CN101908490B - Circuit substrate module with heat radiator and production method thereof - Google Patents
Circuit substrate module with heat radiator and production method thereof Download PDFInfo
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- CN101908490B CN101908490B CN2009101423869A CN200910142386A CN101908490B CN 101908490 B CN101908490 B CN 101908490B CN 2009101423869 A CN2009101423869 A CN 2009101423869A CN 200910142386 A CN200910142386 A CN 200910142386A CN 101908490 B CN101908490 B CN 101908490B
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- circuit substrate
- bearing seat
- location division
- load bearing
- copper layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Abstract
The invention discloses a circuit substrate module with a heat radiator and a production method thereof. A circuit substrate is jointed with a bearing seat of the heat radiator and is made of a two-sided copper-coated ceramic plate; a circuit pattern is formed on a copper layer on one side of the circuit substrate; a plurality of first positioning parts are formed on the copper layer on the other side of the circuit substrate; a plurality of second positioning parts are formed on the bearing seat, wherein the second positioning parts are in one-to-one correspondence with the first positioning parts; the circuit substrate and the bearing seat are oppositely positioned through corresponding first positioning parts and second positioning parts and are subject to the heat treatment; and the circuit substrate is jointed with the bearing seat, so that the circuit substrate is fixed on the bearing seat. The invention can not only reduce the thermal impedance, but also can greatly improve the heat-radiating efficiency, so that the circuit substrate and the heat radiator are favorably and reliably jointed.
Description
Technical field
The present invention relates to a kind of manufacturing approach, particularly relate to a kind of manufacturing approach of the circuit substrate module with sintering processing permanent circuit substrate and radiator and the circuit substrate module that makes thereof with radiator with circuit substrate module of radiator.
Background technology
In order to improve the efficient of electronic component; Increasing electronic component develops towards high power; For example high brightness LED (High Brightness LED), concentrating solar battery, insulated gate bipolar transistor (Insulated Gate BipolarTransistor, IGBT) etc.
Because high-power electronic component can produce a large amount of heat usually when work, if heat energy can't in time be got rid of, will make the performance of electronic component impaired.Therefore, the high power electronic element need be arranged in pairs or groups radiator (heat sink) with the ability quick heat radiating.
As shown in Figure 1, after general electronic component 91 is located at circuit board 92, engage with the load bearing seat 941 of radiator 94 with scolder or heat-conducting glue 93 again, the heat energy that electronic component 91 is produced conducts to radiating fin 942 acceleration heat radiations through load bearing seat 941.
Yet along with electronic component power constantly promotes, the requirement of heat dissipation is also more and more harsh, and the thermal impedance that the scolder or the heat-conducting glue 93 of available circuit plate 92 and engage 92 and load bearing seat 941 produces all can influence the heat dissipation of electronic component 91.So how to reduce the thermal impedance between electronic component 91 to the radiator 94,, still have improved necessity to promote heat dissipation.And connecting circuit plate 92 also wears out because often be in hot environment with the scolder or the heat-conducting glue 93 of load bearing seat 941 easily, influences the strong degree that engages of circuit board 92 and load bearing seat 941, and improved necessity is also arranged.
Summary of the invention
The purpose of this invention is to provide a kind of thermal impedance that can reduce between electronic component and the radiator, and can promote the manufacturing approach of circuit board and the circuit substrate module that engages strong degree of radiator with radiator.
Another object of the present invention; Provide a kind of circuit substrate module with radiator; Being applicable to provides the electronic component that can generate heat to be electrically connected; For example high brightness LED (High Brightness LED), concentrating solar battery, insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) etc.
According to one side of the present invention, the present invention has the manufacturing approach of the circuit substrate module of radiator, and a circuit substrate is engaged in the load bearing seat of a radiator, and this circuit substrate is processed with the double-sided copper-clad ceramic wafer, and forms circuit pattern in copper layer wherein; Another side copper layer at this circuit substrate forms a plurality of first location divisions; And form respectively and a plurality of one to one second location divisions, said first location division at this load bearing seat; Make this circuit substrate and this load bearing seat relative positioning through corresponding said first location division and said second location division; And heat-treat, and, make this circuit substrate be fixed in this load bearing seat with this circuit substrate and this load bearing seat sinter bonded.
Be applicable to make said first location division and the said second location division relative positioning mode can for: make corresponding every pair of this first location division and this second location division one of them for groove; Wherein another is a projection, and every pair first location division and second location division can be engaged mutually; Perhaps, make respectively that this first location division is a groove, and respectively this second location division is a projection, or makes respectively that this first location division is a projection, and respectively this second location division is a groove, every pair first location division and second location division can be engaged mutually; Perhaps; Corresponding respectively this first location division is respectively a groove with this second location division respectively; And form the room that is communicated with, with a ccontaining reference column, and engage with corresponding this first location division and this second location division respectively through these reference column two ends respectively; And making respectively this first location division and respectively this second location division relative positioning, said reference column is that pottery is processed or copper becomes preferable.
Manufacturing approach with circuit substrate module of radiator of the present invention, said second location division and this load bearing seat together model form, or after this load bearing seat moulding, process in addition again.
Manufacturing approach with circuit substrate module of radiator of the present invention, said first location division are to define a predetermined pattern with liquid photosensitive processing procedure or circuit ink printing processing procedure in this copper layer, and this copper layer of etching forms again.
Heat treatment step of the present invention is to utilize direct copper joining technique (to be called for short DCB; Direct Copper Bonding or abbreviation DBC; Direct BondingCopper); Be lower than metallic copper fusing point (about 1083 ℃) and be higher than copper and the temperature range of cupric oxide eutectic temperature (1063 ℃) is heat-treated one, with this circuit substrate and this load bearing seat sinter bonded.
Be applicable to that radiator of the present invention can be general common radiator or water-cooling type radiator with radiating fin, and unrestricted.Aforementioned method for making is applicable to that this load bearing seat is copper person, when only being groove as if said first location division, is ceramic person applicable to this load bearing seat also, and ceramic material is aluminium oxide (Al for example
2O
3), aluminium nitride (AlN), titanium oxide (TiO
2), silica (SiO
2), zirconia (ZrO
2), zinc oxide (ZnO), forsterite (2MgOSiO
2), barium titanate (BaTiO
3) etc., wherein preferable with aluminium oxide and aluminium nitride.
According to another aspect of the present invention, the present invention has the manufacturing approach of the circuit substrate module of radiator, a circuit substrate is engaged in the load bearing seat of a radiator; This circuit substrate is processed with the double-sided copper-clad ceramic wafer; And form circuit pattern in copper layer wherein, form a plurality of first location divisions at the another side copper layer of this circuit substrate, and form a plurality of second location divisions at this load bearing seat; And get the suitable middle copper layer of size; Form respectively and the corresponding a plurality of perforation in said first location division and said second location division at this middle copper layer, again this middle copper is placed between this circuit substrate and this load bearing seat, match with said perforation through said first location division and said second location division; With this circuit substrate and this load bearing seat relative positioning; And heat-treat, and, make this circuit substrate be fixed in this load bearing seat with this circuit substrate, this middle copper layer and this load bearing seat sinter bonded.
Be applicable to make said first location division, this middle copper layer and the said second location division relative positioning mode can for: respectively this first location division and respectively this second location division be respectively projection; And match with one of this middle copper layer corresponding perforation respectively, make this first location division respectively and respectively corresponding with the one respectively perforation in this second location division engage mutually and locate; Perhaps; Respectively this first location division and respectively this second location division be respectively groove, and each first location division matches with a perforation of corresponding one second location division and this middle copper layer respectively, forms the room that is communicated with; With a ccontaining reference column; And make corresponding respectively this first location division, respectively this perforation and this second location division relative positioning respectively through this reference column, that is to say that this reference column engages its two ends mutually with this first location division and this second location division respectively through this perforation; With this first location division, this perforation and location, this second location division, this reference column is processed with pottery or copper becomes preferable whereby.
Manufacturing approach with circuit substrate module of radiator of the present invention, said second location division and this load bearing seat together model form, or after this load bearing seat moulding, process in addition again.
Manufacturing approach with circuit substrate module of radiator of the present invention, said first location division are to define a predetermined pattern with liquid photosensitive processing procedure or circuit ink printing processing procedure in this copper layer, and this copper layer of etching forms again.
Aforementioned method for making is applicable to that this load bearing seat is ceramic person, and is poor than copper product in the heat-conducting effect of laterally (being general so-called x-y direction) because of ceramic material, and can increase horizontal heat conduction efficiency through this middle copper layer.
According to the present invention on the other hand; The present invention has the circuit substrate module of radiator; In order to the electronic component that can generate heat to be set; This circuit substrate module comprises: one has the radiator of a load bearing seat, the side surface that a ceramic layer, is located at this ceramic layer and the circuit layer with circuit pattern, and the copper layer be located between this ceramic layer and this load bearing seat, and this copper layer and this ceramic layer and this load bearing seat are sinter bonded.
It is preferable that wherein the area of this copper layer is not less than the area of this ceramic layer.
Circuit substrate module with radiator of the present invention, this load bearing seat are that copper becomes, and the area of this copper layer equals the area of this ceramic layer.
Circuit substrate module with radiator of the present invention, this load bearing seat are that pottery is processed, and the area of this copper layer equals the area of this load bearing seat.
Circuit substrate module with radiator of the present invention, this circuit layer is formed by the copper patterned of sinter bonded in this ceramic layer surface.
According to another aspect of the present invention, the present invention has the circuit substrate module of radiator, and in order to the electronic component that can generate heat to be set, this circuit substrate module comprises: a radiator and a circuit substrate; This radiator has a load bearing seat; This circuit substrate comprises that a ceramic layer and is located at this ceramic layer surface and has the circuit layer of circuit pattern, and this circuit substrate is fixed in this load bearing seat with the sinter bonded mode.
Circuit substrate of the present invention and radiator are with sinter bonded, can save the scolder or the heat-conducting glue of existing juncture, and the thermal impedance of avoiding scolder or heat-conducting glue to produce, and scolder or heat-conducting glue cause engaging the not good problem of strong degree because of aging.And; The insulating barrier of circuit substrate of the present invention is that preferable ceramic layer of heat dissipation and the copper layer that passes through excellent thermal conductivity increase horizontal radiating rate; So the present invention not only can reduce thermal impedance and can increase radiating rate; And can significantly promote heat dissipation, and make circuit substrate and radiator have the good strong degree that engages, do not have aging problem.
Description of drawings
Fig. 1 is the sketch map that the existing electronic component that can generate heat of an explanation is located at the juncture of a circuit board and a radiator.
Fig. 2 a to Fig. 2 c is the sketch map of the implementation step of preparation one circuit substrate in first preferred embodiment of manufacturing approach and goods thereof of the circuit substrate module of explanation the present invention with radiator, and wherein Fig. 2 c is the rear view of Fig. 2 b.
Fig. 3 is the sketch map of preparation one radiator in this first preferred embodiment of explanation.
Fig. 4 is that this first preferred embodiment of explanation engages this circuit substrate and this radiator and forms the sketch map of circuit substrate module.
Fig. 5 a to Fig. 5 c is the sketch map of the implementation step of preparation one circuit substrate in second preferred embodiment of manufacturing approach and goods thereof of the circuit substrate module of explanation the present invention with radiator, and wherein Fig. 5 c is the rear view of Fig. 5 b.
Fig. 6 is the sketch map of preparation one middle copper layer in this second preferred embodiment of explanation.
Fig. 7 is the sketch map that this second preferred embodiment of explanation forms the circuit substrate module.
Fig. 8 is the sketch map of preparation one radiator in the 3rd preferred embodiment of manufacturing approach and goods thereof of the circuit substrate module of an explanation the present invention with radiator.
Fig. 9 is the sketch map of preparation one middle copper layer in an explanation the 3rd preferred embodiment.
Figure 10 is through the sketch map of a plurality of reference columns with this middle copper layer and this radiator location in an explanation the 3rd preferred embodiment.
Figure 11 is the sketch map that an explanation the 3rd preferred embodiment forms the circuit substrate module.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is elaborated.
Before the present invention is described in detail, be noted that in following description similar elements is to represent with identical numbering.
Like Fig. 2 a to Fig. 2 c, Fig. 3 and shown in Figure 4, explain the present invention have radiator the circuit substrate module manufacturing approach and have first preferred embodiment of the circuit substrate module of radiator.
The implementation step explanation of this first preferred embodiment as follows.
Consult Fig. 2 a to Fig. 2 c, the implementation step of preparation circuit substrate 10 is described.Shown in Fig. 2 a, get a double-sided copper-clad ceramic wafer 1 earlier, be the equal covering copper layer 12,13 in ceramic layer 11 and ceramic layer 11 two sides in the middle of promptly, and ceramic layer 11 and copper layer 12,13 be with DCB processing procedure sinter bonded, double-sided copper-clad ceramic wafer 1 can be made by oneself or buied by the commercial goods.Utilize again like liquid photosensitive processing procedure common in wiring board (PCB) processing procedure or circuit ink printing processing procedure; Copper layer 12,13 defines predetermined patterns (figure does not show) in the both sides of double-sided copper-clad ceramic wafer 1 respectively; Again with 12,13 etching of copper layer removing the part scope, and copper layer 12 forms circuit pattern shown in Fig. 2 b with as circuit layer 12 ' therein; In a plurality of first location divisions 14 that another side copper layer 13 forms shown in Fig. 2 c, in the present embodiment, first location division 14 is a groove.
Consult Fig. 3; Prepare a radiator 2; Radiator 2 has a load bearing seat 21 and a plurality of radiating fin 22 that is connected with load bearing seat 21; On load bearing seat 21, form respectively and a plurality of one to one second location divisions 23, said first location division 14 (groove), said second location division 23 and this load bearing seat 21 together model form, or after these load bearing seat 21 moulding, process in addition again.That is to say that each 23 corresponding one first location division 14, second location division is in the present embodiment; Second location division 23 is a projection; The shape of projection matches with the groove shapes of first location division 14, for example can be circle, square or triangle etc., and the thickness of projection is not more than the degree of depth of groove; And the thickness of projection is preferable with the degree of depth that is slightly less than groove, and projection can be engaged mutually with groove and be placed in the groove.For the purpose of convenient explanation, the radiator 2 of being given an example in present embodiment and following examples is a comparatively simple radiating device of general structure, in the present embodiment; Load bearing seat 21 and radiating fin 22 are copper, but the radiator of existing other kenels, for example water-cooling type radiator; Or the radiator of ceramic; Be applicable to the present invention, as long as at the load bearing seat of existing radiator second location division 23 is set, so the kenel of radiator 2 is not exceeded with present embodiment yet.
Cooperate and consult Fig. 4; Circuit substrate 10 is stacked and placed on load bearing seat 21; And make circuit substrate 10 and load bearing seat 21 relative positionings through corresponding said first location division 14 (groove) and said second location division 23 (projection); And because the thickness of projection is not more than the degree of depth of groove, the surface of the copper layer 13 of circuit substrate 10 can be contacted with the surface of load bearing seat 21, one of them is a copper oxide at least on 21 surfaces of the surface of copper layer 13 and load bearing seat.Circuit substrate behind stacked and the relative positioning 10 and radiator 2 are lower than in the high temperature furnace of 10ppm at oxygen content; Utilize direct copper joining technique (DCB); Be lower than metallic copper fusing point (about 1083 ℃) and be higher than copper and the temperature range of cupric oxide eutectic temperature (1063 ℃) is heat-treated; Make the copper layer 13 and load bearing seat 21 sinter bonded (generation eutectic bond) of circuit substrate 10, circuit substrate 10 is fixed in load bearing seat 21, and makes circuit substrate module 100 with radiator 2.The electronic component (figure does not show) that circuit substrate module 100 can supply to generate heat is arranged on the circuit substrate 10.In the present embodiment; Though first location division 14 is a groove; Second location division 23 is a projection, but first location division 14 also can be projection (with reference to following second preferred embodiment), and second location division 23 can be the groove (with reference to following the 3rd preferred embodiment) that matches; If this is then through because of forming ceramic layer 11 and load bearing seat 21 sinter bonded that first location division (projection) expose.
Consult Fig. 5 a to Fig. 5 c, Fig. 6 and Fig. 7, explain the present invention have radiator the circuit substrate module manufacturing approach and have second preferred embodiment of the circuit substrate module of radiator.
The implementation step of this second preferred embodiment is explained as follows:
Consult Fig. 5 a to Fig. 5 c, the implementation step of preparation circuit substrate 10 ' is described.Shown in Fig. 5 a, get a double-sided copper-clad ceramic wafer 1 earlier, be the equal covering copper layer 12,13 in ceramic layer 11 and ceramic layer 11 two sides in the middle of promptly, and ceramic layer 11 and copper layer 12,13 be with DCB processing procedure sinter bonded, double-sided copper-clad ceramic wafer 1 can be made by oneself or buied by the commercial goods.Utilize again like liquid photosensitive processing procedure common in wiring board (PCB) processing procedure or circuit ink printing processing procedure; Copper layer 12,13 defines predetermined patterns (figure does not show) in the both sides of double-sided copper-clad ceramic wafer 1 respectively; Again with 12,13 etching of copper layer removing the part scope, and copper layer 12 forms circuit pattern shown in Fig. 5 b with as circuit layer 12 ' therein; In a plurality of first location divisions 14 ' that another side copper layer 13 forms shown in Fig. 5 c, in the present embodiment, first location division 14 ' is a projection.In addition; The step for preparing radiator 2 ' at present embodiment identical with first preferred embodiment (consulting Fig. 3) forms a plurality of second location divisions 23 at radiator 2 ', only equally; In the present embodiment; Radiator 2 ' is processed for aluminium oxide, and first location division 14 ' and 23 positions, second location division do not have correspondingly, but staggers.
As shown in Figure 6; Other gets the middle copper layer 3 of a suitable size; Form respectively and said first location division 14 ' and said second location division, 23 corresponding a plurality of perforation 31,32 at middle copper layer 3; As shown in Figure 6, wherein each perforation 31 is corresponding with one first location division 14 ' respectively, and each perforation 32 is corresponding with one second location division 23 respectively; Make each first location division 14 ' (projection) can be placed in its corresponding perforation 31 whereby, and each second location division 23 (projection) can be placed in its corresponding perforation 32.
Cooperate and consult Fig. 7; Middle copper layer 3 is stacked and placed on the load bearing seat 21 ', said second location division 23 (projection) is engaged mutually with said perforation 32, and with middle copper layer 3 and load bearing seat 21 ' relative positioning; Again circuit substrate 10 ' is stacked and placed on the middle copper layer 3; Said first location division 14 ' is engaged mutually with said perforation 31, and with circuit substrate 10 ' and middle copper layer 3 relative positioning, while circuit substrate 10 ' and load bearing seat 21 ' also relative positioning.Identical ground with first preferred embodiment; The thickness of said first location division 14 ' (projection) and second location division 23 (projection); All be not more than said perforation 31,32 degree of depth (being the thickness of middle copper layer 3); Middle copper layer 3 both side surface can be respectively contacted with the surface of the ceramic layer 11 of load bearing seat 21 ' and circuit substrate 10 ', that is to say that it is preferable that the thickness of middle copper layer 3 is slightly larger than projection thickness.The both side surface of middle copper layer 3 is a cupric oxide; Behind circuit substrate 10 ', middle copper layer 3 and radiator 2 ' relative positioning; As the first preferred embodiment step of heat treatment; And, make circuit substrate 10 ' be fixed in load bearing seat 21 ' with circuit substrate 10 ', middle copper layer 3 and load bearing seat 21 ' sinter bonded, make circuit substrate module 100 ' with radiator 2 '.
In the present embodiment; The area of middle copper layer 3 is suitable with load bearing seat 21 ' area; Can increase the laterally heat conduction efficiency of (x-y direction) through middle copper layer 3; But make all surfaces of heat energy rapid diffusion, pass through load bearing seat 21 ' vertical heat conduction again, and utilize radiating fin 22 ' heat radiation to radiating fin 22 ' in load bearing seat 21 '.
As shown in Figs. 8 to 11, explain the present invention have radiator the circuit substrate module manufacturing approach and have the 3rd preferred embodiment of the circuit substrate module of radiator.
In the 3rd preferred embodiment, the implementation step of preparation circuit substrate 10 is identical with first preferred embodiment, can consult Fig. 2 a to Fig. 2 c, no longer repeats in this.
Consult Fig. 8 and Fig. 9; Preparation radiator 2 " and implementation step and second preferred embodiment of middle copper layer 3 ' roughly the same; only; second location division 23 in the 3rd preferred embodiment " be groove, and middle copper layer 3 " formed each perforation 33 ' distinguishes correspondence one first location division 14 (groove) and one second location division 23 " (groove).Whereby; Each first location division 14 (groove) respectively with corresponding one second location division 23 " perforation 33 ' of (groove) and middle copper layer 3 ' matches, and forms the room (figure does not show) that is communicated with, with a ccontaining reference column 4; in the present embodiment; reference column 4 be a copper, but reference column 4 also can be ceramic, and the radiator 2 of present embodiment " and this second preferred embodiment be similarly aluminium oxide and process.
Cooperate and consult Figure 10 and Figure 11; Can earlier middle copper layer 3 ' be stacked and placed on load bearing seat 21 " on; and make each perforation 33 ' and corresponding second location division 23 " (groove) align; Again each reference column 4 is inserted in each perforation 33 ' and second location division 23 of having alignd respectively " in (groove); then circuit substrate 10 is stacked and placed on the middle copper layer 3 '; make each reference column 4 correspondence be placed in each first location division 14 (groove), through each reference column 4 make corresponding each first location division 14 (groove), respectively bore a hole 33 ' with each second location division 23 " (groove) relative positioning, and middle copper layer 3 ' both sides respectively with the copper layer 13 and the load bearing seat 21 of circuit substrate 10 " contact.For another example with the first preferred embodiment step of heat treatment, and with circuit substrate 10, middle copper layer 3 ' and load bearing seat 21 " sinter bonded, make circuit substrate 10 be fixed in load bearing seat 21 ", make have radiator 2 " circuit substrate module 100 ".As this second preferred embodiment; Can increase the laterally heat conduction efficiency of (x-y direction) through middle copper layer 3 '; But make the heat energy rapid diffusion in load bearing seat 21 " all surfaces, again through load bearing seat 21 " vertical heat conduction to radiating fin 22 ", utilize radiating fin 22 " heat radiation.
Aforementioned each preferred embodiment provide can be conveniently with circuit substrate 10,10 ' with load bearing seat 21,21 ', 21 " the different enforcement aspects of relative positioning; through earlier with circuit substrate 10,10 ' and load bearing seat 21,21 ', 21 " heat-treat again behind the relative positioning; In the time of avoiding desiring to heat-treat; Because move or collision cause circuit substrate 10,10 ' with load bearing seat 21,21 ', 21 " relative displacement and leave the predetermined position that engages, with lifting product yield.
Moreover; Circuit substrate module 100,100 ', 100 of the present invention " be to be insulating barrier with ceramic layer 11, and from ceramic layer 11 to load bearing seat 21,21 ', 21 " between be sinter bonded, have excellent bond strength and strong degree; And can reduce thermal impedance because of scolder or heat-conducting glue generation; And can avoid scolder or the aging problem of heat-conducting glue, being applicable to provides the electronic component that can generate heat to be electrically connected, and can promote heat dissipation.
Claims (10)
1. manufacturing approach with circuit substrate module of radiator is engaged in the load bearing seat of a radiator with a circuit substrate, and this circuit substrate is processed with the double-sided copper-clad ceramic wafer; And form circuit pattern in copper layer wherein; It is characterized in that, form a plurality of first location divisions at the another side copper layer of this circuit substrate, and form a plurality of second location divisions at this load bearing seat; And get a middle copper layer; Form respectively and the corresponding a plurality of perforation in said first location division and said second location division at this middle copper layer, again this middle copper is placed between this circuit substrate and this load bearing seat, match with said perforation through said first location division and said second location division; With this circuit substrate and this load bearing seat relative positioning; And heat-treat, and, make this circuit substrate be fixed in this load bearing seat with this circuit substrate, this middle copper layer and this load bearing seat sinter bonded.
2. the manufacturing approach with circuit substrate module of radiator according to claim 1 is characterized in that, respectively this first location division and respectively this second location division be respectively projection, and match with one of this middle copper layer corresponding perforation respectively.
3. the manufacturing approach with circuit substrate module of radiator according to claim 1; It is characterized in that; Respectively this first location division and respectively this second location division be respectively groove, and each first location division matches with a perforation of corresponding one second location division and this middle copper layer respectively, forms the room that is communicated with; With a ccontaining reference column, and make corresponding respectively this first location division, respectively this perforation and this second location division relative positioning respectively through this reference column.
4. the manufacturing approach with circuit substrate module of radiator according to claim 1 is characterized in that, this load bearing seat is that pottery is processed.
5. the manufacturing approach with circuit substrate module of radiator according to claim 1 is characterized in that said second location division and this load bearing seat together model form, or after this load bearing seat moulding, processes in addition again.
6. the manufacturing approach with circuit substrate module of radiator according to claim 1 is characterized in that, said first location division is to define a predetermined pattern with liquid photosensitive processing procedure or circuit ink printing processing procedure in this copper layer, and this copper layer of etching forms again.
7. circuit substrate module with radiator; It is characterized in that; In order to the electronic component that can generate heat to be set; This circuit substrate module comprises: one has the radiator of a load bearing seat, the side surface that a ceramic layer, is located at this ceramic layer and the circuit layer with circuit pattern, and the copper layer be located between this ceramic layer and this load bearing seat, and this copper layer and this ceramic layer and this load bearing seat are sinter bonded;
Wherein, the area of this copper layer is not less than the area of this ceramic layer.
8. the circuit substrate module with radiator according to claim 7 is characterized in that, this load bearing seat is that copper becomes, and the area of this copper layer equals the area of this ceramic layer.
9. the circuit substrate module with radiator according to claim 7 is characterized in that, this load bearing seat is that pottery is processed, and the area of this copper layer equals the area of this load bearing seat.
10. the circuit substrate module with radiator according to claim 7 is characterized in that, this circuit layer is formed by the copper patterned of sinter bonded in this ceramic layer surface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009101423869A CN101908490B (en) | 2009-06-04 | 2009-06-04 | Circuit substrate module with heat radiator and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101423869A CN101908490B (en) | 2009-06-04 | 2009-06-04 | Circuit substrate module with heat radiator and production method thereof |
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| CN101908490A CN101908490A (en) | 2010-12-08 |
| CN101908490B true CN101908490B (en) | 2012-12-05 |
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| DE102016117841A1 (en) * | 2016-09-21 | 2018-03-22 | HYUNDAI Motor Company 231 | Pack with roughened encapsulated surface to promote adhesion |
| CN108336029B (en) * | 2017-12-25 | 2020-04-17 | 哈尔滨奥瑞德光电技术有限公司 | Preparation method of aluminum nitride bottom plate and copper heat sink composite |
| CN108428682B (en) * | 2018-04-13 | 2020-08-18 | 江西江铃集团新能源汽车有限公司 | Power module and preparation method thereof |
| CN108364913A (en) * | 2018-04-25 | 2018-08-03 | 哈尔滨奥瑞德光电技术有限公司 | A kind of leadless packaging structure and preparation method for silicon carbide power device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672848A (en) * | 1993-12-28 | 1997-09-30 | Kabushiki Kaisha Toshiba | Ceramic circuit board |
| CN101035409A (en) * | 2006-03-08 | 2007-09-12 | 相互股份有限公司 | LED backlight module circuit board for improving the heat radiation efficiency and its making method |
-
2009
- 2009-06-04 CN CN2009101423869A patent/CN101908490B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672848A (en) * | 1993-12-28 | 1997-09-30 | Kabushiki Kaisha Toshiba | Ceramic circuit board |
| CN101035409A (en) * | 2006-03-08 | 2007-09-12 | 相互股份有限公司 | LED backlight module circuit board for improving the heat radiation efficiency and its making method |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2003-78086A 2003.03.14 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101908490A (en) | 2010-12-08 |
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