CN211507632U - IGBT module and electronic equipment - Google Patents
IGBT module and electronic equipment Download PDFInfo
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- CN211507632U CN211507632U CN202020259635.4U CN202020259635U CN211507632U CN 211507632 U CN211507632 U CN 211507632U CN 202020259635 U CN202020259635 U CN 202020259635U CN 211507632 U CN211507632 U CN 211507632U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims description 11
- 229910000962 AlSiC Inorganic materials 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 abstract description 5
- 230000005465 channeling Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本申请涉及IGBT散热技术领域，尤其涉及一种IGBT模块。The present application relates to the technical field of IGBT heat dissipation, and in particular, to an IGBT module.
背景技术Background technique
IGBT是由BJT和MOS组成的复合全控型-电压驱动式-功率半导体器件，是一个非通即断的开关。实际应用中，IGBT可以用于功率变换的场合，如电动汽车、变频空调、风力发电机等，通过高频率的开关，实现对交流电机的控制。在实现过程中，高频率开关会产生热量，因此需要涉及散热技术方面的开发研究。IGBT is a composite fully-controlled-voltage-driven-power semiconductor device composed of BJT and MOS, which is an on-or-off switch. In practical applications, IGBTs can be used in power conversion occasions, such as electric vehicles, inverter air conditioners, wind turbines, etc., through high-frequency switching to realize the control of AC motors. In the implementation process, high-frequency switching generates heat, so development research involving heat dissipation technology is required.
相关技术中，参见图1，IGBT模块包括底板、底板焊片、陶瓷覆铜板、芯片焊片、二极管和IGBT芯片，最后再键合接线，然而，上述结构中底板、底板焊片、陶瓷覆铜板、芯片焊片在散热过程中，会出现窜热的现象，影响到IGBT 模块的使用。In the related art, referring to FIG. 1 , the IGBT module includes a base plate, a base plate solder tab, a ceramic copper clad laminate, a chip solder tab, a diode and an IGBT chip, and finally a bonding wire is made. . During the heat dissipation process of the chip solder, there will be a phenomenon of channeling heat, which affects the use of the IGBT module.
发明内容SUMMARY OF THE INVENTION
有鉴于此，本申请提供一种IGBT模块和电子设备，以解决现有技术中IGBT 模块窜热的问题。In view of this, the present application provides an IGBT module and an electronic device to solve the problem of heat channeling of the IGBT module in the prior art.
本申请提供了一种IGBT模块，包括依次设置的散热板、导热片、线路板片和IGBT芯片。The application provides an IGBT module, which includes a heat dissipation plate, a heat conduction sheet, a circuit board sheet and an IGBT chip arranged in sequence.
在一实施例中，所述散热板和所述线路板片采用相同的材料制成。In one embodiment, the heat dissipation plate and the circuit board are made of the same material.
在一实施例中，所述散热板和所述线路板片采用AlSiC材料制成。In one embodiment, the heat dissipation plate and the circuit board are made of AlSiC material.
在一实施例中，所述导热片的任一位置的厚度位于设定厚度范围之内。In one embodiment, the thickness of any position of the thermally conductive sheet is within a set thickness range.
在一实施例中，所述导热片采用硅脂材料制成。In one embodiment, the thermally conductive sheet is made of silicone grease material.
在一实施例中，所述IGBT芯片包括芯片焊片、两个二极管，以及分别设置在所述两个二极管和线路板片上的键片；所述两个二极管上的键片通过键接线连接，所述线路板片上的键片通过键接线与相邻一个二极管上的键片连接。In one embodiment, the IGBT chip includes a chip bonding pad, two diodes, and key sheets respectively arranged on the two diodes and the circuit board; the key sheets on the two diodes are connected by bonding wires, The key piece on the circuit board is connected with the key piece on an adjacent diode through a key wire.
本申请还提供了一种电子设备，其特征在于，包括上述的IGBT模块。The present application also provides an electronic device, which is characterized by comprising the above-mentioned IGBT module.
本申请是通过在IGBT模块中设置散热板，可以使IGBT芯片产生的热量通过导热片传导到散热片，并由散热片进行散热。由于散热板一板成型，其可以具备了现有技术中线路板片，陶瓷片，导热片和底板的相应功能，减少相关技术中不同层之间的窜热，提升散热速度。In the present application, by arranging a heat dissipation plate in the IGBT module, the heat generated by the IGBT chip can be conducted to the heat dissipation sheet through the heat conduction sheet, and the heat dissipation sheet can dissipate heat. Since the heat dissipation plate is formed by one plate, it can have the corresponding functions of the circuit board sheet, the ceramic sheet, the heat conduction sheet and the bottom plate in the prior art, which reduces the heat channeling between different layers in the related art and improves the heat dissipation speed.
附图说明Description of drawings
图1是现有技术提供的一种IGBT模块的结构示意图。FIG. 1 is a schematic structural diagram of an IGBT module provided by the prior art.
图2是本申请提供的一种IGBT模块的结构示意图。FIG. 2 is a schematic structural diagram of an IGBT module provided by the present application.
具体实施方式Detailed ways
这里将详细地对一种IGBT模块的具体结构。参见图2，一种IGBT模块，包括依次设置的散热板、导热片、线路板片和IGBT芯片。在实际应用中，对于散热板、线路板片和IGBT芯片可以通过对基板进行曝光投影蚀刻、溅射、电镀等工艺步骤处理，并通过回火去应力抛光而成。需要说明的是，技术人员可以根据具体场景调整工艺步骤或工艺原理，在能够制成散热板的情况下，相应方案落入本申请的保护范围。The specific structure of an IGBT module will be described in detail here. Referring to Fig. 2, an IGBT module includes a heat dissipation plate, a heat conduction sheet, a circuit board sheet and an IGBT chip arranged in sequence. In practical applications, heat sinks, circuit boards and IGBT chips can be processed by exposure projection etching, sputtering, electroplating and other process steps on the substrate, and tempered to relieve stress and polish. It should be noted that technicians can adjust the process steps or process principles according to specific scenarios, and in the case that a heat dissipation plate can be made, the corresponding solution falls within the protection scope of the present application.
在本实施例中，散热板可以理解为是图1中陶瓷片、底板焊片和底板的一体成型，这样可以减少各层之间散热效率不同的问题。在一示例中，散热板采用AlSiC材料制成。这是因为，AlSiC的热膨胀系数和常用的衬底材料Al2O3十分接近，对于高功率IGBT模块的热稳定性很有帮助，此外，AlSiC密度仅有铜的1/3，是散热底板的最佳选择。In this embodiment, the heat dissipation plate can be understood as an integral molding of the ceramic sheet, the base plate solder sheet and the base plate in FIG. 1 , which can reduce the problem of different heat dissipation efficiencies between layers. In one example, the heat dissipation plate is made of AlSiC material. This is because the thermal expansion coefficient of AlSiC is very close to the commonly used substrate material Al 2 O 3 , which is very helpful for the thermal stability of high-power IGBT modules. In addition, the density of AlSiC is only 1/3 of that of copper, which is the core of the heat dissipation base plate. best choice.
在本实施例中，考虑到散热板的热量来自线路板片，因此需要在散热板和线路板片之间设置导热片。为保护IGBT芯片，本实施例中导热片的任一位置的厚度位于设定厚度范围之内。实际应用中，导热片可以采用硅脂材料制成。换言之，本实施例中在涂抹硅脂时，各位置的厚度和均匀度要保持一致，使各位置的导热率趋于相同，避免出现芯片过热炸管的质量问题。In this embodiment, considering that the heat of the heat dissipation plate comes from the circuit board sheet, a heat conducting sheet needs to be arranged between the heat dissipation plate and the circuit board sheet. In order to protect the IGBT chip, the thickness of any position of the thermal conductive sheet in this embodiment is within the set thickness range. In practical applications, the thermal conductive sheet can be made of silicone grease material. In other words, when applying the silicone grease in this embodiment, the thickness and uniformity of each position should be kept the same, so that the thermal conductivity of each position tends to be the same, so as to avoid the quality problem of the chip overheating and frying.
在本实施例中，散热板和线路板片可以采用相同的材料制成，如均采用 AlSiC材料制成。这样，散热板和线路板片可以一体成型，例如可以在基板上进行相应的工艺形成线路板片，无需导热片，减小IGBT模块的厚度。In this embodiment, the heat dissipation plate and the circuit board can be made of the same material, for example, both are made of AlSiC material. In this way, the heat dissipation plate and the circuit board can be integrally formed, for example, a corresponding process can be performed on the substrate to form the circuit board without the need for a heat conducting sheet, thereby reducing the thickness of the IGBT module.
继续参见图2，IGBT芯片包括芯片焊片、两个二极管，以及分别设置在两个二极管和线路板片上的键片；两个二极管上的键片通过键接线连接，线路板片上的键片通过键接线与相邻一个二极管上的键片连接。这样，可以形成IGBT 管。Continuing to refer to FIG. 2, the IGBT chip includes a chip solder, two diodes, and keys respectively arranged on the two diodes and the circuit board; the keys on the two diodes are connected by bonding wires, and the keys on the circuit board pass through The bond wire is connected to the bond sheet on an adjacent diode. In this way, an IGBT tube can be formed.
至此，本申请是通过在IGBT模块中设置散热板，可以使IGBT芯片产生的热量通过导热片传导到散热片，并由散热片进行散热。由于散热板一板成型，其可以具备了现有技术中线路板片，陶瓷片，导热片和底板的相应功能，减少相关技术中不同层之间的窜热，提升散热速度。另外，本申请中，随着IGBT模块结构的变更，加工工艺可以减少一半，生产周期加快了1/4，其体积小，重量轻，成本比原有的成本降低3/4，整体成本降低了1/4，可以广泛应用到各种电子设备(如变频器)之上。So far, in the present application, by arranging a heat sink in the IGBT module, the heat generated by the IGBT chip can be conducted to the heat sink through the heat-conducting sheet, and the heat is dissipated by the heat-dissipating sheet. Since the heat dissipation plate is formed by one plate, it can have the corresponding functions of the circuit board sheet, the ceramic sheet, the heat conduction sheet and the bottom plate in the prior art, which reduces the heat channeling between different layers in the related art and improves the heat dissipation speed. In addition, in this application, with the change of the IGBT module structure, the processing technology can be reduced by half, the production cycle is accelerated by 1/4, the volume is small, the weight is light, the cost is reduced by 3/4 compared with the original cost, and the overall cost is reduced. 1/4, can be widely used in various electronic equipment (such as frequency converter).
本申请还提供了一种电子设备，包括图2所示的IGBT模块。其中电子设备可以如变频器或者采用变频功率的器件，可以应用到电动汽车、变频空调、风力发电机、太阳能电厂、电力储能等领域，具有非常好的应用前景。The present application also provides an electronic device including the IGBT module shown in FIG. 2 . Among them, electronic devices can be frequency converters or devices using variable frequency power, which can be applied to electric vehicles, variable frequency air conditioners, wind turbines, solar power plants, power storage and other fields, and have very good application prospects.
Claims (7)
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| CN202020259635.4U CN211507632U (en) | 2020-03-05 | 2020-03-05 | IGBT module and electronic equipment |
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