CN111765788A - Novel phase change temperature-uniforming plate - Google Patents
Novel phase change temperature-uniforming plate Download PDFInfo
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- CN111765788A CN111765788A CN202010688377.6A CN202010688377A CN111765788A CN 111765788 A CN111765788 A CN 111765788A CN 202010688377 A CN202010688377 A CN 202010688377A CN 111765788 A CN111765788 A CN 111765788A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of electronic element heat dissipation, in particular to a novel phase change temperature-uniforming plate, which comprises: the heat source type heat-insulating plate comprises a temperature-insulating plate main body, wherein one side of the temperature-insulating plate main body is a heat source side, the temperature-insulating plate main body is formed by overlapping two cover plates, a sunken area is arranged on the inner side wall of at least one cover plate, a closed cavity is formed by the inner side wall of the other cover plate, a plurality of flow channels extending to two ends of the cavity are arranged in the cavity in a staggered mode, and a feed inlet communicated with the cavity is formed in the side end of the temperature-insulating plate; the phase change liquid is injected into the cavity through the feed inlet and flows along the plurality of flow channels under the action of gravity; the capillary structure is filled in one of the flow channels and extends to the two ends of the cavity along the direction of the gravity force exerted on the phase change liquid, the phase change liquid at the bottom of the temperature equalizing plate is absorbed to the top by the capillary structure through the capillary action, the heat at the top is taken away quickly through phase change, and the heat dissipation effect of the whole temperature equalizing plate is greatly improved.
Description
Technical Field
The invention relates to the technical field of electronic element heat dissipation, in particular to a novel phase-change temperature-uniforming plate.
Background
With the continuous development of communication technology, the continuous breakthrough and popularization of the 5G technology, the power consumption of the built base station is also larger and larger, which means that the heat generated by the internal elements during working is also larger and larger, and in addition, the base station is generally built outdoors and is influenced by outdoor temperature, if the temperature is not well controlled, the reliability of the internal elements is influenced, so that the power consumption is larger, the temperature is further increased, the heat cycle is deteriorated, and the difficulty in maintaining the base station is increased.
The traditional aluminium system heat dissipation teeth piece that adopts is applied to communications facilities, and it is inside for solid, dispels the heat through the effect of aluminium part heat conduction, involves that 5G basic station internal component is numerous, and the space is limited, and installation traditional aluminium system heat dissipation teeth piece not only occupation space is big, still can increase the weight of equipment. In addition, the limited thermal conductivity and temperature equalization effect of the heat dissipation fins can not meet the heat dissipation requirement of the current base station.
The heat dissipation plate replaces the traditional heat dissipation mode, and the purpose of heat dissipation is achieved by quickly absorbing heat through the internal working liquid phase change characteristics, but the existing heat dissipation plate is unreasonable in internal structural design, so that the working liquid phase change effect is poor, and the heat dissipation effect is affected.
Disclosure of Invention
In view of the above, embodiments of the present invention are proposed to provide a novel phase change vapor cell that overcomes or at least partially solves the above problems.
In order to solve the above problems, an embodiment of the present invention discloses a novel phase change temperature-uniforming plate, including:
the heat source type heat-insulating plate comprises a temperature-insulating plate main body, wherein one side of the temperature-insulating plate main body is a heat source side, the temperature-insulating plate main body is formed by overlapping two cover plates, a sunken area is arranged on the inner side wall of at least one cover plate, a closed cavity is formed by the inner side wall of the other cover plate, a plurality of flow channels extending to two ends of the cavity are arranged in the cavity in a staggered mode, and a feed inlet communicated with the cavity is formed in the side end of the temperature-insulating plate;
the phase change liquid is injected into the cavity through the feed inlet and flows along the plurality of flow channels under the action of gravity;
and the capillary structure is filled in at least one of the flow passages and extends to two ends of the cavity along the direction of the gravity applied to the phase-change liquid.
Further, a first capillary structure is arranged in the flow channel close to the heat source side.
Further, a plurality of second capillary structures extend from the periphery of the first capillary structure.
Further, the capillary structure is made of porous materials with adsorption effect, such as fibers, silk screen, copper/aluminum foam and the like.
Furthermore, the capillary structure can be in the form of branches and trunks by using the principle of bionics as a reference.
Furthermore, a plurality of convex blocks which are abutted against the inner side wall of the other cover plate are uniformly distributed on the inner wall of at least one concave area, a gap is arranged between two adjacent convex blocks, and a plurality of staggered flow channels are formed between the plurality of convex blocks and the inside of the cavity.
Furthermore, the inner side wall of the cover plate provided with the sunken area is provided with a through groove for communicating the sunken area with the outside and is overlapped with another cover plate to form the feed inlet.
Further, the phase change liquid is a refrigerant.
Furthermore, a heat conducting substrate is arranged outside the temperature equalizing plate main body and close to the heat source side, and a plurality of temperature equalizing plate main bodies are arranged on the heat conducting substrate.
Further, the depressed region is made by an inflation process.
The embodiment of the invention has the following advantages: according to the invention, the phase-change liquid flows under the action of gravity, the flowing direction and flow of the phase-change liquid are controlled by the bumps, the flowing rule of the phase-change liquid is uniform, and meanwhile, a flow channel formed by a plurality of bumps is convenient for filling a capillary structure; the capillary structure extends along the gravity direction of the phase change liquid, the phase change liquid filled at the bottom of the temperature equalization plate is adsorbed to the top through the capillary structure, the heat dissipation effect of the top is improved, the second capillary structure extending in the circumferential direction uses the bionics principle for reference, the phase change liquid in the first capillary structure is circumferentially diffused in a branch shape, the heat dissipation area inside the temperature equalization plate is increased, and the integral heat dissipation function of the temperature equalization plate is further improved; in addition, after the phase change liquid is heated and evaporated, the phase change liquid is cooled and liquefied by the side wall of the top of the temperature equalizing plate and flows back to the phase change liquid at the bottom through the flow channel to form gas-liquid phase change circulation, so that the heat dissipation effect of the whole temperature equalizing plate is greatly improved, and the temperature equalizing plate is energy-saving and environment-friendly.
Drawings
FIG. 1 is a schematic structural view of a vapor chamber body according to the present invention;
FIG. 2 is a schematic view of the structure of the cover plate of the present invention;
FIG. 3 is a schematic view of the distribution of the capillary structure in the cover plate according to the present invention;
FIG. 4 is another schematic view of the distribution of the capillary structure in the cover plate according to the present invention;
FIG. 5 is a schematic view of a plurality of uniform temperature plate bodies mounted on a heat conducting substrate according to the present invention;
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
One of the core ideas of the embodiment of the invention is that by utilizing the principles of phase change liquid condensation and evaporation and gravity flow of liquid, a capillary structure for absorbing the phase change liquid at the bottom is arranged in the temperature-uniforming plate along the liquid flow direction to enhance the heat absorption and heat dissipation capacity of the top of the temperature-uniforming plate, and the capillary structure can be reasonably arranged according to the arrangement condition of internal flow channels in the temperature-uniforming plate to improve the heat absorption and heat dissipation effects of all parts of the temperature-uniforming plate.
Referring to fig. 1 to 5, a novel phase change vapor chamber of the present invention is shown, including:
the heat source type uniform temperature plate comprises a uniform temperature plate main body 10, wherein one side of the uniform temperature plate main body 10 is a heat source side, the uniform temperature plate main body 10 is formed by overlapping two cover plates 11, a concave area 12 is arranged on the inner side wall of at least one of the cover plates 11, a closed cavity is formed by the inner side wall of the other cover plate 11, a plurality of flow channels 16 extending to two ends of the cavity are arranged in the cavity in a staggered mode, and a feed inlet 14 communicated with the cavity is formed in the side end of the uniform temperature plate;
the phase change liquid 15 is injected into the cavity through the feed port 14 and flows along the flow channels 16 under the action of gravity;
and the capillary structure 17 is filled in at least one flow channel 16 and extends to two ends of the cavity along the direction of the gravity force applied to the phase-change liquid.
The cover plate 11 is generally made of aluminum, and has good thermal conductivity and plasticity, and is convenient for forming the concave region 12 and simple to manufacture.
At least one of the two cover plates 11 forms the concave area 12, a chamber for flowing the phase-change liquid 15 is formed, and a plurality of bumps 13 are uniformly arranged in the chamber to limit the flow direction and the flow quantity of the phase-change liquid 15, and simultaneously, the capillary structure 17 is convenient to fill, so that the capillary structure 17 is more stable in the formed flow channel 16.
The capillary structure 17 is arranged in the formed flow channel 16 and can be in various shapes and structures, and most importantly, the capillary structure 17 is arranged according to the direction of the gravity applied to the phase-change liquid 15, so that the phase-change liquid 15 at the bottom is introduced into the top through the adsorption effect of the capillary structure 17, and the heat exchange can be rapidly carried out after the top is heated.
Quantitative phase change liquid 15 is injected into the cavity, the interior of the cavity needs to be vacuumized after injection, meanwhile, the feed port 14 is sealed to prevent the leakage of the phase change liquid 15, the phase change liquid 15 is positioned at the middle bottom of the cavity under the action of gravity, the phase change liquid 15 is sucked to the top through the capillary structure 17, the heat is conducted by an external heat source on the temperature equalizing plate, the aluminum cover plate 11 quickly conducts heat to the interior of the cavity, the phase change liquid 15 adsorbed in the phase change liquid 15 is heated and evaporated after the capillary structure 17 at the top close to the heat source conduction direction is heated, the phase change liquid 15 is evaporated to the top and nearby flow channels 16 far away from the heat source, steam is condensed at the positions with lower temperature, the absorbed heat is consumed in the liquid-vapor-liquid exchange process, the liquid flows into the phase change liquid 15 at the bottom of the cavity along the flow channels 16 after liquid change, the absorbed heat is continuously, compared with the traditional temperature-uniforming plate with poor top heat dissipation, the temperature-uniforming plate has obvious improvement. In this embodiment, the first capillary structure 171 is provided in the flow channel 16 near the heat source side, and the capillary structure 17 is provided in the chamber near the flow channel 16 near the heat source side, so that the absorbed heat can be consumed quickly.
In this embodiment, first capillary structure 171 circumference extension is equipped with many second capillary structures 172, carries out corresponding setting to capillary structure 17 based on the direction that liquid received gravity, can use the bionics principle for reference, adopts the branch type structure, carries the condensing agent of branch root (bottom) other positions of novel samming board, and second capillary structure 172 strengthens the effect of the double-phase circulation of gas-liquid, further the temperature on average novel samming board surface promptly.
In the present embodiment, the capillary structure 17 is made of a porous material having an adsorption effect, such as a fiber, a wire mesh, a copper/aluminum foam, or the like.
In this embodiment, a plurality of bumps 13 abutting against the inner sidewall of the other cover plate 11 are uniformly distributed on the inner wall of at least one of the recessed regions 12, a gap is provided between two adjacent bumps 13, and a plurality of staggered flow channels 16 are formed between the plurality of bumps 13 and the inside of the chamber.
In this embodiment, be equipped with on the inside wall of the apron 11 of sunken territory 12 communicate this sunken territory 12 with outside logical groove, with another apron 11 overlap and form the feed inlet 14, feed inlet 14 and the inside intercommunication of cavity, two apron 11 link together through hot pressing or welded mode, and the cavity passes through feed inlet 14 and outside intercommunication, before sealing, at first carries out impurity clearance through feed inlet 14 to its inside, then pours into phase transition liquid 15 after the extraction vacuum into, seals the processing again.
In this embodiment, the phase change liquid 15 is a refrigerant.
In this embodiment, a heat conducting substrate 18 is disposed outside the temperature equalizing plate main body 10 and near the heat source side, a plurality of temperature equalizing plate main bodies 10 are disposed on the heat conducting substrate 18, the heat conducting substrate 18 integrates a plurality of temperature equalizing plates, the heat conducting substrate 18 can be used as a heat source point for equalizing temperature, the heat conducting substrate 18 is mounted on a heating portion of an electronic component, the material of the heat conducting substrate 18 is also aluminum, and the connection manner between the temperature equalizing plate and the heat conducting substrate 18 can be fixed or detachable.
In this embodiment, the concave region 12 is manufactured by inflation processing, and the concave region 12 is processed by an inflation process, so that the forming effect is good, and the overall structure is good.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is made on the novel phase-change vapor chamber provided by the present invention, and the principle and the implementation manner of the present invention are explained by applying a specific example, and the description of the above example is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (9)
1. A novel phase change vapor chamber, comprising:
the heat source type heat-insulating plate comprises a temperature-insulating plate main body, wherein one side of the temperature-insulating plate main body is a heat source side, the temperature-insulating plate main body is formed by overlapping two cover plates, a sunken area is arranged on the inner side wall of at least one cover plate, a closed cavity is formed by the inner side wall of the other cover plate, a plurality of flow channels extending to two ends of the cavity are arranged in the cavity in a staggered mode, and a feed inlet communicated with the cavity is formed in the side end of the temperature-insulating plate;
the phase change liquid is injected into the cavity through the feed inlet and flows along the plurality of flow channels under the action of gravity;
and the capillary structure is filled in at least one of the flow passages and extends to two ends of the cavity along the direction of the gravity applied to the phase-change liquid.
2. The vapor chamber of claim 1, wherein a first capillary structure is disposed in the flow channel adjacent to the heat source side.
3. The vapor-deposition plate according to claim 2, wherein the first capillary structure is circumferentially extended with a plurality of second capillary structures.
4. The vapor-temperature plate according to claim 1, wherein the capillary structure is made of porous material with adsorption effect such as fiber, silk screen, copper/aluminum foam and the like.
5. The temperature-equalizing plate of claim 1, wherein a plurality of protrusions abutting against the inner sidewall of the other cover plate are uniformly distributed on the inner wall of at least one of the recessed regions, a gap is formed between two adjacent protrusions, and a plurality of staggered flow channels are formed between the plurality of protrusions and the interior of the chamber.
6. The temperature-equalizing plate of claim 1, wherein the inner sidewall of the cover plate with the recessed area is provided with a through groove for communicating the recessed area with the outside, and the through groove overlaps with another cover plate to form the feed port.
7. The vapor-temperature plate according to claim 1, wherein the phase change liquid is a refrigerant.
8. The vapor plate of claim 1, wherein a thermally conductive substrate is disposed on an exterior of the vapor plate body adjacent to the heat source side, and a plurality of the vapor plate bodies are disposed on the thermally conductive substrate.
9. The vapor chamber of claim 1, wherein the recessed areas are formed by an inflation process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010688377.6A CN111765788A (en) | 2020-07-16 | 2020-07-16 | Novel phase change temperature-uniforming plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010688377.6A CN111765788A (en) | 2020-07-16 | 2020-07-16 | Novel phase change temperature-uniforming plate |
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| CN111765788A true CN111765788A (en) | 2020-10-13 |
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| CN202010688377.6A Pending CN111765788A (en) | 2020-07-16 | 2020-07-16 | Novel phase change temperature-uniforming plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113053841A (en) * | 2021-03-12 | 2021-06-29 | 深圳市飞荣达科技股份有限公司 | Three-dimensional VC temperature-equalizing device |
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