CN218730930U

CN218730930U - Ceramic copper-clad substrate pre-coated with sintering material

Info

Publication number: CN218730930U
Application number: CN202223019454.2U
Authority: CN
Inventors: 杨晓战
Original assignee: Shenzhen Sirui Chenxin Material Co ltd
Current assignee: Shenzhen Sirui Chenxin Material Co ltd
Priority date: 2022-11-14
Filing date: 2022-11-14
Publication date: 2023-03-24
Anticipated expiration: 2032-11-14

Abstract

The utility model discloses a copper base plate is covered to pottery that sintered material covers in advance relates to electronic component packaging technology field, cover the copper base plate including pottery, the top that the pottery covered the copper base plate is through the positive sintered material board of laminating structure fixedly connected with, the top fixed mounting of positive sintered material board has locating component, the top of positive sintered material board is provided with the chip, the pottery covers the bottom of copper base plate and passes through heat dissipation connection structure fixedly connected with back sintered material board. The utility model discloses an install positive sintered material board at the activity inslot that the copper base plate top was covered to pottery, the dovetail groove that the bottom upper surface was seted up can carry out the block with the interlayer better and connect, reduces the gap that bottom and interlayer are connected, and the dovetail groove that the articulamentum bottom was seted up can further reduce the gap that articulamentum and interlayer block are connected, and the half slot that the articulamentum top was seted up can make articulamentum and buffer layer laminating inseparabler, improves the leakproofness, reduces the joint gap.

Description

Ceramic copper-clad substrate pre-coated with sintering material

Technical Field

The utility model relates to an electronic component packaging technology field, concretely relates to sintering material pre-coated's pottery covers copper base plate.

Background

With the development of light and intelligent industrial products, the packaging requirements for electronic components are higher and higher. The ceramic copper-clad substrate has the advantages of good heat-conducting property, low cost and light weight, so the ceramic copper-clad substrate has great advantages in the packaging operation of the power module.

The following problems exist in the prior art:

in the existing ceramic copper-clad substrate pre-coated with a sintering material, the ceramic substrate completes the connection of a part of connection electrodes or connection surfaces of a chip through a surface copper-clad layer, and a gap is easily generated on the surface of the ceramic substrate when the copper-clad layer is coated, so that the normal work of the chip is influenced; in the existing ceramic copper-clad substrate pre-coated with a sintered material, because a lot of gullies or gaps exist between the bottom surface of a radiator and the surface of the ceramic copper-clad substrate, all the gaps are air, and because the air is a poor thermal conductor, the air gaps can seriously affect the heat dissipation efficiency, the performance of the radiator is greatly reduced, and even the radiator cannot play a role.

SUMMERY OF THE UTILITY MODEL

The utility model provides a ceramic that sintered material covered in advance covers copper base plate to solve the problem that proposes in the above-mentioned background art.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:

the utility model provides a copper base plate is covered to pottery that sintered material was covered in advance, includes that pottery covers the copper base plate, the top that pottery covers the copper base plate is through laminating structure fixedly connected with positive sintered material board, the top fixed mounting of positive sintered material board has locating component, the top of positive sintered material board is provided with the chip, the bottom that pottery covers the copper base plate is through heat dissipation connection structure fixedly connected with back sintered material board, the bottom fixedly connected with radiator of back sintered material board.

Laminated structure includes the activity groove, the activity groove is seted up at the top that the pottery covered the copper base plate, the diapire fixed joint in activity groove has the bottom, the last fixed surface joint of bottom has the interlayer, the top fixed joint of interlayer has the articulamentum, the top fixed joint of articulamentum has the buffer layer, the top fixed joint of buffer layer has the bond line, the top fixed joint of bond line has the heat-conducting layer.

The heat dissipation connecting structure comprises a heat dissipation mounting groove, the heat dissipation mounting groove is formed in the bottom of the ceramic copper-clad substrate, the heat dissipation mounting groove is provided with a positioning groove, the outer wall of the positioning groove is fixedly connected with cooling fins, the top of the back sintering material plate is fixedly connected with a positioning column, and the right side of the positioning groove is fixedly connected with a heat conduction groove.

The utility model discloses technical scheme's further improvement lies in: trapezoidal grooves are formed in the upper surface of the bottom layer and the top of the buffer layer, and trapezoidal blocks are fixedly connected to the top and the bottom of the interlayer.

The utility model discloses technical scheme's further improvement lies in: the top of the connecting layer is provided with a semicircular groove, and the bottom of the connecting layer is provided with a trapezoidal groove.

The utility model discloses technical scheme's further improvement lies in: the bottom fixedly connected with semicircle piece of buffer layer, the top of flexible bond line and the equal fixedly connected with trapezoidal piece in bottom, the dovetail groove has been seted up to the bottom of heat-conducting layer.

The utility model discloses technical scheme's further improvement lies in: the top of the positioning groove is fixedly connected with a cushion pad, and the top of the cushion pad is fixedly connected with a cushion sheet.

The utility model discloses technical scheme's further improvement lies in: the top fixedly connected with cooling pad of buffer chip, the inside fixed mounting of cooling pad has the cooling ball.

Owing to adopted above-mentioned technical scheme, the utility model discloses relative prior art, the technological progress who gains is:

1. the utility model provides a copper base plate is covered to pottery that sintered material covers in advance, adopt mutually supporting between articulamentum and the activity groove, through installing positive sintered material board at the pottery movable groove that covers copper base plate top, the dovetail groove that the bottom upper surface was seted up can carry out the block with the interlayer better and connect, reduce the gap that bottom and interlayer are connected, the dovetail groove that the articulamentum bottom was seted up can further reduce the gap that articulamentum and interlayer block are connected, the half slot that the articulamentum top was seted up can make articulamentum and buffer layer laminating inseparabler, improve the leakproofness, reduce the connection gap, the setting of dovetail groove and half slot can reach the heat that produces chip work and carry out radiating purpose simultaneously.

2. The utility model provides a copper base plate is covered to pottery that sintered material covers in advance, adopt cooling pad and the mutually supporting between the heat conduction groove, the constant head tank that covers the copper base plate bottom to the pottery is aimed at through the reference column on the back sintered material board and inserts, thereby place the radiator and cover the copper base plate at pottery, the heat conduction groove dispels the heat for the radiator with the heat transfer, the efficiency of heat dissipation is improved, utilize the fin to carry out the partial heat dissipation with the heat that the device produced, the cooling pad can cool down the processing with inside heat, avoid the heat too high, influence work, the blotter cushions the heat, further reduce the heat, the efficiency of heat dissipation is improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic sectional view of the present invention;

FIG. 3 is an enlarged schematic view of the structure at the position A of the present invention;

fig. 4 is an enlarged schematic structural diagram of the position B of the present invention.

In the figure: 1. a chip; 2. fitting a structure; 21. a movable groove; 22. a heat conductive layer; 23. an adhesive layer; 24. a buffer layer; 25. a connection layer; 26. an interlayer; 27. a bottom layer; 3. a positioning assembly; 4. sintering the material plate on the front surface; 5. a ceramic copper-clad substrate; 6. sintering the material plate on the back; 61. a positioning column; 7. a heat sink; 8. a heat dissipation connection structure; 81. a heat dissipation mounting groove; 82. a heat conducting groove; 83. a heat sink; 84. a cooling pad; 85. positioning a groove; 86. a cushion pad; 87. a buffer sheet; 88. and (5) cooling the balls.

Detailed Description

The present invention will be described in further detail with reference to the following examples:

example 1

As shown in fig. 1-4, the utility model provides a copper base plate is covered to pottery that sintered material covered in advance, including pottery copper base plate 5, the positive sintered material board 4 of laminating structure 2 fixedly connected with is passed through at the top of pottery copper base plate 5, and wherein positive sintered material possesses insulating or semi-insulating sintered material for aluminium oxide and compound, silicon oxide and compound etc. and possess. The top fixed mounting of positive sintered material board 4 has locating component 3, the top of positive sintered material board 4 is provided with

chip

1, 8 fixedly connected with back sintered material boards 6 are passed through to the bottom of pottery copper-clad base plate 5, the bottom fixedly connected with radiator 7 of back sintered material board 6, laminated structure 2 includes movable groove 21, movable groove 21 sets up the top at pottery copper-clad base plate 5, the diapire fixed joint of movable groove 21 has bottom 27, the last fixed surface joint of bottom 27 has interlayer 26, the top fixed joint of interlayer 26 has articulamentum 25, the top fixed joint of articulamentum 25 has buffer layer 24, the fixed joint in top of buffer layer 24 has bond line 23, the fixed joint in top of bond line 23 has heat-conducting layer 22, heat dissipation connection structure 8 is including heat dissipation mounting groove 81, heat dissipation mounting groove 81 sets up in the bottom of pottery copper-clad base plate 5, constant head tank 85 has been seted up to heat dissipation mounting groove 81, the outer wall fixedly connected with fin 83 of constant head tank 85, the top fixedly connected with reference column 61 of back sintered material board 6, the right side fixedly connected with heat-conducting groove 82 of constant head tank 85.

In this embodiment, through installing positive sintered material board 4 in the activity groove 21 at pottery copper-clad substrate 5 top, locating component 3 can fix a position chip 1, prevent that chip 1's position from not taking place to remove, the dovetail groove that bottom 27 upper surface was seted up can carry out the block with interlayer 26 better and connect, reduce the gap that bottom 27 and interlayer 26 are connected, the dovetail groove that connecting layer 25 bottom was seted up can further reduce the gap that connecting layer 25 and interlayer 26 block are connected, the half slot that connecting layer 25 top was seted up can make connecting layer 25 and buffer layer 24 laminate inseparabler, improve the leakproofness, reduce the connection gap, the setting of dovetail groove and half slot can reach the purpose of dispelling the heat of the heat that chip 1 work produced simultaneously, it inserts to aim at the constant head tank 85 of pottery copper-clad substrate 5 bottom to aim at reference column 61 on back sintered material board 6, place radiator 7 at pottery ceramic substrate 5, heat conduction groove 82 dispels the heat for radiator 7 with the heat transfer, improve the radiating efficiency, utilize fin 83 to carry out partial heat dissipation with the heat that the device produced, cooling pad 84 can cool down the processing of covering the heat, avoid crossing the heat and reduce the copper heat and cover copper substrate 86, it can further to reduce the heat efficiency with the ceramic substrate, it can reduce the heat sink 7 to further to cover, it to bond, it to further with the heat sink, it can reduce the heat, it can reduce the back to cover the heat efficiency with the ceramic substrate 6.

Example 2

As shown in fig. 1-4, on the basis of embodiment 1, the utility model provides a technical solution: preferably, the trapezoidal groove has all been seted up at the upper surface of bottom 27 and the top of buffer layer 24, and the semicircular groove has been seted up at the top of articulamentum 25 and bottom fixedly connected with trapezoidal piece of interlayer 26, and the trapezoidal groove has been seted up at the top of articulamentum 25, and the trapezoidal groove has been seted up to the bottom of articulamentum 25, and the bottom fixedly connected with semicircle piece of buffer layer 24, the top of flexible bond line 23 and the equal fixedly connected with trapezoidal piece in bottom, and the trapezoidal groove has been seted up to the bottom of heat-conducting layer 22.

In this embodiment, through installing positive sintered material board 4 in the activity inslot 21 at pottery copper-clad base plate 5 top, the dovetail groove that bottom 27 upper surface was seted up can carry out the block with interlayer 26 better and connect, reduce the gap that bottom 27 and interlayer 26 are connected, the dovetail groove that connecting layer 25 bottom was seted up can further reduce the gap that connecting layer 25 and interlayer 26 block are connected, the half slot that the connecting layer 25 top was seted up can make connecting

layer

25 and 24 laminating of buffer layer inseparabler, improve the leakproofness, reduce the joint gap, the setting of dovetail groove and half slot can reach the heat that produces chip 1 work and carry out radiating purpose simultaneously.

Example 3

As shown in fig. 1-4, on the basis of embodiment 1, the utility model provides a technical solution: preferably, the top of the positioning groove 85 is fixedly connected with a buffer pad 86, the top of the buffer pad 86 is fixedly connected with a buffer sheet 87, the top of the buffer sheet 87 is fixedly connected with a cooling pad 84, and the inside of the cooling pad 84 is fixedly provided with cooling balls 88.

In this embodiment, align the constant head tank 85 of pottery copper-clad substrate 5 bottom through reference column 61 on back sintering material board 6 and insert, thereby place radiator 7 at pottery copper-clad substrate 5, heat conduction groove 82 dispels the heat for radiator 7 with the heat transfer, the efficiency of heat dissipation is improved, utilize fin 83 to carry out partial heat dissipation with the heat that the device produced, cooling pad 84 can cool down the processing with inside heat, avoid the heat too high, influence work, blotter 86 cushions the heat, further reduce the heat, the efficiency of heat dissipation is improved.

The working principle of the ceramic copper-clad substrate pre-coated with the sintering material will be described in detail below.

As shown in fig. 1-4, by installing the front sintered material plate 4 in the movable groove 21 at the top of the ceramic copper-clad substrate 5, the positioning assembly 3 can position the chip 1 to prevent the chip 1 from moving, the trapezoidal groove formed on the upper surface of the bottom layer 27 can better clamp and connect the interlayer 26 to reduce the gap between the bottom layer 27 and the interlayer 26, the trapezoidal groove formed at the bottom of the connecting layer 25 can further reduce the gap between the connecting layer 25 and the interlayer 26, the semicircular groove formed at the top of the connecting layer 25 can make the connecting layer 25 and the buffer layer 24 tightly attached to each other, improve the sealing property and reduce the connecting gap, meanwhile, the trapezoidal groove and the semicircular groove are arranged to achieve the purpose of dissipating heat generated by the work of the chip 1, the positioning column 61 on the back sintering material plate 6 is aligned with the positioning groove 85 at the bottom of the ceramic copper-clad substrate 5 to be inserted, the heat sink 7 is placed on the ceramic copper-clad substrate 5, the heat conduction groove 82 transfers the heat to the heat sink 7 to dissipate the heat, the heat dissipation efficiency is improved, partial heat dissipation is performed on the heat generated by the device through the radiating fins 83, the internal heat can be cooled through the cooling pad 84, the heat is prevented from being too high, the work is prevented from being influenced, the heat is buffered through the buffering pad 86, the further heat is reduced, the back sintering material plate 6 can enable the heat sink 7 to be better combined with the ceramic copper-clad substrate 5, and the heat dissipation efficiency is improved.

The present invention has been described in detail with reference to the above general description, but it will be apparent to one of ordinary skill in the art that modifications and improvements can be made to the invention. Therefore, modifications or improvements without departing from the spirit of the invention are within the scope of the invention.

Claims

1. The utility model provides a ceramic that sintered material was covered with copper base plate in advance, includes ceramic and covers copper base plate (5), its characterized in that: the top of the ceramic copper-clad substrate (5) is fixedly connected with a front sintered material plate (4) through a bonding structure (2), the top of the front sintered material plate (4) is fixedly provided with a positioning assembly (3), the top of the front sintered material plate (4) is provided with a chip (1), the bottom of the ceramic copper-clad substrate (5) is fixedly connected with a back sintered material plate (6) through a heat dissipation connecting structure (8), and the bottom of the back sintered material plate (6) is fixedly connected with a radiator (7);

the laminated structure (2) comprises a movable groove (21), the movable groove (21) is formed in the top of a ceramic copper-clad substrate (5), a bottom layer (27) is fixedly clamped on the bottom wall of the movable groove (21), an interlayer (26) is fixedly clamped on the upper surface of the bottom layer (27), a connecting layer (25) is fixedly clamped on the top of the interlayer (26), a buffer layer (24) is fixedly clamped on the top of the connecting layer (25), an adhesive layer (23) is fixedly clamped on the top of the buffer layer (24), and a heat conducting layer (22) is fixedly clamped on the top of the adhesive layer (23);

the heat dissipation connecting structure (8) comprises a heat dissipation mounting groove (81), the heat dissipation mounting groove (81) is formed in the bottom of the ceramic copper-clad substrate (5), the heat dissipation mounting groove (81) is provided with a positioning groove (85), the outer wall of the positioning groove (85) is fixedly connected with a cooling fin (83), the top of the back sintered material plate (6) is fixedly connected with a positioning column (61), and the right side of the positioning groove (85) is fixedly connected with a heat conduction groove (82).

2. The sintered material pre-coated ceramic copper-clad substrate as claimed in claim 1, wherein: trapezoidal grooves are formed in the upper surface of the bottom layer (27) and the top of the buffer layer (24), and trapezoidal blocks are fixedly connected to the top and the bottom of the interlayer (26).

3. The sintered material pre-coated ceramic copper-clad substrate as claimed in claim 1, wherein: the top of the connecting layer (25) is provided with a semicircular groove, and the bottom of the connecting layer (25) is provided with a trapezoidal groove.

4. The sintered material pre-coated ceramic copper-clad substrate as claimed in claim 1, wherein: the bottom fixedly connected with semicircle piece of buffer layer (24), the equal fixedly connected with trapezoidal piece in top and the bottom of flexible bond line (23), the dovetail groove has been seted up to the bottom of heat-conducting layer (22).

5. The sintered material pre-coated ceramic copper-clad substrate as claimed in claim 1, wherein: the top of the positioning groove (85) is fixedly connected with a cushion pad (86), and the top of the cushion pad (86) is fixedly connected with a cushion sheet (87).

6. The ceramic copper-clad substrate precoated with a sintering material according to claim 5, wherein: the top fixedly connected with cooling pad (84) of buffer chip (87), the inside fixed mounting of cooling pad (84) has cooling ball (88).