CN109640596B - High-efficient little heat dissipation module that leads - Google Patents
High-efficient little heat dissipation module that leads Download PDFInfo
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- CN109640596B CN109640596B CN201910025531.9A CN201910025531A CN109640596B CN 109640596 B CN109640596 B CN 109640596B CN 201910025531 A CN201910025531 A CN 201910025531A CN 109640596 B CN109640596 B CN 109640596B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 50
- 238000010521 absorption reaction Methods 0.000 claims abstract description 22
- 230000005855 radiation Effects 0.000 claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 15
- 238000009423 ventilation Methods 0.000 claims description 12
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
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- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005536 corrosion prevention Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000009434 installation Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000013585 weight reducing agent Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000005495 investment casting Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
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- 239000000498 cooling water Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
The invention relates to a high-efficiency micro-conduction heat radiation module, which comprises an upper module cabinet body, a lower module cabinet body and high-efficiency micro-conduction heat radiation bodies, wherein the high-efficiency micro-conduction heat radiation bodies are fixed in the upper module cabinet body and the lower module cabinet body; the high-efficiency micro-conduction radiator comprises a substrate, a micro-channel heat conducting cavity and radiating fins, wherein the upper part of the substrate is a radiating section, the lower part of the substrate is a heat absorbing section, the middle part of the substrate is provided with a mounting flange, and the radiating section is provided with a plurality of radiating fins; the micro-channel heat conducting cavity is arranged in the base body and consists of a plurality of independent micro-channels which are not communicated with each other, and the outer plane of the heat absorbing section of the base body is a heat absorbing surface; the heat dissipation section of the matrix is fixed in the upper cabinet body of the module, the heat absorption section of the matrix is fixed in the lower cabinet body of the module, and the intelligent power module is fixed on the heat absorption surface of the matrix. The advantages are that: the heat-dissipating device has the advantages of compact structure, small volume and light weight, meets the space and weight requirements of ship equipment, and achieves the heat dissipation requirement of conducting heat from the closed cavity to the external space.
Description
Technical Field
The invention relates to a high-efficiency micro-conduction heat radiation module, in particular to a heat radiation module which is suitable for the field of heat transfer and heat radiation in a sealed cavity of a water surface and underwater ship control power supply.
Background
The ocean vessel is used as a main body of material transportation, and the intelligent control of large tonnage, high navigational speed and high integration becomes the development direction of the ocean vessel. The highly integrated intelligent control system is required to have the characteristics of large capacity, small volume, light weight, high automation degree and the like, wherein the calculation speed and the reaction efficiency of a core device, namely a new generation of intelligent power module, are higher than the technical indexes of the existing power module. Meanwhile, the dissipation power of the new generation intelligent power module during operation is far greater than that of the existing power module. At present, the heat dissipation modes of the power device applied to the ocean vessel comprise three modes of profile air cooling heat dissipation, water cooling heat dissipation and heat pipe heat dissipation. The sectional material air cooling heat dissipation mode has low heat dissipation power and cannot meet heat dissipation requirements. The cooling water circulation system in the water cooling heat dissipation mode has the advantages of complex structure and high maintenance cost, and is particularly difficult to maintain in the ocean. The heat pipe heat dissipation is used as a high-efficiency vacuum heat conduction technology, the heat pipe conduction is carried out by applying the phase change principle of working media, the heat conduction efficiency is nearly thousands times that of common metals, the heat pipe technology applied to ship equipment is mature, and more products are applied. However, the development of manufacturing technology and control technology of ocean vessels has prompted the highly integrated intelligent control system to adopt a new generation of intelligent power module to meet the performance index, but the high integration of the new generation of intelligent power module results in very large heat during operation, and the current heat pipe heat dissipation products with sectional materials air cooling heat dissipation, water cooling heat dissipation and conventional structures cannot meet the use requirements of heat dissipation. Therefore, in order to meet the heat dissipation problem of the highly integrated intelligent control system in ocean ship equipment, the high-efficiency micro-conduction heat dissipation module applied to the ship internal control equipment under the marine climate condition is provided, and the long-term stable operation of the ship control system in marine transportation is ensured.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide the high-efficiency micro-conduction heat dissipation module which is compact in structure, small in size and light in weight, and the integrated high-efficiency micro-conduction heat dissipation body is connected with the upper module cabinet body and the lower module cabinet body to form two parts of upper heat dissipation and lower sealing heat conduction, so that the heat conduction part provided with the new generation intelligent power module is arranged in the sealed cabinet body, and the problems of sealing, moisture resistance, corrosion resistance and the like are solved; the heat of the intelligent power module arranged on the high-efficiency micro-conduction radiator is quickly transferred to the radiating fins arranged on the upper cabinet body of the module through the micro-channel heat conducting cavity when the intelligent power module works; the matrix, the radiating fins and the micro-channel heat conducting cavity of the high-efficiency micro-conduction radiator for installing the intelligent power module are of an integrated structure, so that the generation of contact thermal resistance among the matrix, the radiating fins and the micro-channel heat conducting cavity is avoided, and the high-efficiency and rapid heat transfer of the intelligent power module in the sealed cabinet body to the outside of the cabinet body is ensured.
In order to achieve the above purpose, the present invention is realized by the following technical scheme:
a high-efficiency micro-conduction heat dissipation module comprises an upper module cabinet body, a lower module cabinet body and high-efficiency micro-conduction heat dissipation bodies, wherein the high-efficiency micro-conduction heat dissipation bodies are fixed in the upper module cabinet body and the lower module cabinet body;
the high-efficiency micro-conduction radiator is of an integrated structure and comprises a base body, a micro-channel heat conduction cavity, radiating fins, a mounting flange and guide rail grooves, wherein the upper part of the base body is a radiating section, the lower part of the base body is a heat absorption section, the middle part of the base body is provided with the mounting flange, the radiating section is provided with a plurality of radiating fins, and the two sides of the base body are provided with the guide rail grooves; the micro-channel heat conducting cavity is arranged in the base body and consists of a plurality of independent micro-channels which are not communicated with each other, each micro-channel extends from the heat absorbing section to the heat radiating section and extends to the inside of the heat radiating fin, the micro-channels which are not communicated with each other are arranged in a row in the efficient micro-conductive heat radiating body, and each micro-channel is filled with a phase change medium; the outer plane of the base body heat absorption section is a heat absorption surface;
the heat dissipation section of the matrix is fixed in the upper cabinet body of the module, the heat absorption section of the matrix is fixed in the lower cabinet body of the module, and the intelligent power module is fixed on the heat absorption surface of the matrix.
The inner surface of the micro channel is provided with a plurality of bosses or grooves, and the bosses or grooves are rectangular, circular arc-shaped, trapezoidal or triangular.
The top end of the efficient micro-conductive radiator is fixedly connected with the top of the upper cabinet body of the module through a fastening screw, and the bottom end of the efficient micro-conductive radiator is fixedly connected with the bottom of the lower cabinet body of the module through a fastening screw.
The module under cabinet body include seal groove, locating plate, fixed depression bar, guide rail, mounting groove, installation logical groove, the module under cabinet body cast the fashioned cavity structure of integration as openly open, all the other faces are enclosed construction, positive four frames are equipped with the seal groove, seal groove internal fixation has the sealing silica gel strip, positive top and bottom are equipped with the locating plate, the locating plate is used for fixed intelligent power module with fixed depression bar cooperation, the top surface is equipped with mounting groove, mounting groove's bottom surface and the mounting flange fixed connection of high-efficient little guide radiator, the internal installation logical groove that is equipped with of module under cabinet, the installation logical inslot both ends are equipped with the guide rail, guide rail and the guide rail groove phase-match of high-efficient little guide radiator for the location is installed high-efficient little guide radiator.
The bottom surface of the lower cabinet body of the module is provided with a weight-reducing groove.
The intelligent power modules are fixedly arranged in rows in the lower module cabinet body, the intelligent power modules between the rows are supported and fixed through the lower cabinet body support and the fixed compression bar, and the adjacent lower cabinet body support and the heat absorption section of the matrix are fixedly connected through bolts; the lower cabinet body bracket is provided with a lightening hole.
The upper cabinet body of the module and the lower cabinet body of the module are fixedly connected through bolts.
The module upper cabinet body comprises hanging rings, ventilation meshes and an upper cabinet body base body, wherein the hanging rings are connected with the upper cabinet body base body through bolts, the ventilation meshes are arranged on the side face of the upper cabinet body base body, and are air channels of the radiating fins of the high-efficiency micro-conduction radiating body, and air after exchanging heat with the radiating fins is dispersed into air outside the module upper cabinet body; the ventilation mesh and the upper cabinet body matrix are integrally cast and formed.
The module lower cabinet body, the module upper cabinet body, the module lower cabinet body support and the high-efficiency micro-conductive radiator are all made of aluminum or copper, and the surface is subjected to anodic oxidation or electrophoresis corrosion prevention treatment.
The high-efficiency micro-conduction radiator is a high-efficiency micro-conduction radiator I or a high-efficiency micro-conduction radiator II, the radiating fins and the mounting flanges of the high-efficiency micro-conduction radiator I are symmetrically arranged on two sides of the substrate, the radiating fins and the mounting flanges of the high-efficiency micro-conduction radiator II are arranged on one side of the substrate, and the other side of the substrate is of a plane structure.
Compared with the prior art, the invention has the beneficial effects that:
1. the international advanced micro heat conduction pipe technology is adopted, and the heat absorption surface arranged by the efficient micro heat conduction body is used for realizing the heat dissipation requirement of conducting heat from the closed cavity to the external space.
2. The high-efficiency micro-conduction heat radiation body adopts the structural design of a plurality of independent micro channels, so that the use safety and the service life of the high-efficiency micro-conduction heat radiation module are ensured to meet the requirements.
3. The design of the bulges or grooves of various structures on the inner cavity surface of the micro channel greatly increases the heat exchange area of the high-efficiency micro-conduction heat radiation body and improves the heat radiation capacity of the high-efficiency micro-conduction heat radiation module.
4. The international advanced precision casting technology is adopted, so that the heat absorbing surface, the micro-channel heat conducting cavity and the heat radiating fins of the intelligent power module are integrated, and the generation of the contact thermal resistance of the high-efficiency micro-conducting heat radiator is avoided.
5. The cabinet body and the upper cabinet body of module lower cabinet body precision casting shaping have guaranteed that the intensity and the precision of the cabinet body satisfy the operation requirement.
6. The high-efficiency micro-conductive heat dissipation module adopts a weight reduction groove design, and meets the overall weight requirement on the premise of not reducing the overall strength.
7. Has the advantages of compact structure, small volume and light weight, and meets the space and weight requirements of ship equipment.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic diagram of the front structure of the lower cabinet of the module.
Fig. 3 is a schematic view of the bottom structure of the lower cabinet of the module.
Fig. 4 is a schematic diagram of the top surface structure of the lower cabinet of the module.
FIG. 5 is a schematic cross-sectional view of a highly efficient micro-conductive heat sink I.
FIG. 6 is a schematic diagram of the bottom structure of the heat sink I.
Fig. 7 is a schematic diagram of the bottom structure of the high-efficiency micro-conductive heat sink ii.
Fig. 8 is a schematic cross-sectional view of a highly efficient micro-conductive heat sink ii.
Fig. 9 is a schematic view of a rectangular groove structure of the inner surface of the micro-channel.
Fig. 10 is a schematic view of a rectangular boss structure of the inner surface of the microchannel.
FIG. 11 is a schematic view of a semicircular groove structure on the inner surface of a microchannel.
Fig. 12 is a schematic view of a semicircular boss structure of the inner surface of the microchannel.
FIG. 13 is a schematic view of the configuration of the trapezoidal grooves on the inner surface of the microchannel.
Fig. 14 is a schematic view of a trapezoid boss structure on the inner surface of a microchannel.
Fig. 15 is a schematic view of a triangular groove structure on the inner surface of a microchannel.
Fig. 16 is a schematic view of triangular boss structure of the inner surface of the microchannel.
Fig. 17 is a schematic diagram of the front structure of the lower cabinet bracket.
Fig. 18 is a schematic view of the top surface structure of the lower cabinet bracket.
Fig. 19 is a schematic view of the lower cabinet bracket connection structure.
Fig. 20 is a schematic diagram of the front structure of the upper cabinet of the module.
Fig. 21 is a schematic view of the bottom structure of the cabinet on the module.
FIG. 22 is a schematic diagram of the connection structure of the lower cabinet support, the high-efficiency micro-conductive radiator II and the lower cabinet module.
In the figure: 1-module lower cabinet 2-sealing silica gel strip 3-fixing compression bar 4-intelligent power module 5-lower cabinet support 6-module upper cabinet 7-mounting hanging ring 8-high-efficiency micro-conduction radiator I9-fastening screw I10-high-efficiency micro-conduction radiator II 11-fastening screw II 12-fastening screw III 13-sealing groove 14-positioning plate 15-bottom fixing screw hole 16-bottom counter bore 17-weight reduction groove 18-fastening screw hole I19-guide rail I20-fastening screw hole II 21-mounting groove 22-mounting through groove I23-mounting through groove II 24-guide rail II 25-top screw hole 26-micro-channel the heat conduction cavity 27-the heat dissipation fins 28-the mounting flange 29-the bottom threaded holes 30-the guide rail groove I31-the mounting counter bore 32-the guide rail groove II 33-the heat absorption surface 34-the rectangular groove 35-the rectangular boss 36-the semicircular boss 37-the semicircular groove 38-the trapezoidal boss 39-the trapezoidal groove 40-the triangular boss 41-the triangular groove 42-the guide surface 43-the compression bar top plate 44-the weight reduction hole 45-the bracket through hole 46-the bracket threaded holes 47-the bracket base 48-the bracket fastening screw 49-the hanging ring mounting threaded holes 50-the conical counter bore 51-the ventilation mesh 52-the mounting through hole 53-the upper cabinet base 54-the side wall threaded holes.
Detailed Description
The present invention will be described in detail below with reference to the drawings of the specification, but it should be noted that the practice of the present invention is not limited to the following embodiments.
1-8, a high-efficiency micro-conduction heat dissipation module comprises an upper module cabinet body 6, a lower module cabinet body 1 and high-efficiency micro-conduction heat dissipation bodies, wherein a plurality of high-efficiency micro-conduction heat dissipation bodies are fixed in the upper module cabinet body 6 and the lower module cabinet body 1; the high-efficiency micro-conduction radiator is of an integrated structure and comprises a base body, a micro-channel heat conduction cavity 26, radiating fins 27, a mounting flange 28 and guide rail grooves, wherein the upper part of the base body is a heat dissipation section, the lower part of the base body is a heat absorption section, the middle part of the base body is provided with the mounting flange 28, the heat dissipation section is provided with a plurality of radiating fins 27, and the two sides of the base body are provided with the guide rail grooves; the micro-channel heat conducting cavity 26 is arranged in the base body, the micro-channel heat conducting cavity 26 consists of a plurality of independent micro-channels which are not communicated with each other, each micro-channel extends from the heat absorbing section to the heat radiating section and extends to the inside of the heat radiating fin 27, the micro-channels which are not communicated with each other are arranged in a row in the efficient micro-conductor heat radiating body, and each micro-channel is filled with a phase change medium; the outer plane of the base body heat absorption section is a heat absorption surface 33. The top end of the efficient micro-conduction radiator is fixedly connected with the top of the upper cabinet body 6 of the module through a fastening screw, and the bottom end of the efficient micro-conduction radiator is fixedly connected with the bottom of the lower cabinet body 1 of the module through a fastening screw.
The heat dissipation section of the matrix is fixed in the module upper cabinet 6, the heat absorption section of the matrix is fixed in the module lower cabinet 1, and the intelligent power module 4 is fixed on the heat absorption surface 33 of the matrix. The high-efficiency micro-conduction radiator is a high-efficiency micro-conduction radiator I8 or a high-efficiency micro-conduction radiator II 10, the radiating fins 27 and the mounting flanges 28 of the high-efficiency micro-conduction radiator I8 are symmetrically arranged on two sides of the substrate, the radiating fins 27 and the mounting flanges 28 of the high-efficiency micro-conduction radiator II 10 are arranged on one side of the substrate, and the other side of the substrate is of a plane structure. The high-efficiency micro-conduction radiator II 10 is arranged on two sides, the plane structure of the high-efficiency micro-conduction radiator II is fixedly connected with two sides of the upper module cabinet 6 and the lower module cabinet 1, and the high-efficiency micro-conduction radiator I8 is fixed between the high-efficiency micro-conduction radiator II 10.
The intelligent power module 4 is fixed on the heat absorbing surfaces 33 of the efficient micro-conduction heat radiator I8 and the efficient micro-conduction heat radiator II 10, and heat generated during operation of the intelligent power module 4 is rapidly conducted to the outside of the upper module cabinet 6 of the ship, wherein the upper module cabinet is provided with the intelligent power module 4, through the micro-channel heat conducting cavities 26 inside the efficient micro-conduction heat radiator I8 and the efficient micro-conduction heat radiator II 10. The high-efficiency micro-conduction radiator I8 and the high-efficiency micro-conduction radiator II 10 are in fastening fit with the module upper cabinet 6 and the module lower cabinet 1 by adopting a fastening screw I9 and a fastening screw III 12. The upper cabinet body 6 of the module is fixedly connected with the lower cabinet body 1 of the module through a fastening screw II 11, the lower cabinet body support 5 is fixedly connected with the lower cabinet body 1 of the module, the high-efficiency micro-conduction radiator I8 and the high-efficiency micro-conduction radiator II 10 through a support fastening screw 48, and the lower cabinet body support 5 is fixedly connected with the high-efficiency micro-conduction radiator I8 through a support fastening screw 48.
Referring to fig. 9-16, the inner surface of the micro-channel is provided with a plurality of bosses or grooves, the bosses or grooves are rectangular, arc-shaped, trapezoid or triangle, namely, rectangular grooves 34, rectangular bosses 35, semicircular bosses 36, semicircular grooves 37, trapezoid bosses 38, trapezoid grooves 39, triangle bosses 40 and triangle grooves 41, other geometric shapes can be adopted, the heat exchange area of the efficient micro-conductive heat dissipation body can be increased, and the heat dissipation capacity of the efficient micro-conductive heat dissipation module is improved. The inner surface of the micro-channel heat conduction cavity 26 is provided with a plurality of top threaded holes 25 of the efficient micro-conduction radiator, the top threaded holes 25 penetrate through a conical counter bore 50 at the top of the module upper cabinet 6 and are fixedly installed on the module upper cabinet 6, and the bottom threaded holes 29 penetrate through a counter bore 16 at the bottom of the module lower cabinet 1 and are fixedly installed on the module lower cabinet 1 through a fastening screw III 12.
See fig. 2-4, the module lower cabinet body 1 includes seal groove 13, locating plate 14, fixed depression bar 3, guide rail, mounting groove 21, installation logical groove, the module lower cabinet body 1 be integrated precision casting fashioned cavity structure, whole appearance is the cuboid, openly uncovered, the other face is the enclosed construction, positive four frames are equipped with seal groove 13, seal silica gel strip 2 installs in seal groove 13 through interference fit. The positive top and bottom are equipped with locating plate 14, and locating plate 14 is used for fixed intelligent power module 4 with fixed depression bar 3 cooperation, and the top surface is equipped with mounting groove 21, and mounting flange 28 fixed connection of high-efficient little guide radiator is equipped with the installation through groove in the module lower cabinet body 1, and the installation through groove both ends are equipped with the guide rail, and the guide rail is with the guide rail groove phase-match of high-efficient little guide radiator for the location is installed high-efficient little guide radiator.
Specifically, a bottom fixing threaded hole 15 is formed in the bottom of the module lower cabinet body 1 and is used for being installed and fixed with an external installation frame, a bottom counter bore 16 in the bottom surface of the module lower cabinet body 1 is used for connecting a fastening screw III 12 with a threaded hole 29 in the bottoms of the high-efficiency micro-conductive radiator I8 and the high-efficiency micro-conductive radiator II 10, the module lower cabinet body 1 is fixed with the high-efficiency micro-conductive radiator I8 and the high-efficiency micro-conductive radiator II 10, and a weight reduction groove 17 is formed in the bottom surface of the module lower cabinet body 1 and is used for controlling the weight of the module lower cabinet body 1; the top of the lower module cabinet body 1 is provided with a fastening threaded hole I18 which is matched with a fastening screw II 11 to fix the upper module cabinet body 6 on the lower module cabinet body 1. The two ends of the installation through groove are provided with a guide rail I19 and a guide rail II 24 which are respectively matched with a guide rail groove I30 and a guide rail groove II 32 on the high-efficiency micro-conduction radiator I8 and the high-efficiency micro-conduction radiator II 10, and are used for positioning and installing the high-efficiency micro-conduction radiator I8 and the high-efficiency micro-conduction radiator II 10, and the guide rail groove adopt a protruding arc-shaped structure and can also adopt other structures.
The fastening threaded hole II 20 and the mounting groove 21 at the top of the module lower cabinet body 1 are matched with the mounting flange 28, the efficient micro-conduction radiator is fixed with the top of the module lower cabinet body 1 through the fastening screw I9, and the mounting through groove I22 and the mounting through groove II 23 are used for inserting the heat absorbing surfaces 33 of the efficient micro-conduction radiator I8 and the efficient micro-conduction radiator II 10 into the module lower cabinet body 1. The mounting flange 28 is matched with the mounting groove 21I and the mounting groove 21 II, and countersunk screws penetrate through the mounting counter bores 31 to be fixedly connected with the mounting groove 21I and the mounting groove 21 II.
Referring to fig. 17-19, the high-efficiency micro-conduction heat dissipation module further comprises a lower cabinet bracket 5, intelligent power modules 4 are fixed in rows in the lower cabinet 1 of the module, the intelligent power modules 4 between the rows are supported and fixed through the lower cabinet bracket 5 and a fixed compression bar 3, and the adjacent lower cabinet bracket 5 and heat absorption sections of the matrix are fixedly connected through bolts.
The lower cabinet body support 5 is of an integrated structure, and the guide surfaces 42 are positioned on the left side and the right side of the lower cabinet body support 5 and adjacent to the heat absorbing surfaces 33 of the high-efficiency micro-conduction heat radiator I8 and the high-efficiency micro-conduction heat radiator II 10, so that the intelligent power module 4 can be conveniently installed and disassembled; the compression bar top plate 43 is positioned at the upper side and the lower side of the lower cabinet bracket 5, and is matched with the fixed compression bar 3 to lock and fix the intelligent power module 4; the bracket through hole 45 and the bracket threaded hole 46 are arranged on the lower cabinet bracket 5, the weight reducing hole 44 is arranged on the lower cabinet bracket 5, and the whole base body 47 of the lower cabinet bracket 5 is cast and molded precisely. The lower cabinet bracket 5 is fastened and connected through the through holes on the heat absorbing surface 33 by bracket fastening screws 48. Referring to fig. 22, the lower cabinet bracket 5 and the high-efficiency micro-conductive radiator ii 10 are fastened and matched with the threaded holes 54 on the side wall of the lower cabinet 1 of the module through the bracket fastening screws 48, so that the high-efficiency micro-conductive radiator ii 10 and the lower cabinet bracket 5 are fixed on the side wall of the lower cabinet 1 of the module.
Referring to fig. 20-21, the module upper cabinet 6 comprises a hanging ring 7, a ventilation mesh 51 and an upper cabinet base 53, the hanging ring 7 is connected with the upper cabinet base 53 through a hanging ring mounting threaded hole 49, the ventilation mesh 51 is arranged on the side surface of the upper cabinet base 53, the ventilation mesh 51 is an air channel of the high-efficiency micro-conduction radiator radiating fin 27, and air after exchanging heat with the radiating fin 27 is dispersed into the air outside the module upper cabinet 6; the ventilation mesh 51 and the upper cabinet base 53 are integrally cast. The conical counter bore 50 at the top of the upper cabinet base 53 is used for fixing the efficient micro-conductive radiator. The installation through hole 52 at the bottom of the upper cabinet body substrate 53 is a through hole for connecting and fastening the upper module cabinet body 6 and the lower module cabinet body 1 by the fastening bolt II. The hanging ring installation threaded hole 49, the conical counter bore 50, the installation through hole 52 and the ventilation mesh 51 are all machined on the upper cabinet body base 53 to form an integrated structure.
The lower module cabinet body 1, the upper module cabinet body 6, the lower cabinet body bracket 5 and the high-efficiency micro-conductive radiator are all made of aluminum or copper, and the surfaces of the upper module cabinet body and the lower module cabinet body are subjected to anodic oxidation or electrophoresis corrosion prevention treatment.
Examples
1-22, when in installation, the number of the high-efficiency micro-conduction heat radiation bodies I8 is 4, the number of the high-efficiency micro-conduction heat radiation bodies II 10 is 2, and the high-efficiency micro-conduction heat radiation bodies I and II are arranged according to the illustrated positions. The intelligent power module 4 is fixed on the heat absorbing surfaces 33 of the high-efficiency micro-conduction heat radiation body I8 and the high-efficiency micro-conduction heat radiation body II 10 by adopting a fixed compression bar 3 as shown in the figure; the high-efficiency micro-conduction radiator I8 and the high-efficiency micro-conduction radiator II 10 are of an integrated structure made of the same material, and no contact thermal resistance is generated in the heat transfer process; the heat absorbing surface 33 is inserted into the sealed cavity in the module lower cabinet body 1 through the installation through groove I22 and the installation through groove II 23 at the top of the module lower cabinet body 1; the guide rail grooves I30 and the guide rail grooves II 32 on two sides of the heat absorbing surface 33 are matched with the guide rail I19 and the guide rail II 24, and the high-efficiency micro-conductive heat radiating body II 10 is arranged on two side walls of the lower cabinet body 1 of the module; the high-efficiency micro-conduction radiator I8 and the high-efficiency micro-conduction radiator II 10 are fixed on the upper module cabinet 6 and the lower module cabinet 1; the lower cabinet body bracket 5, the module lower cabinet body 1, the high-efficiency micro-conduction radiator I8 and the high-efficiency micro-conduction radiator II 10 are connected and fastened through bracket fastening screws 48; the module lower cabinet body 1 and the module upper cabinet body 6 are fixed together by fastening screws II 11.
The number and positions of the high-efficiency micro-conductive heat radiator I8 and the high-efficiency micro-conductive heat radiator II 10 in the embodiment can be used for assembling the high-efficiency micro-conductive heat radiator I8 and the high-efficiency micro-conductive heat radiator II 10 with different numbers at intervals or not according to different use requirements of customers, and the high-efficiency micro-conductive heat radiator I8 or the high-efficiency micro-conductive heat radiator II 10 can be assembled completely or used for meeting the heat dissipation requirements of the intelligent power modules 4 with different numbers and types.
Claims (8)
1. The high-efficiency micro-conduction heat dissipation module is characterized by comprising an upper module cabinet body, a lower module cabinet body and high-efficiency micro-conduction heat dissipation bodies, wherein the high-efficiency micro-conduction heat dissipation bodies are fixed in the upper module cabinet body and the lower module cabinet body;
the high-efficiency micro-conduction radiator is of an integrated structure and comprises a base body, a micro-channel heat conduction cavity, radiating fins, a mounting flange and guide rail grooves, wherein the upper part of the base body is a radiating section, the lower part of the base body is a heat absorption section, the middle part of the base body is provided with the mounting flange, the radiating section is provided with a plurality of radiating fins, and the two sides of the base body are provided with the guide rail grooves; the micro-channel heat conducting cavity is arranged in the base body and consists of a plurality of independent micro-channels which are not communicated with each other, each micro-channel extends from the heat absorbing section to the heat radiating section and extends to the inside of the heat radiating fin, the micro-channels which are not communicated with each other are arranged in a row in the efficient micro-conductive heat radiating body, and each micro-channel is filled with a phase change medium; the outer plane of the base body heat absorption section is a heat absorption surface;
the heat dissipation section of the base body is fixed in the upper cabinet body of the module, the heat absorption section of the base body is fixed in the lower cabinet body of the module, and the intelligent power module is fixed on the heat absorption surface of the base body;
the module lower cabinet body comprises a sealing groove, a positioning plate, a fixed compression bar, a guide rail, a mounting groove and a mounting through groove, wherein the module lower cabinet body is of an integrated casting cavity structure, the front surface is open, the other surfaces are of a closed structure, four front frames are provided with sealing grooves, sealing silica gel strips are fixed in the sealing grooves, the top and the bottom of the front surface are provided with the positioning plate, the positioning plate is matched with the fixed compression bar and used for fixing an intelligent power module, the top surface is provided with the mounting groove, the bottom surface of the mounting groove is fixedly connected with a mounting flange of the efficient micro-conduction radiator, the mounting through groove is arranged in the module lower cabinet body, guide rails are arranged at two ends of the mounting through groove, and the guide rails are matched with the guide rail grooves of the efficient micro-conduction radiator and are used for positioning and mounting the efficient micro-conduction radiator;
the module upper cabinet body comprises hanging rings, ventilation meshes and an upper cabinet body base body, wherein the hanging rings are connected with the upper cabinet body base body through bolts, the ventilation meshes are arranged on the side face of the upper cabinet body base body, and are air channels of the radiating fins of the high-efficiency micro-conduction radiating body, and air after exchanging heat with the radiating fins is dispersed into air outside the module upper cabinet body; the ventilation mesh and the upper cabinet body matrix are integrally cast and formed.
2. The efficient micro-conductive heat dissipation module as claimed in claim 1, wherein the inner surface of the micro-channel is provided with a plurality of bosses or grooves, and the bosses or grooves are rectangular, circular arc-shaped, trapezoid-shaped or triangular.
3. The efficient micro-conductive heat radiation module according to claim 1, wherein the top end of the efficient micro-conductive heat radiation body is fixedly connected with the top of the upper cabinet body of the module through a fastening screw, and the bottom end of the efficient micro-conductive heat radiation body is fixedly connected with the bottom of the lower cabinet body of the module through a fastening screw.
4. The efficient micro-conductive heat dissipation module as defined in claim 1, wherein the bottom surface of the module lower cabinet body is provided with a weight-reducing groove.
5. The efficient micro-conduction heat dissipation module according to claim 1, further comprising a lower cabinet bracket, wherein intelligent power modules are fixed in rows in the lower cabinet of the module, the intelligent power modules between the rows are supported and fixed through the lower cabinet bracket and a fixed compression bar, and the adjacent heat absorption sections of the lower cabinet bracket and the base are fixedly connected through bolts; the lower cabinet body bracket is provided with a lightening hole.
6. The efficient micro-conductive heat dissipation module as claimed in claim 1, wherein the module upper cabinet and the module lower cabinet are fixedly connected through bolts.
7. The efficient micro-conductive heat dissipation module as defined in claim 5, wherein the module lower cabinet, the module upper cabinet, the lower cabinet support and the efficient micro-conductive heat dissipation body are made of aluminum or copper, and the surface is subjected to anodic oxidation or electrophoretic corrosion prevention treatment.
8. The efficient micro-conductive radiating module of claim 1, wherein the efficient micro-conductive radiating body is an efficient micro-conductive radiating body I or an efficient micro-conductive radiating body II, radiating fins and mounting flanges of the efficient micro-conductive radiating body I are symmetrically arranged on two sides of a base body, the radiating fins and the mounting flanges of the efficient micro-conductive radiating body II are arranged on one side of the base body, and the other side of the base body is of a plane structure.
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| CN201910025531.9A CN109640596B (en) | 2019-01-11 | 2019-01-11 | High-efficient little heat dissipation module that leads |
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| CN201910025531.9A CN109640596B (en) | 2019-01-11 | 2019-01-11 | High-efficient little heat dissipation module that leads |
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| CN109640596A CN109640596A (en) | 2019-04-16 |
| CN109640596B true CN109640596B (en) | 2023-12-15 |
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| CN110505791A (en) * | 2019-07-31 | 2019-11-26 | 联想(北京)有限公司 | A kind of radiator and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080038533A (en) * | 2006-10-30 | 2008-05-07 | 주식회사 이엠따블유안테나 | Interdigital capacitor, inductor, and transmission line and coupler using them |
| JP2008282074A (en) * | 2007-05-08 | 2008-11-20 | Matsushita Electric Ind Co Ltd | Heat radiation mechanism |
| CN106033749A (en) * | 2015-03-13 | 2016-10-19 | 上海交通大学 | Parallel type parallel-microchannel multi-chip radiator |
| CN106332529A (en) * | 2016-10-18 | 2017-01-11 | 中车大连机车研究所有限公司 | Corrugated tube type micro-circulation radiator and micro-circulation heat exchange system |
| CN206563521U (en) * | 2017-01-16 | 2017-10-17 | 深圳市迈安热控科技有限公司 | Porous heat pipe |
-
2019
- 2019-01-11 CN CN201910025531.9A patent/CN109640596B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080038533A (en) * | 2006-10-30 | 2008-05-07 | 주식회사 이엠따블유안테나 | Interdigital capacitor, inductor, and transmission line and coupler using them |
| JP2008282074A (en) * | 2007-05-08 | 2008-11-20 | Matsushita Electric Ind Co Ltd | Heat radiation mechanism |
| CN106033749A (en) * | 2015-03-13 | 2016-10-19 | 上海交通大学 | Parallel type parallel-microchannel multi-chip radiator |
| CN106332529A (en) * | 2016-10-18 | 2017-01-11 | 中车大连机车研究所有限公司 | Corrugated tube type micro-circulation radiator and micro-circulation heat exchange system |
| CN206563521U (en) * | 2017-01-16 | 2017-10-17 | 深圳市迈安热控科技有限公司 | Porous heat pipe |
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Effective date of registration: 20231108 Address after: 114000 No. 18, Daqi street, Tiexi District, Anshan City, Liaoning Province Applicant after: Anshan Anming Heat Pipe Technology Co.,Ltd. Address before: 114000 No. 18, Daqi street, Tiexi District, Anshan City, Liaoning Province Applicant before: ANSHAN ANMING INDUSTRY Co.,Ltd. |
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