CN218783092U

CN218783092U - Cooling liquid tank

Info

Publication number: CN218783092U
Application number: CN202222840393.XU
Authority: CN
Inventors: 王东; 武义杰; 武方伟
Original assignee: Anhui Guotai Aluminium Co ltd
Current assignee: Anhui Guotai Aluminium Co ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-03-31
Anticipated expiration: 2032-10-27

Abstract

The utility model discloses a cooling liquid box, which relates to the technical field of cooling liquid boxes and comprises a first clapboard and a second clapboard which are fixedly connected in the cooling liquid box and divide the cooling liquid box into a liquid inlet chamber, a liquid outlet chamber and a cooling chamber; the liquid inlet pipe is arranged on the side wall of the liquid inlet chamber and is communicated with the liquid inlet chamber; the liquid outlet pipe is arranged on the side wall of the liquid outlet chamber and is communicated with the liquid outlet chamber; the heat dissipation copper pipes are positioned in the cooling chamber, one ends of the heat dissipation copper pipes penetrate through the first partition plate and extend into the liquid inlet chamber, and the other ends of the heat dissipation copper pipes penetrate through the second partition plate and extend into the liquid outlet chamber; the semiconductor refrigerating sheet is fixedly connected to the side wall of the cooling liquid box at a position corresponding to the cooling chamber; this application has convenient to use, to the cooling of coolant liquid advantage such as effectual.

Description

Cooling liquid tank

Technical Field

The utility model relates to a technical field of coolant liquid case, in particular to coolant liquid case.

Background

The new energy battery generates heat greatly in the using process, and the temperature is increased under the condition of impact, so that the situation of spontaneous combustion is easily caused;

the existing new energy battery box has a heat dissipation function and mainly dissipates heat through heat dissipation fins, patent application No. CN202123203730.6 discloses a new energy lithium battery heat dissipation plate, an external circulating water pipeline is connected with a water inlet pipe 6 and a water outlet pipe 7, circulating water enters into a water storage cavity 5 and is provided with water through holes 12, the circulating water enters into a blind hole 11 and a cavity 10 through the water through holes 12, heat of a battery is conducted to the inside of a heat conduction plate 3 through heat conducting silica gel 2 and conducted to the outside of a mounting plate 1 through heat conducting fins 4, and air through holes 13 are formed in the heat conducting fins 4, so that external air can conveniently dissipate heat through the heat conducting fins 4 and the heat conducting fins 4 are convenient to dissipate heat;

however, the external circulating water pipeline utilized by the patent can receive the hot water flowing out of the water outlet pipe, and once the service life is prolonged, the overall temperature of the cooling water gradually rises, so that the heat dissipation effect is increasingly poor.

Therefore this application has set up a coolant liquid case, can cool down the coolant liquid after the heat absorption automatically to the circulation system among the new energy battery heat sink.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a coolant liquid case is provided to solve among the prior art of description in the background art the problem that the water circulating system of new energy battery heat dissipation usefulness lacks the function of cooling down to the coolant liquid.

In order to solve the above problems, the utility model provides a following technical scheme: a cooling liquid box comprises a first partition plate and a second partition plate, wherein the first partition plate and the second partition plate are fixedly connected in the cooling liquid box and divide the cooling liquid box into a liquid inlet chamber, a liquid outlet chamber and a cooling chamber; the liquid inlet pipe is arranged on the side wall of the liquid inlet chamber and is communicated with the liquid inlet chamber; the liquid outlet pipe is arranged on the side wall of the liquid outlet chamber and is communicated with the liquid outlet chamber; the heat dissipation copper pipes are positioned in the cooling chamber, one ends of the heat dissipation copper pipes penetrate through the first partition plate and extend into the liquid inlet chamber, and the other ends of the heat dissipation copper pipes penetrate through the second partition plate and extend into the liquid outlet chamber; and the semiconductor refrigerating sheet is fixedly connected to the side wall of the cooling liquid box at a position corresponding to the cooling chamber.

Preferably: the side wall of the cooling chamber is provided with an opening, the opening is opposite to the semiconductor refrigeration piece, and the semiconductor refrigeration piece is in contact with the heat dissipation copper pipe.

Preferably: the heat dissipation copper pipe is S-shaped.

Preferably: the front side wall and the rear side wall of the cooling chamber are respectively provided with a first ventilation hole and a second ventilation hole, and the inner walls of the first ventilation hole and the second ventilation hole are fixedly connected with a filter screen.

Preferably, the following components: a heat-conducting plate is fixedly connected to one surface of the semiconductor refrigerating plate, which is back to the cooling liquid box, and a plurality of radiating fins are arranged on the heat-conducting plate.

The technical scheme has the advantages that:

this application can connect the outlet pipe through the feed liquor pipe, and the outlet pipe is connected to the feed liquor union coupling, and the coolant liquid after the heat absorption is delivered to the feed liquor room, then deliver to the liquid outlet room through the heat dissipation copper pipe in, the coolant liquid is when heat dissipation copper pipe, and the refrigerating face of semiconductor refrigeration piece can absorb the heat energy of coolant liquid in the heat dissipation copper pipe, realizes the cooling to the coolant liquid, and this just can make keeping low temperature state that the coolant liquid can last, can be long-time be used for the heat absorption cooling.

Drawings

Fig. 1 is a schematic view of a coolant tank of the present invention.

Fig. 2 is a sectional view of the coolant tank of the present invention.

Wherein: the cooling liquid box 10, the first partition plate 11, the second partition plate 12, the liquid inlet chamber 20, the liquid inlet pipe 21, the liquid outlet chamber 30, the liquid outlet pipe 31, the cooling chamber 40, the heat dissipation port 41, the first ventilation hole 42, the second ventilation hole 43, the filter screen 44, the heat dissipation copper pipe 50, the semiconductor refrigeration piece 60, the heat conduction plate 61, the heat dissipation fins 62 and the mounting plate 70.

Detailed Description

The following describes embodiments of the present invention in detail with reference to the drawings.

Referring to fig. 1-2, in the first embodiment, a coolant tank includes a first partition 11, a second partition 12 fixedly connected to the inside of the coolant tank 10, and dividing the coolant tank 10 into an inlet chamber 20, an outlet chamber 30 and a temperature reduction chamber 40; a liquid inlet pipe 21 disposed on the sidewall of the liquid inlet chamber 20 and communicated with the liquid inlet chamber 20; a liquid outlet pipe 31 arranged on the side wall of the liquid outlet chamber 30 and communicated with the liquid outlet chamber 30; the heat dissipation copper pipes 50 are positioned in the cooling chamber 40, one end of each heat dissipation copper pipe penetrates through the first partition plate 11 and extends into the liquid inlet chamber 20, and the other end of each heat dissipation copper pipe penetrates through the second partition plate 12 and extends into the liquid outlet chamber 30; and a semiconductor refrigerating sheet 60 fixedly connected to the side wall of the cooling liquid tank 10 at a position corresponding to the cooling chamber 40.

The present embodiment is implemented as follows:

this application is when using, with the external outlet pipe of feed liquor pipe 21, the external inlet tube of drain pipe 31, the coolant liquid after the heat absorption passes through feed liquor pipe 21 and gets into feed liquor room 20, then flow into in the drain room 30 through heat dissipation copper pipe 50, flow out by drain pipe 31 again, wherein, the refrigeration face of semiconductor refrigeration piece 60 can absorb the heat to coolant liquid case 10, make cooling chamber 40 temperature reduce, thereby the heat energy of the coolant liquid in the copper pipe 50 that will dispel the heat is siphoned away, thereby realize the cooling to the coolant liquid.

As an optimized scheme of the embodiment, in order to improve the cooling effect, the side wall of the cooling chamber 40 is provided with an opening 41, the opening 41 is over against the semiconductor chilling plate 60, the semiconductor chilling plate 60 is in contact with the heat dissipation copper pipe 50, and the chilling surface of the semiconductor chilling plate 60 is directly in contact with the heat dissipation copper pipe 50, so that the cooling effect on the cooling liquid can be improved.

In order to further improve the heat dissipation effect, the heat dissipation copper tube 50 is S-shaped, so as to increase the contact area between the heat dissipation copper tube 50 and the semiconductor cooling plate 60.

As the optimization scheme of this implementation, the front and rear side walls of this temperature-reducing chamber 40 have first ventilation hole 42, second ventilation hole 43 respectively, and the inner wall fixedly connected with filter screen 44 of this first ventilation hole 42, second ventilation hole 43, first ventilation hole 42, second ventilation hole 43 can increase the radiating effect of temperature-reducing chamber 40, and filter screen 44 can avoid impurity to get into temperature-reducing chamber 40 simultaneously.

As an optimized scheme of this implementation, a heat conducting plate 61 is fixedly connected to a surface of the semiconductor chilling plate 60 opposite to the coolant tank 10, the heat conducting plate 61 is provided with a plurality of heat dissipation fins 62, and the heat conducting plate 61 and the heat dissipation fins 62 can dissipate heat of the heating surface of the semiconductor chilling plate 60.

The above is only the preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and improvements can be made without departing from the inventive concept, and all of them belong to the protection scope of the present invention.

Claims

1. A coolant tank, characterized by comprising

The first partition plate and the second partition plate are fixedly connected in the cooling liquid box, and the cooling liquid box is divided into a liquid inlet chamber, a liquid outlet chamber and a cooling chamber;

the liquid inlet pipe is arranged on the side wall of the liquid inlet chamber and is communicated with the liquid inlet chamber;

the liquid outlet pipe is arranged on the side wall of the liquid outlet chamber and is communicated with the liquid outlet chamber;

the heat dissipation copper pipes are positioned in the cooling chamber, one ends of the heat dissipation copper pipes penetrate through the first partition plate and extend into the liquid inlet chamber, and the other ends of the heat dissipation copper pipes penetrate through the second partition plate and extend into the liquid outlet chamber;

and the semiconductor refrigerating sheet is fixedly connected to the side wall of the cooling liquid box at a position corresponding to the cooling chamber.

2. The coolant tank as claimed in claim 1, wherein the side wall of the temperature reducing chamber has an opening facing the semiconductor chilling plate, and the semiconductor chilling plate is in contact with the heat dissipating copper pipe.

3. A coolant tank according to claim 2 wherein the heat sink copper tube is S-shaped.

4. The coolant tank as claimed in claim 1, wherein the front and rear side walls of the temperature reduction chamber have a first vent hole and a second vent hole, respectively, and a strainer is fixedly attached to the inner walls of the first and second vent holes.

5. The coolant tank of claim 1 wherein a thermally conductive plate is fixedly attached to the semiconductor cooling plate opposite the coolant tank, the thermally conductive plate having a plurality of fins.