CN217636257U - Refrigerating device and double-circulation heat dissipation device for refrigerating device - Google Patents

Abstract

The utility model discloses a refrigerating plant and be used for refrigerating plant's dual cycle heat abstractor. The dual cycle heat dissipation device includes: the cooling system comprises two refrigerant boxes and two radiating assemblies which are arranged side by side in a transverse manner, wherein each radiating assembly comprises a refrigerant outflow pipe, a refrigerant backflow pipe, a refrigerant transmission pipe and a radiating net; the refrigerant transmission pipe comprises a first pipe tail end, a vertical pipeline, a heat exchange pipeline and a second pipe tail end which are sequentially connected, the first pipe tail end and the second pipe tail end are both positioned below the radiating net and are respectively communicated with the refrigerant outflow pipe and the refrigerant backflow pipe, the vertical pipeline vertically extends from the bottom end of the radiating net to the top end of the radiating net, and the heat exchange pipeline is distributed from the top end of the radiating net to the bottom end of the radiating net in a winding manner; the refrigerant outflow pipe is communicated with the upper end of the refrigerant inner cavity, the refrigerant backflow pipe is communicated with the lower end of the refrigerant inner cavity, and the pipe diameter of the refrigerant outflow pipe and the pipe diameter of the refrigerant backflow pipe are both larger than the pipe diameter of the refrigerant transmission pipe. The double-circulation heat dissipation device has the advantages of high heat dissipation efficiency and reliable work.

Description

Refrigerating device and double-circulation heat dissipation device for refrigerating device

Technical Field

The utility model belongs to the technical field of refrigeration plant and specifically relates to a refrigerating plant and be used for refrigerating plant's dual cycle heat abstractor is related to.

Background

In respective refrigeration equipment using semiconductor refrigeration sheets as refrigeration sources, in order to improve the refrigeration performance of the semiconductor refrigeration sheets, a radiator is required to be arranged at the hot end of each semiconductor refrigeration sheet for heat dissipation. The common radiator is an aluminum block matched with a fan, the radiating effect depends on the reliability of the fan, and the cost is higher. The radiator adopts a structure that a refrigerant box is matched with a radiating net, the refrigerant in the refrigerant box is used for bringing heat to the radiating net, and the heat is radiated outside through the radiating net.

SUMMERY OF THE UTILITY MODEL

The utility model provides a refrigerating plant and be used for refrigerating plant's dual cycle heat abstractor to solve the not high technical problem of single cycle heat radiation structure has the radiating efficiency among the prior art.

The utility model provides a dual cycle heat abstractor for refrigerating plant, include: the refrigerant box comprises two refrigerant boxes which are arranged side by side, wherein each refrigerant box is provided with a refrigerant inner cavity, and a phase-change refrigerant is filled in the refrigerant inner cavity; the two heat dissipation assemblies are positioned above the refrigerant boxes, and each heat dissipation assembly is connected with one of the refrigerant boxes; each heat dissipation assembly comprises a refrigerant outflow pipe, a refrigerant return pipe, a refrigerant transmission pipe connected between the refrigerant outflow pipe and the refrigerant return pipe, and a heat dissipation net fixedly connected with the refrigerant transmission pipe;

the refrigerant transmission pipe comprises a first pipe tail end, a vertical pipeline, a heat exchange pipeline and a second pipe tail end which are sequentially connected, the first pipe tail end and the second pipe tail end are both positioned below the radiating net and are respectively communicated with the refrigerant outflow pipe and the refrigerant backflow pipe, the vertical pipeline vertically extends from the bottom end of the radiating net to the top end of the radiating net, and the heat exchange pipeline is distributed from the top end of the radiating net in a winding manner;

the refrigerant outflow pipe is communicated with the upper end of the refrigerant inner cavity, the refrigerant backflow pipe is communicated with the lower end of the refrigerant inner cavity, and the pipe diameter of the refrigerant outflow pipe and the pipe diameter of the refrigerant backflow pipe are both larger than the pipe diameter of the refrigerant transmission pipe.

Preferably, the pipe diameter of the refrigerant outflow pipe is equal to that of the refrigerant return pipe, and the pipe diameter of the refrigerant transmission pipe is 60-90% of that of the refrigerant outflow pipe.

Preferably, the two heat dissipation nets are arranged in parallel at intervals; the radial distance H1 between the two radiating nets is not smaller than the radial distance H2 between any one radiating net and the refrigerant box.

Preferably, the axial distance H3 between the bottom end of the radiating net and the top end of the refrigerant box is 1-5 times larger than the radial distance H2, and the axial distance H3 is larger than the radial distance H2.

Preferably, the radial spacing H2 is between 3-10CM.

Preferably, the first tube end, the vertical tube, the heat exchange tube and the second tube end are integrally formed tubes.

Preferably, the heat exchange pipeline comprises a plurality of horizontal sub-pipes which are sequentially connected and horizontally fixed on the heat dissipation net, and the distance between any adjacent horizontal sub-pipes is equal.

Preferably, two refrigerant boxes are of an integral structure, respective refrigerant inner cavities of the two refrigerant boxes are communicated to form a transversely extending heat exchange inner cavity, two refrigerant outflow pipes are connected to the upper end of the heat exchange inner cavity, and two refrigerant backflow pipes are connected to the lower end of the heat exchange inner cavity.

Preferably, a partition plate is arranged in the middle of the heat exchange inner cavity, and the heat exchange inner cavity is divided into a lower cavity and an upper cavity by the partition plate; the partition board is provided with a through groove for communicating the lower cavity with the upper cavity, the two refrigerant outflow pipes are both connected with the upper cavity, and the two refrigerant backflow pipes are both connected with the lower cavity.

Preferably, the tail ends of the two refrigerant outflow pipes are communicated with the heat exchange inner cavity through a first connecting pipe, and the first connecting pipe and the two refrigerant outflow pipes are of an integral structure; the tail ends of the two refrigerant backflow pipes are communicated with the heat exchange inner cavity through second connecting pipes, and the second connecting pipes and the two refrigerant backflow pipes are of an integrated structure.

The utility model also discloses a refrigerating plant, include the box and locate the semiconductor refrigeration piece of a box side, still include dual cycle heat abstractor, wherein, refrigerant box and the laminating setting of semiconductor refrigeration piece.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses a double-circulation heat abstractor except adopting two parallel way heat dissipation circulation to obtain than the higher radiating efficiency of heat dissipation circulation all the way, thereby mainly adopted following technological innovation means to come ingenious improvement radiating component and obtain better radiating effect:

1. the pipe diameter of the refrigerant outflow pipe and the pipe diameter of the refrigerant return pipe are both larger than the pipe diameter of the refrigerant transmission pipe, so that the phase-change refrigerant has higher circulating flow speed in each path of circulating heat dissipation, and the phase-change refrigerant has higher efficient heat dissipation capacity.

2. The upper end through setting up refrigerant outflow pipe and refrigerant inner chamber is linked together, and sets up refrigerant transmission pipe and have vertical pipeline through first pipe end and refrigerant outflow pipe, lets the phase change refrigerant of refrigerant inner chamber utilize capillary phenomenon can upwards get into the refrigerant outflow pipe and even enter into vertical pipeline in, can be fast upwards rush to vertical pipeline top back and get into the heat transfer pipeline fast in the heat absorption production phase change in-process, and the heat dissipation is high-efficient and reliable operation.

Drawings

Fig. 1 is a schematic view of the internal structure of one embodiment of a refrigeration apparatus.

Fig. 2 is an enlarged schematic view of a portion a of fig. 1.

Fig. 3 is a schematic perspective view of a first embodiment of a dual-cycle heat dissipation device.

Fig. 4 is a side view of a first embodiment of a dual cycle heat sink.

Fig. 5 is a schematic perspective view of a second embodiment of a dual-cycle heat dissipation device.

Fig. 6 is a schematic structural view of a refrigerating apparatus using the dual cycle heat sink shown in fig. 5.

Fig. 7 is an enlarged schematic view of a portion B in fig. 6.

Fig. 8 is a schematic perspective view of a third embodiment of a dual-cycle heat dissipation device.

Detailed Description

To further clarify the technical solutions and effects adopted by the present application to achieve the intended purpose, the following detailed description is given with reference to the accompanying drawings and preferred embodiments according to the present application. In the following description, different "one embodiment" or "an embodiment" refers to not necessarily the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

As shown in connection with fig. 1 and 2, the refrigeration device may be an ice chest or a refrigerator. Refrigerating plant includes box 1, locates semiconductor refrigeration piece 2 and the dual cycle heat abstractor of 1 side of box, utilizes the dual cycle heat abstractor to provide the efficient heat dissipation for semiconductor refrigeration piece 2 to guarantee semiconductor refrigeration piece 2 can provide high-efficient reliable refrigeration ability for box 1.

Specifically, as shown in fig. 3 and 4, the dual cycle heat dissipation device specifically includes: two refrigerant boxes 4 which are arranged transversely side by side, wherein each refrigerant box 4 is provided with a refrigerant inner cavity, and a phase-change refrigerant is filled in the refrigerant inner cavity; two radiator units above refrigerant box 4, every radiator unit links to each other with one of them refrigerant box 4 respectively, utilizes a radiator unit to match respectively with a refrigerant box 4 in order to form a heat dissipation circulation respectively to constitute the double circulation heat abstractor who has two way heat dissipation circulations that are parallelly connected, improve the radiating efficiency to semiconductor refrigeration piece 2 with two way heat dissipation circulations that are parallelly connected.

Each heat dissipation assembly comprises a refrigerant outflow pipe 5, a refrigerant backflow pipe 6, a refrigerant transmission pipe 7 and a heat dissipation net 8, wherein the pipe diameter of the refrigerant outflow pipe 5 and the pipe diameter of the refrigerant backflow pipe 6 are both larger than the pipe diameter of the refrigerant transmission pipe 7; the refrigerant outflow pipe 5 is communicated with the upper end of the refrigerant inner cavity so as to facilitate the phase-change refrigerant to enter the refrigerant transmission pipe through the refrigerant outflow pipe 5; the refrigerant return pipe 6 is communicated with the lower end of the refrigerant inner cavity so as to be beneficial to quickly filling the refrigerant inner cavity with the phase-change refrigerant returned from the refrigerant transmission pipe 7 under the action of gravity, ensure that the refrigerant inner cavity is filled with the phase-change refrigerant, and quickly exchange heat by abutting the refrigerant box 4 and the semiconductor refrigeration sheet 2 so as to provide conditions for ensuring the heat dissipation capacity of the heat dissipation assembly; the refrigerant transmission pipe 7 specifically comprises a first pipe end 71, a vertical pipe 72, a heat exchange pipe 73 and a second pipe end 74 which are connected in sequence, the first pipe end 71 and the second pipe end 74 are both located below the radiator grid 8, the first pipe end 71 is communicated with the refrigerant outflow pipe 5, the second pipe end 74 is communicated with the refrigerant return pipe 6, the vertical pipe 72 extends to the top end of the radiator grid 8 in a vertical shape from the bottom end of the radiator grid 8, and the heat exchange pipe 73 is distributed in a winding manner from the bottom end of the radiator grid 8 from the top end of the radiator grid 8.

The utility model discloses a double-circulation heat abstractor except adopting two parallel way heat dissipation circulation to obtain than the higher radiating efficiency of heat dissipation circulation all the way, thereby mainly adopted following technological innovation means to come ingenious improvement radiating component and obtain better radiating effect:

1. the phase change refrigerant has a faster circulation flow speed in each path of circulation heat dissipation, so that the phase change refrigerant has a more efficient heat dissipation capability. Particularly, the utility model discloses set up the pipe diameter of refrigerant outlet pipe 5, the pipe diameter of refrigerant back flow 6 all is greater than the pipe diameter of refrigerant transmission pipe 7, let the phase change refrigerant can flow to the refrigerant transmission pipe from refrigerant outlet pipe 5 with great flow after absorbing the heat from refrigerant box 4, let the phase change refrigerant enter into in the refrigerant transmission pipe that the pipe diameter diminishes with faster speed transmission, and the phase change refrigerant after refrigerant transmission pipe carries out the heat exchange with radiator-grid 8, also can flow back to the refrigerant inner chamber from the bigger refrigerant back flow 6 of bore under the action of gravity.

2. The heat dissipation reliability is high. Specifically, the refrigerant outflow pipe 5 is communicated with the upper end of the refrigerant inner cavity, the refrigerant transmission pipe is provided with a vertical pipeline 72 and the refrigerant outflow pipe 5 through a first pipe tail end 71, the refrigerant outflow pipe 5 and the refrigerant transmission pipe 7 are long and narrow pipelines with small pipe diameters, even under the condition that the semiconductor refrigeration piece 2 does not need to dissipate heat, the phase-change refrigerant in the refrigerant inner cavity can upwards enter the refrigerant outflow pipe 5 and even enter the vertical pipeline 72 through capillary phenomenon, once the semiconductor refrigeration piece 2 generates heat in the working process, the heat is subjected to heat exchange through the refrigerant box 4, the phase-change refrigerant in the refrigerant outflow pipe 5 and even in the vertical pipeline 72 quickly enters the heat exchange pipeline 73 in the process of phase change (for example, part of the phase-change refrigerant is changed into gas from liquid) in the process of absorbing heat, the phase-change refrigerant quickly flows upwards to the top end of the vertical pipeline 72 and then quickly flows downwards from top to the heat dissipation net 8 from top to bottom in the heat exchange pipeline 73, and finally the refrigerant transmission pipe 7 with a large pipe diameter flows back to quickly fill the inner cavity, so that the phase change in the inner cavity is ensured, and the heat dissipation reliability is ensured.

The pipe diameter of the refrigerant outflow pipe 5 is equal to the pipe diameter of the refrigerant return pipe 6, and the pipe diameter of the refrigerant transmission pipe 7 is preferably 60-90% of the pipe diameter of the refrigerant outflow pipe 5. For example, the refrigerant outflow pipe 5 and the refrigerant return pipe 6 are pipes having an inner diameter of 8mm, and the refrigerant delivery pipe 7 is a pipe having an inner diameter of 6 mm.

Wherein, as shown in fig. 4 in particular, two heat dissipation nets 8 are arranged in parallel and spaced apart. The radial distance H1 between the two radiating nets 8 is not smaller than the radial distance H2 between any one radiating net 8 and the refrigerant box 4. Preferably, H2 is between 3 and 10CM. The arrangement has the advantages that the two heat dissipation nets 8 are arranged in parallel at intervals, so that the double-circulation heat dissipation device is compact in overall structure and small in size; meanwhile, the radial distance H1 between the two radiating nets 8 is large, so that the two radiating nets 8 and the surrounding air have good heat radiation space to ensure the heat radiation capability of the radiating assembly.

Moreover, an axial distance H3 between the bottom end of the radiating net 8 and the top end of the refrigerant box 4 is preferably 1-5 times as long as the radial distance H2, wherein the axial distance H3 is larger than the radial distance H2. The structure enables the distance between the radiating net 8 and the refrigerant box 4 to be larger, and can reduce the heat of the radiating net 8 from being radiated back to the refrigerant box 4 again, so that the double-circulation radiating device is ensured to have better radiating performance.

The first pipe end 71, the vertical pipe 72, the heat exchange pipe 73, and the second pipe end 74 are integrally formed pipes, that is, the refrigerant transmission pipe 7 is a single pipe. This structure is advantageous for simplifying the assembling operation of the heat dissipating module.

Moreover, the heat exchange pipe 73 includes a plurality of horizontal sub-pipes connected in sequence and horizontally fixed on the radiator grid 8, and the distance between any adjacent horizontal sub-pipes is equal. This configuration facilitates maintaining optimum heat radiation performance between the heat exchange tubes 73 and the heat radiating mesh 8.

Referring to fig. 1 and 2 again, the casing of the box body 1 is of a double-layer structure, the casing of the box body 1 comprises an inner casing 11 and an outer casing, and the semiconductor refrigeration piece 2 is attached to the outer side surface of the inner casing 11 through a larger cooling block 3, so that the cooling block 3 is facilitated to improve the cooling capacity transfer capacity between the semiconductor refrigeration piece 2 and the inner casing 11. And the heat radiation net 8 is arranged on the outer side surface of the shell, so that heat is radiated by heat exchange between the heat and the air outside the box body 1 through the heat radiation net 8.

The utility model discloses a double circulation heat abstractor, both can utilize two refrigerant boxes 4 that transversely set up side by side and the left and right parts of a semiconductor refrigeration piece 2 to dispel the heat respectively, construct the circulation heat dissipation of the same kind separately and improve the holistic heat-sinking capability; meanwhile, two refrigerant boxes 4 which are arranged side by side and transversely can be used for radiating 2 semiconductor refrigerating sheets 2 which are distributed side by side respectively. Therefore, the dual-cycle heat dissipation device is flexible to use and wide in adaptability.

In conjunction with the embodiments shown in fig. 5-7, it reflects the heat absorption cold plate 4' in which two refrigerant boxes 4 arranged side by side and horizontally are an integral structure, and the refrigerant inner cavities of the two refrigerant boxes 4 are communicated to form a heat exchange inner cavity extending horizontally, the refrigerant outflow pipe 5 is connected to the upper end of the heat exchange inner cavity, and the refrigerant return pipe 6 is connected to the lower end of the heat exchange inner cavity. This kind of structure makes refrigerant box more easily assemble the use in refrigerating plant.

Preferably, a partition plate 40 is arranged in the middle of the heat exchange cavity of the heat absorption cold plate 4' to divide the heat exchange cavity into a lower cavity 41 and an upper cavity 42; a through groove for communicating the lower cavity 41 with the upper cavity 42 is formed in the partition plate 40, and a phase-change refrigerant can flow between the lower cavity 41 and the upper cavity 42 by using the phase-change refrigerant; and, two refrigerant outflow pipes 5 are connected to the upper chamber 42, and two refrigerant return pipes 6 are connected to the lower chamber 41.

The heat exchange inner cavity is divided into the lower cavity 41 and the upper cavity 42 by the partition plate 40, so that the phase change refrigerant can be ensured to flow freely in the heat exchange inner cavity, the mutual interference between the refrigerant outflow pipe 5 and the refrigerant return pipe 6 is reduced, the phase change refrigerant flowing out of the refrigerant return pipe 6 can be ensured to flow into the upper cavity 42 from the lower cavity 42 through the through groove of the partition plate 40, after sufficient heat exchange is carried out between the phase change refrigerant and the heat absorption cold plate 4' in the flowing process, the phase change refrigerant enters the heat dissipation assembly through the refrigerant outflow pipe 5 to carry out heat dissipation circulation, the integral heat dissipation capacity of the heat dissipation device is improved, and the refrigerating device is ensured to have better refrigerating performance.

In connection with the embodiment shown in fig. 8. On the basis of the embodiment shown in fig. 5, in order to further simplify the assembly between the refrigerant outflow pipe 5, the refrigerant return pipe 6 and the heat absorbing cold plate 4', the following design is made: the tail ends of the two refrigerant outflow pipes 5 are communicated with the heat exchange inner cavity through first connecting pipes 5', and the first connecting pipes 5' and the two refrigerant outflow pipes 5 are of an integral structure; the tail ends of the two refrigerant return pipes 6 are communicated with the heat exchange inner cavity through second connecting pipes 6', and the second connecting pipes 6' and the two refrigerant return pipes 6 are of an integral structure.

Therefore, the assembling process of assembling the two refrigerant outflow pipes 5 and the two refrigerant backflow pipes 6 with the heat absorption cold plate 4 'is reduced, and the connecting positions of the two heat dissipation assemblies and the heat absorption cold plate 4' are changed from 4 to 2, so that the possibility of leakage of phase change refrigerants in the heat exchange inner cavity can be reduced, and the reliability of the dual-cycle heat dissipation device is improved.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A dual cycle heat sink for a refrigeration device comprising: the refrigerant box comprises two refrigerant boxes (4) which are transversely arranged side by side, wherein each refrigerant box (4) is provided with a refrigerant inner cavity, two heat dissipation assemblies are arranged above the refrigerant boxes (4), and each heat dissipation assembly is connected with one refrigerant box (4) respectively; every radiator unit all includes refrigerant outflow pipe (5), refrigerant back flow (6), connects refrigerant transmission pipe (7) between refrigerant outflow pipe (5) and refrigerant back flow (6) and with fixed radiator-grid (8) that link to each other of refrigerant transmission pipe (7), its characterized in that:

the refrigerant transmission pipe (7) comprises a first pipe tail end (71), a vertical pipeline (72), a heat exchange pipeline (73) and a second pipe tail end (74) which are sequentially connected, the first pipe tail end (71) and the second pipe tail end (74) are both positioned below the heat dissipation net (8) and are respectively communicated with the refrigerant outflow pipe (5) and the refrigerant return pipe (6), the vertical pipeline (72) vertically extends from the bottom end of the heat dissipation net (8) to the top end of the heat dissipation net (8), and the heat exchange pipeline (73) is distributed from the top end of the heat dissipation net (8) in a winding manner;

the refrigerant outflow pipe (5) is communicated with the upper end of the refrigerant inner cavity, the refrigerant backflow pipe (6) is communicated with the lower end of the refrigerant inner cavity, and the pipe diameter of the refrigerant outflow pipe (5) and the pipe diameter of the refrigerant backflow pipe (6) are both larger than the pipe diameter of the refrigerant transmission pipe (7).

2. The dual cycle heat sink of claim 1, wherein: the pipe diameter of the refrigerant outflow pipe (5) is equal to that of the refrigerant return pipe (6), and the pipe diameter of the refrigerant transmission pipe (7) is 60-90% of that of the refrigerant outflow pipe (5).

3. The dual cycle heat sink of claim 1, wherein: the two radiating nets (8) are arranged in parallel at intervals; the radial distance H1 between the two radiating nets (8) is not less than the radial distance H2 between any one radiating net (8) and the refrigerant box (4).

4. The dual cycle heat sink of claim 3, wherein: and an axial distance H3 between the bottom end of the radiating net (8) and the top end of the refrigerant box (4), wherein the axial distance H3 is 1-5 times of the radial distance H2.

5. The dual cycle heat sink of claim 1, wherein: the first tube end (71), the vertical tube (72), the heat exchange tube (73) and the second tube end (74) are integrally formed tubes.

6. The dual cycle heat sink of claim 1, wherein: the heat exchange pipeline (73) comprises a plurality of horizontal sub-pipes which are sequentially connected and horizontally fixed on the heat dissipation net (8), and the distance between any adjacent horizontal sub-pipes is equal.

7. The dual cycle heat sink of any one of claims 1-6, wherein: the two refrigerant boxes (4) are of an integral structure, the refrigerant inner cavities of the two refrigerant boxes (4) are communicated to form a transversely extending heat exchange inner cavity, the two refrigerant outflow pipes (5) are connected to the upper end of the heat exchange inner cavity, and the two refrigerant backflow pipes (6) are connected to the lower end of the heat exchange inner cavity.

8. The dual cycle heat sink of claim 7, wherein: a clapboard (40) is arranged in the middle of the heat exchange inner cavity, and the heat exchange inner cavity is divided into a lower cavity (41) and an upper cavity (42) by the clapboard (40); the partition plate (40) is provided with a through groove for communicating the lower cavity (41) with the upper cavity (42), the two refrigerant outflow pipes (5) are both connected with the upper cavity (42), and the two refrigerant backflow pipes (6) are both connected with the lower cavity (41).

9. The dual cycle heat sink of claim 7, wherein: the tail ends of the two refrigerant outflow pipes (5) are communicated with the heat exchange inner cavity through first connecting pipes (5 '), and the first connecting pipes (5') and the two refrigerant outflow pipes (5) are of an integral structure; the tail ends of the two refrigerant return pipes (6) are communicated with the heat exchange inner cavity through second connecting pipes (6 '), and the second connecting pipes (6') and the two refrigerant return pipes (6) are of an integral structure.

10. The utility model provides a refrigerating plant, includes box (1) and locates semiconductor refrigeration piece (2) of box (1) a side, its characterized in that: the dual-cycle heat dissipation device as defined in any one of claims 1 to 9, wherein the refrigerant box (4) is attached to the semiconductor cooling plate (2).

Images