CN218764060U - Semiconductor refrigerating device and refrigerated wine cabinet with same - Google Patents
Semiconductor refrigerating device and refrigerated wine cabinet with same Download PDFInfo
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- CN218764060U CN218764060U CN202222869471.9U CN202222869471U CN218764060U CN 218764060 U CN218764060 U CN 218764060U CN 202222869471 U CN202222869471 U CN 202222869471U CN 218764060 U CN218764060 U CN 218764060U
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Abstract
The utility model discloses a semiconductor refrigerating device, which comprises a semiconductor refrigerating module and a shell, wherein the semiconductor refrigerating module at least comprises a semiconductor refrigerating sheet, a heat dissipation assembly and a cooling dispersion assembly, the shell is enclosed to form a first cavity, a partition plate is arranged in the first cavity and divides the first cavity into a first cavity and a second cavity, the semiconductor refrigerating module is arranged on the partition plate in a penetrating way, the cooling dispersion assembly is positioned in the first cavity, and the heat dissipation assembly is positioned in the second cavity; the heat dissipation assembly comprises a heat dissipation base and a heat dissipation fan, wherein a first fan cover located behind the heat dissipation fan is arranged on the rear side of the shell, a plurality of first air inlets are formed in the first fan cover, and a plurality of first air outlets communicated with the second cavity are correspondingly formed in the left side and the right side of the shell. From this, through keeping apart first air intake and first air outlet completely to phenomenon such as the air leakage that thoughtlessly appears has improved the radiating effect of module. In addition, the utility model discloses still provide the cold-stored gradevin that has it.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field, concretely relates to semiconductor refrigerating plant and have its cold-stored gradevin.
Background
The semiconductor refrigeration wine cabinet comprises a cabinet body and a semiconductor refrigeration module arranged in the cabinet body, wherein the semiconductor refrigeration module comprises a semiconductor chip, heat dissipation aluminum arranged at one end of the semiconductor chip, a heat dissipation fan arranged on the heat dissipation aluminum, cooling dissipation aluminum arranged at the other end of the semiconductor chip and a cooling dissipation fan arranged on the cooling dissipation aluminum, a first fan cover is arranged at a position, close to the heat dissipation fan, on the cabinet body, and a second fan cover is arranged at a position, close to the cooling dissipation fan, in the cabinet body. Wherein, a plurality of air inlets and a plurality of air outlets are arranged on the first fan cover and the second fan cover, and the air inlets and the air outlets are communicated with each other and have no structural separation. By the design, after the heat dissipation fan or the cooling fan is started, external air can enter the heat dissipation aluminum or the cooling aluminum through the air inlet, and meanwhile, partial air also enters the heat dissipation aluminum or the cooling aluminum through the air outlet; similarly, air after heat exchange by the heat dissipation aluminum or refrigeration by the cold dissipation aluminum can be discharged through the air outlet or the air inlet, so that the phenomenon of air mixing and air leakage is caused, the heat dissipation effect and the refrigeration effect are greatly reduced, and the working performance of the semiconductor refrigeration module is greatly reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the prior art defect, the utility model provides a semiconductor refrigerating plant and have its cold-stored gradevin through keeping apart first air intake and first air outlet completely to phenomenon such as mixed wind hourglass can not appear, and then has improved semiconductor refrigeration module's radiating effect.
The utility model discloses a solve the technical scheme that its problem adopted and be:
the utility model provides a semiconductor refrigerating plant, includes the semiconductor refrigeration module, the semiconductor refrigeration module includes the semiconductor refrigeration piece at least, sets up the radiator unit of semiconductor refrigeration piece one end and setting are in the radiator unit of semiconductor refrigeration piece other end, wherein:
the semiconductor refrigeration device is characterized by further comprising a shell, the shell is enclosed into a first cavity at least provided with a rear side opening, a partition plate which is longitudinally arranged is arranged in the first cavity, the partition plate divides the first cavity into a first cavity and a second cavity in sequence along the front-rear direction, the semiconductor refrigeration module is arranged on the partition plate in a penetrating mode, the cold dissipation assembly is located in the first cavity, and the heat dissipation assembly is located in the second cavity;
the heat dissipation assembly comprises a heat dissipation base and a heat dissipation fan arranged on the heat dissipation base, a rear plate is arranged on the rear side of the shell, a first fan cover which is communicated with the second cavity and is located behind the heat dissipation fan is arranged on the rear plate, the first fan cover is opposite to the rear plate, protruding and provided with a plurality of first air inlets, and a plurality of first air outlets which are communicated with the second cavity are correspondingly arranged on the left side and the right side of the shell.
Therefore, the semiconductor refrigeration module is arranged on the partition plate in a penetrating mode, and the first cavity and the second cavity form an independent cold dissipation space and a heat dissipation space under the partition effect of the partition plate, so that cold and hot air separation of the semiconductor refrigeration module is realized; in addition, through setting up first fan casing on the backplate of shell rear side, in the operation process of semiconductor refrigeration module, this radiator fan accessible first fan casing on a plurality of air intakes with outside air suction to the second cavity in to discharge through a plurality of first air outlets of shell left and right sides after carrying out the heat transfer with the heat dissipation base, because first air intake is kept apart completely with first air outlet, thereby phenomenons such as the air leakage that can not appear mixing, and then improved semiconductor refrigeration module's radiating effect.
Further, the cold dissipation device also comprises an inner shell arranged in the first cavity, the inner shell is enclosed into a second cavity, and the cold dissipation assembly is positioned in the second cavity; and a heat insulation material is filled between the inner shell and the first cavity.
Furthermore, the cooling dissipation assembly comprises a cooling dissipation base and a cooling dissipation fan arranged on the cooling dissipation base, a second fan cover located in front of the cooling dissipation fan is arranged in the second cavity, and a plurality of second air inlets and a plurality of second air outlets arranged on two sides of the second air inlets are formed in the second fan cover;
the end face, facing the cold dissipation assembly, of the second fan cover is further provided with an annular convex edge arranged around the periphery of the cold dissipation fan, and the annular convex edge separates the second air inlets from the second air outlets.
From this, through set up on the second fan casing around establishing the annular protruding edge in cooling fan periphery, can separate second air intake and second air outlet and come to form the wind pressure effect and make a plurality of second air intakes of intracavity air accessible and discharge from a plurality of second air outlets after cooling through the cooling base that looses, reduced the phenomenon of mixing wind, improved semiconductor refrigeration module's refrigeration effect greatly.
Further, a protrusion is formed on the rear side of the inner shell, a third cavity communicated with the second cavity is formed in the protrusion, and the second fan cover is arranged between the second cavity and the third cavity;
the cold dissipation assembly is located within the third chamber.
Furthermore, a bayonet communicated with the third chamber and allowing the semiconductor refrigeration module to pass through is formed in the protrusion, a fixing sleeve is sleeved on the bayonet, and the fixing sleeve is detachably connected with the heat dissipation base.
Furthermore, the semiconductor refrigeration module also comprises a heat insulation layer arranged between the heat dissipation base and the cold dissipation base, wherein the heat insulation layer comprises a cotton pad and a foam board which are mutually abutted, the cotton pad is abutted with the heat dissipation base, and the foam board is abutted with the cold dissipation base;
the foam board is clamped on the fixing sleeve.
Furthermore, the cotton pad is an EVA foam cotton pad, and the foam board is an EPS foam board.
Furthermore, a plurality of radiating fins arranged at intervals are arranged on the radiating base, and each radiating fin comprises a first radiating fin with a higher height and a second radiating fin with a lower height.
Further, the semiconductor refrigeration pieces are provided with two semiconductor refrigeration pieces which are arranged at intervals.
Additionally, the utility model provides a cold-stored gradevin, including above-mentioned semiconductor refrigerating plant and the door body, first cavity still has the front side opening, the door body rotates and sets up the shell front side just can open or close first cavity.
To sum up, the utility model provides a pair of semiconductor refrigerating plant and have its cold-stored gradevin has following beneficial effect:
(1) The semiconductor refrigeration device of the utility model, through the semiconductor refrigeration module being arranged on the baffle plate in a penetrating way, under the separation effect of the baffle plate, the first cavity and the second cavity are respectively formed into an independent cold dissipation space and a heat dissipation space, thus realizing the cold and hot wind isolation of the semiconductor refrigeration module; in addition, through setting up first fan casing on the backplate of shell rear side, in the operation process of semiconductor refrigeration module, this radiator fan accessible first fan casing on a plurality of air intakes with outside air suction to the second cavity in to discharge through a plurality of first air outlets of shell left and right sides after carrying out the heat transfer with the heat dissipation base, because first air intake is kept apart completely with first air outlet, thereby phenomenons such as the air leakage that can not appear mixing, and then improved semiconductor refrigeration module's radiating effect.
(2) The utility model discloses a semiconductor refrigerating plant, through set up on the second fan housing around establishing the annular protruding edge in cooling fan periphery, can separate second air intake and second air outlet and come to form the wind pressure effect and make a plurality of second air intakes of intracavity air accessible get into and discharge from a plurality of second air outlets after cooling base cooling, reduced the phenomenon of mixing wind, improved semiconductor refrigeration module's refrigeration effect greatly.
Drawings
FIG. 1 is an exploded view of the wine cabinet of the present invention;
FIG. 2 is a schematic view of the refrigerated wine cabinet of the present invention;
FIG. 3 is a schematic sectional view of the refrigerated wine cabinet of the present invention;
FIG. 4 is an enlarged view of a portion A of FIG. 3;
FIG. 5 is an exploded view of the semiconductor refrigeration module in the wine cooler of the present invention;
fig. 6 is a schematic structural view of a heat dissipation base in the semiconductor refrigeration module of the present invention;
fig. 7 is a schematic structural view of a second fan cover in the refrigerated wine cabinet of the present invention.
Wherein the reference numerals have the following meanings:
1. a semiconductor refrigeration module; 11. a semiconductor refrigeration sheet; 12. a heat dissipation base; 121. a heat dissipating fin; 1211. a first heat radiation fin; 1212. a second heat radiation fin; 122. a first mounting hole; 123. a second mounting hole; 13. a cold dissipating base; 131. cooling fins; 132. a boss; 133. a third mounting hole; 14. a heat insulating sleeve; 15. a screw; 161. a cotton pad; 162. a foam board; 17. mounting a bracket; 18. a heat radiation fan; 19. a cooling fan; 2. a housing; 21. a first air outlet; 22. a first chamber; 23. a second chamber; 3. an inner shell; 31. a protrusion; 32. a support; 33. a third chamber; 4. a partition plate; 41. a clamping hole; 5. a back plate; 51. a first fan cover; 511. a first air inlet; 6. fixing a sleeve; 61. mounting a column; 7. a door body; 8. a second fan housing; 81. a second air inlet; 82. a second air outlet; 83. the annular convex edge.
Detailed Description
For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the module or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example one
Referring to fig. 1-7, the utility model provides a semiconductor refrigerating device at first, including semiconductor refrigeration module 1 and shell 2, this semiconductor refrigeration module 1 includes semiconductor refrigeration piece 11 at least, sets up at the radiator unit of 11 one ends of semiconductor refrigeration piece and sets up the scattered cold subassembly at the 11 other ends of semiconductor refrigeration piece. The enclosure of the housing 2 is a first cavity with at least a rear opening, the inside of the first cavity is provided with a partition plate 4 which is longitudinally arranged, the partition plate 4 sequentially divides the first cavity into a first cavity 22 and a second cavity 23 along the front-rear direction, the semiconductor refrigeration module 1 is arranged on the partition plate 4 in a penetrating manner, a cold dissipation assembly of the semiconductor refrigeration module is located in the first cavity 22, and a heat dissipation assembly of the semiconductor refrigeration module is located in the second cavity 23. Specifically, the heat dissipation assembly comprises a heat dissipation base 12 and a heat dissipation fan 18 arranged on the heat dissipation base 12, the cooling dissipation assembly comprises a cooling dissipation base 13 and a cooling dissipation fan 19 arranged on the cooling dissipation base 13, the heat dissipation base 12 is attached to the heating end face of the semiconductor refrigeration sheet 11, and the cooling dissipation base 13 is attached to the refrigeration end face of the semiconductor refrigeration sheet 11. In addition, the rear side of the housing 2 is further provided with a rear plate 5, the rear plate 5 is provided with a first fan cover 51 which is communicated with the second chamber 23 and is located behind the heat dissipation fan 18, the first fan cover 51 is arranged in a protruding manner relative to the rear plate 5 and is provided with a plurality of first air inlets 511, and the left side and the right side of the housing 2 are correspondingly provided with a plurality of first air outlets 21 which are communicated with the second chamber 23.
Therefore, the semiconductor refrigeration module 1 is arranged on the partition plate 4 in a penetrating manner, and the first chamber 22 and the second chamber 23 form an independent cold dissipation space and a heat dissipation space respectively under the separation effect of the partition plate 4, so that cold and hot air separation of the semiconductor refrigeration module 1 is realized; through set up first fan casing 51 on the backplate 5 at shell 2, in the operation process of semiconductor refrigeration module 1, a plurality of first air intakes 511 on this radiator fan 18 accessible first fan casing 51 inhale the outside air to second cavity 23 in, and discharge through a plurality of first air outlets 21 of the shell 2 left and right sides after carrying out the heat transfer with heat dissipation base 12, because this first air intake 511 and first air outlet 21 mutually perpendicular just separate completely, thereby phenomenons such as the mixed wind leaks can not appear, and then semiconductor refrigeration module 1's radiating effect has been improved.
In this embodiment, the partition plate 4 is provided with a fastening hole 41 through which the semiconductor refrigeration module 1 can be inserted.
Further, the semiconductor refrigeration device also comprises an inner shell 3 arranged in the first cavity 22, the inner shell 3 encloses a second cavity, and the cold dissipation component in the semiconductor refrigeration module 1 is positioned in the second cavity; the space between the inner shell 3 and the first chamber 22 is filled with a thermal insulation material. Specifically, a protrusion 31 is formed on the rear side of the inner shell 3, a third cavity 33 communicated with the second cavity is formed inside the protrusion 31, a bayonet communicated with the third cavity 33 and allowing the semiconductor refrigeration module 1 to extend into is formed on the protrusion 31, and the cooling dissipation assembly is located in the third cavity 33. In addition, the second fan cover 8 is arranged between the second cavity and the third cavity 33 and positioned in front of the cooling fan 19, the second fan cover 8 is in a flat plate shape, the middle part of the second fan cover is provided with a plurality of second air inlets 81, and the upper side and the lower side of the second fan cover are provided with a plurality of second air outlets 82; the end surface of the second fan housing 8 facing the cold dissipation assembly is further provided with an annular convex edge 83 surrounding the periphery of the cold dissipation fan 19, and the annular convex edge 83 separates the second air inlets 81 from the second air outlets 82.
Therefore, by arranging the annular convex edge 83 around the periphery of the cooling fan 19 on the second fan cover 8, in the operation process of the semiconductor refrigeration module 1, the cooling fan 19 can suck the air in the cavity into the third cavity 33 through the plurality of second air inlets 81 on the second fan cover 8, and blow out through the plurality of second air outlets 82 on the second fan cover 8 after being refrigerated by the cooling base 13; because the second air inlet 81 and the second air outlet 82 are separated by the annular convex edge 83, air can circularly flow under the action of air pressure, so that the air mixing phenomenon is reduced, and the refrigerating effect of the semiconductor refrigerating module 1 is greatly improved.
Referring to fig. 5-6, the heat dissipation base 12 is made of heat dissipation aluminum, and a plurality of heat dissipation fins 121 are disposed on the heat dissipation aluminum at intervals, where the heat dissipation fins 121 include a first heat dissipation fin 1211 with a higher height and a second heat dissipation fin 1212 with a lower height. Thus, the heat radiation area can be increased by providing the first heat radiation fins 1211 having a high height; by providing the second heat dissipating fins 1212 having a lower height, gaps may be formed between the first heat dissipating fins 1211 and the second heat dissipating fins 1212, and the gaps may form an air passage to accelerate the flow of air, thereby further improving heat dissipating efficiency. The top of the heat dissipation base 12 is connected with a mounting bracket 17, a fan mounting position is arranged on the mounting bracket 17, and the heat dissipation fan 18 is mounted on the mounting bracket 17 through the fan mounting position; the cooling base 13 is made of cooling aluminum, and the cooling fan 19 is directly installed at the bottom of the cooling base 13; the cooling aluminum is provided with a plurality of cooling fins 131 which are arranged at intervals. In addition, a plurality of first mounting holes 122 are further formed in the cooling aluminum, and a plurality of third mounting holes 133 are correspondingly formed in the cooling aluminum. Thus, the heat sink base 12 and the cold sink base 13 can be connected by using the screws 15 to pass through the first mounting holes 122 and fix the screws to the third mounting holes 133. In addition, in order to avoid the influence of the heat generated by the heat dissipation base 12 or the cold air generated by the cold dissipation base 13 being transmitted by screws, the heat insulating sleeve 14 is further inserted into the first mounting hole 122, and a fourth mounting hole through which a screw can pass is formed in the heat insulating sleeve 14.
In the present embodiment, the first mounting hole 122 is a through hole; the third mounting hole 133 is a threaded hole; the fourth mounting hole is a counter bore. The heat dissipation fan 18 and the mounting bracket 17, the mounting bracket 17 and the heat dissipation aluminum, and the cooling fan 19 and the cooling aluminum are all fixed by screws.
Further, in the semiconductor refrigeration module 1 of this application, its semiconductor refrigeration piece 11 is provided with two, and two semiconductor refrigeration pieces 11 are horizontal interval arrangement and all are located between heat dissipation base 12 and the cold base 13 that looses. Similarly, the two heat dissipation bases 12 and the two heat dissipation fans 18 are respectively disposed corresponding to the two semiconductor cooling fins 11, and the two heat dissipation bases 12 are integrally formed. Specifically, two bosses 132 arranged at intervals are integrally formed at the top of the cooling base 13, the two semiconductor cooling fins 11 are respectively placed on the two bosses 132, the cooling end surfaces of the two semiconductor cooling fins 11 are respectively attached to the top surfaces of the two bosses 132, and the heating end surfaces of the two semiconductor cooling fins 11 are respectively attached to the bottom surfaces of the two cooling bases 12.
Therefore, by adopting the two semiconductor refrigerating pieces 11, the refrigerating capacity is greatly increased, and the requirement of lower temperature is met; by integrally forming the two heat dissipation bases 12, the assembly is simpler and more convenient.
Further, the semiconductor refrigeration module 1 further comprises a heat insulation layer arranged between the heat dissipation base 12 and the cold dissipation base 13; specifically, the heat insulation layer includes a cotton pad 161 and a foam board 162, which are abutted against each other, the cotton pad 161 is abutted against the heat dissipation base 12, and the foam board 162 is abutted against the cold dissipation base 13. The first avoidance hole and the second avoidance hole for the screw 15 to pass through are respectively formed in the cotton pad 161 and the foam board 162, the second avoidance groove for the boss 132 to pass through is formed in the foam board 162, and the first avoidance groove for the semiconductor refrigeration sheet 11 to pass through is formed in the cotton pad 161.
From this, through setting up cotton pad 161 and cystosepiment 162, not only play thermal-insulated heat retaining function, and when cotton pad 161 received the extrusion, thereby it has the buffering rebound effect and can avoid heat dissipation base 12 directly to crush semiconductor refrigeration piece 11.
In this embodiment, the cotton pad 161 is an EVA foam cotton pad, and the foam board 162 is an EPS foam board.
Referring to fig. 1 and 3 again, the bayonet on the protrusion 31 of the inner shell 3 is further sleeved with a fixing sleeve 6, a through groove is formed inside the fixing sleeve 6, and the foam board 162 on the semiconductor refrigeration module 1 is clamped on the through groove of the fixing sleeve 6; the periphery of the fixed sleeve 6 is clamped on the clamping hole 41 of the clapboard 4; in addition, the fixing sleeve 6 is further provided with a plurality of mounting posts 61, the mounting posts 61 are provided with fifth mounting holes, and the heat dissipation base 12 is provided with a plurality of corresponding second mounting holes 123. Therefore, the heat dissipation base 12 can be fixedly connected to the fixing sleeve 6 by passing a bolt through the second mounting hole 123 and fixing the bolt in the fifth mounting hole, so as to fixedly mount the semiconductor refrigeration module 1.
Example two
Referring to fig. 1-7 again, the present invention further provides a refrigerated wine cabinet, which includes the semiconductor refrigeration device and the door body 7 provided in the first embodiment, the first cavity further has a front side opening, and the door body 7 is rotatably disposed at the front side of the housing 2 and can open or close the first chamber 22. In addition, the second cavity also has a front side opening, and a plurality of brackets 32 for placing wine bottles are arranged at intervals along the height direction in the second cavity.
To sum up, the utility model provides a pair of semiconductor refrigerating plant and have its cold-stored gradevin has following beneficial effect:
the semiconductor refrigeration device of the utility model has the advantages that the semiconductor refrigeration module 1 is arranged on the partition plate 4 in a penetrating way, and the first cavity 22 and the second cavity 23 form an independent cold dissipation space and a heat dissipation space respectively under the separation effect of the partition plate 4, so that the cold and hot air separation of the semiconductor refrigeration module 1 is realized; through set up first fan casing 51 on the backplate 5 at shell 2, in the operation process of semiconductor refrigeration module 1, a plurality of first air intakes 511 on this radiator fan 18 accessible first fan casing 51 inhale the outside air to second cavity 23 in, and discharge through a plurality of first air outlets 21 of the shell 2 left and right sides after carrying out the heat transfer with heat dissipation base 12, because this first air intake 511 and first air outlet 21 mutually perpendicular just separate completely, thereby phenomenons such as the mixed wind leaks can not appear, and then semiconductor refrigeration module 1's radiating effect has been improved.
In the semiconductor refrigeration device of the present invention, by disposing the annular convex edge 83 on the second fan housing 8, during the operation of the semiconductor refrigeration module 1, the cooling fan 19 can suck the air in the cavity into the third chamber 33 through the second air inlets 81 on the second fan housing 8, and blow out through the second air outlets 82 on the second fan housing 8 after being cooled by the cooling base 13; because the second air inlet 81 and the second air outlet 82 are separated by the annular convex edge 83, air can circularly flow under the action of air pressure, so that the air mixing phenomenon is reduced, and the refrigerating effect of the semiconductor refrigerating module 1 is greatly improved.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and for simplicity in description, and are not intended to indicate or imply that the referenced modules or components must be in a particular orientation, constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
In addition, in the description of the present invention, "a plurality" or "a plurality" means two or more unless specifically limited otherwise.
The technical means disclosed by the scheme of the present invention is not limited to the technical means disclosed by the above embodiments, but also includes the technical scheme formed by the arbitrary combination of the above technical features. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also considered as the protection scope of the present invention.
Claims (10)
1. The utility model provides a semiconductor refrigerating plant, includes the semiconductor refrigeration module, the semiconductor refrigeration module includes the semiconductor refrigeration piece at least, sets up the radiator unit and the setting of semiconductor refrigeration piece one end are in the cold subassembly that looses of the semiconductor refrigeration piece other end, its characterized in that:
the semiconductor refrigeration device is characterized by further comprising a shell, the shell is enclosed to form a first cavity at least provided with a rear side opening, a partition plate is longitudinally arranged in the first cavity, the partition plate divides the first cavity into a first cavity and a second cavity in sequence along the front-rear direction, the semiconductor refrigeration module penetrates through the partition plate, the cold dissipation assembly is located in the first cavity, and the heat dissipation assembly is located in the second cavity;
the heat dissipation assembly comprises a heat dissipation base and a heat dissipation fan arranged on the heat dissipation base, a rear plate is arranged on the rear side of the shell, a first fan cover is arranged on the rear plate and communicated with the second cavity and located behind the heat dissipation fan, the first fan cover is opposite to the rear plate, the rear plate is protruding and provided with a plurality of first air inlets, and a plurality of first air outlets communicated with the second cavity are correspondingly arranged on the left side and the right side of the shell.
2. The semiconductor cooling device according to claim 1, further comprising an inner shell disposed within the first cavity, the inner shell enclosing a second cavity and the cold dissipation assembly being located within the second cavity; and a heat insulation material is filled between the inner shell and the first cavity.
3. The semiconductor refrigerating device according to claim 2, wherein the cooling dissipation assembly comprises a cooling dissipation base and a cooling dissipation fan arranged on the cooling dissipation base, a second fan cover is arranged in the second cavity and located in front of the cooling dissipation fan, and a plurality of second air inlets and a plurality of second air outlets are formed in the second fan cover and located on two sides of the plurality of second air inlets;
the end face, facing the cold dissipation assembly, of the second fan cover is further provided with an annular convex edge arranged around the periphery of the cold dissipation fan, and the annular convex edge separates the second air inlets from the second air outlets.
4. The semiconductor refrigerating device according to claim 3, wherein a protrusion is formed on a rear side of the inner case, a third chamber communicating with the second chamber is formed inside the protrusion, and the second fan cover is disposed between the second chamber and the third chamber;
the cold dissipation assembly is located within the third chamber.
5. The semiconductor refrigeration device according to claim 4, wherein the protrusion has a bayonet for the semiconductor refrigeration module to pass through, the bayonet is sleeved with a fixing sleeve, and the fixing sleeve is detachably connected to the heat dissipation base.
6. The semiconductor refrigeration device according to claim 5, wherein the semiconductor refrigeration module further comprises a thermal insulation layer arranged between the heat dissipation base and the cold dissipation base, the thermal insulation layer comprises a cotton pad and a foam board which are abutted against each other, the cotton pad is abutted against the heat dissipation base, and the foam board is abutted against the cold dissipation base;
the foam board is clamped on the fixing sleeve.
7. The semiconductor cooling device according to claim 6, wherein the cotton pad is an EVA foam cotton pad, and the foam board is an EPS foam board.
8. The semiconductor cooling device according to claim 1, wherein the heat dissipation base is provided with a plurality of heat dissipation fins arranged at intervals, and the heat dissipation fins comprise a first heat dissipation fin with a higher height and a second heat dissipation fin with a lower height.
9. The semiconductor refrigeration device according to claim 1, wherein the semiconductor refrigeration pieces are provided in two and arranged at a distance from each other.
10. A refrigerated wine cabinet comprising a semiconductor refrigeration device according to any one of claims 1 to 9 and a door, wherein the first chamber further has a front opening, and the door is rotatably disposed on the front side of the housing and can open or close the first chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222869471.9U CN218764060U (en) | 2022-10-28 | 2022-10-28 | Semiconductor refrigerating device and refrigerated wine cabinet with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222869471.9U CN218764060U (en) | 2022-10-28 | 2022-10-28 | Semiconductor refrigerating device and refrigerated wine cabinet with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218764060U true CN218764060U (en) | 2023-03-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222869471.9U Active CN218764060U (en) | 2022-10-28 | 2022-10-28 | Semiconductor refrigerating device and refrigerated wine cabinet with same |
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| Country | Link |
|---|---|
| CN (1) | CN218764060U (en) |
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2022
- 2022-10-28 CN CN202222869471.9U patent/CN218764060U/en active Active
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