CN220021896U - Annular macro-channel laser heat sink - Google Patents
Annular macro-channel laser heat sink Download PDFInfo
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- CN220021896U CN220021896U CN202320999202.6U CN202320999202U CN220021896U CN 220021896 U CN220021896 U CN 220021896U CN 202320999202 U CN202320999202 U CN 202320999202U CN 220021896 U CN220021896 U CN 220021896U
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- heat sink
- sink body
- macro
- cover plate
- channel
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- 239000007788 liquid Substances 0.000 claims abstract description 27
- 239000000110 cooling liquid Substances 0.000 claims abstract description 21
- 238000003466 welding Methods 0.000 claims abstract description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000012809 cooling fluid Substances 0.000 claims description 3
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 19
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an annular macro-channel laser heat sink, comprising: the heat sink comprises a heat sink body, wherein a through hole is formed in the middle of the heat sink body, a plurality of laser welding surfaces are arranged on the inner wall of the through hole, grooves communicated with each other are formed in the upper end face and the lower end face of the heat sink body, liquid inlet holes and liquid outlet holes are formed in the two sides of the heat sink body, and the liquid inlet holes and the liquid outlet holes are communicated with the grooves; the first cover plate is welded with the groove on the upper end surface of the heat sink body; the second cover plate is welded with the groove on the lower end surface of the heat sink body; the inner cavity formed by the first cover plate, the second cover plate and the groove is a cooling liquid channel. According to the utility model, the first cover plate and the second cover plate are welded with the heat sink body to form the integrated cooling liquid channel, so that the sealing performance of the cooling liquid channel is improved, leakage is avoided, and the reliability of the laser is improved.
Description
Technical Field
The utility model relates to the technical field of lasers, in particular to an annular macro-channel laser heat sink.
Background
In recent years, with the development of application technology of solid-state lasers, in some application fields, higher requirements on a light-emitting surface of the laser, a divergence angle, directivity and the like of the laser are put forward, the innovative design of a heat sink of the laser can fulfill the requirements, and the photoelectric performance of the laser is further met by matching with a specific heat dissipation mode. The traditional laser radiating mode is roughly divided into a heat conduction mode and a liquid cooling mode, the radiating performance is definitely higher in liquid cooling radiating efficiency, the liquid is adopted for radiating, various channel designs and applications of heat sinks are needed, and the macro channel is formed, so that the liquid radiating requirement of the laser is met, and the requirement on liquid is reduced.
The traditional macro-channel laser heat sink adopts a sealing ring mode to seal a structure combination key area in practical application, so as to ensure the tightness of a macro-channel, and for a relatively complex heat sink (annular structure) with a special-shaped structure, more sealing rings are used for carrying out plane sealing or axial sealing.
In carrying out the utility model, the inventors have found that at least the following problems exist in the prior art: the application of the sealing ring in the macro-channel laser heat sink needs to consider the sealing effect, and the key indexes of the sealing ring are the type, the material, the processing precision of the sealing surface, the applied pressure and the like of the sealing ring, and the sealing performance is reduced due to the mismatch of the type of any one index and the change of the use environment. There is room for improvement in existing macro-channel laser heatsinks.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems in the related art to a certain extent.
Therefore, the utility model aims to provide the annular macro-channel laser heat sink which is good in sealing performance and high in reliability.
In order to achieve the above object, the present utility model provides a heat sink for a ring macro-channel laser, comprising:
the heat sink comprises a heat sink body, wherein a through hole is formed in the middle of the heat sink body, a plurality of laser welding surfaces are arranged on the inner wall of the through hole, grooves communicated with each other are formed in the upper end face and the lower end face of the heat sink body, liquid inlet holes and liquid outlet holes are formed in the two sides of the heat sink body, and the liquid inlet holes and the liquid outlet holes are communicated with the grooves;
the first cover plate is welded with the groove on the upper end face of the heat sink body;
the second cover plate is welded with the groove on the lower end face of the heat sink body;
the inner cavity formed by the first cover plate, the second cover plate and the groove is a cooling liquid channel.
According to the annular macro-channel laser heat sink, the first cover plate and the second cover plate are welded with the heat sink body to form the integrated cooling liquid channel, compared with a cooling liquid channel formed by sealing the traditional cover plate and the heat sink body by using the sealing ring, the structure is simplified, the sealing performance of the cooling liquid channel is improved, leakage is avoided, the reliability of a laser is improved, and the use requirement of the laser in a severe environment is met.
According to one embodiment of the utility model, the outer ring of the groove is provided with a first step, the inner ring of the groove is provided with a second step, the top surfaces of the first step and the second step are positioned on the same horizontal plane, and the top surfaces of the first step and the second step are welded with the bottom surfaces of the first cover plate and the second cover plate respectively.
According to one embodiment of the utility model, the grooves of the upper end face of the heat sink body and the grooves of the lower end face of the heat sink body are communicated through a plurality of through holes.
According to one embodiment of the utility model, the central normal of each laser welding surface converges on the central axis of the heat sink body, and each laser welding surface has the same number of through holes as the area between the laser welding surface and the outer side of the heat sink body projected to the laser welding surface.
According to one embodiment of the utility model, fins are arranged in the cooling liquid channel.
According to one embodiment of the utility model, the outer side surface of the heat sink body is provided with a plurality of positioning parts.
According to one embodiment of the utility model, a mounting hole penetrating through the inner wall of the heat sink body is arranged between the adjacent laser welding surfaces.
According to one embodiment of the utility model, the heat sink body is made of oxygen-free copper or tungsten-copper alloy.
According to one embodiment of the utility model, the inner wall of the cooling liquid channel is gold plated.
According to one embodiment of the utility model, the outer surfaces of the heat sink body, the first cover plate and the second cover plate are gold plated.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the utility model. Also, like reference numerals are used to designate like parts throughout the figures. Wherein:
fig. 1 is a schematic structural diagram of a heat sink of a ring macro-channel laser according to an embodiment of the present utility model.
Fig. 2 is a schematic diagram of an exploded structure of a heat sink of a ring macro-channel laser according to an embodiment of the present utility model.
Fig. 3 is a cross-sectional view taken along line A-A of fig. 1.
Fig. 4 is a schematic diagram illustrating a flow of cooling liquid in a heat sink of a ring macro-channel laser according to an embodiment of the present utility model.
Reference numerals illustrate:
the heat sink comprises a heat sink body, a first cover plate, a 3-liquid inlet, a 4-liquid outlet, a 5-laser welding surface, a 6-second cover plate, a 7-groove, a 11-positioning part, a 12-mounting hole, a 13-through hole, a 14-first step and a 15-second step.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model. On the contrary, the embodiments of the utility model include all alternatives, modifications and equivalents as may be included within the spirit and scope of the appended claims.
Fig. 1 is a schematic structural diagram of a heat sink of a ring macro-channel laser according to an embodiment of the present utility model. Referring to fig. 1 to 4, an embodiment of the present utility model proposes a circular macro-channel laser heat sink, which includes a heat sink body 1, a first cover plate 2, and a second cover plate 6.
The middle part of the heat sink body 1 is provided with a through hole, and the inner wall of the through hole is provided with a plurality of laser welding surfaces 5. The laser bonding surface 5 is used for fixing the semiconductor laser. The number of laser welding surfaces 5 can be designed according to practical needs. The upper end face and the lower end face of the heat sink body 1 are provided with grooves 7 which are communicated, the two sides of the heat sink body 1 are provided with liquid inlet holes 3 and liquid outlet holes 4, and the liquid inlet holes 3 and the liquid outlet holes 4 are communicated with the grooves 7. The liquid inlet hole 3 and the liquid outlet hole 4 can be exchanged in position, and the respective positions can be designed according to the needs.
The first cover plate 2 is welded with a groove 7 on the upper end surface of the heat sink body 1, and the second cover plate 6 is welded with a groove 7 on the lower end surface of the heat sink body 1. The inner cavity formed by the first cover plate 2, the second cover plate 6 and the groove 7 is a cooling liquid channel. In one embodiment, the first cover plate 2 and the second cover plate 6 are in the same shape and are in circular shapes, and are symmetrically distributed along two end surfaces of the heat sink body 1, and the grooves 7 are in the shape of a ring and are also symmetrically distributed along two end surfaces of the heat sink body 1.
According to the annular macro-channel laser heat sink, the first cover plate and the second cover plate are welded with the heat sink body to form the integrated cooling liquid channel, compared with a cooling liquid channel formed by sealing a traditional cover plate and the heat sink body by using the sealing ring, the structure is simplified, the sealing performance of the cooling liquid channel is improved, leakage is avoided, the reliability of a laser is improved, and the use requirement of the laser in a severe environment is met.
In one example, referring to fig. 2, the outer ring of the groove 7 is provided with a first step 14, the inner ring of the groove 7 is provided with a second step 15, the top surfaces of the first step 14 and the second step 15 are located at the same horizontal plane, and the top surfaces of the first step 14 and the second step 15 are welded with the bottom surfaces of the first cover plate 2 and the second cover plate 6, respectively. The spacing and height of the first step 14 and the second step 15 determine the cross-sectional area of the cooling fluid channel. The grooves 7 on the upper end surface of the heat sink body 1 are communicated with the grooves 7 on the lower end surface of the heat sink body 1 through a plurality of through holes 13. The through holes 13 are positioned between the first step 14 and the second step 15, so that the cooling liquid exchange speed of the upper cooling liquid channel and the lower cooling liquid channel of the heat sink body can be accelerated, and the heat dissipation capacity of the heat sink body is improved. In order to further improve the heat dissipation efficiency of the semiconductor laser, fins (not shown in the figure) are arranged in the cooling liquid channel, and can increase the contact area with cooling liquid and improve the heat exchange efficiency of the annular macro-channel laser heat sink.
In one example, the central normals of the respective laser welding faces 5 converge on the central axis of the heat sink body 1, each laser welding face 5 having the same number of through holes 13 as the area between its projection to the outer side of the heat sink body 1. The liquid inlet hole 3 or the liquid outlet hole 4 is communicated with the adjacent through hole 13. In the embodiment shown in fig. 2, the number of through holes 13 in the area between the laser welding surface 5 and the outer side surface of the heat sink body 1 is 3, so that a better heat dissipation effect is achieved.
In one example, the outer side of the heat sink body 1 has several positioning portions 11, the positioning portions 11 having positioning holes for positioning mounting of a plurality of annular macro-channel laser heat sinks. In an annular macro-channel laser heat sink, mounting holes 12 penetrating through the inner wall of the heat sink body 1 are formed between adjacent laser welding surfaces 5. The mounting hole 12 is used for mounting a semiconductor laser.
In one example, the heat sink body 1 is made of oxygen-free copper or tungsten copper alloy, and has high thermal conductivity and good solderability. The inner wall of the cooling liquid channel is plated with gold, which plays a role in preventing oxidation of the oxygen-free copper. In addition, gold is plated on the outer surfaces of the heat sink body 1, the first cover plate 2 and the second cover plate 6, and the effect of preventing oxidation on the oxygen-free copper side is also achieved.
In summary, the sealing performance of the annular macro-channel laser heat sink in the embodiment only needs to be evaluated once before use, namely, through an air pressure or hydraulic pressure maintaining test, the semiconductor laser does not need to evaluate the annular macro-channel laser heat sink again when being packaged with the annular macro-channel laser heat sink, and the processing man-hour of the laser device is greatly reduced.
It should be noted that in the description of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present utility model, the azimuth or positional relationship indicated by the terms "left", "right", "front", "rear", etc., are based on the azimuth or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and further implementations are included within the scope of the preferred embodiment of the present utility model in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present utility model.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.
Claims (10)
1. A circular macro-channel laser heatsink, comprising:
the heat sink comprises a heat sink body (1), wherein a through hole is formed in the middle of the heat sink body (1), a plurality of laser welding surfaces (5) are arranged on the inner wall of the through hole, grooves (7) which are communicated are formed in the upper end face and the lower end face of the heat sink body (1), liquid inlet holes (3) and liquid outlet holes (4) are formed in the two sides of the heat sink body (1), and the liquid inlet holes (3) and the liquid outlet holes (4) are communicated with the grooves (7);
the first cover plate (2) is welded with a groove (7) on the upper end surface of the heat sink body (1);
the second cover plate (6) is welded with the groove (7) on the lower end surface of the heat sink body (1);
the inner cavity formed by the first cover plate (2), the second cover plate (6) and the groove (7) is a cooling liquid channel.
2. The annular macro-channel laser heat sink according to claim 1, wherein the outer ring of the groove (7) is provided with a first step (14), the inner ring of the groove (7) is provided with a second step (15), the top surfaces of the first step (14) and the second step (15) are located on the same horizontal plane, and the top surfaces of the first step (14) and the second step (15) are welded with the bottom surfaces of the first cover plate (2) and the second cover plate (6), respectively.
3. The annular macro-channel laser heat sink according to claim 1, wherein the grooves (7) of the upper end surface of the heat sink body (1) and the grooves (7) of the lower end surface of the heat sink body (1) are communicated through a plurality of through holes (13).
4. The annular macro-channel laser heat sink according to claim 1, characterized in that the central normal of each laser welding surface (5) converges at the central axis of the heat sink body (1), each laser welding surface (5) having the same number of through holes (13) as the area between its projection to the outer side of the heat sink body (1).
5. The annular macro-channel laser heat sink of claim 1 wherein fins are disposed within the cooling fluid channel.
6. The annular macro-channel laser heat sink according to claim 1, characterized in that the outer side of the heat sink body (1) has several positioning parts (11).
7. The annular macro-channel laser heat sink according to claim 1, wherein mounting holes (12) penetrating the inner wall of the heat sink body (1) are provided between adjacent laser welding faces (5).
8. The annular macro-channel laser heat sink according to any of claims 1 to 7, wherein the heat sink body (1) is made of oxygen free copper or tungsten copper alloy.
9. The annular macro-channel laser heat sink of claim 8 wherein the inner wall of the cooling fluid channel is gold plated.
10. The annular macro-channel laser heatsink according to claim 8, wherein the outer surfaces of the heatsink body (1), the first cover plate (2) and the second cover plate (6) are gold plated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202320999202.6U CN220021896U (en) | 2023-04-27 | 2023-04-27 | Annular macro-channel laser heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202320999202.6U CN220021896U (en) | 2023-04-27 | 2023-04-27 | Annular macro-channel laser heat sink |
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CN220021896U true CN220021896U (en) | 2023-11-14 |
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CN202320999202.6U Active CN220021896U (en) | 2023-04-27 | 2023-04-27 | Annular macro-channel laser heat sink |
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CN (1) | CN220021896U (en) |
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- 2023-04-27 CN CN202320999202.6U patent/CN220021896U/en active Active
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