CN218603712U

CN218603712U - Digital multimedia conference display mainboard

Info

Publication number: CN218603712U
Application number: CN202222730988.XU
Authority: CN
Inventors: 龙秀周
Original assignee: Zhongxin Intelligent Times Shenzhen Co ltd
Current assignee: Zhongxin Intelligent Times Shenzhen Co ltd
Priority date: 2022-10-17
Filing date: 2022-10-17
Publication date: 2023-03-10
Anticipated expiration: 2032-10-17

Abstract

The utility model relates to a digital multimedia conference shows mainboard belongs to electron hardware heat dissipation technical field, including mainboard, mainboard lid, modularization radiator and dust guard, wherein the mainboard is equipped with mainboard installing port, electric capacity and control chip, is equipped with the mainboard lid on the mainboard, and mainboard lid double-screw bolt aligns with mainboard installing port after together installs in the display and corresponds position department, installs the modularization radiator on electric capacity and the control chip, and its radiating effect is good, has promoted the complete machine performance, has prolonged the life of mainboard components and parts.

Description

Digital multimedia conference display mainboard

Technical Field

The utility model belongs to the technical field of the electron hardware heat dissipation, concretely relates to digital multimedia conference shows mainboard.

Background

With the popularization of electronic technology, electronic display devices are increasingly used in various industries, and the current office forms such as teleconferencing, home work and the like further expand the application requirements of the display devices.

The display main board is the most important device in the display device, and when the display main board is used in the office meeting scene, the display main board usually needs to be operated for a long time, electronic components such as a capacitor and a chip on the display main board can generate a large amount of heat, and the performance and the service life of the electronic device can be obviously reduced if the heat is not dissipated timely.

In the prior art, passive heat dissipation is usually performed without installing additional heat dissipation elements, or a heat dissipation fan is installed for the whole machine, and special heat dissipation is performed less for the main board elements.

SUMMERY OF THE UTILITY MODEL

For solving the above-mentioned problem that exists among the prior art, the utility model provides a digital multimedia conference shows mainboard has the characteristics that the heat-sinking capability is strong.

The purpose of the utility model can be realized by the following technical scheme:

the utility model provides a digital multimedia conference shows mainboard, includes mainboard and the mainboard lid of setting on the mainboard, wherein, be equipped with the modularization radiator on the mainboard, the top of mainboard lid is provided with radiator unit.

As a preferred technical scheme of the utility model, open at the top of mainboard lid has the thermovent, radiator unit includes the fan, the fan passes through the mounting bracket to be fixed in the thermovent.

As a preferred technical scheme of the utility model, one side that the mainboard was kept away from to the fan is provided with and is equipped with the dust guard, the dust guard is fixed on the mainboard lid.

As a preferred technical scheme of the utility model, one side that the mainboard was kept away from to the fan is provided with the dust guard, the dust guard is fixed on the mainboard lid.

As a preferred technical scheme of the utility model, the modularization radiator includes the base, be equipped with a plurality of heating panels on the base, the heating panel is oblique four-edge platform type, the top surface area of heating panel is less than the bottom area.

As an optimal technical scheme of the utility model, be provided with a plurality of electric capacity and control chip on the mainboard, all be provided with a plurality of modularization radiator on electric capacity and the control chip.

As a preferred technical scheme of the utility model, the dust guard screw has all been seted up to four edges of dust guard, the mainboard is covered and has been seted up the mainboard lid screw corresponding with the dust guard screw, the dust guard screw passes through the mounting nail with the mainboard lid screw that corresponds and is connected.

The utility model has the advantages that:

the utility model discloses in, through additionally setting up the modularization radiator on electronic component, strengthen passive heat dissipation, additionally set up down-pressure type radiator fan on the mainboard, increased the initiative heat dissipation, compare the passive heat dissipation of no device, improved the radiating effect, promoted the complete machine performance, prolonged the life of mainboard components and parts.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a schematic diagram of the main board structure of the present invention;

FIG. 3 is a schematic view of the main board cover structure of the present invention;

fig. 4 is a schematic structural view of the modular heat sink of the present invention;

fig. 5 is a schematic structural view of the dust guard of the present invention.

Description of the main element symbols:

in the figure: 1. a main board; 12. a capacitor; 13. a control chip; 2. a main plate cover; 21. a fan; 22. the main plate covers the screw hole; 3. a modular heat sink; 31. a base; 32. a heat dissipation plate; 4. a dust guard; 41. a dust guard screw hole; 42. a dust screen; 5. a heat dissipation assembly.

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the objects of the present invention, the following detailed description is given to the embodiments, structures, features and effects according to the present invention with reference to the accompanying drawings and preferred embodiments.

Referring to fig. 1-5, a digital multimedia conference display main board includes a main board 1, a main board cover 2, a modular heat sink 3, a dust-proof board 4 and a heat dissipation assembly 5, wherein a capacitor 12 and a control chip 13 are disposed on the main board 1, and a plurality of modular heat sinks 3 are disposed on the capacitor 12 and the control chip 13 during use.

Specifically, referring to fig. 3, the main board cover 2 is provided with a heat dissipation assembly 5, a fan 21 is disposed in the heat dissipation assembly 5, and main board cover screw holes 22 are formed around the fan 21, when the display is used, the main board cover screw studs and the main board mounting holes are aligned and then mounted at corresponding positions of the display, and the fan 21 on the main board cover 2 continuously operates to provide a downward air channel and accelerate air flow.

Referring to fig. 4, the design of the modular heat sink 3 includes a base 31 and heat dissipation plates 32, the heat dissipation plates 32 are in the shape of an oblique truncated pyramid, a plurality of heat dissipation plates 32 are arranged on the base 31, the modular heat sink 3 is adhered to the capacitor 12 and the control chip 13 on the motherboard by a heat conductive adhesive in use, one or more modular heat sinks 3 can be installed according to the size of the top of the capacitor 12 and the top of the control chip 13, and when a plurality of modular heat sinks 3 are installed, the modular heat sinks 3 are closely arranged on a heat-dissipating device in a matrix, so that the heat conduction range is wider.

Regarding the design of the dust-proof board 4, referring to fig. 5, the dust-proof board 4 is provided with a dust-proof net 42, dust-proof board screw holes 41 are opened at positions corresponding to the main board cover screw holes 22 around the dust-proof net 42, when in use, the dust-proof board 4 is screwed on the main board cover 2 after the dust-proof board screw holes 41 are aligned with the main board cover screw holes 22, and at this time, the dust-proof net 42 covers the fan 21 to prevent dust driven when air flows with high speed from entering the main board.

The utility model discloses a theory of operation and use flow: during the use, install electric capacity 12 and control chip 13 department on the mainboard through heat conduction glue with one or more modularization radiators 3, make modularization radiator 3 can cover electric capacity 12 and control chip 13's top surface, then with install in the display corresponding position department together after mainboard lid stud aligns mainboard installing port, install in mainboard lid 2 top corresponding position department after aligning mainboard lid screw 22 with dust guard screw 41 at last, the passive heat dissipation of the component of mainboard is strengthened through modularization radiator 3 this moment, heat accessible radiator fan 21 is discharge with higher speed simultaneously, whole radiating efficiency is showing and is promoted.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed by the preferred embodiment, it is not limited to the present invention, and any person skilled in the art can make modifications or changes equivalent to the equivalent embodiments by utilizing the above disclosed technical contents without departing from the technical scope of the present invention, but all the modifications, changes and changes of the technical spirit of the present invention made to the above embodiments are also within the scope of the technical solution of the present invention.

Claims

1. The utility model provides a digital multimedia conference shows mainboard, includes mainboard (1) and mainboard lid (2) of setting on mainboard (1), its characterized in that: a modularized radiator (3) is arranged on the main board (1), and a radiating component (5) is arranged at the top of the main board cover (2);

the top of mainboard lid (2) is opened there is the thermovent, radiator unit (5) are including fan (21), fan (21) are fixed in the thermovent through the mounting bracket.

2. The display main board for the digital multimedia conference, according to claim 1, wherein: one side of the fan (21) far away from the main board (1) is provided with a dust guard (4), and the dust guard (4) is fixed on the main board cover (2).

3. The display main board for digital multimedia conferences according to claim 2, characterized in that: the middle part of the dustproof plate (4) is provided with a dustproof net (42), and the position of the dustproof net (42) corresponds to the position of the fan (21).

4. The display main board for the digital multimedia conference, according to claim 1, wherein: modularization radiator (3) are including base (31), be equipped with a plurality of heating panel (32) on base (31), heating panel (32) are oblique four-edge platform type, the top terminal surface area of heating panel (32) is less than the bottom area.

5. The display main board for digital multimedia conferences according to claim 1, characterized in that: be provided with a plurality of electric capacity (12) and control chip (13) on mainboard (1), all be provided with a plurality of modularization radiator (3) on electric capacity (12) and control chip (13).

6. The display main board for digital multimedia conferences according to claim 2, characterized in that: dust guard screw (41) have all been seted up at four edges of dust guard (4), set up on mainboard lid (2) mainboard lid screw hole (22) corresponding with dust guard screw hole (41), dust guard screw hole (41) are connected through the installation nail with mainboard lid screw hole (22) that correspond.