CN116053604A - Formation cabinet with heat dissipation function - Google Patents
Formation cabinet with heat dissipation function Download PDFInfo
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- CN116053604A CN116053604A CN202310208386.4A CN202310208386A CN116053604A CN 116053604 A CN116053604 A CN 116053604A CN 202310208386 A CN202310208386 A CN 202310208386A CN 116053604 A CN116053604 A CN 116053604A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/058—Construction or manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0404—Machines for assembling batteries
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/44—Methods for charging or discharging
- H01M10/446—Initial charging measures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6554—Rods or plates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6556—Solid parts with flow channel passages or pipes for heat exchange
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
- H01M10/6561—Gases
- H01M10/6563—Gases with forced flow, e.g. by blowers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
- H01M10/6567—Liquids
- H01M10/6568—Liquids characterised by flow circuits, e.g. loops, located externally to the cells or cell casings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/657—Means for temperature control structurally associated with the cells by electric or electromagnetic means
- H01M10/6572—Peltier elements or thermoelectric devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a formation cabinet with heat dissipation function, it includes the cabinet body, be provided with wind chamber and cold liquid chamber in the cabinet wall of the cabinet body, the wind chamber sets up in the one side that is close to the cabinet body outside, separate through first heat conduction board between cold liquid chamber and the wind chamber, set up the air inlet with wind chamber intercommunication on the outer wall of the cabinet body, the wind chamber communicates with the inside of the cabinet body, the cabinet body still communicates there is the blast pipe, air inlet department is provided with the fan that is used for leading in external gas into the wind chamber; the cold liquid cavity is communicated with a water inlet pipe and a water outlet pipe, the cold liquid water tank is fixedly arranged on the cabinet body, the water inlet pipe and the water outlet pipe are communicated with the cold liquid water tank, a circulating water pump for guiding water into the water inlet pipe is arranged on the cold liquid water tank, and a liquid cooling module for cooling water in the cold liquid water tank is arranged on the cold liquid water tank. The application has the effect of effectively cooling the inside of the formation cabinet.
Description
Technical Field
The application relates to the technical field of battery formation, in particular to a formation cabinet with a heat dissipation function.
Background
Aiming at the characteristics of low capacity or better consistency of battery formation process, the formation cabinet adopts automatic charge-discharge switching, automatic current setting and power-down protection, and has a full Chinese microcomputer operation interface, and the formation cabinet has the advantages of advanced structure, reliable performance, simple and convenient operation, and extremely high cost performance, and is ideal production equipment for secondary battery manufacturers.
The formation and capacity-division processes of the lithium battery have strict requirements on the ambient temperature, the general ambient temperature is controlled to be 20-25 ℃, and a large amount of heat is generated by the formation cabinet during operation, so that the internal temperature of the formation cabinet is increased, the normal operation of the formation cabinet is affected, and therefore, a fan is usually arranged on the formation cabinet to radiate the inside of the formation cabinet.
However, the formation cabinet can also absorb a part of heat except for generating hot gas during operation, and the internal temperature of the formation cabinet can be continuously increased along with the increase of the heat absorbed by the cabinet wall of the formation cabinet, so that the internal temperature of the formation cabinet is difficult to be effectively cooled only by the fan.
Disclosure of Invention
In order to improve the cooling effect to the inside of formation cabinet, this application provides a formation cabinet with heat dissipation function.
The application provides a formation cabinet with heat dissipation function adopts following technical scheme:
the formation cabinet with the heat dissipation function comprises a cabinet body, wherein an air cavity and a cold liquid cavity are arranged in a cabinet wall of the cabinet body, the air cavity is arranged on one side close to the outside of the cabinet body, the cold liquid cavity and the air cavity are separated by a first heat conducting plate, an air inlet communicated with the air cavity is formed in the outer wall of the cabinet body, the air cavity is communicated with the inside of the cabinet body, an exhaust pipe is further communicated with the cabinet body, and a fan for guiding external air into the air cavity is arranged at the air inlet;
the cold liquid cavity is communicated with a water inlet pipe and a water outlet pipe, the cold liquid water tank is fixedly arranged on the cabinet body, the water inlet pipe and the water outlet pipe are communicated with the cold liquid water tank, a circulating water pump for guiding water into the water inlet pipe is arranged on the cold liquid water tank, and a liquid cooling module for cooling water in the cold liquid water tank is arranged on the cold liquid water tank.
Through adopting above-mentioned technical scheme, formation cabinet is when using, cool down the water in the cold liquid water tank through the liquid cooling module, the water after the refrigeration gets into cold liquid intracavity through circulating water pump, afterwards rethread outlet pipe gets back to in the cold liquid water tank, and the heat that the cabinet wall of the cabinet body absorbed is cooled down through the cooling water, the heat is difficult for accumulating on the cabinet wall, simultaneously, the air current has been blown the wind intracavity through the fan, the air current is in the wind intracavity time, the cooling water in with cold liquid intracavity through first heat-conducting plate further cools down the air current, the air current after the cooling gets into the cabinet body inside, discharge the inside steam of cabinet from the blast pipe, thereby improved the cooling effect to formation cabinet inside greatly.
Optionally, the cabinet is internal and be close to the fixed air supply case that is provided with in bottom of the cabinet, the wind chamber intercommunication has the ventilation pipe, ventilation pipe and air supply case intercommunication, a plurality of supply-air inlets have been seted up to the roof of air supply case, and is a plurality of the supply-air inlets disperse on the roof of air supply case.
Through adopting above-mentioned technical scheme, through the ventilation pipe with the air current after the cooling in the wind chamber to the air supply case, a plurality of supply-air inlets of rethread air supply case roof guide the air current to each position in the cabinet body to improve the radiating effect to the internal portion of cabinet.
Optionally, a dust screen is arranged at each air supply outlet.
Through adopting above-mentioned technical scheme, prevent to a certain extent that the dust from getting into the cabinet body through the dust screen.
Optionally, the liquid cooling module includes semiconductor refrigeration piece and second heat-conducting plate, the through-hole with the cold liquid water tank intercommunication has been seted up to the lateral wall of cold liquid water tank, the fixed setting of second heat-conducting plate is in the through-hole, the fixed setting of semiconductor refrigeration piece is kept away from one side of cold liquid water tank at the second heat-conducting plate, and the cold junction and the laminating of second heat-conducting plate of semiconductor refrigeration piece, the semiconductor refrigeration piece is connected with the power.
Through adopting above-mentioned technical scheme, will refrigerate through the semiconductor refrigeration piece to the second heat-conducting plate, after the cooling water gets into the cold liquid water tank, carries out the heat exchange through the water in second heat-conducting plate and the cold liquid water tank to the water in the cold liquid water tank cools down.
Optionally, the one side that the second heat-conducting plate was kept away from to the semiconductor refrigeration piece still is fixed to be provided with the fin box, be provided with radiating fin in the fin box, the mounting hole has been seted up to the lateral wall of fin box, the semiconductor refrigeration piece is located the mounting hole position, and the hot junction and the radiating fin laminating of semiconductor refrigeration piece, air intake and air outlet have been seted up respectively on the fin box and lie in radiating fin's both sides, the ventilation pipe intercommunication has the honeycomb duct, honeycomb duct and air intake intercommunication.
By adopting the technical scheme, the heat displaced by the hot end of the semiconductor refrigerating sheet is conducted to the radiating fins, the heat is dispersed through the radiating fins, and the cooling air flow in the ventilating pipe is guided into the fin box through the heat conducting pipe to cool the radiating fins, so that the hot end of the semiconductor refrigerating sheet is effectively cooled.
Optionally, the middle of cold liquid water tank is the platykurtic, inlet tube and outlet pipe are connected respectively in the both sides of cold liquid water tank, the intermediate position that the second heat-conducting plate is located the cold liquid water tank.
Through adopting above-mentioned technical scheme, through setting the intermediate position of cold liquid water tank to the platykurtic, reduce the circulation of rivers in the cold liquid water tank, increase the area of contact of rivers and second heat-conducting plate simultaneously to improve the refrigeration effect to the interior water of cold liquid water tank.
Optionally, one end of the first heat conducting plate, which is close to the wind cavity, is fixedly provided with a plurality of heat dissipating blocks, each heat dissipating block is in clearance fit, and an air flow channel through which air passes is formed between each heat dissipating block.
Through adopting above-mentioned technical scheme, reduce the inner space of wind chamber through the radiating block, the cooling water in the cold liquid chamber is conducted to the heat conduction piece after the heat conduction of first heat conduction board, improves the area of contact with the air current in the wind chamber to improve the refrigeration effect to the air current in the wind chamber.
Optionally, a cavity is formed in the heat dissipation block, and each cavity of the heat dissipation block is communicated with the cold liquid cavity.
Through adopting above-mentioned technical scheme, in the cooling water of cold liquid intracavity got into the cavity of radiating block, improved the heat conduction effect to the radiating block to further improve the refrigeration effect to the air current in the wind chamber.
Optionally, a heat insulation cavity is further arranged in the cabinet wall, close to one side of the outer portion of the cabinet body, of the air cavity, and heat insulation cotton is filled in the heat insulation cavity.
By adopting the technical scheme, the heat exchange between the air in the air cavity and the outside air is reduced through the heat insulation cavity.
Optionally, still be provided with a plurality of baffles that are used for placing the group battery in the cabinet body, the inside of baffle is provided with flow channel, flow channel and cold liquid chamber intercommunication.
Through adopting above-mentioned technical scheme, when the group battery is placed on the baffle, the group battery is direct to contact with the baffle, and the heat that the group battery surface produced is conducted to on the baffle, through the flow channel with in the baffle with cold liquid chamber intercommunication, make the cooling water in the cold liquid chamber get into in the flow channel, cool down the baffle to effectively avoid heat to gather on the baffle, lead to the internal temperature of cabinet to rise.
In summary, the present application includes at least one of the following beneficial technical effects:
1. when the formation cabinet is used, the liquid cooling module is used for refrigerating water in the cold liquid water tank, the refrigerated water enters the cold liquid cavity through the circulating water pump and then returns to the cold liquid water tank through the water outlet pipe, heat absorbed by the cabinet wall of the cabinet body is cooled through the cooling water, the heat is not easy to accumulate on the cabinet wall, meanwhile, air flow is blown into the air cavity through the fan, when the air flow is in the air cavity, the cooling water in the cold liquid cavity is used for further cooling the air flow through the first heat conducting plate, the cooled air flow enters the cabinet body, and hot air in the cabinet body is discharged from the exhaust pipe, so that the cooling effect on the inside of the formation cabinet is greatly improved;
2. the internal space of the air cavity is reduced through the heat dissipation block, and cooling water in the cold liquid cavity is conducted to the heat conduction block after being conducted through the first heat conduction plate, so that the contact area with air flow in the air cavity is increased, and the refrigerating effect on the air flow in the air cavity is improved;
3. when the battery pack is placed on the partition board, the battery pack is directly contacted with the partition board, heat generated on the surface of the battery pack is conducted to the partition board, and through the communication of the liquid flow channel in the partition board and the cold liquid cavity, cooling water in the cold liquid cavity enters the liquid flow channel to cool the partition board, so that heat accumulation on the partition board is effectively avoided, and the temperature in the cabinet body is increased.
Drawings
FIG. 1 is a schematic overall structure of an embodiment of the present application;
FIG. 2 is a cross-sectional view of a structure of an embodiment of the present application;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is a schematic view of a part of the structure of an embodiment of the present application, mainly used for expressing the schematic view of the structure of a cold liquid water tank;
fig. 5 is a partial structural cross-sectional view of an embodiment of the present application, mainly for expressing a structural schematic view of a separator.
Reference numerals illustrate: 1. a cabinet body; 11. a cabinet door; 111. a door frame; 112. transparent glass; 113. a door lock; 12. a partition plate; 121. a heat radiation port; 122. a flow channel; 123. a connecting pipe; 13. a heat insulating chamber; 131. thermal insulation cotton; 14. a wind chamber; 141. a ventilation pipe; 1411. a flow guiding pipe; 15. a cold liquid cavity; 151. a water inlet pipe; 152. a water outlet pipe; 16. an exhaust pipe; 17. an air inlet; 18. a blower; 2. a blow box; 21. an air supply port; 22. a dust screen; 3. a first heat-conducting plate; 31. a heat dissipation block; 32. an air flow channel; 4. a cold liquid water tank; 41. a circulating water pump; 42. a semiconductor refrigeration sheet; 43. a second heat-conducting plate; 5. a fin box; 51. and a heat radiating fin.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-5.
The embodiment of the application discloses a formation cabinet with a heat dissipation function. Referring to fig. 1, including the cabinet body 1, one of them lateral wall opening of the cabinet body 1 sets up, and the open end of the cabinet body 1 articulates there is cabinet door 11, and cabinet door 11 includes door frame 111 and fixed transparent glass 112 that sets up in door frame 111, is provided with the lock 113 that is used for closing cabinet door 11 on the door frame 111, and the inside of the cabinet body 1 is fixed in proper order from the bottom up and is provided with a plurality of support frames, all fixes being provided with baffle 12 on every support frame, and baffle 12 level sets up, has seted up a plurality of thermovent 121 that link up baffle 12 on the baffle 12, and the group battery is placed on baffle 12.
Referring to fig. 2 and 3, a heat insulation cavity 13, an air cavity 14 and a cold liquid cavity 15 are sequentially arranged in the cabinet wall of the cabinet body 1 from outside to inside, the heat insulation cavity 13, the air cavity 14 and the cold liquid cavity 15 are all communicated with three side walls of the cabinet body 1 except for an opening end, heat insulation cotton 131 is filled in the heat insulation cavity 13, an exhaust pipe 16 is communicated with the top of the cabinet body 1, heat exchange between air in the air cavity 14 and outside air is reduced through the heat insulation cavity 13, and therefore the inside of the cabinet body 1 is cooled better.
Referring to fig. 2 and 3, an air inlet 17 communicated with an air cavity 14 is formed in the outer side wall of the cabinet body 1, the air inlet 17 is formed at a position close to the bottom wall of the cabinet body 1, a fan 18 is fixedly arranged in the air inlet 17, an air feeding box 2 is fixedly arranged in the cabinet body 1 and close to the bottom of the cabinet body 1, the air cavity 14 is communicated with an air pipe 141, the air pipe 141 penetrates through each partition plate 12, the air pipe 141 is communicated with the air feeding box 2, a plurality of air supply openings 21 are formed in the top wall of the air feeding box 2, the plurality of air supply openings 21 are distributed on the top wall of the air feeding box 2, and a dust screen 22 is fixedly arranged at each air supply opening 21; the air flow is blown into the air cavity 14 through the fan 18, then is guided into the air supply box 2 through the ventilation pipe 141, and is guided to each position in the cabinet body 1 through the plurality of air supply openings 21 on the top wall of the air supply box 2, and hot air in the cabinet body 1 is discharged from the exhaust pipe 16, so that the temperature in the cabinet body 1 is reduced.
Referring to fig. 2 and 3, the air cavity 14 and the cold liquid cavity 15 are separated by the first heat conducting plate 3, the first heat conducting plate 3 is made of brass, one end of the first heat conducting plate 3 close to the air cavity 14 is fixedly provided with a plurality of heat dissipating blocks 31, the heat dissipating blocks 31 are integrally formed by stamping the first heat conducting plate 3, cavities are formed in the heat dissipating blocks 31, the cavities of each heat dissipating block 31 are communicated with the cold liquid cavity 15, the plurality of heat dissipating blocks 31 are distributed on the first heat conducting plate 3 in a matrix arrangement, and the heat dissipating blocks 31 are in clearance fit with each other, and an air flow channel 32 for passing air is formed between the heat dissipating blocks 31.
Referring to fig. 2 and 3, the cold liquid cavity 15 is communicated with a water inlet pipe 151 and a water outlet pipe 152, the communication end of the water inlet pipe 151 and the cold liquid cavity 15 is close to the bottom wall of the cabinet body 1, the communication end of the water outlet pipe 152 and the cabinet body 1 is close to the top wall of the cabinet body 1, the side wall of the cabinet body 1 is fixedly provided with a cold liquid water tank 4, a water inlet and a water outlet are respectively formed in two sides of the cold liquid water tank 4, the water outlet pipe 152 is communicated with the water inlet of the cold liquid water tank 4, a circulating water pump 41 is fixedly arranged at the water outlet of the cold liquid water tank 4, the water inlet end of the circulating water pump 41 is communicated with the inside of the cold liquid water tank 4, the water outlet end of the circulating water pump 41 is communicated with the water inlet pipe 151, and a liquid cooling module for cooling water in the cold liquid water tank 4 is arranged on the cold liquid water tank 4.
The inner space of the air cavity 14 is reduced through the radiating blocks 31, thereby reducing the capacity of air in the air cavity 14, water in the cold liquid water tank 4 is refrigerated through the liquid cooling module, the refrigerated water enters the cold liquid cavity 15 through the circulating water pump 41, cooling water in the cold liquid cavity 15 enters the cavity of the radiating blocks 31, the radiating blocks 31 are refrigerated, air flows in the air flow channels 32 between the radiating blocks 31 after entering the air cavity 14, the contact area with the air flow is increased through the radiating blocks 31, the air flow in the air cavity 14 is cooled, the cooled air flow after entering the cabinet body 1 can further improve the cooling effect on the interior of the cabinet body 1, then the cooled air flows back into the cold liquid water tank 4 through the water outlet pipe 152, and heat absorbed by the cabinet wall of the cabinet body 1 is cooled through the cooling water and is not easy to accumulate on the cabinet wall.
Referring to fig. 4, the middle of the cold liquid water tank 4 is flat, and the maximum water flow of the middle section of the cold liquid water tank 4 is equal to the maximum water flow of the water inlet and the water outlet, and the water flow and the heat dissipation area of the water flow in the cold liquid water tank 4 are controlled by setting the middle position of the cold liquid water tank 4 to be flat, so that the temperature of the water in the cold liquid water tank 4 is conveniently reduced.
Referring to fig. 4, the liquid cooling module includes a semiconductor refrigeration sheet 42 and a second heat-conducting plate 43, a through hole communicated with the cold liquid water tank 4 is formed on a side wall of the flat section of the cold liquid water tank 4, a containing groove communicated with the through hole is further formed on a side wall of the cold liquid water tank 4, the second heat-conducting plate 43 is fixedly arranged in the containing groove, a joint between the second heat-conducting plate 43 and the cold liquid water tank 4 is sealed by welding, and the second heat-conducting plate 43 is also made of red copper; the heat in the cooling liquid water tank 4 is absorbed by the second heat conducting plate 43, and as the second heat conducting plate 43 is made of red copper, the second heat conducting plate 43 has better heat conducting effect and higher heat capacity, and the heat in the cooling liquid water tank 4 can be better replaced.
Referring to fig. 4, a semiconductor refrigeration piece 42 is fixedly arranged at one side of a second heat-conducting plate 43 far away from the cold liquid water tank 4, and the cold end of the semiconductor refrigeration piece 42 is attached to the second heat-conducting plate 43, and the semiconductor refrigeration piece 42 is connected with a power supply; the second heat-conducting plate 43 is cooled by the semiconductor cooling plate 42, and after the cooling water enters the cold-liquid water tank 4, the cooling water exchanges heat with the water in the cold-liquid water tank 4 by the second heat-conducting plate 43, so that the temperature of the water in the cold-liquid water tank 4 is reduced.
Referring to fig. 3 and 4, a fin box 5 is fixedly arranged at one end, far away from the second heat conducting plate 43, of the semiconductor refrigeration piece 42 on the cold liquid water tank 4, a radiating fin 51 is fixedly arranged in the fin box 5, a mounting opening is formed at one end, close to the cold liquid water tank 4, of the fin box 5, the semiconductor refrigeration piece 42 is located at the mounting opening, the hot end of the semiconductor refrigeration piece 42 is abutted to the radiating fin 51, an air inlet and an air outlet are respectively formed at two sides of the fin box 5, a draft tube 141 is communicated with a draft tube 1411, and the draft tube 1411 is communicated with the air inlet of the fin box 5.
Referring to fig. 5, a liquid flow channel 122 is further provided in the separator 12, the liquid flow channel 122 is coiled in the separator 12, two ends of the liquid flow channel 122 are respectively communicated with a connecting pipe 123, and the two connecting pipes 123 are respectively communicated with the cold liquid cavity 15; when the battery pack is placed on the partition plate 12, the battery pack is directly contacted with the partition plate 12, heat generated on the surface of the battery pack is conducted to the partition plate 12, and through communicating the liquid flow channel 122 in the partition plate 12 with the cold liquid cavity 15, cooling water in the cold liquid cavity 15 enters the liquid flow channel 122 to cool the partition plate 12, so that heat accumulation on the partition plate 12 is effectively avoided, and the temperature in the cabinet body 1 is increased.
The implementation principle of the formation cabinet with the heat dissipation function is as follows: when the formation cabinet is used, the second heat-conducting plate 43 is refrigerated through the semiconductor refrigerating sheet 42, after the cooling water enters the cold liquid water tank 4, the cooling water exchanges heat with the water in the cold liquid water tank 4 through the second heat-conducting plate 43, so that the water in the cold liquid water tank 4 is cooled, the refrigerated water enters the cold liquid cavity 15 and the liquid flow channel 122 of the partition plate 12 through the circulating water pump 41, and then returns to the cold liquid water tank 4 through the water outlet pipe 152, and the heat absorbed by the cabinet wall of the cabinet body 1 is cooled through the cooling water, so that the heat is not easy to accumulate on the cabinet wall.
The temperature of the cooling water in the cooling liquid cavity 15 is transferred to the first heat-conducting plate 3 through the first heat-conducting plate 3, the cooling water in the cooling liquid cavity 15 enters the cavity of the heat dissipation block 31, the heat dissipation block 31 is refrigerated, the air flow is blown into the air cavity 14 through the fan 18, after entering the air cavity 14, the air flow in the air cavity 14 is further cooled through the first heat-conducting plate 3 and the heat dissipation block 31, the cooled air flow is guided into the air supply box 2 through the ventilation pipe 141, and then the air flow is guided to various positions in the cabinet body 1 through the plurality of air supply openings 21 on the top wall of the air supply box 2, and hot air in the cabinet body 1 is discharged from the exhaust pipe 16, so that the cooling effect on the inside of the formed cabinet is greatly improved.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (10)
1. A formation cabinet with heat dissipation function, its characterized in that: the novel intelligent cabinet temperature control device comprises a cabinet body (1), wherein an air cavity (14) and a cold liquid cavity (15) are arranged in a cabinet wall of the cabinet body (1), the air cavity (14) is arranged on one side close to the outside of the cabinet body (1), the cold liquid cavity (15) is separated from the air cavity (14) through a first heat-conducting plate (3), an air inlet (17) communicated with the air cavity (14) is formed in the outer wall of the cabinet body (1), the air cavity (14) is communicated with the inside of the cabinet body (1), an exhaust pipe (16) is further communicated with the cabinet body (1), and a fan (18) used for guiding external air into the air cavity (14) is arranged at the air inlet (17).
The utility model discloses a cold liquid water tank, including cabinet body (1), cold liquid chamber (15) intercommunication has inlet tube (151) and outlet pipe (152), fixedly be provided with cold liquid water tank (4) on cabinet body (1), inlet tube (151) and outlet pipe (152) all communicate with cold liquid water tank (4), be provided with on cold liquid water tank (4) and be used for leading-in circulating water pump (41) of inlet tube (151) with water, be provided with on cold liquid water tank (4) and be used for carrying out refrigerated liquid cooling module to cold liquid water tank (4) interior water.
2. The formation cabinet with heat dissipation function according to claim 1, wherein: the novel air supply cabinet is characterized in that an air supply box (2) is fixedly arranged in the cabinet body (1) and close to the bottom of the cabinet body (1), an air cavity (14) is communicated with an air pipe (141), the air pipe (141) is communicated with the air supply box (2), a plurality of air supply openings (21) are formed in the top wall of the air supply box (2), and the air supply openings (21) are dispersed on the top wall of the air supply box (2).
3. The formation cabinet with heat dissipation function according to claim 2, wherein: and a dustproof net (22) is arranged at each air supply opening (21).
4. The formation cabinet with heat dissipation function according to claim 2, wherein: the liquid cooling module comprises a semiconductor refrigerating sheet (42) and a second heat-conducting plate (43), a through hole communicated with the cold liquid water tank (4) is formed in the side wall of the cold liquid water tank (4), the second heat-conducting plate (43) is fixedly arranged in the through hole, the semiconductor refrigerating sheet (42) is fixedly arranged on one side, far away from the cold liquid water tank (4), of the second heat-conducting plate (43), the cold end of the semiconductor refrigerating sheet (42) is attached to the second heat-conducting plate (43), and the semiconductor refrigerating sheet (42) is connected with a power supply.
5. The formation cabinet with heat dissipation function according to claim 4, wherein: the semiconductor refrigerating piece (42) is kept away from one side of second heat-conducting plate (43) and still fixedly provided with wing box (5), be provided with radiating fin (51) in wing box (5), the mounting hole has been seted up to the lateral wall of wing box (5), semiconductor refrigerating piece (42) are located the mounting hole position, and the hot junction and the laminating of radiating fin (51) of semiconductor refrigerating piece (42), air intake and air outlet have been seted up respectively to the both sides that just are located radiating fin (51) on wing box (5), ventilation pipe (141) intercommunication has honeycomb duct (1411), honeycomb duct (1411) and air intake intercommunication.
6. The formation cabinet with heat dissipation function according to claim 4, wherein: the middle of the cold liquid water tank (4) is flat, the water inlet pipe (151) and the water outlet pipe (152) are respectively connected to two sides of the cold liquid water tank (4), and the second heat conducting plate (43) is positioned in the middle of the cold liquid water tank (4).
7. The formation cabinet with heat dissipation function according to claim 1, wherein: one end of the first heat-conducting plate (3) close to the air cavity (14) is fixedly provided with a plurality of heat dissipation blocks (31), the heat dissipation blocks (31) are in clearance fit, and an air flow channel (32) for air to pass through is formed between the heat dissipation blocks (31).
8. The formation cabinet with heat dissipation function according to claim 7, wherein: the inside of the heat dissipation block (31) is provided with a cavity, and the cavity of each heat dissipation block (31) is communicated with the cold liquid cavity (15).
9. The formation cabinet with heat dissipation function according to claim 1, wherein: the air chamber (14) is close to the cabinet wall of the external side of the cabinet body (1) and is internally provided with a heat insulation chamber (13), and the heat insulation chamber (13) is internally filled with heat insulation cotton (131).
10. The formation cabinet with heat dissipation function according to claim 1, wherein: the battery pack cooling device is characterized in that a plurality of partition plates (12) used for placing the battery pack are further arranged in the cabinet body (1), a liquid flow channel (122) is arranged in the partition plates (12), and the liquid flow channel (122) is communicated with the cold liquid cavity (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310208386.4A CN116053604A (en) | 2023-02-27 | 2023-02-27 | Formation cabinet with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310208386.4A CN116053604A (en) | 2023-02-27 | 2023-02-27 | Formation cabinet with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116053604A true CN116053604A (en) | 2023-05-02 |
Family
ID=86125802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310208386.4A Withdrawn CN116053604A (en) | 2023-02-27 | 2023-02-27 | Formation cabinet with heat dissipation function |
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| Country | Link |
|---|---|
| CN (1) | CN116053604A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117154287A (en) * | 2023-09-15 | 2023-12-01 | 泰铂（上海）环保科技股份有限公司 | Low-noise energy storage cabinet |
-
2023
- 2023-02-27 CN CN202310208386.4A patent/CN116053604A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117154287A (en) * | 2023-09-15 | 2023-12-01 | 泰铂（上海）环保科技股份有限公司 | Low-noise energy storage cabinet |
| CN117154287B (en) * | 2023-09-15 | 2024-04-05 | 泰铂（上海）环保科技股份有限公司 | Low-noise energy storage cabinet |
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Application publication date: 20230502 |
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