CN110505791A - A kind of radiator and electronic equipment - Google Patents
A kind of radiator and electronic equipment Download PDFInfo
- Publication number
- CN110505791A CN110505791A CN201910701772.0A CN201910701772A CN110505791A CN 110505791 A CN110505791 A CN 110505791A CN 201910701772 A CN201910701772 A CN 201910701772A CN 110505791 A CN110505791 A CN 110505791A
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- Prior art keywords
- accommodating chamber
- heat
- radiator
- chamber
- pedestal
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the present application provides a kind of radiator and electronic equipment, radiator is used for an electronic equipment, radiator includes contacting with the heat source of electronic equipment and thermally conductive pedestal, pedestal has extended to form multiple spaced cooling fins to the direction far from heat source on the end face far from heat source, the first accommodating chamber is equipped in each cooling fin, wherein, the phase-change heat agent undergone phase transition after being heated is provided in the first accommodating chamber.In the heat of pedestal conduction heat sources, phase-change heat agent in first accommodating chamber, which is heated, to be undergone phase transition, phase-change heat agent after evaporation is moved upward along the cavity wall of the first accommodating chamber, and the condensation liquefaction when being moved to the top area of chamber of the first accommodating chamber, heat is discharged to the air and cavity wall of the chamber roof to the first accommodating chamber, then the side chamber wall along the chamber of the first accommodating chamber flows to the bottom of the chamber of the first accommodating chamber, this absorbs heat again, by the process heat dissipation constantly evaporated and condensed, radiating efficiency is improved.
Description
Technical field
The invention relates to radiating device technical field, in particular to a kind of radiator and electronic equipment.
Background technique
It improves with the continuous development of society, during electronic equipment has become people's life, work and study
Necessary article, still, as the ability of electronic equipment is more and more stronger, the heat of generation in the process of running is also increasingly
It is more, and then the requirement to heat dissipation also becomes higher and higher, meanwhile, the development with electronic equipment to lightening direction, so that existing
It is impossible to meet the demand of electronic equipment development, also, the development difficulty of highly heat-conductive material and throwings for some radiators
It is higher to enter cost, it can not meet demand.
Apply for content
The embodiment of the present application provides a kind of radiator, is used for an electronic equipment, and the radiator includes:
Pedestal contacts and thermally conductive with the heat source of the electronic equipment, and the pedestal is on the end face far from the heat source
Multiple spaced cooling fins have been extended to form to the direction far from the heat source, have been equipped with first in each cooling fin
Accommodating chamber, wherein the phase-change heat agent undergone phase transition after being heated is provided in first accommodating chamber.
In some embodiments of the present application, the second accommodating chamber, each first accommodating chamber are formed in the pedestal
It is connected to second accommodating chamber.
In some embodiments of the present application, the pedestal and each cooling fin are all made of plastic cement material.
In some embodiments of the present application, second accommodating chamber is formed with multiple in the cavity wall close to the heat source
Groove.
In some embodiments of the present application, the pedestal uses metal material, and each cooling fin is all made of plastic cement
Material.
In some embodiments of the present application, the arc-shaped setting of cavity wall of each first accommodating chamber.
In some embodiments of the present application, multiple cooling fins are equally arranged in parallel, and each described first holds
Receive chamber far from the heat source side roof be in arc-shaped setting.
In some embodiments of the present application, multiple cooling fins are annular in shape and angles is waited to be arranged, and each described first
Accommodating chamber is in arc-shaped setting in the roof far from the heat source side.
The embodiment of the present application also provides a kind of electronic equipment, comprising:
The first noumenon is formed with a heat source thereon；
Radiator as described above, the radiator are arranged on the heat source.
In some embodiments of the present application, the electronic equipment further include:
Second ontology, second ontology are connect in which can change relative position with the first noumenon.
Disclosure based on the above embodiment can know, radiator provided by the embodiments of the present application and use the heat dissipation
The electronic equipment of device be provided with it is following the utility model has the advantages that by the way that the pedestal of radiator is contacted setting with the heat source, into
And realize and conducted by the heat that the pedestal issues heat source, for pedestal in the heat of conduction heat sources, pedestal itself can
It is heated, is undergone phase transition so that the phase-change heat agent in the first accommodating chamber in each cooling fin of pedestal is heated, the phase transformation
Coolant is by heat absorption heat and evaporates, and the phase-change heat agent after evaporation is moved upward along the cavity wall of the first accommodating chamber, and
When being moved to the top of chamber of the first accommodating chamber, since the heat at the top of the chamber of conduction to the first accommodating chamber is less,
Phase-change heat agent after evaporation constantly transmits heat to the side chamber wall of the first accommodating chamber in moving process, and then can hold first
Receive chamber chamber top area when condensation, heat is discharged to the air and cavity wall of the chamber roof to the first accommodating chamber, into
And condensed phase-change heat agent can flow to the bottom of the chamber of the first accommodating chamber along the side chamber wall of the chamber of first accommodating chamber
Portion, then this absorbs heat, and repeat it is above-mentioned first absorb heat and distribute the process of heat after evaporation, by constantly evaporate with
And the process heat dissipation of condensation, it realizes and improves thermal coefficient, the technical effect of improving heat radiation efficiency, while heat dissipation dress can also be reduced
It sets occupied space and mitigates radiator overall weight, greatly improve the practicability of above-mentioned radiator and can be used
Property.
Detailed description of the invention
Fig. 1 is a kind of the first structural schematic diagram of radiator provided by the embodiments of the present application；
Fig. 2 is a kind of second of structural schematic diagram of radiator provided by the embodiments of the present application；
Fig. 3 is a kind of the third structural schematic diagram of radiator provided by the embodiments of the present application.
Appended drawing reference
1, pedestal；11, the second accommodating chamber；
2, cooling fin；21, the first accommodating chamber；
3, phase-change heat agent；
4, heat source.
Specific embodiment
In the following, being described in detail in conjunction with specific embodiment of the attached drawing to the application, but not as the restriction of the application.
It should be understood that various modifications can be made to disclosed embodiments.Therefore, following description should not regard
To limit, and only as the example of embodiment.Those skilled in the art will expect within the scope and spirit of this
Other modifications.
The attached drawing being included in the description and forms part of the description shows embodiment of the disclosure, and with it is upper
What face provided is used to explain the disclosure together to substantially description and the detailed description given below to embodiment of the disclosure
Principle.
By the description of the preferred form with reference to the accompanying drawings to the embodiment for being given as non-limiting example, the application's
These and other characteristic will become apparent.
It is also understood that although the application is described referring to some specific examples, those skilled in the art
Member realizes many other equivalents of the application in which can determine, they have feature as claimed in claim and therefore all
In the protection scope defined by whereby.
When read in conjunction with the accompanying drawings, in view of following detailed description, above and other aspect, the feature and advantage of the disclosure will become
It is more readily apparent.
The specific embodiment of the disclosure is described hereinafter with reference to attached drawing；It will be appreciated, however, that the disclosed embodiments are only
Various ways implementation can be used in the example of the disclosure.Known and/or duplicate function and structure and be not described in detail to avoid
Unnecessary or extra details makes the disclosure smudgy.Therefore, specific structural and functionality disclosed herein is thin
Section is not intended to restrictions, but as just the basis of claim and representative basis be used to instructing those skilled in the art with
Substantially any appropriate detailed construction diversely uses the disclosure.
This specification can be used phrase " in one embodiment ", " in another embodiment ", " in another embodiment
In " or " in other embodiments ", it can be referred to one or more of the identical or different embodiment according to the disclosure.
In the following, the embodiment of the present application is described in detail in conjunction with attached drawing.
The embodiment of the present application provides a kind of radiator, is used for an electronic equipment, as shown in Figure 1 to Figure 3, described to dissipate
Thermal includes pedestal 1, is contacted with the heat source 4 of the electronic equipment and thermally conductive, and the pedestal 1 is in the separate heat source 4
Multiple spaced cooling fins 2 have been extended to form to the direction far from the heat source 4 on end face, in each cooling fin 2
It is equipped with the first accommodating chamber 21, wherein the phase-change heat agent 3 undergone phase transition after being heated is provided in first accommodating chamber 21.
Specifically, during the electronic equipment is run, the heat source 4 in electronic equipment can generate heat, by the pedestal 1 of radiator with
The contact of heat source 4 setting, and then conducted by the heat that the pedestal 1 issues heat source 4, pedestal 1 is in conduction heat sources 4
Heat when, pedestal 1 itself can be heated so that the phase transformation in the first accommodating chamber 21 in each cooling fin 2 of pedestal 1 dissipate
Thermit powder 3 is heated to be undergone phase transition, and the phase-change heat agent 3 is by heat absorption heat and evaporates, and the phase-change heat agent 3 after evaporation is along first
The cavity wall of accommodating chamber 21 is moved upward, and when being moved to the top of chamber of the first accommodating chamber 21, due to conduction to first
The heat at the top of the chamber of accommodating chamber 21 is less, and the phase-change heat agent 3 after evaporation is constantly accommodated to first in moving process
The side chamber wall of chamber 21 transmits heat, and then can condense in the top area of the chamber of the first accommodating chamber 21, by heat discharge to
The air and cavity wall of the chamber roof of first accommodating chamber 21, and then condensed phase-change heat agent 3 can be accommodated along described first
The side chamber wall of the chamber of chamber 21 flows to the bottom of the chamber of the first accommodating chamber 21, then this absorbs heat, and repeats above-mentioned first to absorb
Heat and the process for distributing heat after evaporation are radiated by the process constantly evaporated and condensed, realize and improve thermally conductive system
Number, the technical effect of improving heat radiation efficiency, while can also reduce space occupied by radiator and mitigate radiator it is whole
Body weight greatly improves the practicability and workability of above-mentioned radiator.Wherein, the phase transformation that phase-change heat agent 3 can be chosen
Material is more, for example, can be the electricity of 7100 signal of electronics fluorination liquid or Novec of 7000 model of Novec of 3M brand
Son fluorination liquid, all have lower operating pressure, phase transition temperature is room temperature, and if to further heat radiation performance, then
Refrigerant can also be selected to be substituted, such as R134a (HFA 134a), operating pressure can be relatively higher,
But it can guarantee that there is better heat dissipation performance, certainly, in actual use, the phase transformation being not limited in above-mentioned staged an uprising example
Coolant 3, as long as the phase-change heat agent 3 of selection can be suitable for above-mentioned radiator and can undergo phase transition simultaneously when heated
Play the function of heat dissipation.In addition, phase-change heat agent 3 employed in the radiator of above-mentioned technical proposal is preferably not
For water, on the one hand, when using water as phase-change heat agent 3, need to carry out vacuumize process in the first accommodating chamber 21, together
When, it there is provision of sintering capillary structure, still, the sintering capillary structure structure is relative complex, is difficult at this with relatively narrow
It is arranged in first accommodating chamber 21 in space, certainly, using 3D printing technique it is possible that laying out corresponding sintering capillary
Structure, but its cost is relatively high；In addition, water can be chemically reacted with various metals material, as cooling fin warp frequently with
Aluminium material, and even using sintering capillary structure has been made by 3D printing technique in cooling fin made of the aluminium material,
It still can not use water as phase-change heat agent, that is, when using water as phase-change heat agent, chemical stability is inadequate
Stablize, and then the reliability decrease of radiator entirety can be made, in this case, is just merely able to close using fine copper or copper
Golden material；It is, using above-mentioned electronics fluorination liquid (e.g., the electricity of 7000 model of Novec of 3M brand in phase-change heat agent 3
The electronics fluorination liquid of son fluorination 7100 signal of liquid Novec) or when refrigerant (e.g., R134a etc.), the phase-change heat agent 3
Compatibility with enough chemical stabilities and with various metals, enable to radiator entirety radiating efficiency and
Reliability in use is increased dramatically.
In order to further increase the heat dissipation effect of the radiator, in some embodiments of the present application, such as Fig. 2 institute
Show, the second accommodating chamber 11 is formed in the pedestal 1, and each first accommodating chamber 21 connects with second accommodating chamber 11
It is logical.Specifically, by the way that the second accommodating chamber 11 is arranged in pedestal 1, enable to phase-change heat agent 3 can be with heat source 4 more
It is close, and then absorption heat that can be more efficient, faster realize phase transformation, that is, by thermal evaporation, in addition, by making each institute
It states the first accommodating chamber 21 to be connected to second accommodating chamber 11, the phase transformation in each first accommodating chamber 21 is enabled to dissipate
The heat that thermit powder 3 is absorbed into is more uniform, improves the whole radiating efficiency of cooling fin 2, meanwhile, in the second accommodating chamber 11
After by thermal evaporation, the phase-change heat agent 3 of the gaseous state shape of formation relatively uniform can also flow to each heat dissipation for phase-change heat agent 3
Piece 2, and then improve 2 entirety of cooling fin and heat is distributed, improve the radiating efficiency of radiator entirety.In the present embodiment,
The used phase-change heat agent 3 in the first accommodating chamber 21 and the second accommodating chamber 11 in the radiator is preferably not yet
It is equally due to when using water as phase-change heat agent 3, needing in the first accommodating chamber 21 and the second accommodating chamber 11 for water
Vacuumize process is carried out, meanwhile, also still need in the first accommodating chamber 21 and the second accommodating chamber 11 of opposite small space
Setting sintering capillary structure, significantly improves production cost；In addition, further including that chemistry can occur with various metals material for water instead
The case where answering, its chemical stability caused to be not sufficiently stable, and then the reliability decrease of radiator entirety can be made.
In some embodiments of the present application, the pedestal 1 and each cooling fin 2 are all made of plastic cement material.Specifically
Ground, the plastic cement material have preferable high temperature resistant and heating conduction, are using plastic cement material, can be first according to above-mentioned pedestal 1
Corresponding mold is made with the shape and structure of cooling fin 2, and then realizes the injection to radiator entirety by way of injection molding
Molding, certainly, radiator will not directly do encapsulation process, carry out leak detection, tool with the radiator to the ejection formation
Body, it can be detected by way of filling liquid, later, also need to detect the plastic chamber in the radiator of the ejection formation
With the presence or absence of gas and being purged in wall, after completing corresponding detection, fill phase-change heat agent 3, and to above-mentioned injection at
The radiator of type is sealed processing, ultimately forms the radiator completely sealed.
In order to further increase the thermal conductivity of the radiator, in some embodiments of the present application, described
Two accommodating chambers 11 are formed with multiple grooves in the cavity wall close to the heat source 4, can by multiple groove structures of setting
So that the phase-change heat agent 3 being loaded in second accommodating chamber 11 can be with the second accommodating chamber of pedestal 1 under liquid condition
11 bottom of chamber face has bigger contact area, and then after the heat that pedestal 1 absorbs heat source 4, the phase-change heat agent 3 of liquid
The heat that the pedestal 1 is transmitted can be absorbed by bigger contact area, improve the effect that phase-change heat agent 3 absorbs heat
Rate, and then promote the radiating efficiency of entire radiator.
Certainly, in some embodiments of the present application, the pedestal 1 can also be all made of gold with each cooling fin 2
Belong to material or the pedestal 1 uses metal material, and each cooling fin 2 is all made of plastic cement material, specifically, in institute
When stating pedestal 1 using metal material, the aluminium of selection, can be by squeezing the metal material of selection as heat sink material
Molding after carrying out extrusion forming to metal material, also needs to carry out alkali cleaning, the based process work such as polishing to form the pedestal 1
Make, if the pedestal 1 formed when squeezing metal material does not have side wall, side can be installed by welding
Wall, and in the completed carries out leak detection and fliud flushing to pedestal 1, degassing processing, at this point, by the cooling fin 2 of plastics and gold
When the pedestal 1 of category material is assembled, seal bond material can be used, cooling fin 2 is bonded on the pedestal 1, and bonding
The preceding filling completed to the phase-change heat agent 3 in pedestal 1 and cooling fin 2 is handled.
In order to enable the phase-change heat agent 3 after evaporation in the chamber roof condensation liquefaction of first accommodating chamber 21
It is faster back to the bottom of the chamber of first accommodating chamber 21 afterwards, in some embodiments of the present application, such as Fig. 3 institute
Show, the arc-shaped setting of cavity wall of each first accommodating chamber 21 makes the chamber roof in first accommodating chamber 21
Phase-change heat agent 3 after condensation liquefaction can cavity wall arcuately faster realize reflux, to improve dissipating for phase-change heat agent 3
The thermal efficiency.
In addition, multiple cooling fins 2 are equally arranged in parallel in some embodiments of the present application, make institute
Preferable radiating efficiency can be had in heat dissipation by stating radiator, and multiple cooling fins 2 are equally arranged in parallel
The occupied bulk of radiator can be preferably reduced, so that radiator can be applied to smaller size installation space
Electronic equipment, such as ultra-thin notes side computer, tablet computer or portable notebook computer etc., and it is each it is described first appearance
Chamber 21 of receiving in the roof far from 4 side of heat source is in arc-shaped setting, be more advantageous in gasiform phase-change heat agent 3 with
The roof far from 4 side of heat source of first accommodating chamber 21 carries out heat exchange, faster to liquefy and then be back to the first appearance
It receives chamber 21, and carries out absorption heat again.
Meanwhile in some embodiments of the present application, multiple cooling fins 2 are annular in shape and angles is waited to be arranged, can be with
It is that heat source 4 is set in the interior or described pedestal 1 by pedestal 1 to be arranged around the heat source 4, so that the heat dissipation
Device can have preferable radiating efficiency in heat dissipation, and annularly wait angles setting that can make multiple cooling fins 2
Obtain each cooling fin 2 has biggish spacing between the side of the side far from cricoid center line, is more advantageous to heat dissipation, into
And enable the phase-change heat agent 3 of gaseous state shape in cooling fin 2 in the side of the side far from cricoid center line corresponding the
It liquefies faster on the side wall of one accommodating chamber 21, radiating efficiency is improved, likewise, the occupied object of the radiator of the structure
Reason space is also sufficiently small, enables to save space using the electronic equipment of the radiator of the structure, and have good heat dissipation
Effect；Each first accommodating chamber 21 is in arc-shaped setting in the roof far from 4 side of heat source, is similarly served to favor in gas
The roof far from 4 side of heat source of the phase-change heat agent 3 of body shape and the first accommodating chamber 21 carries out heat exchange, with faster liquid
Change and then be back to the first accommodating chamber 21, and carries out absorption heat again.
The embodiment of the present application also provides a kind of electronic equipment, comprising: the first noumenon and above-mentioned radiator, it is described
A heat source 4 is formed on the first noumenon；The radiator is arranged on the heat source 4, and specifically, the electronic equipment can be with
For laptop, tablet computer, at least one of mobile phone or server.During electronic equipment operation,
Heat source 4 in electronic equipment can generate heat, and the pedestal 1 of radiator be contacted setting with the heat source 4, and then pass through the pedestal
The heat that 1 pair of heat source 4 issues conducts, and in the heat of conduction heat sources 4, pedestal 1 itself can be heated pedestal 1, so that
The phase-change heat agent 3 in the first accommodating chamber 21 in each cooling fin 2 of pedestal 1 is heated to be undergone phase transition, the phase-change heat agent 3 by
Heat absorption heat simultaneously evaporates, and the phase-change heat agent 3 after evaporation is moved upward along the cavity wall of the first accommodating chamber 21, and in movement
It is less due to conducting heat to the top of the chamber of the first accommodating chamber 21 when to the top of the chamber of the first accommodating chamber 21, it steams
Phase-change heat agent 3 after hair constantly transmits heat to the side chamber wall of the first accommodating chamber 21 in moving process, and then can be first
It is condensed when the top area of the chamber of accommodating chamber 21, heat is discharged to the air and chamber of the chamber roof to the first accommodating chamber 21
Wall, and then condensed phase-change heat agent 3 can flow to the first accommodating chamber 21 along the side chamber wall of the chamber of first accommodating chamber 21
Chamber bottom, then this absorbs heat, and repeat it is above-mentioned first absorb heat and distribute the process of heat after evaporation, by not
The process of disconnected evaporation and condensation radiates, and realizes and improves thermal coefficient, the technical effect of improving heat radiation efficiency, while can also
Reduce radiator occupied by space and mitigate radiator overall weight, greatly improve the practicability of above-mentioned radiator with
And workability.
In some embodiments of the present application, the electronic equipment further includes the second ontology, second ontology with it is described
The first noumenon to connect in which can change relative position, and in the present embodiment, the electronic equipment can be laptop,
In, described first is the system end of the laptop, and second ontology is the display end of the laptop.
It is apparent to those skilled in the art that for convenience and simplicity of description, the data of foregoing description
The electronic equipment that processing method is applied to, can be with reference to the corresponding description in before-mentioned products embodiment, and details are not described herein.
Above embodiments are only the exemplary embodiment of the application, are not used in limitation the application, the protection scope of the application
It is defined by the claims.Those skilled in the art can make respectively the application in the essence and protection scope of the application
Kind modification or equivalent replacement, this modification or equivalent replacement also should be regarded as falling within the scope of protection of this application.
Claims (10)
1. a kind of radiator, is used for an electronic equipment, the radiator includes:
Pedestal contacts and thermally conductive with the heat source of the electronic equipment, and the pedestal is on the end face far from the heat source to remote
Direction from the heat source has extended to form multiple spaced cooling fins, is equipped with the first receiving in each cooling fin
Chamber, wherein the phase-change heat agent undergone phase transition after being heated is provided in first accommodating chamber.
2. radiator according to claim 1, wherein it is formed with the second accommodating chamber in the pedestal, each described
One accommodating chamber is connected to second accommodating chamber.
3. radiator according to claim 2, the pedestal and each cooling fin are all made of plastic cement material.
4. radiator according to claim 2, second accommodating chamber is formed in the cavity wall close to the heat source
Multiple grooves.
5. radiator according to claim 1, the pedestal uses metal material, and each cooling fin is all made of modeling
Glue material matter.
6. radiator according to claim 1, wherein the arc-shaped setting of cavity wall of each first accommodating chamber.
7. radiator according to claim 1, wherein multiple cooling fins are equally arranged in parallel, Mei Gesuo
It is in arc-shaped setting that the first accommodating chamber, which is stated, in the roof far from the heat source side.
8. radiator according to claim 1, wherein multiple cooling fins are annular in shape and angles is waited to be arranged, each
First accommodating chamber is in arc-shaped setting in the roof far from the heat source side.
9. a kind of electronic equipment, comprising:
The first noumenon is formed with a heat source thereon；
Such as the described in any item radiators of claim 1-8, the radiator is arranged on the heat source.
10. electronic equipment according to claim 9, further includes:
Second ontology, second ontology are connect in which can change relative position with the first noumenon.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910701772.0A CN110505791A (en) | 2019-07-31 | 2019-07-31 | A kind of radiator and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910701772.0A CN110505791A (en) | 2019-07-31 | 2019-07-31 | A kind of radiator and electronic equipment |
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| CN110505791A true CN110505791A (en) | 2019-11-26 |
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| CN201910701772.0A Pending CN110505791A (en) | 2019-07-31 | 2019-07-31 | A kind of radiator and electronic equipment |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111246708A (en) * | 2020-01-13 | 2020-06-05 | 广州视源电子科技股份有限公司 | Heat sink and method for manufacturing the same |
| CN111765788A (en) * | 2020-07-16 | 2020-10-13 | 深圳市飞荣达科技股份有限公司 | Novel phase change temperature-uniforming plate |
| US11222830B2 (en) * | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
| CN114096108A (en) * | 2020-08-24 | 2022-02-25 | 华为技术有限公司 | Heat sink and method for manufacturing the same |
| WO2022148435A1 (en) * | 2021-01-08 | 2022-07-14 | 华为技术有限公司 | Radiator and communication device |
| CN115243512A (en) * | 2022-07-12 | 2022-10-25 | 杭州逗酷软件科技有限公司 | Radiator and wireless network equipment |
| WO2023016281A1 (en) * | 2021-08-13 | 2023-02-16 | Telefonaktiebolaget Lm Ericsson (Publ) | Phase change heatsink, manufacturing process thereof, and communication device having the heatsink |
| WO2024037278A1 (en) * | 2022-08-15 | 2024-02-22 | 中兴通讯股份有限公司 | Heat dissipation apparatus, circuit board, communication device, electronic device, and communication base station |
| CN118017348A (en) * | 2024-04-10 | 2024-05-10 | 北京融为科技有限公司 | Heat dissipation mechanism, laser communication load and satellite |
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| US11222830B2 (en) * | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
| CN111246708A (en) * | 2020-01-13 | 2020-06-05 | 广州视源电子科技股份有限公司 | Heat sink and method for manufacturing the same |
| CN111765788A (en) * | 2020-07-16 | 2020-10-13 | 深圳市飞荣达科技股份有限公司 | Novel phase change temperature-uniforming plate |
| CN114096108A (en) * | 2020-08-24 | 2022-02-25 | 华为技术有限公司 | Heat sink and method for manufacturing the same |
| WO2022148435A1 (en) * | 2021-01-08 | 2022-07-14 | 华为技术有限公司 | Radiator and communication device |
| WO2023016281A1 (en) * | 2021-08-13 | 2023-02-16 | Telefonaktiebolaget Lm Ericsson (Publ) | Phase change heatsink, manufacturing process thereof, and communication device having the heatsink |
| CN115243512A (en) * | 2022-07-12 | 2022-10-25 | 杭州逗酷软件科技有限公司 | Radiator and wireless network equipment |
| WO2024037278A1 (en) * | 2022-08-15 | 2024-02-22 | 中兴通讯股份有限公司 | Heat dissipation apparatus, circuit board, communication device, electronic device, and communication base station |
| CN118017348A (en) * | 2024-04-10 | 2024-05-10 | 北京融为科技有限公司 | Heat dissipation mechanism, laser communication load and satellite |
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