CN217037818U - Cloud terminal - Google Patents

Abstract

The present invention provides a cloud terminal, including: the touch screen comprises a bottom plate, a circuit board, a heat dissipation part, a middle frame and a touch pad, wherein the circuit board is arranged on one side of the bottom plate; one end of the circuit board comprises a groove with an inward-sunken edge, the heat dissipation part is arranged in the groove and used for dissipating heat of the circuit board; the touch control plate is arranged on one side of the circuit board back to the bottom plate; the middle frame comprises a first end and a second end which are communicated, the first end is connected with the bottom plate, and the second end is connected with the touch pad. The heat dissipation efficiency of the cloud terminal is improved.

Description

Cloud terminal

Technical Field

The utility model relates to the technical field of cloud computing, in particular to a cloud terminal.

Background

With the application of the cloud computer or the cloud desktop technology, the cloud terminal can acquire hardware resources required by the terminal device from the cloud resources through the transmission protocol. For example, hardware devices such as a CPU, a memory, and a hard disk of the cloud terminal are collected in the cloud data center.

At present, a cloud terminal can be designed into a card type structure, a user can log in and access to cloud computer service through the cloud terminal, and only a device for communication is included in the cloud terminal in order to reduce the size of the cloud terminal. However, the cloud terminal generates more heat during operation, which results in low heat dissipation efficiency of the cloud terminal.

SUMMERY OF THE UTILITY MODEL

The utility model provides a cloud terminal, which is used for solving the technical problem that the heat dissipation efficiency of the cloud terminal is low in the prior art.

The present invention provides a cloud terminal, including: a bottom plate, a circuit board, a heat dissipation component, a middle frame and a touch panel, wherein,

the circuit board is arranged on one side of the bottom plate;

one end of the circuit board comprises a groove with an inward-sunken edge, the heat dissipation part is arranged in the groove and used for dissipating heat of the circuit board;

the touch control plate is arranged on one side of the circuit board back to the bottom plate;

the middle frame comprises a first end and a second end which are communicated, the first end is connected with the bottom plate, and the second end is connected with the touch pad.

In a possible embodiment, the cloud terminal further includes a heat sink disposed between the circuit board and the bottom plate, and the heat sink is configured to absorb heat from the circuit board.

In one possible embodiment, the heat dissipation member is an induced draft fan.

In a possible embodiment, the side wall of the middle frame includes an air inlet and an air outlet, the air inlet is disposed on the side wall far away from the heat dissipation component, the air outlet is disposed on the side wall near the heat dissipation component, and the air from the air inlet is exhausted through the air outlet.

In a possible implementation manner, the inner wall of the middle frame comprises a clamping portion, and the clamping portion is connected with the circuit board so that the circuit board is clamped in the middle frame.

In a possible implementation manner, the touch pad is adhered to the second end of the middle frame, and the heat dissipation component is connected with one side of the touch pad facing the circuit board.

In one possible implementation, the circuit board includes a first side and a second side, the first side is a side facing the bottom plate, the second side is a side facing the touch pad, the first side includes a first component, the second side includes a second component, a height of the first component is less than or equal to a first threshold, a height of the second component is less than or equal to a second threshold, and the first threshold is greater than the second threshold.

In one possible embodiment, the first surface includes a motor, and the motor is configured to respond to a touch signal of the touch pad.

In a possible embodiment, opposite corners of the middle frame comprise antennas of the same communication type, and the first side of the circuit board comprises connection lines of the antennas.

In a possible implementation manner, the cloud terminal further includes a voice device, the voice device is disposed at an edge of the circuit board, and the voice device is configured to receive a voice signal.

The utility model provides a cloud terminal, which comprises: the circuit board is arranged on one side of the bottom plate, one end of the circuit board comprises a groove with an inward concave edge, the heat dissipation part is arranged in the groove and used for dissipating heat of the circuit board, the touch pad is arranged on one side of the circuit board, which faces away from the circuit board, the middle frame comprises a first end and a second end, the first end is connected with the bottom plate, and the second end is connected with the touch pad. According to the cloud terminal, a user can perform touch operation on the cloud terminal through the touch pad without configuring a mouse connected with the cloud terminal, so that the use cost of the cloud terminal is reduced, and in the operation of the cloud terminal, the heat generated by the circuit board can be discharged out of the cloud terminal through the heat dissipation part due to the fact that the heat dissipation part is arranged in the groove of the circuit board, and further the heat dissipation efficiency of the cloud terminal is improved.

Drawings

Fig. 1 is a schematic structural diagram of a cloud terminal according to an embodiment of the present invention;

fig. 2 is a schematic view of a heat dissipation process of a cloud terminal according to an embodiment of the present invention;

fig. 3A is a schematic structural diagram of a circuit board according to an embodiment of the present invention;

fig. 3B is a schematic structural diagram of a circuit board according to an embodiment of the present invention;

fig. 3C is a schematic structural diagram of a circuit board according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a middle frame according to an embodiment of the present invention;

fig. 5 is a schematic diagram of an antenna structure according to an embodiment of the present invention;

fig. 6 is a schematic diagram of another cloud terminal according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a location of a speech device according to an embodiment of the present invention;

fig. 8 is a schematic view of a working process of another cloud terminal according to an embodiment of the present invention.

Reference numerals:

11: a base plate;

12: a circuit board;

13: a heat dissipating member;

14: a middle frame;

15: a touch pad;

21: an air inlet;

22: an air outlet;

31: a groove;

32: a communication module;

33: a motor;

34: an external interface;

35: a wiring groove;

36: a first side;

37: a second face;

38: a first component;

39: a second component;

41: a first end;

42: a second end;

51: a first antenna;

52: a second antenna;

53: a first antenna connection line;

54: a second antenna connection line;

61: a heat sink;

71: a voice groove.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus a detailed description thereof will be omitted.

Although relative terms, such as "upper" and "lower," may be used herein to describe one element of an icon relative to another, such terms are used herein for convenience only, e.g., with reference to the orientation of the example illustrated in the drawings. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," and "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc. The terms "first" and "second" are used merely as labels, and are not limiting on the number of their objects.

For ease of understanding, the concepts related to the present application are explained below.

Cloud terminal: user terminal of cloud computer. The cloud computer is an integral service scheme, hardware devices such as a CPU (central processing unit), an internal memory and a hard disk are not arranged in the cloud computer, hardware resources of the cloud computer are all collected in a data center at the cloud end, and a user can access a cloud network at any place with the network through a cloud terminal. For example, by connecting the cloud terminal to a keyboard, a mouse, and a display, it is possible to access data and various applications of a user, which is not different from using a conventional computer. Because no hardware equipment is arranged, the safety of the cloud computer in use, maintenance and management is higher. For example, operations such as upgrading a cloud network and repairing bugs are all processed in a centralized manner at the cloud end, viruses do not have any attachments on a cloud terminal, and all applications, data and various interfaces of a cloud computer can be managed and controlled in a unified manner, so that the data of an enterprise is prevented from being lost.

In the correlation technique, cloud terminal can design for "card formula" structure, only includes the communication device who is used for the communication in the cloud terminal, and then acquires data in high in the clouds resource through communication device, can reduce cloud terminal's size like this, and the user of being convenient for carries. However, the cloud terminal generates more heat during operation, which results in lower heat dissipation efficiency of the cloud terminal.

In order to solve the technical problem that the heat dissipation efficiency of a cloud terminal is low in the related art, an embodiment of the utility model provides the cloud terminal which comprises a bottom plate, a circuit board, a heat dissipation part, a middle frame and a touch panel, wherein the circuit board is arranged on one side of the bottom plate, one end of the circuit board comprises a groove with an inward-recessed edge, the heat dissipation part is arranged in the groove and used for dissipating heat of the circuit board, the touch panel is arranged on one side, back to the bottom plate, of the circuit board, the middle frame comprises a first end and a second end which are communicated, the first end is connected with the bottom plate, the second end is connected with the touch panel, the cloud terminal further comprises a heat dissipation fin, and the heat dissipation fin is arranged between the circuit board and the bottom plate so that the heat dissipation fin can absorb heat dissipated by devices on the surface of the circuit board. Like this, the user can carry out touch-control operation to cloud terminal through the touch-control board, need not to dispose the mouse that links to each other with cloud terminal, reduce cloud terminal's use cost, and, the fin can absorb circuit board surface device's the aggregate heat, area of contact when improving the heat dissipation, when cloud terminal moves, because heat dissipation part sets up in the recess of circuit board, consequently, the heat that the circuit board produced and the absorptive heat of fin all can all pass through heat dissipation part discharge cloud terminal, and then improve cloud terminal's radiating efficiency.

Next, referring to fig. 1, a cloud terminal according to an embodiment of the present invention is described in detail.

Fig. 1 is a schematic structural diagram of a cloud terminal according to an embodiment of the present invention. Referring to fig. 1, the touch panel includes a base plate 11, a circuit board 12, a heat dissipation member 13, a middle frame 14, and a touch pad 15. The circuit board 12 is disposed on one side of the base plate 11, one end of the circuit board 12 includes a groove recessed inward from an edge, and the heat dissipation member 13 is disposed in the groove. The touch pad 15 is disposed on a side of the circuit board 12 opposite to the bottom board 11. The middle frame 14 includes a first end and a second end, the first end is connected to the bottom plate 11, and the second end is connected to the touch pad 15.

Alternatively, the shape of the bottom plate 11 may be a polygon. For example, the shape of the bottom plate may be any polygon such as a square, a rectangle, a circle, and the like. Optionally, the material of the bottom plate 11 may be glass. For example, the material for the base plate 11 of the cloud terminal may be glass, and the material for the base plate 11 may be aluminum alloy, ceramic, or the like. Optionally, the thickness of the bottom plate 11 is less than or equal to a preset threshold. For example, the thickness of the base plate 11 of the cloud terminal may be 0.4 mm, 0.5 mm, 0.8 mm, or the like.

Optionally, the circuit board 12 is used for data transmission. For example, the Circuit Board 12 may be a Printed Circuit Board (PCB) 12 on which a plurality of devices for communication are integrated. For example, a wifi module for data transmission may be included on the circuit board, an interface (e.g., Type-c interface) with an external device may also be included on the circuit board, and the like.

Optionally, one end of the circuit board 12 includes a groove recessed inward from the edge. For example, the surface of the circuit board may include a component region for mounting a component of the cloud terminal and an edge region, which may be a groove recessed inward from an end portion. Optionally, the other end of the circuit board 12 includes a trace groove recessed inward from the edge, and the trace groove is used for passing through lines on two sides of the circuit board.

Optionally, the circuit board 12 includes a first side and a second side. The first surface is a surface facing the bottom plate 11, and the second surface is a surface facing the touch panel 15. For example, the surface of the circuit board facing the base board may be the front surface of the circuit board, and the back surface of the circuit board may be the surface of the circuit board facing the touch pad.

Optionally, the first side of the circuit board 12 includes a first component and the second side of the circuit board 12 includes a second component. The height of the first component element is smaller than or equal to a first threshold value, the height of the second component element is smaller than or equal to a second threshold value, and the first threshold value is larger than the second threshold value. For example, the first component may be a high-height component such as a wifi module or a motor, and the second component may be a low-height component such as a resistor or a capacitor. For example, the components and parts that the first face of circuit board set up are highly being less than 3 millimeters components and parts, and the components and parts that the second face of circuit board set up are highly being less than 0.5 millimeters components and parts, can set up highly higher components and parts in the same side of circuit board like this, and the another side of circuit board can only set up highly lower components and parts, and then reduces the thickness of circuit board, reduces the thickness at cloud terminal to make cloud terminal portable. For example, the motor on the circuit board is 3 millimeters, wifi module on the circuit board is 2 millimeters, the resistance on the circuit board is 0.5 millimeter, if set up the motor at the first face of circuit board, set up the wifi module at the second face of circuit board, then no matter resistance sets up there, the thickness of circuit board all is 5 millimeters (neglecting the thickness of PCB board), if set up motor and wifi module at the first face of circuit board, set up resistance at the second face of circuit board (because the space resource on circuit board surface is limited, therefore, some components and parts need set up the another side at the circuit board), then the thickness of circuit board is 3.5 millimeters, can effectual reduction circuit board thickness like this, and then reduce the thickness at cloud terminal.

Optionally, the first side of the circuit board 12 includes a motor. The motor is used for responding to a touch signal of the touch pad 15. For example, when a user clicks a touch pad of the cloud terminal, the touch pad generates a current in response to a click operation of the user, and then the motor is driven by the current to vibrate or rotate, so that the touch operation is fed back to the user. For example, when a user clicks a touch pad of the cloud terminal, the motor generates vibration and transmits the vibration to the touch pad to respond to the touch operation of the user.

Optionally, the design of the circuit board 12 satisfies the following conditions: the functional module is designed in a regularization and miniaturization mode; and optimally placing the modules. Wherein, functional module regularization, miniaturized design specifically do: on the premise of ensuring the signal quality, the layout control of the components is reduced, and the layout area is saved. For example, place components and parts such as motor, wifi module at the first face of circuit board, place components and parts such as electric capacity, resistance at the second face of circuit board, can effectively reduce the demand of modular area like this, and then practice thrift the layout area of circuit board.

Optionally, the module position is optimized to be placed, specifically: the routing distance between the components on the surface of the circuit board 12 is small, the number of times of routing intersection is reduced, and the requirement of routing space is reduced. For example, the number of routing layers can be increased by routing intersection, and then the layout space of components is occupied, so that the distance between the components cannot be effectively shortened.

Optionally, the size of the shielding of the components on the circuit board 12 is smaller than or equal to the third threshold. For example, in the process flow of the circuit board, the size and the pitch of the pads of the shielding case of the component need to be reduced (for example, 1 mm in the prior art, and 0.6 mm in the present invention), so that the area of the circuit board can be reduced. Optionally, when the component is spirally mounted on the circuit board 12, the screw hole of the nut may be disposed at a position close to the edge of the circuit board 12, so as to improve the layout utilization rate.

Alternatively, the heat radiating member 13 may be an air-extracting fan. For example, because the induced draft fan is arranged at the position of the groove of the circuit board, when the induced draft fan works, air can uniformly flow on the first surface and the second surface of the circuit board, so that heat generated by the circuit board can be effectively absorbed, and the heat dissipation efficiency of the circuit board is improved. Optionally, the thickness of the heat dissipation member 13 is larger than the thickness of the circuit board 12. For example, the air-extracting fan sets up the recess at the circuit board, and the first face of the outstanding circuit board in air-extracting fan's top, the second face of the outstanding circuit board in air-extracting fan's bottom like this, and at air-extracting fan during operation, air-extracting fan can cool down the first face and the second face of circuit board simultaneously, improves the radiating efficiency at cloud terminal.

Optionally, the touch pad 15 is disposed on a side of the circuit board 12 opposite to the bottom plate 11. For example, the bottom of the cloud terminal is a bottom plate, the middle part of the cloud terminal is a circuit board and a heat dissipation part, and the top of the cloud terminal is a touch pad. Optionally, the touch pad 15 includes a touch surface and a non-touch surface. The non-touch surface faces the circuit board 12, and the touch surface faces away from the circuit board 12. For example, the touch surface of the touch pad is on the surface of the cloud terminal, and then the touch operation of the user is received through the touch surface. Alternatively, the shape of the touch pad 15 may be a polygon. For example, the shape of the touch pad 15 may be any polygon such as a square, a rectangle, and a circle. Alternatively, the shape of the touch pad 15 may be the same as that of the base plate 11. For example, if the shape of the base plate is rectangular, the shape of the touch panel is rectangular, and if the shape of the base plate is circular, the shape of the touch panel is circular.

Optionally, the middle frame 14 includes a first end and a second end therethrough. Wherein, the first end is connected with the bottom plate 11, and the second end is connected with the touch pad 15. For example, a first end of the middle frame is connected with the edge of the bottom plate, and a second end of the middle frame is connected with the edge of the touch pad. Optionally, the touch pad 15 is adhered to the second end of the middle frame 14, and the heat sink 13 is connected to a side of the touch pad 15 facing the circuit board 12. For example, the second end of the middle frame may be bonded to the non-touch surface of the touch pad by a back adhesive, and the top of the updraft fan may be connected (snapped, bonded, etc.) to the non-touch surface of the touch pad.

Optionally, the side wall of the middle frame 14 includes an air inlet and an air outlet. The air inlet is disposed on a side wall far away from the heat dissipation member 13, the air outlet is disposed on a side wall close to the heat dissipation member 13, and air from the air inlet is exhausted through the air outlet. For example, if the bottom plate is rectangular and the right edge of the circuit board includes a groove, the heat dissipation component is disposed on the right side of the circuit board, the air outlet may be disposed on the right side wall of the middle frame (the right side wall of the middle frame is closest to the right edge of the circuit board), and the air inlet may be disposed on the left side wall of the middle frame (the left side wall of the middle frame is farthest from the right edge of the circuit board).

Alternatively, the shape of the inlet and outlet may be the same. For example, if the air inlet is rectangular, the air outlet may also be rectangular. Optionally, the area of the air inlet may be larger than that of the air outlet. For example, the area of the air inlet can be 1.5 times that of the air outlet, so that the exhaust fan can absorb more air to reduce the temperature of the circuit board, and the heat dissipation efficiency of the cloud terminal is improved.

Alternatively, opposite corners of the middle frame 14 include the same type of antenna and the first side of the circuit board 12 includes the connection lines for the antenna. For example, when the bottom plate is rectangular, one opposite corner of the middle frame can be provided with an antenna supporting a 4G network, the other focusing of the middle frame can be provided with an antenna supporting a 5G network, and a connecting line between the antennas is arranged on the first surface of the circuit board, so that the antennas of the same type are farthest away, and the signal isolation is best. Optionally, the antenna may be fixed at an inner corner of the frame by in-mold injection molding. Optionally, the circuit board 12 may fix the connecting lines between the antennas by adding the wire clamp, so as to fix the antennas, thereby improving the stability of signal transmission.

In the practical application process, when a user clicks the touch pad of the cloud terminal, the touch pad generates current according to the clicking operation of the user, and the motor on the circuit board is driven to vibrate through the current so as to respond to the clicking operation of the user. When the cloud terminal works, the components and parts of the circuit board can generate heat, the air suction type fan can absorb air through the air inlet and exhaust air through the air outlet, and therefore the air can uniformly flow on the surface of the circuit board to absorb the heat generated by the components and parts of the circuit board, the air after absorbing the heat is exhausted out of the cloud terminal, and the heat dissipation efficiency of the cloud terminal is improved.

Next, a heat dissipation process of the cloud terminal will be described with reference to fig. 2.

Fig. 2 is a schematic diagram of a heat dissipation process of a cloud terminal according to an embodiment of the present invention. Referring to fig. 2, the electronic device includes a base plate 11, a circuit board 12, a heat dissipation member 13, a middle frame 14, and a touch pad 15. The circuit board 12 is disposed on one side of the base plate 11, one end of the circuit board 12 includes a groove recessed inward from an edge, and the heat dissipation member 13 is disposed in the groove. The touch pad 15 is disposed on a side of the circuit board 12 opposite to the bottom plate 11. The middle frame 14 includes a first end and a second end (not shown in fig. 2) connected through the middle frame, the first end is connected to the bottom plate 11, and the second end is connected to the touch pad 15. The side wall of the middle frame 14 includes an air inlet 21 and an air outlet 22, the air inlet 21 is disposed on the side wall far away from the heat dissipation component 13, the air outlet 22 is disposed on the side wall near the heat dissipation component 13, and the air from the air inlet 21 is exhausted through the air outlet 22.

Referring to fig. 2, when the cloud terminal operates, components of the circuit board 12 may generate heat and transfer the heat to the circuit board 12, and the heat dissipation component 13 may draw air into the cloud terminal through the air inlet 21 and discharge the air out of the cloud terminal through the air outlet 22, so that the air may uniformly flow on the surface of the circuit board 12 to absorb the heat generated by the components of the circuit board 12, thereby improving the heat dissipation efficiency of the cloud terminal.

The embodiment of the utility model provides a cloud terminal, which comprises a bottom plate, a circuit board, a heat dissipation part, a middle frame and a touch panel, wherein the circuit board is arranged on one side of the bottom plate, one end of the circuit board comprises a groove with an inward sunken edge, the heat dissipation part is arranged in the groove, the heat dissipation part is used for dispelling the heat to the circuit board, the touch-control board sets up the one side with the circuit board bottom plate dorsad, the center is including the first end and the second end that link up, first end is connected with the bottom plate, the second end is connected with the touch-control board, the circuit board includes first face and second face, first face is the face towards the bottom plate, the second face is the face towards the touch-control board, first face includes first components, the second face includes second components, the lateral wall of center includes air intake and air outlet, the air intake sets up in the lateral wall of keeping away from the heat dissipation part, the air outlet sets up in the lateral wall that is close to the heat dissipation part, the wind of air intake passes through the air outlet is discharged. Like this, the user can carry out touch-control operation to cloud terminal through the touch-control board, need not to dispose the mouse that links to each other with cloud terminal, reduce cloud terminal's use cost, the circuit board can be at first face and second face installation components and parts, and then improve the space utilization of circuit board, because the lower components and parts of second face only installation, and then can reduce the circuit board thickness, and, the heat dissipation part can be through air intake to the interior air that inhales of cloud terminal, and through air outlet with air exhaust cloud terminal, like this, the air can be even flows on the surface of circuit board, with the heat that the components and parts of absorption circuit board produced, and then improve cloud terminal's radiating efficiency.

Next, the structure of the circuit board will be described with reference to fig. 3A to 3C.

Fig. 3A is a schematic structural diagram of a circuit board according to an embodiment of the present invention. The embodiment shown in fig. 3A is the first side 36 of the circuit board 12, and fig. 3A shows the circuit board 12. The circuit board 12 includes a communication module 32, an external interface 34, a motor 33, and other communication components. One end of the circuit board 12 includes the recess 31 by the edge is inwards sunken, wherein, recess 31 is used for setting up heat dissipation part 13, and the other end of circuit board 12 includes and is walked line recess 35 by the edge is inwards sunken recess 31, and recess 31 is walked line recess 35 and is used for wearing to establish the connecting wire between first face 36 and the second face 37.

Fig. 3B is a schematic structural diagram of a circuit board according to an embodiment of the present invention. The embodiment shown in fig. 3B is a second side of the circuit board, and fig. 3B includes a circuit board 12. The circuit board 12 may include components with low height, such as capacitors and resistors. One end of the circuit board 12 includes a groove 31 recessed inwardly from the edge, and the other end of the circuit board 12 includes a trace groove 35 recessed inwardly from the edge.

Fig. 3C is a schematic structure of a circuit board according to an embodiment of the present invention. The embodiment shown in fig. 3C is a side view of a circuit board, see fig. 3C, including circuit board 12. The circuit board 12 includes a first side 36 and a second side 37. The first side 36 of the circuit board 12 includes a plurality of first components 38 and the second side 37 of the circuit board 12 includes a plurality of second components 39. By providing higher components on the first side 36 and lower components on the second side 37, the thickness of the circuit board 12 can be effectively reduced.

Next, the structure of the middle frame will be described with reference to fig. 4.

Fig. 4 is a schematic structural diagram of a middle frame according to an embodiment of the present invention. The embodiment shown in fig. 4 is a left side view of the middle frame, see fig. 4, including the middle frame 14. The middle frame 14 includes a first end 41, a second end 42, an air inlet 21 and an air outlet 22. The first end 41 is connected to the bottom plate 11 of the cloud terminal, and the second end 42 is connected to the touch pad 15 of the cloud terminal. The air inlet 21 is disposed on a side wall far away from the heat dissipating component 13, and the air outlet 22 is disposed on a side wall near the heat dissipating component 13, in the embodiment shown in fig. 4, an area of the air inlet 21 is larger than an area of the air outlet 22. When the heat dissipation part 13 operates, air may uniformly flow through the surface of the circuit board 12 in the cloud terminal through the air inlet 21 and be discharged through the air outlet 22, so that the heat dissipation efficiency of the cloud terminal may be improved.

Optionally, the inner wall of the middle frame 14 includes a snap-in portion. The clamping portion is connected to the circuit board 12, so that the circuit board 12 is clamped in the middle frame 14. For example, the inner wall of the middle frame can comprise a groove, the circuit board can be clamped in the middle frame through the groove, the circuit board is detachably mounted in the cloud terminal, when the circuit board is damaged, the circuit board can be detached or replaced, and then the maintenance cost of the cloud terminal is reduced.

Next, an antenna structure of the cloud terminal will be described with reference to fig. 5.

Fig. 5 is a schematic diagram of an antenna structure according to an embodiment of the present invention. Referring to fig. 5, the antenna includes a circuit board 12, a heat dissipation member 13, a middle frame 14, 2 first antennas 51, 2 second antennas 52, a first antenna connection line 53, and a second antenna connection line 54. The first antenna 51 is diagonally disposed in the middle frame 14, the second antenna 52 is diagonally disposed in the middle frame 14, the first antenna connection line 53 is routed on the circuit board, and the second antenna connection line 54 is routed on the circuit board. Optionally, the first antenna 51 may be an antenna supporting 4G communication, and the second antenna 52 may be an antenna supporting 5G communication, so that the same type of antenna has the farthest distance and the best signal isolation, and the connecting line of the antenna is routed on the circuit board, so that the antenna can be effectively fixed, and the stability of the antenna signal is improved.

Based on the embodiment shown in fig. 1, the structure of the cloud terminal shown in fig. 1 will be described in further detail below with reference to fig. 6.

Fig. 6 is a schematic diagram of another cloud terminal according to an embodiment of the present invention. Referring to fig. 6, the heat sink includes a bottom plate 11, a circuit board 12, a heat dissipation member 13, a middle frame 14, a touch pad 15, and a heat sink 61. Wherein, the circuit board 12 is disposed at one side of the base plate 11, one end of the circuit board 12 includes a groove 31 inwardly depressed from an edge, and the heat dissipation member 13 is disposed in the groove 31. The touch pad 15 is disposed on a side of the circuit board 12 opposite to the bottom board 11. The middle frame 14 includes a first end 41 and a second end 42 penetrating therethrough, the first end 41 is connected to the bottom plate 11, and the second end 42 is connected to the touch pad 15. The heat sink 61 is disposed between the circuit board 12 and the base plate 11.

Optionally, a heat sink 61 is used to absorb heat from the circuit board 12. For example, the fin can set up between circuit board and bottom plate, and the first face of circuit board is towards the fin, and the first component on the first face of circuit board can contact with the fin, and like this, the heat of gathering of first component can be transferred to the fin and gived off, can absorb the heat of fin when the air flows through the fin, improves the radiating efficiency at cloud terminal.

Alternatively, the material of the heat sink 61 may be graphite, aluminum alloy, brass, or the like. For example, a plurality of graphite heat sinks may be disposed between the circuit board and the base plate to rapidly absorb heat dissipated by the first component.

Alternatively, the shape of the heat sink 61 may be any polygonal shape. For example, in the practical application process, the internal space of the cloud terminal is limited, and the shape of the radiating fin can be adjusted according to the internal structure of the cloud terminal, so that the heat emitted by components on the circuit board can be absorbed to the maximum extent.

Optionally, the cloud terminal further includes a voice device. Wherein the voice device is disposed at the edge of the circuit board 12. The voice device is used for receiving voice signals. For example, a voice device of the cloud terminal may receive voice information sent by a user, and send the voice information to the cloud terminal through the cloud terminal, so that the cloud terminal generates a corresponding control instruction according to the voice information. For example, the user sends a voice of "opening a hard disk" to the cloud terminal, the cloud terminal sends the voice to the cloud terminal, and the cloud terminal can open the hard disk of the user according to the voice.

Optionally, the cloud terminal may include 2 voice devices, and the voice devices may be disposed at an edge of the circuit board 12. For example, the edge of circuit board can include 2 recesses that are used for placing speech device, and cloud terminal can possess the function of intelligent pronunciation like this, reduces the complexity of cloud terminal operation, improves user's experience.

In the embodiment shown in fig. 6, the size of the cloud terminal can be effectively reduced by the above structure. Next, the dimensions of the cloud terminal according to the embodiment of the present invention will be described with reference to tables 1 to 3.

Table 1 shows the cloud terminal thickness of the embodiment of the present invention:

TABLE 1

Path description	Size (millimeter)
		Touch control panel	0.7
Back adhesive	0.25
		Middle frame	0.6
Gap between circuit board and middle frame	1.1
		Circuit board	0.8
Gap between circuit board and heat sink	3.35
		Heat sink	0.1
Base plate	0.5

As can be seen from table 1, the thickness of the cloud terminal in the embodiment of the present invention is 7.4 mm.

Table 2 shows the cloud terminal length in the embodiment of the present invention:

TABLE 2

Path description	Size (millimeter)
		Middle frame (left side)	2.1
Circuit board and middle frame gap (wind path)	3.15
		Circuit board	56.15
Circuit board and radiating part gap (wind path)	4
		Heat dissipation component	30
Heat radiating component and middle frame gap (wind path)	4
		Middle frame (Right side)	2.1

As can be seen from table 2, the cloud terminal according to the embodiment of the present invention has a length of 101.5 mm.

Table 3 shows the cloud terminal width in the embodiment of the present invention:

TABLE 3

Path description	Size (millimeter)
		Middle frame (Plastic and side antenna)	3.05
Gap between circuit board and middle frame	0.2
		Circuit board	63.5
Gap between circuit board and heat dissipation component	0.2
		Middle frame (another side antenna and plastic)	3.05

As can be seen from table 3, the cloud terminal according to the embodiment of the present invention has a length of 70 mm.

As can be seen from the contents of tables 1, 2 and 3, the cloud terminal of the present invention has the following dimensions: the length is 101.5mm, the width is 70mm, the height is 7.4mm, the size of the terminal device of the existing cloud computer is effectively reduced, the carrying by a user is facilitated, and the user experience is improved.

Next, the position of the speech device on the circuit board will be described with reference to fig. 7.

Fig. 7 is a schematic position diagram of a speech apparatus according to an embodiment of the present invention. Referring to fig. 7, the printed circuit board 12 is included. One end of the circuit board 12 includes a groove 31 recessed inward from the edge, and the groove 31 is used for disposing the heat dissipation member 13. The bottom edge of the circuit board 12 includes 2 inward recessed voice grooves 71, wherein the voice grooves 71 are used for setting a voice device, and the voice device is set in the cloud terminal to reduce the operation complexity of the cloud terminal.

Next, the operation of the cloud terminal shown in fig. 6 will be described with reference to fig. 8.

Fig. 8 is a schematic view of a working process of another cloud terminal according to an embodiment of the present invention. Please refer to fig. 8, which includes a bottom plate, a circuit board, a heat dissipation member, a middle frame, a touch pad, and a heat sink. The circuit board is arranged on one side of the bottom plate, one end of the circuit board comprises a groove with an inward sunken edge, and the heat dissipation part is arranged in the groove. The touch pad is arranged on one side of the circuit board back to the bottom plate. The middle frame includes a first end and a second end (not shown), the first end is connected to the bottom plate, and the second end is connected to the touch pad. The heat sink is arranged between the circuit board and the bottom plate.

Referring to fig. 8, when the cloud terminal operates, the heat collected by the first component of the circuit board may be dissipated to the heat sink, the heat generated by the second component of the circuit board may be dissipated to the circuit board, and the air-extracting fan may absorb air through the air inlet and exhaust air through the air outlet, such that the air may uniformly flow on the surface of the circuit board to absorb the heat generated by the components of the circuit board, and exhaust the heat-absorbed air out of the cloud terminal, thereby improving the heat dissipation efficiency of the cloud terminal.

An embodiment of the present invention provides a cloud terminal, including: the circuit board is arranged on one side of the bottom plate, one end of the circuit board comprises a groove which is formed by inwards concave edges, the heat dissipation part is arranged in the groove, the touch control plate is arranged on one side of the circuit board, which faces away from the bottom plate, the middle frame comprises a first end and a second end which are communicated, the first end is connected with the bottom plate, the second end is connected with the touch control plate, and the heat dissipation plate is arranged between the circuit board and the bottom plate. The voice device may be disposed at an edge of the circuit board. Like this, the user can carry out touch-control operation to the cloud terminal through the touch-control board, need not to dispose the mouse that links to each other with the cloud terminal, reduce the use cost at cloud terminal, the user can pass through speech control cloud terminal, reduce the operation complexity at cloud terminal, and, the aggregation heat of circuit board surface device can be absorbed to the fin, area of contact when improving the heat dissipation, when cloud terminal operation, because heat dissipation part sets up in the recess of circuit board, therefore, the heat that the circuit board produced and the absorptive heat of fin all can be through heat dissipation part discharge cloud terminal, and then improve the radiating efficiency at cloud terminal.

In the description of the present application, it is to be understood that the terms "center", "length", "width", "thickness", "top", "bottom", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", "axial", "circumferential", and the like, are used to indicate an orientation or positional relationship based on that shown in the drawings, merely for the convenience of description and simplicity of description, and do not indicate or imply that the referenced position or element must have a particular orientation, be of particular construction and operation, and therefore, are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixedly connected, detachably connected, or integral to one another; may be mechanically coupled, may be electrically coupled, or may be in communication with each other; either directly or indirectly through intervening media, such as through internal communication or through an interaction between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A cloud terminal, comprising: a bottom plate, a circuit board, a heat dissipation component, a middle frame and a touch panel, wherein,

the circuit board is arranged on one side of the bottom plate;

one end of the circuit board comprises a groove with an inward-sunken edge, the heat dissipation part is arranged in the groove and used for dissipating heat of the circuit board;

the touch control plate is arranged on one side of the circuit board back to the bottom plate;

the middle frame comprises a first end and a second end which are communicated, the first end is connected with the bottom plate, and the second end is connected with the touch pad.

2. The cloud terminal of claim 1, further comprising a heat sink disposed between the circuit board and the backplane, the heat sink configured to absorb heat from the circuit board.

3. The cloud terminal of claim 2, wherein the heat dissipating component is an induced draft fan.

4. The cloud terminal of any of claims 1-3, wherein the side walls of the middle frame comprise an air inlet and an air outlet, the air inlet is disposed on the side wall far away from the heat dissipating component, the air outlet is disposed on the side wall near the heat dissipating component, and air from the air inlet is exhausted through the air outlet.

5. The cloud terminal according to any one of claims 1-3, wherein the inner wall of the middle frame comprises a clamping portion, and the clamping portion is connected with the circuit board so that the circuit board can be clamped in the middle frame.

6. The cloud terminal of any of claims 1-3, wherein the touch pad is adhered to the second end of the middle frame, and the heat dissipation component is connected to a side of the touch pad facing the circuit board.

7. The cloud terminal of any of claims 1-3, wherein the circuit board comprises a first side and a second side, the first side is a side facing the backplane, the second side is a side facing the trackpad, the first side comprises a first component, the second side comprises a second component, the first component has a height less than or equal to a first threshold, the second component has a height less than or equal to a second threshold, and the first threshold is greater than the second threshold.

8. The cloud terminal of claim 7, wherein said first side comprises a motor, said motor being configured to respond to a touch signal from said touch pad.

9. The cloud terminal of claim 8, wherein opposite corners of the middle frame comprise antennas of the same communication type, and the first side of the circuit board comprises connection lines of the antennas.

10. The cloud terminal of any of claims 1-3, wherein the cloud terminal further comprises a voice device, the voice device is disposed at an edge of the circuit board, and the voice device is configured to receive a voice signal.

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