CN218764152U

CN218764152U - Low-noise refrigerating device

Info

Publication number: CN218764152U
Application number: CN202222869264.3U
Authority: CN
Inventors: 张瑞钦; 李治方; 黄智豪; 王祺志; 梁永诒
Original assignee: Guangdong Aodaxin Refrigeration Technology Co ltd
Current assignee: Guangdong Aodaxin Refrigeration Technology Co ltd
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2023-03-28
Anticipated expiration: 2032-10-28

Abstract

The utility model discloses a low-noise refrigerating device, which comprises a cabinet body and a semiconductor refrigerating module, wherein the cabinet body comprises an inner container which is enclosed into a first cavity; the semiconductor refrigeration module comprises a semiconductor chip, a heat dissipation structure and a cold dissipation structure, wherein the cold dissipation structure comprises a cold dissipation plate which is arranged in the first cavity and is positioned at the rear side; the air channel structure comprises a cooling fan arranged at the top of the liner and a guide plate arranged between the cooling fan and the cooling plate, a plurality of guide ribs arranged at intervals are arranged on the guide plate, a plurality of cold air channels are formed by the guide plate, the guide ribs and the liner in a surrounding mode, and the cooling fan blows cold air to the top of the cooling plate through the cold air channels. From this, through addding the wind channel structure, its cold fan accessible that looses blows cold wind to the cold drawing top of loosing to the upper and lower layer temperature that makes the cold drawing of loosing is close, and then effectively solves the big problem of the upper and lower layer difference in temperature of inner bag, improves refrigeration effect.

Description

Low-noise refrigerating device

Technical Field

The utility model relates to a semiconductor refrigeration technology field, concretely relates to low noise refrigerating plant.

Background

At present, semiconductor refrigeration technology is widely applied to various types of refrigeration equipment, such as refrigerators or wine cabinets and the like. Semiconductor refrigeration mainly utilizes semiconductor chip circular telegram back, forms a hot junction and cold junction, and thereby the cold junction carries out the heat exchange through cold plate and the cabinet air that looses thereby forms cold air to reach cryogenic effect. Because the cold air can go down, the upper temperature and the lower temperature in the cabinet have a large difference, so that the refrigeration effect is poor. Therefore, some merchants increase the cooling fan at the inner side of the cabinet and above the cooling plate, and drive air to circularly flow and exchange heat with the cooling plate through the cooling fan, so that the cooling capacity of the cooling plate can be diffused, and the refrigeration effect is improved. However, the arrangement mode of the cooling fan greatly occupies the space of the cooling plate, so that the cooling plate needs to be made small, and the refrigeration effect is reduced; meanwhile, the cooling fan can generate a large amount of noise in the working process, so that the influence on the work and life of people is caused, and the use experience of a user is reduced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the prior art defect, the utility model provides a low noise refrigeration plant through set up the wind channel structure in the internal container of cabinet, its a plurality of cold wind channels of cold fan accessible that looses blow the cold wind to the top of cold drawing that looses to the upper strata temperature of cold drawing that looses has been reduced, makes the upper and lower layer temperature of this cold drawing that looses be close, thereby has effectively solved the big problem of the upper and lower layer difference in temperature of inner bag.

The utility model discloses a solve the technical scheme that its problem adopted and be:

a low noise refrigerating plant, includes the cabinet body and sets up semiconductor refrigeration module in the cabinet body, wherein:

the cabinet body comprises an inner container, and the inner container encloses a first cavity;

the semiconductor refrigeration module comprises a semiconductor chip, a heat dissipation structure connected with the hot end of the semiconductor chip and a cold dissipation structure connected with the cold end of the semiconductor chip, wherein the cold dissipation structure at least comprises a cold dissipation plate which is arranged in the first cavity and is positioned at the rear side;

still include the wind channel structure, the wind channel structure is including setting up the cold fan and the setting of loosing at inner bag top are in loose the cold fan with the guide plate between the cold drawing looses, be equipped with the protruding muscle of water conservancy diversion of a plurality of interval arrangements on the guide plate, a plurality of the protruding muscle of water conservancy diversion and the inner bag encloses synthetic a plurality of cold wind channels each other, it is a plurality of to loose the cold fan through the cold wind channel with the cold wind blow to the top of cold drawing looses.

The utility model discloses a low noise refrigerating plant, through add the wind channel structure in the internal container of cabinet, it looses a plurality of cold wind channels of cold fan accessible and blows the cold wind to the top of cold drawing scattered to reduced the upper strata temperature of cold drawing scattered, makeed the upper strata temperature of cold drawing scattered to be close, thereby effectively solved the big problem of the upper strata difference in temperature about the inner bag. In addition, the cooling fan is arranged at the top of the inner container instead of the side part, so that the space of the cooling plate can not be occupied, the area of the cooling plate can be enlarged, and the refrigeration effect is improved.

Furthermore, a first bulge is arranged at the top of the inner container, and a first installation cavity communicated with the first cavity is arranged in the first bulge; the cooling fan comprises a fan cover and a fan body arranged on the fan cover, and the fan body is arranged in the first mounting cavity through the fan cover.

Further, the cooling fan further comprises a cover plate arranged between the first installation cavity and the first cavity, and a plurality of air inlet holes respectively communicated with the first installation cavity and the first cavity are formed in the cover plate.

Furthermore, the cooling fan further comprises a damping plate arranged between the fan body and the cover plate, one end of the guide plate is abutted to the damping plate, and the other end of the guide plate is abutted to the top of the cooling plate.

From this, through set up the shock attenuation board between fan body and apron to the transmission of vibration has been separated, makes the cold process low noise that looses, thereby satisfies the requirement of refrigerating plant low noise work.

Further, the cabinet body still includes the dustcoat, the dustcoat encloses the second cavity that becomes to have the rear side open-ended, the inside of second cavity is equipped with and is vertical baffle that sets up, the baffle will the second cavity is separated into first cavity and second cavity along the fore-and-aft direction in proper order, the inner bag is located in the first cavity.

Furthermore, a second bulge is arranged on the rear side of the inner container, a second installation cavity which is respectively communicated with the first cavity and the second cavity is arranged in the second bulge, and the communication part of the second installation cavity and the first cavity is sealed by the cold dissipation plate;

the heat dissipation structure also comprises a cold conducting block, one side of the cold conducting block is attached to the heat dissipation plate, and the other side of the cold conducting block is attached to the refrigerating end face of the semiconductor chip;

the semiconductor chip and the cold-conducting block are arranged in the second mounting cavity.

Further, heat radiation structure includes heat dissipation base, heat dissipation pipe and connects a plurality of heat dissipation steel wires of heat dissipation pipe, wherein:

one side of the heat dissipation base is attached to the heating end face of the semiconductor chip, and the other side of the heat dissipation base is provided with a cavity which is filled with a refrigerant;

the heat dissipation pipe is arranged on the heat dissipation base and communicated with the cavity, and the refrigerant can flow in the heat dissipation pipe;

the plurality of radiating steel wires are arranged on the radiating guide pipe in parallel to form a radiating net;

the heat dissipation base is arranged in the second installation cavity, and the heat dissipation guide pipe and the plurality of heat dissipation steel wires are arranged in the second cavity.

Further, the heat dissipation device also comprises a heat dissipation fan arranged in the second chamber, wherein the heat dissipation fan is used for introducing and blowing external air to the heat dissipation guide pipe and the plurality of heat dissipation steel wires so as to realize heat dissipation.

Furthermore, the heat dissipation fans are provided with a plurality of heat dissipation pipes and are located below the heat dissipation guide pipes and the plurality of heat dissipation steel wires.

Further, the shielding net is arranged at the opening at the rear side of the outer cover.

To sum up, the utility model provides a pair of low noise refrigerating plant has following beneficial effect:

(1) The utility model discloses a low noise refrigerating plant, through add the wind channel structure in the internal container of cabinet, it looses a plurality of cold wind channels of cold fan accessible and blows the cold wind to the top of cold drawing scattered to reduced the upper strata temperature of cold drawing scattered, makeed the upper strata temperature of cold drawing scattered to be close, thereby effectively solved the big problem of the upper strata difference in temperature about the inner bag. In addition, the cooling fan is arranged at the top of the inner container instead of the side part, so that the space of the cooling plate can not be occupied, the area of the cooling plate can be enlarged, and the refrigeration effect is improved.

(2) The utility model discloses a low noise refrigerating plant is through setting up the shock attenuation board between fan body and apron to the transmission of vibration has been separated, makes scattered cold process low noise, thereby satisfies the requirement of refrigerating plant low noise work.

Drawings

Fig. 1 is a schematic structural view of the low noise refrigerating apparatus of the present invention;

FIG. 2 is a schematic view of the structure of FIG. 1 from another perspective;

FIG. 3 is a schematic structural view of FIG. 2 with the isolation net hidden;

FIG. 4 is a schematic cross-sectional view of the low noise refrigeration apparatus (with the bottom plate hidden) of the present invention;

FIG. 5 is a schematic structural view of a part of the structure of the low noise refrigerating apparatus of the present invention;

FIG. 6 is a schematic view of the structure of FIG. 5 with the inner container hidden;

FIG. 7 is a schematic view of the structure of FIG. 6 from another perspective;

fig. 8 is an explosion diagram of the semiconductor refrigeration module in the low noise refrigeration apparatus of the present invention.

Wherein the reference numerals have the following meanings:

1. a cabinet body; 11. an inner container; 111. a first protrusion; 112. a second protrusion; 12. a housing; 13. a partition plate; 2. a door body; 3. a semiconductor refrigeration module; 31. a semiconductor chip; 32. a cold dispersing plate; 33. a cold conducting block; 34. a thermal insulation layer; 341. a first foam board; 342. a second foam board; 35. a heat dissipation base; 36. a heat dissipation conduit; 37. a heat dissipating steel wire; 4. an air duct structure; 41. a fan body; 42. a fan housing; 43. a damper plate; 44. a baffle; 441. flow guiding convex ribs; 45. a cover plate; 451. an air inlet hole; 5. an isolation net; 6. a heat dissipation fan.

Detailed Description

For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the module or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Example one

Referring to fig. 1-8, the utility model provides a low noise refrigerating device, which comprises a cabinet body 1, a door body 2 rotatably arranged on the cabinet body 1 and a semiconductor refrigerating module 3 arranged in the cabinet body 1, wherein the cabinet body 1 comprises an inner container 11, the inner container 11 encloses a first cavity, the door body 2 is rotatably arranged on the cabinet body 1 and can open or close the first cavity; the semiconductor refrigeration module 3 comprises a semiconductor chip 31, a heat dissipation structure connected with the hot end of the semiconductor chip 31 and a cold dissipation structure connected with the cold end of the semiconductor chip 31, wherein the cold dissipation structure comprises a cold dissipation plate 32, and a plurality of cold dissipation fins for exchanging heat with air are arranged on the cold dissipation plate 32; the cold plate 32 is disposed in the first cavity and on the rear side. In addition, the air duct structure 4 is disposed in the inner container 11, and the air duct structure 4 includes a cooling fan disposed at the top of the inner container 11 and a flow guide plate 44 disposed between the cooling fan and the cooling plate 32.

Specifically, a first protrusion 111 is disposed at the top of the inner container 11, a first mounting cavity communicated with the first cavity is disposed in the first protrusion 111, the cooling fan includes a fan cover 42 and a fan body 41 disposed on the fan cover 42, and the fan body 41 is mounted in the first mounting cavity through the fan cover 42; an air inlet channel, an air inlet and an air outlet which are communicated with the air inlet channel and are respectively positioned at two sides are defined between the fan cover 42 and the fan body 41. In addition, the cooling fan further comprises a cover plate 45 arranged between the first installation cavity and the first cavity, and a plurality of air inlet holes 451 respectively communicated with the first installation cavity and the first cavity are formed in the cover plate 45. Preferably, the flow guiding plate 44 is further provided with a plurality of flow guiding ribs 441 arranged at intervals, the flow guiding plate 44, the plurality of flow guiding ribs 441 and the inner container 11 enclose a plurality of cold air channels, and the cold air fan blows cold air to the top of the cold dissipating plate 32 through the plurality of cold air channels.

From this, after the cold fan that looses is started, under the effect of fan body 41, the air conditioning in inner bag 11 can enter into inlet air channel through a plurality of fresh air inlets 451 and air intake in to blow out through inlet air channel's air outlet, cold wind blows to the top of cold drawing 32 that looses through a plurality of cold wind channels under the guiding action of a plurality of water conservancy diversion protruding muscle 441 afterwards, thereby has reduced the upper temperature of cold drawing 32 that looses, makes the upper and lower layer temperature of cold drawing 32 that looses be close, thereby effectively solves the big problem of the upper and lower layer difference in temperature of inner bag 11. In addition, the cooling fan is arranged in the first installation cavity at the top of the liner 11 instead of the side part of the liner 11, so that the space of the cooling plate 32 is not occupied, the area of the cooling plate 32 can be enlarged, and the refrigeration effect is improved.

Referring to fig. 6-7, the cooling fan further includes a damping plate 43 disposed between the fan body 41 and the cover plate 45; preferably, the damping plate 43 is a silica gel pad; one end of the flow guide plate 44 abuts against the damping plate 43, and the other end abuts against the top of the cold plate 32. Therefore, the damping plate 43 is arranged between the fan body 41 and the cover plate 45, so that the transmission of vibration is blocked, the low noise in the cooling process is reduced, and the requirement of low-noise operation of the refrigerating device is met.

Referring to fig. 1-6, the cabinet body 1 further includes an outer cover 12, the outer cover 12 encloses a second cavity with a rear opening, a longitudinal partition 13 is disposed inside the second cavity, the partition 13 sequentially partitions the second cavity into a first cavity and a second cavity along a front-rear direction, and the inner container 11 is located in the first cavity. In addition, a second protrusion 112 is further disposed on the rear side of the inner container 11, a second installation cavity respectively communicating the first cavity (inner container 11) and the second cavity is disposed in the second protrusion 112, and the connection between the second installation cavity and the first cavity is sealed by the cold dissipation plate 32. In addition, the cooling structure further comprises a cooling conducting block 33, wherein one side of the cooling conducting block 33 is attached to the cooling plate 32, and the other side of the cooling conducting block 33 is attached to the refrigerating end face of the semiconductor chip 31; the semiconductor chip 31 and the cold conduction block 33 are both disposed in the second mounting cavity.

Therefore, after the cold energy generated by the cold end of the semiconductor chip 31 is transmitted to the cold dissipation plate 32 through the cold guide block 33, the cold dissipation plate 32 is in air contact with the inner container 11 through a plurality of cold dissipation fins for heat exchange, so that the refrigerating effect is achieved.

Referring to fig. 1-6 again, the heat dissipation structure includes a heat dissipation base 35, a heat dissipation pipe 36 and a plurality of heat dissipation steel wires 37 connected to the heat dissipation pipe 36, one side of the heat dissipation base 35 is attached to the heating end face of the semiconductor chip 31, and the other side thereof is provided with a cavity filled with a refrigerant; the heat dissipation pipe 36 is arranged on the heat dissipation base 35 and communicated with the cavity, and the refrigerant can flow in the heat dissipation pipe 36; a plurality of radiator wires 37 are arranged side by side on the radiator guide 36 and form a radiator net.

In this embodiment, the heat sink base 35 is also disposed in the second mounting cavity, and the heat sink conduit 36 and the plurality of heat sink wires 37 are disposed in the second mounting cavity.

Therefore, the refrigerant in the heat dissipation base 35 can absorb heat and be gasified to absorb the hot end heat of the semiconductor chip 31, and then the heat is transferred to the heat dissipation steel wire 37 through the heat dissipation pipe 36 to be dissipated, so that the whole heat dissipation process is zero in noise, and the application in various places with high requirements on noise can be met.

Referring to fig. 8, the semiconductor refrigeration module 3 further includes a heat insulation layer 34 disposed between the cooling structure and the heat dissipation structure, the heat insulation layer 34 includes a first foam plate 341 and a second foam plate 342 that are abutted to each other and have different thicknesses, the first foam plate 341 has a larger thickness and has another end abutted to the heat dissipation base 35, and the second foam plate 342 has a smaller thickness and has another end abutted to the cooling block 33. Preferably, the first foam board 341 and the second foam board 342 are both made of EVA foam board in the prior art.

Therefore, the heat insulation layer 34 is arranged, so that the cooling structure and the heat dissipation structure in the semiconductor refrigeration module 3 can be separated, the mutual transmission of the cold and heat quantity is avoided, and the heat dissipation effect and the refrigeration effect of the semiconductor chip 31 are further ensured.

In addition, the refrigerating device further comprises an isolation net 5, and the isolation net 5 is arranged at the rear side opening of the outer cover 12. Therefore, by arranging the isolation net 5, people can be prevented from accidentally touching the heat dissipation conduit 36 and the heat dissipation steel wire 37, and the use safety of the refrigerating device is improved.

Example two

Referring to fig. 3, the difference between the refrigeration apparatus in the present embodiment and the first embodiment is that the refrigeration apparatus further includes a heat dissipation fan 6 disposed in the second chamber, and the heat dissipation fan 6 can introduce and blow external air to the heat dissipation conduit 36 and the plurality of heat dissipation wires 37 to dissipate heat, so as to improve the heat dissipation effect and further improve the working performance of the semiconductor chip 31.

In this embodiment, two heat dissipation fans 6 are disposed, and are located below the heat dissipation duct 36 and the plurality of heat dissipation wires 37. At the same time, the cooling fan 6 is a silent fan, thereby ensuring low-noise operation of the refrigeration device.

(one) the utility model discloses a low noise refrigerating plant, through add the wind channel structure in the 1 inner bag 11 of the cabinet body, a plurality of cold wind channels of its cooling fan accessible that looses blow the cold blast to the top of cold drawing 32 that looses to the upper and lower floor temperature that makes cold drawing 32 that looses is close, and then has effectively solved the big problem of the upper and lower floor difference in temperature of inner bag 11. In addition, the cooling fan is arranged at the top of the inner container 11 instead of the side part, so that the space of the cooling plate 32 is not occupied, the area of the cooling plate 32 can be enlarged, and the refrigerating effect is improved.

(II) the utility model discloses a low noise refrigerating plant is through setting up damping plate 43 between fan body 41 and apron 45 to the transmission of vibration has been separated, makes the cold process low noise that looses, thereby satisfies the requirement of refrigerating plant low noise work.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and for simplicity in description, and are not intended to indicate or imply that the referenced modules or components must be in a particular orientation, constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

In addition, in the description of the present invention, "a plurality" or "a plurality" means two or more unless specifically limited otherwise.

The technical means disclosed by the scheme of the present invention is not limited to the technical means disclosed by the above embodiments, but also includes the technical scheme formed by the arbitrary combination of the above technical features. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also considered as the protection scope of the present invention.

Claims

1. The utility model provides a low noise refrigerating plant which characterized in that, includes the cabinet body and sets up semiconductor refrigeration module in the cabinet body, wherein:

2. The low-noise refrigerating device according to claim 1, wherein a first bulge is arranged at the top of the inner container, and a first mounting cavity communicated with the first cavity is arranged in the first bulge; the cooling fan comprises a fan cover and a fan body arranged on the fan cover, and the fan body is arranged in the first mounting cavity through the fan cover.

3. The low noise refrigerating device according to claim 2, wherein the cooling fan further comprises a cover plate disposed between the first mounting cavity and the first cavity, and the cover plate is provided with a plurality of air inlet holes respectively communicating with the first mounting cavity and the first cavity.

4. The low noise refrigeration device of claim 3, wherein the cooling fan further comprises a damping plate disposed between the fan body and the cover plate, one end of the flow guide plate abuts against the damping plate, and the other end abuts against the top of the cooling plate.

5. The low-noise refrigerating device according to any one of claims 1 to 4, wherein the cabinet body further comprises an outer cover, the outer cover encloses a second cavity with a rear opening, a longitudinally-arranged partition plate is arranged inside the second cavity, the second cavity is sequentially divided into a first cavity and a second cavity by the partition plate along the front-rear direction, and the inner container is located in the first cavity.

6. The low-noise refrigerating device according to claim 5, wherein a second protrusion is arranged on the rear side of the inner container, a second mounting cavity which is respectively communicated with the first cavity and the second cavity is arranged in the second protrusion, and the communication part of the second mounting cavity and the first cavity is sealed by the cold dissipation plate;

7. The low noise refrigerating device according to claim 6, wherein the heat dissipating structure comprises a heat dissipating base, a heat dissipating pipe, and a plurality of heat dissipating steel wires connecting the heat dissipating pipe, wherein:

8. The low noise refrigerating apparatus according to claim 7, further comprising a heat dissipating fan disposed in the second chamber, wherein the heat dissipating fan is configured to introduce and blow outside air to the heat dissipating duct and the plurality of heat dissipating wires to dissipate heat.

9. A low noise refrigerating apparatus according to claim 8, wherein a plurality of the heat dissipating fans are provided and are located below the heat dissipating pipe and the plurality of heat dissipating wires.

10. The low noise refrigeration device of claim 5, further comprising an isolation mesh disposed at a rear side opening of the housing.