CN216217891U - Drive controller of electric low-speed vehicle - Google Patents

Abstract

The utility model relates to a driving controller of an electric low-speed vehicle, comprising: the LED lamp comprises a heat dissipation plate, an MOS tube aluminum substrate, a switching aluminum bar, a driving plate assembly, a shell and a control plate; the heat dissipation plate is provided with a mounting plane, the MOS tube aluminum substrate is attached to the mounting plane, and the MOS tube aluminum substrate is provided with a first switching copper column, a second switching copper column and a support column; the adapter aluminum row is connected to the first adapter copper column and provided with an aluminum row support; the driving plate assembly is connected to the support columns and the second transfer copper columns, driving plate through holes are formed in the driving plate assembly, and the aluminum row support columns are inserted into the driving plate through holes; the shell is connected to the mounting plane of the heat dissipation plate and covers the MOS tube aluminum substrate, the switching aluminum row and the driving plate assembly; the control panel is installed in the casing, and the connector of control panel wears out the casing installation via hole. Adopt the aluminium base board of MOS pipe to replace the scheme of IGBT module, can effectual reduction in production cost, and each part zonulae occludens, the degree of integrating is high, and the user demand of different occasions can be satisfied in miniaturized design.

Description

Drive controller of electric low-speed vehicle

Technical Field

The utility model relates to the technical field of electric vehicle driving systems, in particular to a driving controller of an electric low-speed vehicle.

Background

With the new energy of various low-speed vehicles, including electric forklifts, electric tractors, logistics storage vehicles, various engineering mechanical vehicles, small-sized agricultural vehicles and other low-speed low-voltage type electric vehicles, the requirements of the industry on the aspects of volume, cost, protection level and the like are higher and higher, with the increasingly fine division of the industry, under the large environment of increasingly severe competition, more and more host manufacturers urgently need to improve the competitiveness of the whole vehicle and the energy consumption efficiency of the vehicle, and customers put forward higher requirements on the volume, the protection level, the use occasions, the overall cost and the like of products.

Traditional electric motor car drive controller includes that casing, IGBT module, drive plate, control panel, film capacitor, low pressure connector and input/output end use the connector, through using the copper bar to carry out the switching and be connected with the connector, the IGBT module cost is higher and the drive controller's of this structure whole volume is great, consequently, continues a drive controller that the volume is less and the cost is lower.

SUMMERY OF THE UTILITY MODEL

The utility model provides a drive controller of an electric low-speed vehicle, which aims to solve the technical problems of large overall size and high production cost of the drive controller.

The technical scheme of the utility model is realized in such a way, and the utility model provides a driving controller of an electric low-speed vehicle, which comprises:

a heat dissipation plate provided with a mounting plane;

the MOS tube aluminum substrate is attached to the mounting plane, and a first switching copper column, a second switching copper column and a support column are arranged on the end face, deviating from the mounting plane, of the MOS tube aluminum substrate;

the adapter aluminum bar is connected to the first adapter copper column, and an aluminum bar support is arranged on the end face, far away from the mounting plane, of the adapter aluminum bar;

the driving plate assembly is connected to the supporting columns and the second transfer copper columns, driving plate through holes are formed in the driving plate assembly, and the aluminum row supporting columns are inserted into the driving plate through holes;

the shell is connected to the mounting plane of the heat dissipation plate and covers the MOS tube aluminum substrate, the switching aluminum bar and the drive plate assembly, mounting through holes and a plurality of wire outlet holes are formed in the shell, and the aluminum bar support extends into the wire outlet holes;

the control panel, install in the casing, the connector of control panel wears out the installation via hole.

In one embodiment, further comprising a first seal ring;

the casing is equipped with the seal groove, the seal groove set up in the casing with mounting plane's junction, first sealing washer is located in the seal groove and with mounting plane looks butt.

In one embodiment, two side faces of the first sealing ring perpendicular to the installation plane are provided with protruding portions, and the protruding portions are abutted against the inner wall of the installation groove.

In one embodiment, the MOS tube aluminum substrate is further provided with a plurality of positioning adapter columns, the driving plate assembly is provided with positioning holes matched with the positioning adapter columns, and the positioning adapter columns are inserted into the positioning holes so that the driving plate assembly is connected with the MOS tube aluminum substrate in a positioning mode.

In one embodiment, a heat conduction silicone grease layer is arranged on an end face, facing the heat dissipation plate, of the MOS tube aluminum substrate, and the heat conduction silicone grease layer is attached to the heat dissipation plate.

In one embodiment, the device further comprises a pre-charged aluminum shell resistor;

the pre-charging aluminum shell resistor is connected to the heat dissipation plate, a heat conduction silicone grease layer is arranged on the end face, facing the heat dissipation plate, of the pre-charging aluminum shell resistor, and the heat conduction silicone grease layer is attached to the heat dissipation plate.

In one embodiment, the drive plate assembly includes:

the driving plate is connected to the supporting column and the second transfer copper column;

the reinforcing plate is arranged on the end face, facing the mounting plane, of the driving plate;

the wiring terminal is arranged on the end face, deviating from the mounting plane, of the driving board, and the reinforcing plate and the wiring terminal are fixedly connected to the driving board through screws;

the capacitors are arranged on the end face, deviating from the mounting plane, of the driving plate;

the capacitor isolation insulating paper is provided with a glue coating surface, and the capacitor isolation insulating paper is attached to the capacitor through the glue coating surface.

In one embodiment, the drive plate assembly further comprises a copper bar;

be equipped with first mounting hole on the drive plate, be equipped with first via hole on the copper bar, first via hole in-connection has screw to keep apart insulating column, screw keeps apart insulating column and passes first via hole and connect in the first mounting hole, make the copper bar with drive plate fixed connection.

In one embodiment, the device further comprises a plurality of second sealing rings;

the wiring terminal and the aluminum row supporting columns are all sleeved with second sealing rings, and the second sealing rings are abutted to the wall of the wire outlet hole, so that the wire outlet hole is sealed.

In one embodiment, the MOS tube aluminum substrate comprises a MOS tube and an aluminum substrate;

the aluminum substrate is provided with a plurality of second mounting holes, and the MOS tubes are welded in the second mounting holes of the aluminum substrate.

Compared with the prior art, the drive controller of the electric low-speed vehicle has the following beneficial effects:

(1) the scheme that the MOS tube aluminum substrate replaces an IGBT module can effectively reduce production cost, all parts are tightly connected, the integration degree is high, and the miniaturized design can meet the use requirements of different occasions;

(2) the two sides of the first sealing ring are provided with the protruding parts, the protruding parts are abutted against the inner wall of the mounting groove, and the first sealing ring can be effectively prevented from falling off after mounting by the protruding parts;

(3) a positioning adapter column is arranged on the end face, deviating from the mounting plane, of the MOS tube aluminum substrate, so that the MOS tube aluminum substrate is conveniently connected with the driving plate assembly in a positioning mode, and dislocation during blind plugging is prevented;

(4) a plurality of second mounting holes are formed in the aluminum substrate, and the MOS tubes are welded in the second mounting holes of the aluminum substrate; the MOS tubes are all welded on the aluminum substrate, and the second mounting holes are additionally arranged, so that welding deformation can be effectively prevented, and good contact of the radiating surface is ensured.

Drawings

FIG. 1 is a schematic diagram of a prior art drive controller;

FIG. 2 is a schematic structural diagram of a driving controller according to an embodiment of the present invention;

FIG. 3 is an exploded view of a drive controller according to an embodiment of the present invention;

FIG. 4 is a schematic view illustrating an installation of a MOS aluminum substrate and a heat dissipation plate according to an embodiment of the utility model;

FIG. 5 is a schematic structural diagram of a driving plate assembly according to an embodiment of the present invention;

FIG. 6 is a schematic view of an installation of a drive plate assembly according to an embodiment of the present invention;

FIG. 7 is a schematic view of the mounting of the housing and the control panel according to the embodiment of the present invention;

fig. 8 is a schematic view of the installation of the housing according to the embodiment of the present invention.

Description of reference numerals:

10. a heat dissipation plate; 11. a mounting plane; 12. a third mounting hole; 13. a first screw hole;

20. an MOS tube aluminum substrate; 21. a second screw hole; 22. a first transfer copper column; 221. a via hole of the first transition copper pillar; 23. a second transfer copper pillar; 24. a support pillar; 25. positioning the transfer column;

30. transferring the aluminum row; 31. a via hole for the aluminum row; 32. aluminum row pillars;

40. a drive plate assembly; 41. a drive plate via; 42. a drive plate; 421. a first mounting hole; 43. a reinforcing plate; 44. a B-terminal binding post; 45. a terminal at the B + end; 46. a capacitor; 47. capacitance isolation insulating paper; 48. copper bars; 481. a first via hole;

50. a housing; 51. a wire outlet hole; 52. mounting a through hole; 53. installing a notch;

60. a control panel; 61. a connector;

70. a screw isolation insulating post;

80. a second seal ring;

90. a first seal ring; 91. a boss portion;

100. and pre-charging the aluminum shell resistor.

Detailed Description

In order to facilitate an understanding of the utility model, the utility model is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, the driving controller of the electric low-speed vehicle in the prior art is schematically configured, and has a large height and a large volume when viewed from fig. 1.

An embodiment of the present invention provides a driving controller for an electric low-speed vehicle, as shown in fig. 3, including a heat dissipation plate 10, a MOS transistor aluminum substrate 20, a plurality of transfer aluminum rows 30, a driving plate assembly 40, a housing 50, and a control board 60.

The heat dissipation plate 10 may have a square plate-shaped configuration or a circular or polygonal plate-shaped configuration, for example, the heat dissipation plate 10 has a mounting plane 11 on the upper end surface of the heat dissipation plate 10, the mounting plane 11 is provided with a plurality of screw holes and a plurality of third mounting holes 12, the screw holes may be used to connect various components, and the third mounting holes 12 may be used to connect the housing 50. The third mounting holes 12 may be formed at or near four corners of the heat dissipation plate 10, and the screw holes are closer to the center of the heat dissipation plate 10.

An MOS tube aluminum substrate 20 attached to the mounting plane 11 of the heat dissipation plate 10, a plurality of second screw holes 21 are also formed in the MOS tube aluminum substrate 20, the second screw holes 21 can be formed in four corners of the MOS tube aluminum substrate 20, first screw holes 13 corresponding to the second screw holes 21 are included in the screw holes in the heat dissipation plate 10, when the MOS tube aluminum substrate 20 is attached to the heat dissipation plate 10, it is required to ensure that the second screw holes 21 are aligned with the first screw holes 13 of the heat dissipation plate 10, and then the MOS tube aluminum substrate 20 is fixedly connected with the heat dissipation plate 10 through screws penetrating into the first screw holes 13 and the second screw holes 21.

The MOS transistor aluminum substrate 20 includes a MOS transistor and an aluminum substrate, the outline of the aluminum substrate is similar to the outline of the heat dissipation plate 10, and the aluminum substrate may also be a square plate structure. The aluminum substrate is provided with a plurality of second mounting holes, the second mounting holes are not shown in the figure, the MOS tubes are welded in the second mounting holes of the aluminum substrate, the MOS tubes are all welded on the aluminum substrate, the second mounting holes are additionally arranged, and welding deformation can be effectively prevented to ensure that the radiating surface is well contacted. In order to further improve the heat dissipation efficiency, the end surface of the MOS tube aluminum substrate 20 facing the heat dissipation plate 10 may be provided with a heat conductive silicone layer, the heat conductive silicone layer is attached to the heat dissipation plate 10, and the heat conductive silicone layer is disposed between the MOS tube aluminum substrate 20 and the heat dissipation plate 10 to improve the heat transfer efficiency, thereby improving the heat transfer efficiency.

The end face, away from the mounting plane 11, of the MOS tube aluminum substrate 20 is provided with a plurality of first adapting copper pillars 22, a plurality of second adapting copper pillars 23, and a plurality of support pillars 24, and the first adapting copper pillars 22 and the second adapting copper pillars 23 can be distributed on the upper surface of the MOS tube aluminum substrate 20 in rows, as shown in fig. 4, four first adapting copper pillars 22 are a horizontal row, and the three horizontal rows of first adapting copper pillars 22 are distributed on the MOS tube aluminum substrate 20 in parallel; five second interconnecting copper columns 23 are arranged in a horizontal row, the four second interconnecting copper columns 23 in the horizontal row are distributed on the MOS tube aluminum substrate 20 in parallel, and it should be noted that a first interconnecting copper column 22 in the horizontal row needs to be arranged between every two second interconnecting copper columns 23 in the horizontal row. The supporting posts 24 may be disposed at the edge of the upper surface of the MOS tube aluminum substrate 20, as shown in fig. 4, the supporting posts 24 may be disposed at the second screw holes 21 at four corners of the MOS tube aluminum substrate 20, and the supporting posts 24 may also be connected in the second screw holes 21.

The switching aluminum bars 30 are connected to the first switching copper pillars 22, as shown in fig. 4, one switching aluminum bar 30 is connected to four first switching copper pillars 22, that is, one switching aluminum bar 30 is connected to one horizontal first switching copper pillar 22, and the upper surfaces of the three horizontal first switching copper pillars 22 are connected to the switching aluminum bars 30.

As shown in fig. 4, four through holes are formed in the aluminum row 30, and four through holes are also formed in the first copper pillar 22, and the through holes 31 of the four aluminum row are respectively in one-to-one correspondence with the through holes 221 of the first copper pillar. The screw isolation insulating column 70 comprises a main body and a screw, a through hole is also formed in the main body, the main body of the screw isolation insulating column 70 penetrates into the through hole 31 of the transfer aluminum bar and the through hole 221 of the first transfer copper column respectively, and then the screw penetrates into the through hole of the main body and is connected to the heat dissipation plate 10, so that the transfer aluminum bar 30 is fixed. The aluminum row pillar 32 is disposed at the center of the aluminum row adapter 30, and the aluminum row pillar 32 extends away from the mounting plane 11.

As shown in fig. 6, a driving plate through hole 41 is formed in the driving plate assembly 40, and the aluminum row support columns 32 are directly inserted into the driving plate through hole 41, so that the driving plate assembly 40 is positioned and mounted on the transfer aluminum row 30.

In one embodiment, the MOS tube aluminum substrate 20 is further provided with a plurality of positioning adapter pillars 25, and the fixing studs of the positioning adapter pillars 25 and the supporting studs 24 can both pass through corresponding screw holes on the MOS tube aluminum substrate 20 and be fixedly connected to the heat dissipation plate 10. The driving plate assembly 40 is provided with a positioning hole matched with the positioning adapter column 25, the positioning hole is not shown in the figure, and the positioning adapter column 25 is inserted into the positioning hole so that the driving plate assembly 40 is connected with the MOS tube aluminum substrate 20 in a positioning manner. And a positioning adapter column 25 is arranged on the end face, away from the mounting plane 11, of the MOS tube aluminum substrate 20, so that the MOS tube aluminum substrate 20 is connected with the driving plate assembly 40 in a positioning manner, and dislocation during blind plugging is prevented.

As shown in fig. 5, the driving board assembly 40 includes a driving board 42, a reinforcing board 43, a post, a plurality of capacitors 46, and a capacitor isolation insulating paper 47. The driving plate 42 is connected to the supporting column 24 and the second transfer copper column 23, the reinforcing plate 43 is arranged on the end face, facing the mounting plane 11, of the driving plate 42, the binding posts comprise a B-end binding post 44 and a B + end binding post, the two binding posts are arranged on the end face, facing away from the mounting plane 11, of the driving plate 42, and the reinforcing plate 43 and the binding posts are fixedly connected to the driving plate 42 through screws; the two binding posts can be fixed on the driving board 42 by adopting a double-layer PCB so as to ensure that the binding posts are not deformed and inclined after being installed; a plurality of capacitors 46 are arranged on the end face of the drive plate 42 facing away from the mounting plane 11; the upper surface of electric capacity 46 is then located to electric capacity isolation insulating paper 47, and electric capacity isolation insulating paper 47 is equipped with the spreading surface, and electric capacity isolation insulating paper 47 is laminated on electric capacity 46 through the spreading surface.

The driving plate assembly 40 further comprises a copper bar 48, a first mounting hole 421 is formed in the driving plate 42, a first through hole 481 is formed in the copper bar 48, a screw isolation insulating column 70 is connected in the first through hole 481, and the screw isolation insulating column 70 penetrates through the first through hole 481 and is connected in the first mounting hole 421, so that the copper bar 48 is fixedly connected with the driving plate 42; the first mounting holes 421 and the first vias 481 correspond to the second via copper pillars 23 one to one.

The housing 50 is connected to the mounting plane 11 of the heat dissipation plate 10 and covers the MOS transistor aluminum substrate 20, the adapting aluminum bar 30 and the driving board assembly 40, the housing 50 is provided with a mounting via 52 and a plurality of wire holes 51, and the aluminum bar support 32 extends into the wire holes 51. As shown in fig. 8, the third mounting holes 12 are disposed at four corners of the heat dissipation plate 10, the housing 50 is provided with corresponding mounting studs toward an end surface of the third mounting hole 12, the mounting studs are not shown on the way, the mounting studs correspond to the third mounting holes 12, the mounting studs extend into the third mounting holes 12 for positioning connection, and the housing 50 is fixedly connected to the heat dissipation plate 10 by screws penetrating into the third mounting holes 12 and being connected to the mounting studs. The B-terminal post 44 and the B + terminal post respectively pass through two outlet holes 51 at the left end of the housing 50, and the aluminum row posts 32 of the aluminum row 30 respectively pass through three outlet holes 51 at sections of the housing 50. The upper surface of the housing 50 is further provided with a mounting notch 53, and the mounting notch 53 can be clamped and sealed through an adapter plug.

In one embodiment, a plurality of second sealing rings 80 are further included, and as shown in fig. 8, one second sealing ring 80 is disposed in each outlet hole 51. The wiring terminal and the aluminum row support post 32 are both sleeved with a second sealing ring 80, and the second sealing ring 80 abuts against the inside of the hole wall of the wire outlet hole 51, so that the wire outlet hole 51 is sealed.

Further, the outlet hole 51 can be filled with sealing glue to ensure the sealing property.

In one embodiment, as shown in fig. 7, the heat sink further includes a first sealing ring 90, the housing 50 is provided with a sealing groove, the sealing groove is opened at a connection position of the housing 50 and the mounting plane 11, and the first sealing ring 90 is disposed in the sealing groove and abuts against the mounting plane 11 to seal a gap between the housing 50 and the heat sink 10.

Furthermore, two side surfaces of the first sealing ring 90 perpendicular to the mounting plane 11 are provided with protrusions 91, and the protrusions 91 are abutted against the inner wall of the mounting groove. The both sides of sealing washer all set up bellying 91, and bellying 91 and the inner wall looks butt of mounting groove can prevent effectively that first sealing washer 90 from droing after the installation through setting up bellying 91

The control board 60 is mounted in the housing 50, as shown in fig. 7, and the connector 61 of the control board 60 passes through the mounting hole 52 of the housing 50.

In one embodiment, the heat dissipating device further includes a pre-filled aluminum casing resistor 100, the pre-filled aluminum casing resistor 100 is connected to the heat dissipating plate 10, a heat conductive silicone layer is disposed on an end surface of the pre-filled aluminum casing resistor 100 facing the heat dissipating plate 10, the heat conductive silicone layer is attached to the heat dissipating plate 10, and the heat conductive silicone layer is disposed to improve the heat conductive efficiency of the pre-filled aluminum casing resistor 100, so as to improve the heat dissipating efficiency.

The installation method of the drive controller of the electric low-speed vehicle comprises the following steps:

as shown in fig. 3 and 4, the end surface of the MOS tube aluminum substrate 20 facing the mounting plane 11 is uniformly coated with a heat conductive silicone grease to form a heat conductive silicone grease layer; then, placing the MOS tube aluminum substrate 20 on the installation plane 11 of the heat dissipation plate 10, ensuring that the second screw holes 21 of the MOS aluminum substrate are aligned with the first screw holes 13 of the heat dissipation plate 10, and penetrating the first screw holes 13 and the second screw holes 21 by screws to fixedly connect the MOS aluminum substrate with the heat dissipation plate 10;

the aluminum row transferring 30 is placed on the upper surface of the first copper column transferring 22, the through holes 31 of the aluminum row transferring correspond to the through holes 221 of the first copper column transferring one by one, the main body of the screw isolation insulating column 70 penetrates into the through holes 31 of the aluminum row transferring and the through holes 221 of the first copper column transferring respectively, and then penetrates into the through holes of the main body and is connected to the heat dissipation plate 10 through screws, so that the aluminum row transferring 30 is fixed;

the fixing studs of the positioning adapter column 25 and the support column 24 both penetrate through corresponding screw holes on the MOS tube aluminum substrate 20 and are fixedly connected in the screw holes of the heat dissipation plate 10; the bottom surface of the pre-charging aluminum shell resistor 100 is coated with heat-conducting silicone grease, and the pre-charging aluminum shell resistor 100 is fixed at the edge of the heat dissipation plate 10 by using screws;

as shown in fig. 5, screws are respectively inserted into the mounting holes of the reinforcing plate 43 and the driving plate 42 to fix the B-terminal connection post 44 and the B + terminal connection post on the driving plate 42, the protective film of the capacitor isolation insulating paper 47 is torn off, the glue-coated surface of the capacitor isolation insulating paper 47 is attached to the surface of the capacitor 46 of the driving plate 42, and then the via hole on the capacitor isolation insulating paper 47 is ensured to be aligned with the corresponding via hole of the driving plate 42; the main body of the screw isolation insulating column 70 passes through the first via hole 481 of the positive and negative end reinforcing copper bar 48 and the first mounting hole 421 of the driving plate 42, respectively, so that the copper bar 48 is mounted on the driving plate 42, thereby completing the mounting of the driving plate assembly 40.

As shown in fig. 6, the aluminum row struts 32 extend to the drive plate via holes 41 of the drive plate 42, the drive plate 42 is connected to the surface of the support columns 24 and the surface of the second transfer copper columns 23, the screw isolation insulation columns 70 respectively penetrate through the corresponding drive plate 42 mounting holes, then screws respectively penetrate through the corresponding screw isolation insulation columns 70 via holes, the drive plate 42 is fixedly connected to the heat dissipation plate 10, and screws penetrate through the second screw holes 21 and the support columns 24 via holes, so that the drive plate 42 is fixedly connected to the support columns 24;

as shown in fig. 7, the control board 60 is disposed in the direction shown in the drawing, the connector 61 of the control board 60 is inserted through the mounting through hole 52 of the housing 50, and the control board 60 is fixed in the housing 50 by a tapping screw; clamping the first sealing ring 90 of the shell 50 in the sealing groove of the shell 50 according to the position and the direction in the figure, and finishing the installation of the control plate 60 and the first sealing ring 90;

the adapter aluminum bar 30, the B-terminal binding post 44 and the B + terminal binding post respectively pass through the corresponding binding holes, pass through the third mounting hole 12 of the heat dissipation plate 10 by screws and are fixedly connected to the mounting stud of the shell 50, so that the shell 50 is fixedly connected with the heat dissipation plate 10; the second sealing ring 80 is respectively sleeved on the B-terminal wiring column 44 and the B + terminal wiring column, and is clamped in the wire outlet hole 51, the wire outlet hole 51 is filled with sealing glue, and the switching plug is directly clamped in the mounting groove of the shell 50, so that all components are mounted, and the mounting is completed as shown in fig. 2.

According to the driving controller of the electric low-speed vehicle, the scheme that the MOS tube aluminum substrate 20 replaces an IGBT module is adopted, the production cost can be effectively reduced, all the parts are tightly connected, the integration degree is high, and the miniaturization design can meet the use requirements of different occasions.

The driving controller of the electric low-speed vehicle can use a natural cooling radiator scheme, and meets the requirements of IP65 protection grade and vibration grade of a machine; the process assembly is simple, the integration degree is high, and the price and the cost of the whole machine are low; the whole structure of the machine can meet the protection grade of IP65 and the requirement of vibration grade, and is suitable for different occasions and environments; the whole structure of the machine is flexible and convenient to disassemble and assemble, the maintenance is simple and convenient, most of internal parts can be die sinking parts, and the whole universality of the precision of the parts is ensured; the whole structure is flexible, can be used as a single main drive, can also meet the requirements of dual-drive and multi-drive parallel operation, and has high precision and strong universality among parts.

It should be noted that the description of the present invention and the accompanying drawings illustrate preferred embodiments of the present invention, but the present invention may be embodied in many different forms and is not limited to the embodiments described in the present specification, which are provided as additional limitations to the present invention and to provide a more thorough understanding of the present disclosure. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the utility model as defined by the appended claims.

Claims (10)

1. A drive controller for an electric low-speed vehicle, comprising:

a heat dissipation plate (10) provided with a mounting plane (11);

the MOS tube aluminum substrate (20) is attached to the mounting plane (11), and a first switching copper column (22), a second switching copper column (23) and a support column (24) are arranged on the end face, deviating from the mounting plane (11), of the MOS tube aluminum substrate (20);

the adapter aluminum row (30) is connected to the first adapter copper column (22), and an aluminum row support column (32) is arranged on the end face, far away from the mounting plane (11), of the adapter aluminum row (30);

the driving plate assembly (40) is connected to the supporting columns (24) and the second transfer copper columns (23), driving plate through holes (41) are formed in the driving plate assembly (40), and the aluminum row supporting columns (32) are inserted into the driving plate through holes (41);

the shell (50) is connected to the mounting plane (11) of the heat dissipation plate (10) and covers the MOS tube aluminum substrate (20), the transfer aluminum bar (30) and the driving plate assembly (40), mounting through holes (52) and a plurality of wire outlet holes (51) are formed in the shell (50), and the aluminum bar support columns (32) extend into the wire outlet holes (51);

and the control board (60) is installed in the shell (50), and a connector (61) of the control board (60) penetrates through the installation through hole (52).

2. The drive controller of an electric low-speed vehicle according to claim 1, further comprising a first seal ring (90);

the casing (50) is equipped with the seal groove, the seal groove set up in casing (50) with the junction of mounting plane (11), first sealing washer (90) are located in the seal groove and with mounting plane (11) looks butt.

3. The drive controller of an electric low-speed vehicle according to claim 2, wherein the first seal ring (90) has a protrusion (91) on both sides perpendicular to the mounting plane (11), and the protrusion (91) abuts against the inner wall of the seal groove.

4. The drive controller of the electric low-speed vehicle according to claim 1, wherein a plurality of positioning adapter columns (25) are further arranged on the MOS tube aluminum substrate (20), positioning holes matched with the positioning adapter columns (25) are formed in the drive plate assembly (40), and the positioning adapter columns (25) are inserted into the positioning holes so that the drive plate assembly (40) is connected with the MOS tube aluminum substrate (20) in a positioning manner.

5. The drive controller for an electric low-speed vehicle according to claim 1, wherein an end surface of the MOS tube aluminum substrate (20) facing the heat dissipation plate (10) is provided with a heat conductive silicone layer, and the heat conductive silicone layer is bonded to the heat dissipation plate (10).

6. The drive controller of an electric low-speed vehicle according to claim 1, further comprising a pre-charged aluminum case resistor (100);

the pre-charging aluminum shell resistor (100) is connected to the heat dissipation plate (10), a heat conduction silicone grease layer is arranged on the end face, facing the heat dissipation plate (10), of the pre-charging aluminum shell resistor (100), and the heat conduction silicone grease layer is attached to the heat dissipation plate (10).

7. The drive controller of an electric low-speed vehicle according to claim 1, wherein the drive plate assembly (40) includes:

the driving plate (42) is connected to the supporting column (24) and the second transfer copper column (23);

a reinforcing plate (43) provided on an end surface of the drive plate (42) facing the mounting plane (11);

the binding post is arranged on the end face, deviating from the mounting plane (11), of the driving plate (42), and the reinforcing plate (43) and the binding post are fixedly connected to the driving plate (42) through screws;

the capacitors (46) are arranged on the end face, away from the mounting plane (11), of the driving plate (42);

and the capacitor isolation insulating paper (47) is provided with a glue coating surface, and the capacitor isolation insulating paper (47) is attached to the capacitor (46) through the glue coating surface.

8. The drive controller of an electric low-speed vehicle according to claim 7, wherein the drive plate assembly (40) further includes a copper bar (48);

the driving plate (42) is provided with a first mounting hole (421), the copper bar (48) is provided with a first via hole (481), the first via hole (481) is internally connected with a screw isolation insulating column (70), and the screw isolation insulating column (70) penetrates through the first via hole (481) and is connected to the inside of the first mounting hole (421), so that the copper bar (48) is fixedly connected with the driving plate (42).

9. The drive controller of an electric low-speed vehicle according to claim 7, further comprising a plurality of second seal rings (80);

the wiring column and the aluminum row supporting column (32) are all sleeved with the second sealing ring (80), and the second sealing ring (80) is abutted to the wall of the wire outlet hole (51), so that the wire outlet hole (51) is sealed.

10. The drive controller of an electric low-speed vehicle according to claim 1, wherein the MOS tube aluminum substrate (20) includes a MOS tube and an aluminum substrate;

the aluminum substrate is provided with a plurality of second mounting holes, and the MOS tubes are welded in the second mounting holes of the aluminum substrate.

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