CN218735728U - IGBT module heat radiation structure - Google Patents
IGBT module heat radiation structure Download PDFInfo
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- CN218735728U CN218735728U CN202222654496.7U CN202222654496U CN218735728U CN 218735728 U CN218735728 U CN 218735728U CN 202222654496 U CN202222654496 U CN 202222654496U CN 218735728 U CN218735728 U CN 218735728U
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Abstract
The utility model discloses a IGBT module heat radiation structure, including setting up in the heating panel of IGBT module bottom, the connection of heating panel bottom is provided with the casing, be provided with the water course cavity in the casing, be provided with the water route system who communicates in the water course cavity on the heating panel, be provided with combined type seal structure between heating panel and the casing. The radiating plate arranged at the bottom is used as a connecting piece of the IGBT module and the shell, the structure is simple, the fastening assembly with good sealing effect is achieved through the combined type sealing structure of the radiating plate, the water resistance of the water channel cavity in the shell is reduced, the processing is simple, and the assembly is easy. The combined type sealing structure can also realize the accurate positioning of the IGBT module and the casing, and the phenomenon that the sealing effect is reduced due to the positioning deviation among the IGBT module, the heat dissipation plate and the casing is avoided.
Description
Technical Field
The utility model belongs to the technical field of the radiator manufacturing technology and specifically relates to a IGBT module heat radiation structure is related to.
Background
At present, the new energy automobile industry develops rapidly, the structural requirements of main parts of the new energy automobile industry and a controller of the new energy automobile industry are more compact, the IGBT is a key part in the controller, the IGBT can generate heat during working and is very important for heat dissipation, and the performance of a product can be directly influenced by a heat dissipation structure. Therefore, the heat dissipation structure is also very critical, and whether the design of the structure is reasonable or not can directly influence the heat dissipation, the safety, the price, the assembly process and the like.
For example, application number CN201520977636.1 discloses IGBT heat dissipation module and has its IGBT module 11/2015 30, IGBT heat dissipation module includes: a heat sink base plate, the heat sink base plate comprising: the bottom plate body comprises a body part, a first surface layer and a second surface layer, the first surface layer and the second surface layer are respectively arranged on two opposite surfaces of the body part, the N heat dissipation columns are arranged on the first surface layer at intervals, one end of each heat dissipation column is fixed with the first surface layer, the other end of each heat dissipation column is a free end, the first surface layer and the heat dissipation columns are both suitable for being in contact with cooling liquid, and the bottom plate of the radiator is made of copper; the copper-clad plate comprises a substrate, a first copper layer and a second copper layer, wherein the first copper layer and the second copper layer are respectively arranged on two oppositely arranged surfaces of the substrate, the substrate is a silicon nitride substrate, and the first copper layer is arranged on a second surface layer. The copper radiator bottom plate has a good radiating effect, can improve the radiating capacity of the IGBT radiating module, and can meet the radiating requirement of the IGBT radiating module.
Although the above scheme can utilize the bottom plate and the upper surface layer thereof to dissipate heat, the contact area between the heat dissipation module and the cooling liquid is limited, and the connection structure is complex, so that the market demand can not be met.
Disclosure of Invention
The heat dissipation module connection structure to among the prior art that mentions among the background art is complicated, and sealing performance is unsatisfactory problem along with the live time lapse, the utility model provides a simple structure is accomplished through the combined type seal structure of heating panel to IGBT module heat radiation structure, utilizes to set up in the heating panel of bottom as IGBT module and casing connecting piece, and the fastening assembly that sealed effect is good reduces the water course cavity water resistance in the casing, and processing is simple, easily the equipment.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a IGBT module heat radiation structure, is including setting up in the heating panel of IGBT module bottom, the connection of heating panel bottom is provided with the casing, be provided with the water course cavity in the casing, be provided with the waterway system who communicates in the water course cavity on the heating panel, be provided with combined type seal structure between heating panel and the casing. The water course cavity is interior to be separated by the heating panel with the IGBT module, and waterway system in the heating panel can ensure that flowing water in the water course cavity fully dispels the heat to the IGBT module, and casing and heating panel fixed connection can be ensured to combined type seal structure between heating panel and the casing, sealing connection is also realized with the IGBT module to the heating panel simultaneously, and the accurate location of IGBT module and casing also can be realized to combined type seal structure, avoid the IGBT module, positioning deviation appears between heating panel and the casing and causes sealed effect to descend.
Furthermore, the combined type seal structure comprises a seal groove arranged on one side, close to the IGBT module, of the heat dissipation plate, and a main seal ring is arranged in the seal groove. The sealing groove is arranged around the IGBT module, and the IGBT module can be enclosed and sealed by the main sealing ring arranged in the sealing groove.
Preferably, the composite sealing structure comprises a connecting hole arranged along the periphery of the heat dissipation plate, and an anti-loosening piece connected to the machine shell is arranged in the connecting hole. The anti-loosening member can prevent the casing from loosening and increase the structural strength of the casing.
Preferably, the combined sealing structure comprises an assembly hole formed in the heat dissipation plate, and an assembly part connected to the IGBT module is arranged in the assembly hole. The assembly parts in the assembly holes are used for fixing the IGBT module and the heat dissipation plate, and the heat dissipation effect is prevented from being reduced due to dislocation of the IGBT module and the heat dissipation plate.
Furthermore, an assembly groove is formed in the bottom of the heat dissipation plate, a bottom plate is installed in the assembly groove, and a water passing groove is formed between the bottom plate and the heat dissipation plate. The water passing groove can ensure that the heat dissipation water in the water channel cavity fully contacts the assembly groove, so that the heat of the IGBT module is taken away by the heat dissipation water, the water passing groove in the assembly groove is smooth in structure, the flowing water resistance is effectively reduced, and the heat dissipation efficiency is improved.
Preferably, one surface of the bottom plate, which is close to the casing, is provided with a first sealing plate, the waterway system comprises water through holes correspondingly formed in the first sealing plate and the bottom plate, and the water through groove is communicated with the waterway cavity through the water through holes. The first sealing plate is used for sealing between the heat dissipation plate and the shell, water holes are formed in the first sealing plate and the bottom plate, the first sealing plate and the bottom plate are correspondingly arranged at two ends of the water passing groove, and heat dissipation water flows through the whole heat dissipation plate to complete heat removal.
Preferably, the combined sealing structure comprises a sub-sealing ring arranged at the bottom of the heat dissipation plate corresponding to the water passing hole, a limiting hole is formed in the heat dissipation plate corresponding to the sub-sealing ring, and a pressing piece is arranged in the limiting hole. The limiting hole is used for fixing the sub-sealing ring between the heat dissipation plate and the shell, and the locking points are arranged on two sides of the sub-sealing ring, so that the sub-sealing ring can be compressed conveniently, and the water leakage risk is reduced.
Preferably, the composite sealing structure comprises a first positioning hole penetrating through the IGBT module and the heat dissipation plate; the composite sealing structure comprises a second positioning hole penetrating through the heat dissipation plate and the shell. The first positioning hole is used for determining the relative position between the IGBT module and the heat dissipation plate, and the second positioning hole is used for determining the relative position between the heat dissipation plate and the machine shell; the first positioning hole and the second positioning hole are matched to complete the unified integration and positioning of the IGBT module, the heat dissipation plate and the machine shell, the composite sealing structure can be accurately installed, and the heat dissipation effect is not reduced due to deviation.
Therefore, the utility model discloses following beneficial effect has: (1) The heat dissipation plate arranged at the bottom is used as a connecting piece of the IGBT module and the shell, the fastening assembly with simple structure and excellent sealing effect is completed through the combined sealing structure of the heat dissipation plate, the water resistance of the water channel cavity in the shell is reduced, and the heat dissipation plate is simple to process and easy to assemble; (2) The anti-loosening piece can prevent the shell from loosening and increase the structural strength of the shell; (3) The water passing groove in the assembly groove has a smooth structure, so that the water flow resistance is effectively reduced, and the heat dissipation efficiency is improved; (4) The first positioning hole and the second positioning hole are matched to complete the unified integration and positioning of the IGBT module, the heat dissipation plate and the machine shell, and the composite sealing structure can be accurately installed.
Drawings
Fig. 1 is an exploded view of the present invention.
Fig. 2 is a schematic structural view of the heat sink in fig. 1.
Fig. 3 is an isometric view of the base plate of fig. 2.
Fig. 4 is an isometric view of the heat sink of fig. 2.
In the figure: 100IGBT modules, a machine shell 1, a water channel cavity 11, a heat dissipation plate 2, an assembly groove 21, a composite sealing structure 3, a sealing groove 31, a main sealing ring 32, a connecting hole 33, an assembly hole 34, a water passing groove 35, a bottom plate 4, a first sealing plate 5, a water passing hole 51, a sub sealing ring 6, a limiting hole 61, a first positioning hole 7, a second positioning hole 8 and a third positioning hole 9.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description. Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
Example 1
As shown in fig. 1 and 2, an IGBT module heat dissipation structure includes a heat dissipation plate disposed at the bottom of an IGBT module, a casing is connected to the bottom of the heat dissipation plate, a water channel cavity is disposed in the casing, a water channel system communicated with the water channel cavity is disposed on the heat dissipation plate, and a composite sealing structure is disposed between the heat dissipation plate and the casing. The water course cavity is interior to be separated by the heating panel with the IGBT module, and waterway system in the heating panel can ensure that flowing water in the water course cavity fully dispels the heat to the IGBT module, and casing and heating panel fixed connection can be ensured to combined type seal structure between heating panel and the casing, sealing connection is also realized with the IGBT module to the heating panel simultaneously, and the accurate location of IGBT module and casing also can be realized to combined type seal structure, avoid the IGBT module, positioning deviation appears between heating panel and the casing and causes sealed effect to descend.
As shown in fig. 3 and 4, the composite sealing structure includes a sealing groove disposed on one side of the heat dissipation plate close to the IGBT module, and a main sealing ring is disposed in the sealing groove. The combined type seal structure includes the connecting hole that sets up along the heating panel periphery, be provided with in the connecting hole and connect the anti-loosening piece in the casing. The combined type sealing structure comprises an assembly hole formed in the heat dissipation plate, and an assembly part connected to the IGBT module is arranged in the assembly hole.
The sealing groove is arranged around the IGBT module, and the IGBT module can be enclosed and sealed by the main sealing ring arranged in the sealing groove. The anti-loosening member can prevent the casing from loosening and increase the structural strength of the casing. The assembly parts in the assembly holes are used for fixing the IGBT module and the heat dissipation plate, and the heat dissipation effect is prevented from being reduced due to dislocation of the IGBT module and the heat dissipation plate.
It is worth noting that an assembly groove is formed in the bottom of the heat dissipation plate, a bottom plate is installed in the assembly groove, and a water passing groove is formed between the bottom plate and the heat dissipation plate. The water channel system comprises a water channel cavity, a water channel is arranged between the water channel cavity and the bottom plate, a first sealing plate is arranged on one side, close to the shell, of the bottom plate, a water passing hole is correspondingly formed in the first sealing plate and the bottom plate, and the water passing channel is communicated with the water channel cavity through the water passing hole. The combined type sealing structure comprises sub-sealing rings which are arranged at the bottom of the heat dissipation plate and correspond to the water passing holes, limiting holes are formed in the heat dissipation plate and correspond to the sub-sealing rings, and pressing pieces are arranged in the limiting holes. The composite sealing structure comprises a first positioning hole penetrating through the IGBT module and the heat dissipation plate; the composite sealing structure comprises a second positioning hole penetrating through the heat dissipation plate and the shell.
The water passing groove can ensure that the heat dissipation water in the water channel cavity fully contacts the assembly groove, so that the heat of the IGBT module is taken away by the heat dissipation water, the water passing groove in the assembly groove is smooth in structure, the flowing water resistance is effectively reduced, and the heat dissipation efficiency is improved. The first sealing plate is used for sealing between the heat dissipation plate and the shell, water holes are formed in the first sealing plate and the bottom plate, the first sealing plate and the bottom plate are correspondingly arranged at two ends of the water passing groove, and heat dissipation water flows through the whole heat dissipation plate to complete heat removal. The limiting hole is used for fixing the sub-sealing ring between the heat dissipation plate and the shell, and the locking points are arranged on two sides of the sub-sealing ring, so that the sub-sealing ring can be compressed conveniently, and the water leakage risk is reduced. The first positioning hole is used for determining the relative position between the IGBT module and the heat dissipation plate, and the second positioning hole is used for determining the relative position between the heat dissipation plate and the machine shell; the first positioning hole and the second positioning hole are matched to complete the unified integration and positioning of the IGBT module, the heat dissipation plate and the machine shell, the composite sealing structure can be accurately installed, and the heat dissipation effect is not reduced due to deviation. In this embodiment, still disclose the third locating hole that sets up on the heating panel, the third locating hole both is the locating hole between IGBT module and the heating panel, and is the locating hole between heating panel and the casing again, as public locating hole, can enough assist first locating hole location IGBT module and the relative position of heating panel, can assist the relative position of second locating hole location heating panel and casing again, fixes a position through the third locating hole is unified after two location are accomplished simultaneously, ensures layer upon layer location coordination, realizes effectively sealed.
In this embodiment, heating panel and bottom plate all adopt die casting aluminium technology mould casting, both form through friction stir welding, the water course cavity in the water channel intercommunication casing of heating panel inside is through crossing the water hole, when the assembly, at first through first locating hole and second locating hole to IGBT module, heating panel and casing are fixed a position, ensure that the three position corresponds, first closing plate cooperates the sealing of accomplishing the upper and lower both sides of heating panel with the second closing plate jointly after that, it is inseparable to ensure the sealed face joint of heating panel both sides, effectively reduce the possibility that the cooling water leaked, and simultaneously, main sealing washer cooperates the completion secondary seal with the sub-seal circle, utilize assembly part and locking piece to accomplish the fastening at last, realize rapid Assembly.
In addition to the above embodiments, the technical features of the present invention can be re-selected and combined within the scope of the present invention as disclosed in the claims and the specification to constitute new embodiments, which can be realized by those skilled in the art without any creative work, therefore, the embodiments of the present invention not described in detail should be regarded as specific embodiments of the present invention and within the protection scope of the present invention.
Claims (8)
1. The utility model provides a IGBT module heat radiation structure, its characterized in that, is including setting up the heating panel in IGBT module bottom, the connection of heating panel bottom is provided with the casing, be provided with the water course cavity in the casing, be provided with the waterway system who communicates in the water course cavity on the heating panel, be provided with combined type seal structure between heating panel and the casing.
2. The IGBT module heat dissipation structure of claim 1, wherein the composite sealing structure comprises a sealing groove disposed on a side of the heat dissipation plate close to the IGBT module, and a main sealing ring is disposed in the sealing groove.
3. The IGBT module heat dissipation structure of claim 1, wherein the composite sealing structure comprises a connection hole disposed along a periphery of the heat dissipation plate, and an anti-loose member connected to the case is disposed in the connection hole.
4. The IGBT module heat dissipation structure of claim 1, wherein the composite sealing structure comprises a mounting hole disposed on the heat dissipation plate, and a mounting member connected to the IGBT module is disposed in the mounting hole.
5. The IGBT module heat dissipation structure of claim 1, wherein the bottom of the heat dissipation plate is provided with an assembly groove, a bottom plate is installed in the assembly groove, and a water passing groove is arranged between the bottom plate and the heat dissipation plate.
6. The IGBT module heat dissipation structure of claim 5, wherein the bottom plate is provided with a first sealing plate on a side thereof adjacent to the casing, the waterway system comprises water through holes correspondingly formed in the first sealing plate and the bottom plate, and the water through groove is communicated with the waterway cavity through the water through holes.
7. The IGBT module heat dissipation structure according to any one of claims 1 to 6, wherein the composite sealing structure includes a sub-sealing ring disposed at a bottom of the heat dissipation plate corresponding to the water through hole, the heat dissipation plate is provided with a limiting hole corresponding to the sub-sealing ring, and a pressing member is disposed in the limiting hole.
8. The IGBT module heat dissipation structure according to claim 7, wherein the composite sealing structure includes a first positioning hole penetrating the IGBT module and the heat dissipation plate; the composite sealing structure comprises a second positioning hole penetrating through the heat dissipation plate and the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222654496.7U CN218735728U (en) | 2022-09-30 | 2022-09-30 | IGBT module heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222654496.7U CN218735728U (en) | 2022-09-30 | 2022-09-30 | IGBT module heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218735728U true CN218735728U (en) | 2023-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222654496.7U Active CN218735728U (en) | 2022-09-30 | 2022-09-30 | IGBT module heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218735728U (en) |
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2022
- 2022-09-30 CN CN202222654496.7U patent/CN218735728U/en active Active
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