the high ceramics of heat transfer efficiency.
It should be understood that in other embodiments, it can also according to the demand of user, bottom is made in the material for selecting other heat transfer efficiencies high
Seat 100, such as the metal or alloy material etc. that the thermal coefficients such as copper, aluminium are high.
In the present embodiment, luminescence component 200 includes luminescence chip 210, the first conducting wire 220 and the second conducting wire 230.Hair
Optical chip 210 is fixedly connected on 110 bottom of accommodating chamber, and the first conducting wire 220 and the second conducting wire 230 connect with luminescence chip 210
It connects.Luminescence chip 210 is electrically connected by the first conducting wire 220 and the second conducting wire 230 with the external world, power supply light emitting.Further, it shines
Chip 210 includes that the chip of at least two luminescent colors generates different display effects by the superposition of color.Due to shining
Chip 210 is fixedly connected on 110 bottom of accommodating chamber, and it is existing that light mixing occurs in accommodating chamber 110 for the light that luminescence chip 210 issues
As so that the light chromaticness that light emitting diode issues is more uniform.
Further, the first conducting wire 220 and the second conducting wire 230 are sticked on luminescence chip 210 by crystal-bonding adhesive.
Fig. 2 is the partial structural diagram of light-emitting diode encapsulation structure 010 provided in this embodiment.Referring to figure 2., into
One step, it is coated with reflective layer 112 in 110 circumferential side wall of accommodating chamber, some light that luminescence chip 210 issues is through reflective layer
112 occur diffusing reflection, not only make light mixing effect more preferable, but also since light-emitting angle changes, can effectively reduce out light
When total reflection, improve light extraction efficiency.
Fig. 1 is please referred to, in the present embodiment, silica gel 300 is filled in accommodating chamber 110, luminescence component 200 is by silica gel 300
Covering, so as to be protected to luminescence component 200.Further, the surface that silica gel 300 is located at opening 111 is provided with
Fold improves light extraction efficiency, to improve the brightness of light emitting diode to effectively reduce total reflection.
Further, silica gel 300, which is located on the surface at opening 111, is provided with multiple raised 310, passes through setting protrusion
310, reduce out total reflection when light.Further, in the present embodiment, protrusion 310 is pyramid shape, and section is substantially in three
Angular, along the direction far from luminescence component 200, the width of the triangle is gradually reduced.
It should be noted that do not limit the concrete shape of protrusion 310 herein, it is possible to understand that, it is specific at other
, can also according to the demand of user in embodiment, the shape of specific setting protrusion 310, such as trigone is set by protrusion 310
Taper is triangular prism shaped etc..
The light-emitting diode encapsulation structure 010 provided in the embodiments of the present invention is accommodated by being located in silica gel 300
The surface setting protrusion 310 of the opening of chamber 110 111 reduces total reflection when light emitting diode goes out light, improves out to form fold
Light efficiency, to improve the brightness of light emitting diode.And the LED package knot that the embodiments of the present invention provide
010 structure of structure is simple, facilitates manufacture.
Embodiment 2
The present embodiment also provides a kind of light-emitting diode encapsulation structure 010, the light-emitting diode encapsulation structure 010 and reality
It is roughly the same to apply example 1, something in common is not repeated to describe.
Specifically, the present embodiment the difference from embodiment 1 is that, yellow fluorescent powder, luminescence chip are mixed in silica gel 300
210 further include blue dies.Blue dies issue blue ray after being powered, blue ray is projected by fluorescent powder, to reach
Quality white light.
Embodiment 3
Fig. 3 is light-emitting diode encapsulation structure 010 provided in this embodiment.Referring to figure 3., the present embodiment also provides one
Kind light-emitting diode encapsulation structure 010, the light-emitting diode encapsulation structure 010 is roughly the same with embodiment 1, and something in common is not
Repeat description.
Specifically, the present embodiment the difference from embodiment 1 is that, the shape of protrusion 310 is different.In the present embodiment, convex
310 are played to be hemispherical, section is semicircle.By setting hemispherical for protrusion 310, when can further decrease out light
Total reflection, improve light extraction efficiency.
Embodiment 4
Present embodiments provide a kind of light emitting diode (not shown go out) comprising the light emitting diode that embodiment 1 is recorded
Encapsulating structure 010.Since the light emitting diode includes the light-emitting diode encapsulation structure 010 that embodiment 1 provides, also have
Light extraction efficiency is high, brightness is high, the simple beneficial effect of structure.
It should be understood that in other embodiments, what light emitting diode can also be provided using embodiment 2 or embodiment 3
Light-emitting diode encapsulation structure 010.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.
Claims (7)
1. a kind of light-emitting diode encapsulation structure characterized by comprising
Pedestal, the pedestal have accommodating chamber open at one end；
The luminescence component at the accommodating chamber bottom is set；And
The silica gel being filled in the accommodating chamber, the surface that the silica gel is located at the opening are provided with fold；
The silica gel has the protrusion that the opening is arranged in, to form the fold；The section of the protrusion is triangle,
Along the direction far from the luminescence component, the width of the protrusion reduces.
2. light-emitting diode encapsulation structure according to claim 1, it is characterised in that:
Fluorescent powder is mixed in the silica gel.
3. light-emitting diode encapsulation structure according to claim 1, it is characterised in that:
The luminescence component includes that first for being fixedly connected on the luminescence chip of accommodating chamber bottom and connecting with luminescence chip is led
Line and the second conducting wire；The luminescence chip is electrically connected by first conducting wire and the second conducting wire with the external world.
4. light-emitting diode encapsulation structure according to claim 3, it is characterised in that:
First conducting wire and second conducting wire are sticked on the luminescence chip by crystal-bonding adhesive.
5. light-emitting diode encapsulation structure according to claim 1, it is characterised in that:
The section of the accommodating chamber is to be gradually increased along the direction width dimensions from the bottom surface of the accommodating chamber to the opening
It is trapezoidal.
6. light-emitting diode encapsulation structure according to claim 1, it is characterised in that:
The pedestal is made from a material that be thermally conductive.
7. a kind of light emitting diode, it is characterised in that:
The light emitting diode includes light-emitting diode encapsulation structure as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821914980.6U CN209169172U (en) | 2018-11-20 | 2018-11-20 | A kind of light-emitting diode encapsulation structure and light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821914980.6U CN209169172U (en) | 2018-11-20 | 2018-11-20 | A kind of light-emitting diode encapsulation structure and light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209169172U true CN209169172U (en) | 2019-07-26 |
Family
ID=67339165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821914980.6U Active CN209169172U (en) | 2018-11-20 | 2018-11-20 | A kind of light-emitting diode encapsulation structure and light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209169172U (en) |
-
2018
- 2018-11-20 CN CN201821914980.6U patent/CN209169172U/en active Active
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