CN216249131U - High efficiency memory bank heat abstractor - Google Patents
High efficiency memory bank heat abstractor Download PDFInfo
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- CN216249131U CN216249131U CN202122812670.1U CN202122812670U CN216249131U CN 216249131 U CN216249131 U CN 216249131U CN 202122812670 U CN202122812670 U CN 202122812670U CN 216249131 U CN216249131 U CN 216249131U
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- sleeve
- plate
- mounting
- memory bank
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Abstract
The utility model discloses a high-efficiency memory bank heat dissipation device, and belongs to the technical field of memory bank accessories. The heat dissipation device comprises a mounting ring, wherein the upper surface of the mounting ring is fixedly connected with a plurality of connecting rods, one end of each connecting rod is fixedly connected with a heat conducting plate, the four corners of the mounting ring are fixedly connected with a fixing plate, the upper surface of each fixing plate is provided with a fixing threaded hole, the lower surface of the mounting ring is fixedly connected with a sleeve, the peripheral side surface of each sleeve is provided with a plurality of ventilation holes, two opposite surfaces of each sleeve are fixedly connected with a plurality of mounting plates, the upper surface of each mounting plate is provided with a plurality of mounting threaded holes, the lower surface of each mounting plate is in threaded connection with a connecting plate, and one surface of each connecting plate is fixedly provided with a heat dissipation fan. The mounting ring, the connecting rod and the heat conducting plate are arranged, the mounting ring can be conveniently fixed on the wall of the case through the fixing plate when the heat radiating device is used, each heat radiating fan is arranged on the sleeve, hot air in the sleeve is exhausted by each heat radiating fan, and the heat radiating efficiency of the memory bank is improved by matching with the case fan.
Description
Technical Field
The utility model belongs to the technical field of memory bank accessories, and particularly relates to a high-efficiency memory bank heat dissipation device.
Background
With the development of information technology, more and more companies choose to build a dedicated server belonging to the company to store company data, perform cooperative work and the like, and compared with a common household host, the processor and the memory bank of the server host have higher pressure and more heat dissipation.
The existing server host usually pays more attention to the heat dissipation effect of the processor when in use, and the heat dissipation of the memory bank is not well considered, so that the heat dissipation effect of the memory bank is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high-efficiency memory bank heat dissipation device, which solves the problem of poor heat dissipation effect of a memory bank in the prior art.
In order to solve the technical problems, the utility model is realized by the following technical scheme:
the utility model relates to a high-efficiency memory bank heat dissipation device, which comprises a mounting ring, wherein the upper surface of the mounting ring is fixedly connected with a plurality of connecting rods, one end of each connecting rod is fixedly connected with a heat conduction plate, the heat conduction plate is fixed through the connecting rods, four corners of the mounting ring are fixedly connected with a fixing plate, the upper surface of the fixing plate is provided with a fixing threaded hole, the mounting ring is fixed on the wall of a chassis through the fixing plate and the fixing threaded hole, the lower surface of the mounting ring is fixedly connected with a sleeve, the sleeve covers a memory area, the peripheral side of the sleeve is provided with a plurality of vent holes, air can enter the sleeve from the vent holes, the two opposite surfaces of the sleeve are fixedly connected with a plurality of mounting plates, the upper surface of each mounting plate is provided with a plurality of mounting threaded holes, the lower surface of each mounting plate is in threaded connection with a connecting plate, and one surface of each connecting plate is fixedly provided with a heat dissipation fan, the lower surface of the sleeve is attached to the main board, air in the sleeve is blown out through the cooling fans, and the cooling fans of the case are matched for cooling.
Preferably, the fixed surface of heat-conducting plate has the fan control panel, fixed surface has a plurality of wiring mouths, conveniently connects each radiator fan under the fan control panel.
Preferably, a plurality of memory slots are fixedly mounted on the upper surface of the main board, and a memory bank is fixedly mounted on one surface of each memory slot.
Preferably, the size of the sleeve is matched with that of the main board, the sleeve is matched with the size of the memory slot and the size of the memory bank, and the sleeve completely covers the memory area.
Preferably, the fan control board is electrically connected to each cooling fan, and each cooling fan is controlled by the fan control board.
Preferably, the mounting ring is sized to match the sleeve.
Preferably, the mounting plates are symmetrically arranged relative to the memory slot, and the blowing directions of the cooling fans are the same, so that the direction of the air channel in the sleeve is parallel to the memory bars.
The utility model has the following beneficial effects:
1. when the heat dissipation device is used, the mounting ring, the connecting rod and the heat conduction plate are arranged, the mounting ring can be conveniently fixed on the wall of the case through the fixing plate when the heat dissipation device is used, so that the heat conduction plate is attached to the wall of the case, the sleeve can cover the memory area without contacting with the main board, each heat dissipation fan is arranged on the sleeve, hot air in the sleeve is discharged by each heat dissipation fan, and the heat dissipation efficiency of the memory bank is improved by matching with the case fan.
2. When the cooling fan is used, all the cooling fans can be connected to the fan control board through the fan control board and the wiring ports, so that all the cooling fans can be conveniently controlled through the fan control board.
Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a high-efficiency memory bank heat dissipation device according to the present invention;
fig. 2 is a top view of a high efficiency memory bank heat dissipation device of the present invention;
fig. 3 is a front view of a high efficiency memory bank heat dissipation device of the present invention;
FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 3 according to the present invention;
fig. 5 is a side view of a high efficiency memory bank heat dissipation device of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below: 1. a mounting ring; 2. a connecting rod; 3. a heat conducting plate; 4. a fixing plate; 5. fixing the threaded hole; 6. a sleeve; 7. a vent hole; 8. mounting a plate; 9. installing a threaded hole; 10. a connecting plate; 11. a heat radiation fan; 12. a fan control panel; 13. a wiring port; 14. a main board; 15. a memory slot; 16. and (4) memory banks.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "opening," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like are used in an orientation or positional relationship that is merely for convenience in describing and simplifying the description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
Referring to fig. 1-5, the present invention is a high efficiency heat dissipating device for memory stick, comprising a mounting ring 1, a plurality of connecting rods 2 fixedly connected to the upper surface of the mounting ring 1, a heat conducting plate 3 fixedly connected to one end of each connecting rod 2, the heat conducting plate 3 fixed by the connecting rods 2, a fixing plate 4 fixedly connected to four corners of the mounting ring 1, a fixing screw hole 5 formed on the upper surface of the fixing plate 4, the mounting ring 1 fixed to the wall of the case by the fixing plate 4 and the fixing screw hole 5, a sleeve 6 fixedly connected to the lower surface of the mounting ring 1, the sleeve 6 covering the memory area, a plurality of vent holes 7 formed on the peripheral side of the sleeve 6 for allowing air to enter the sleeve 6 from the vent holes 7, a plurality of mounting plates 8 fixedly connected to both opposite surfaces of the sleeve 6, a plurality of mounting screw holes 9 formed on the upper surface of the mounting plates 8, and a connecting plate 10 threadedly connected to the lower surface of the mounting plates 8, a cooling fan 11 is fixedly installed on one surface of the connecting plate 10, the lower surface of the sleeve 6 is attached to the main board 14, air in the sleeve 6 is blown out through the cooling fans 11, and cooling is conducted through the cooling fans of the case.
Fixed surface installs fan control panel 12 under the heat-conducting plate 3, and fixed surface installs a plurality of wiring mouths 13 under the fan control panel 12, conveniently connects each radiator fan 11.
A plurality of memory slots 15 are fixedly mounted on the upper surface of the main board 14, and a memory bank 16 is fixedly mounted on one surface of each memory slot 15.
The size of the sleeve 6 is matched with that of the main board 14, the size of the sleeve 6 is matched with that of the memory slot 15 and the memory bank 16, and the sleeve 6 completely covers the memory area.
The fan control board 12 is electrically connected to each of the heat dissipation fans 11, and each of the heat dissipation fans 11 is controlled by the fan control board 12.
The mounting ring 1 is sized to match the sleeve 6.
The mounting plates 8 are symmetrically arranged about the memory slot 15, and the blowing directions of the cooling fans 11 are the same, so that the direction of the air channel in the sleeve 6 is parallel to the memory bars 16.
One specific application of this embodiment is: when the heat dissipation device is used, the heat dissipation fans 11 are firstly installed on the sleeve 6 through the installation plates 8 and the connection plates 10, the blowing direction of each heat dissipation fan 11 is consistent with the air exhaust direction of a case, the model of the selected heat dissipation fan 11 is DC1503, each heat dissipation fan 11 is connected with the fan control panel 12, the fan control panel 12 is connected with the case main board 14, the fixing plate 4 of the installation ring 1 is in threaded connection with the case, the case is covered, the sleeve 6 covers the region of the memory slot 15, and the heat dissipation fans 11 are controlled to drive air in the sleeve 6 to be blown out, so that heat dissipated by the memory bank 16 is blown out.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims (7)
1. The utility model provides a high efficiency DRAM heat abstractor, includes collar (1), its characterized in that:
fixed surface is connected with a plurality of connecting rods (2) on collar (1), connecting rod (2) one end fixedly connected with heat-conducting plate (3), collar (1) four corners fixedly connected with fixed plate (4), fixed screw hole (5) have been seted up to fixed plate (4) upper surface, fixed surface is connected with sleeve (6) under collar (1), a plurality of ventilation holes (7) have been seted up to sleeve (6) week side, a plurality of mounting panels (8) of the equal fixedly connected with in two relative surfaces of sleeve (6), a plurality of mounting screw hole (9) have been seted up to mounting panel (8) upper surface, mounting panel (8) lower surface threaded connection has connecting plate (10), a fixed surface of connecting plate (10) installs radiator fan (11), sleeve (6) lower surface laminating mainboard (14).
2. The high-efficiency memory bank heat dissipation device as recited in claim 1, wherein a fan control board (12) is fixedly mounted on a lower surface of the heat conduction plate (3), and a plurality of wiring ports (13) are fixedly mounted on a lower surface of the fan control board (12).
3. The device as claimed in claim 1, wherein a plurality of memory slots (15) are fixedly mounted on the upper surface of the motherboard (14), and a memory bank (16) is fixedly mounted on one surface of the memory slots (15).
4. The device as claimed in claim 1, wherein the sleeve (6) is sized to match the motherboard (14), and the sleeve (6) is sized to fit the memory slot (15) and the memory bank (16).
5. The device as claimed in claim 2, wherein the fan control board (12) is electrically connected to each of the heat dissipation fans (11).
6. A high efficiency memory bank heatsink as claimed in claim 1, wherein the mounting ring (1) is sized to match the sleeve (6).
7. The device as claimed in claim 6, wherein the mounting plate (8) is disposed symmetrically with respect to the memory slot (15), and the blowing direction of each cooling fan (11) is the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122812670.1U CN216249131U (en) | 2021-11-17 | 2021-11-17 | High efficiency memory bank heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122812670.1U CN216249131U (en) | 2021-11-17 | 2021-11-17 | High efficiency memory bank heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216249131U true CN216249131U (en) | 2022-04-08 |
Family
ID=80942050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122812670.1U Active CN216249131U (en) | 2021-11-17 | 2021-11-17 | High efficiency memory bank heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216249131U (en) |
-
2021
- 2021-11-17 CN CN202122812670.1U patent/CN216249131U/en active Active
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