CN218585948U - Automatic wafer transmission system - Google Patents
Automatic wafer transmission system Download PDFInfo
- Publication number
- CN218585948U CN218585948U CN202223057655.1U CN202223057655U CN218585948U CN 218585948 U CN218585948 U CN 218585948U CN 202223057655 U CN202223057655 U CN 202223057655U CN 218585948 U CN218585948 U CN 218585948U
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- seat
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- blanking
- driving
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 50
- 238000007599 discharging Methods 0.000 claims abstract description 17
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 70
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of wafer production, in particular to an automatic wafer transmission system, which comprises a transmission seat, a feeding mechanism and a discharging mechanism; the transmission seat is provided with a movable seat and a transmission assembly; the moving seat is provided with a material taking plate and a material taking driving piece; the feeding mechanism comprises a feeding seat; the feeding seat is provided with a feeding placing plate; the blanking mechanism comprises a blanking seat; the blanking seat is provided with a blanking placing plate; the wafer transmission system also comprises a plurality of positioning and supporting components; the positioning and supporting assembly comprises a left clamping plate, a right clamping plate and a clamping driving assembly; the transmission assembly is used for driving the movable seat to place the plate at the feeding position, between the left clamping plate and the right clamping plate and to place the plate at the discharging position to move. The utility model discloses a set up transmission seat, feed mechanism, unloading mechanism and location supporting component, can drive the wafer and realize automatic transmission between feed mechanism, a plurality of station and unloading mechanism, improved work efficiency to can save the cost.
Description
Technical Field
The utility model relates to a wafer production technical field, concretely relates to automatic change wafer transmission system.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon.
In the production process of the wafer, the processing needs to be performed in a plurality of equipment stations, such as a dicing machine, a probe inspection machine, and the like, so that the wafer needs to be transported in the plurality of equipment stations.
At present, the wafer is transmitted in a plurality of equipment stations in two main modes: the first method is to transfer the wafer among a plurality of equipment stations in a manual mode, but the mode needs continuous work of manpower, so that the problems of manpower cost waste and low work efficiency exist; the second is by placing the robot in two adjacent equipment stations, but this approach requires multiple robots, greatly increasing cost.
SUMMERY OF THE UTILITY MODEL
The utility model aims at the above-mentioned among the prior art not enough, provide an automatic wafer transmission system, realize the automatic transmission between a plurality of stations.
The purpose of the utility model is realized through the following technical scheme: an automatic wafer transmission system comprises a transmission seat, a feeding mechanism and a discharging mechanism; the feeding mechanism and the discharging mechanism are respectively arranged on two sides of the transmission seat;
the transmission seat is provided with a moving seat and a transmission assembly for driving the moving seat to move; the moving seat is provided with a material taking plate and a material taking driving piece for driving the material taking plate to lift;
the feeding mechanism comprises a feeding seat; the feeding seat is provided with a plurality of feeding placing plates; the blanking mechanism comprises a blanking seat; the blanking seat is provided with a plurality of blanking placing plates;
the wafer transmission system also comprises a plurality of positioning and supporting components; the positioning support assembly comprises a left clamping plate, a right clamping plate and a clamping driving assembly for driving the left clamping plate and the right clamping plate to approach or separate;
the transmission assembly is used for driving the movable seat to place the plate at the feeding position, between the left clamping plate and the right clamping plate and to place the plate at the discharging position to move.
The utility model is further arranged in that the transmission component comprises a first synchronizing wheel arranged on one side of the transmission seat, a second synchronizing wheel arranged on the other side of the transmission seat, a synchronous belt arranged between the first synchronizing wheel and the second synchronizing wheel and a stepping motor used for driving the second synchronizing wheel to rotate; the movable seat is provided with a connecting block connected with the synchronous belt.
The utility model is further arranged that the transmission component also comprises a guide track arranged on the transmission seat and a guide slide block connected with the guide track in a sliding way; the guide sliding block is arranged on the moving seat.
The utility model is further arranged that the material taking driving piece comprises an electric cylinder arranged on the moving seat; the output end of the electric cylinder is connected with the material taking plate;
the material taking driving part also comprises a guide sleeve arranged on the moving seat and a sliding column arranged in the guide sleeve in a sliding manner; the sliding column is connected with the material taking plate.
The utility model is further provided with that the top of the material taking plate is provided with a first fixed block;
the material taking plate is arranged at the top of the movable seat; the electric cylinder is arranged at the bottom of the movable seat.
The utility model is further provided with a feeding lifting plate which is arranged on the feeding seat in a lifting way; the feeding seat is provided with a feeding lifting piece for driving the feeding lifting plate to lift; the plurality of loading placing plates are arranged at intervals along the height direction of the loading lifting plate; and a feeding opening is formed in one side of the feeding lifting plate.
The utility model is further provided with a discharging lifting plate which is arranged on the discharging seat in a lifting way; the blanking base is provided with a blanking lifting piece used for driving the blanking lifting plate to lift; the plurality of blanking placing plates are arranged at intervals along the height direction of the blanking lifting plate; and a discharging opening is formed in one side of the discharging lifting plate.
The utility model discloses further set up to, the top that the board was placed to the material loading and the top that the board was placed to the unloading all are equipped with the second fixed block.
The utility model is further arranged in that the clamping driving component comprises a left cylinder and a right cylinder; the output end of the left air cylinder is connected with the left clamping plate; the output end of the right cylinder is connected with the right clamping plate;
the clamping driving assembly further comprises a clamping slide rail; the bottom of left splint and the bottom of right splint all are equipped with the centre gripping slider with centre gripping slide rail sliding connection.
The utility model discloses further set up to, the top of left side splint and the top of right splint all are equipped with the third fixed block.
The utility model has the advantages that: the utility model discloses a set up transmission seat, feed mechanism, unloading mechanism and location supporting component, can drive the wafer and realize automatic transmission between feed mechanism, a plurality of station and unloading mechanism, improved work efficiency to can save the cost.
Drawings
The invention is further described with the aid of the accompanying drawings, in which the embodiments do not constitute any limitation to the invention, and for a person skilled in the art, without inventive step, other figures can be derived from the following figures.
FIG. 1 is a schematic view of the structure of the present invention cooperating with the equipment station;
FIG. 2 is a partial enlarged view of portion A of FIG. 1;
fig. 3 is a schematic structural diagram of the present invention;
FIG. 4 is a partial enlarged view of portion B of FIG. 3;
fig. 5 is a schematic structural diagram of the feeding mechanism of the present invention;
fig. 6 is a schematic structural view of the blanking mechanism of the present invention;
FIG. 7 is a schematic view of a wafer structure;
wherein: 1. a transmission seat; 11. a first synchronizing wheel; 12. a second synchronizing wheel; 13. a synchronous belt; 14. a stepping motor; 15. a guide rail; 16. a guide slider; 2. a movable seat; 21. connecting blocks; 22. taking a material plate; 23. an electric cylinder; 24. a guide sleeve; 25. a sliding post; 26. a first fixed block; 3. a feeding seat; 31. a loading placing plate; 32. a feeding lifting plate; 33. a feeding lifting member; 34. feeding and opening; 4. a blanking seat; 41. blanking placing plates; 42. blanking lifting plates; 43. blanking lifting pieces; 44. opening the blanking; 45. a second fixed block; 5. a station; 51. a left splint; 52. a right splint; 53. a left cylinder; 54. a right cylinder; 55. clamping the slide rail; 56. clamping the sliding block; 57. a third fixed block; 61. a wafer seat; 62. a wafer; 63. a first fixing hole; 64. a second fixing hole.
Detailed Description
The invention will be further described with reference to the following examples.
As shown in fig. 1 to 7, the automated wafer transferring system of the present embodiment includes a transferring base 1, a feeding mechanism and a discharging mechanism; the feeding mechanism and the discharging mechanism are respectively arranged on two sides of the transmission seat 1;
the transmission seat 1 is provided with a moving seat 2 and a transmission assembly for driving the moving seat 2 to move; the moving seat 2 is provided with a material taking plate 22 and a material taking driving piece for driving the material taking plate 22 to lift;
the feeding mechanism comprises a feeding seat 3; the feeding seat 3 is provided with a plurality of feeding placing plates 31; the blanking mechanism comprises a blanking seat 4; the blanking seat 4 is provided with a plurality of blanking placing plates 41;
the wafer transmission system also comprises a plurality of positioning and supporting components; the positioning support assembly comprises a left clamping plate 51, a right clamping plate 52 and a clamping driving assembly for driving the left clamping plate 51 and the right clamping plate 52 to approach or separate;
the transmission assembly is used for driving the movable seat 2 to move among the feeding placing plate 31, the left clamping plate 51 and the right clamping plate 52 and the discharging placing plate 41.
Specifically, in the automated wafer transfer system according to this embodiment, the transfer base 1 is disposed between the plurality of stations 5, and each station 5 is provided with a positioning support assembly; the wafer comprises a wafer seat 61 and a plurality of wafers 62 arranged on the wafer seat 61; when the wafer processing device is used, firstly, a plurality of wafer seats 61 are respectively placed in the feeding placing plate 31 of the feeding seat 3, then the transmission assembly drives the movable seat 2 to move to the bottom of the feeding placing plate 31, the material taking plate 22 is driven to ascend by the material taking driving part, the wafer seats 61 of the feeding placing plate 31 are jacked up and then taken out, the transmission assembly drives the movable seat 2 and the wafer seats 61 to sequentially move to each station 5, when the transmission assembly drives the movable seat 2 and the wafer seats 61 to move to one of the stations 5, the material taking driving part jacks up the wafer seats 61 of the feeding placing plate 31 to a position between the left clamping plate 51 and the right clamping plate 52 through the material taking plate 22, the clamping driving assembly drives the feeding placing plate 31 to descend after clamping the wafer seats 61, when the wafers 62 are processed on the stations 5, the material driving part jacks up the wafer seats 61 of the feeding placing plate 31 through the material taking plate 22 and then takes out, the transmission assembly drives the movable seat 2 and the wafer seats 61 to move to the next station 5, when the wafers 62 of the wafer seats are processed and all the wafers are placed on the stations 41, and all the wafers processed and then all the wafers are placed on the lower plate 41. Through the arrangement, the automatic transmission of the wafers among the feeding mechanism, the stations 5 and the discharging mechanism can be driven, the working efficiency is improved, and the cost can be saved.
In the automatic wafer conveying system according to this embodiment, the conveying assembly includes a first synchronizing wheel 11 disposed on one side of the conveying base 1, a second synchronizing wheel 12 disposed on the other side of the conveying base 1, a synchronizing belt 13 disposed between the first synchronizing wheel 11 and the second synchronizing wheel 12, and a stepping motor 14 for driving the second synchronizing wheel 12 to rotate; the movable base 2 is provided with a connecting block 21 connected with the synchronous belt 13.
Specifically, in this embodiment, the stepping motor 14 is used to control the movement of the movable base 2, so as to effectively control the moving position of the movable base 2, and thus, the wafer can be accurately transferred among the feeding mechanism, the plurality of stations 5 and the discharging mechanism.
In the automatic wafer transferring system of this embodiment, the transferring assembly further includes a guiding rail 15 disposed on the transferring base 1 and a guiding slider 16 slidably connected to the guiding rail 15; the guide slider 16 is arranged on the moving seat 2. Through the arrangement, the movable seat 2 can drive the wafer to stably move and transmit.
In the automatic wafer conveying system of this embodiment, the material taking driving member includes an electric cylinder 23 disposed on the moving base 2; the output end of the electric cylinder 23 is connected with the material taking plate 22; by arranging the electric cylinder 23 to drive the material taking plate 22 to ascend and descend, the space can be saved, and the sufficient range is provided.
The material taking driving part also comprises a guide sleeve 24 arranged on the moving seat 2 and a sliding column 25 arranged in the guide sleeve 24 in a sliding manner; the sliding column 25 is connected with the material taking plate 22. Through the arrangement, the material taking plate 22 can drive the wafer to stably lift.
In the automatic wafer conveying system according to this embodiment, a first fixing block 26 is disposed at the top of the material taking plate 22; specifically, set up the first fixed orifices 63 that corresponds with first fixed block 26 on wafer seat 61, remove the bottom that seat 2 moved to material placing plate 31 at the transmission assembly drive, get flitch 22 through getting the material driving piece drive and rise to insert first fixed block 26 in first fixed orifices 63, and place the wafer seat 61 jack-up of plate 31 with the material loading, make the material loading place plate 31 and wafer seat 61 separation, can drive removal seat 2, get flitch 22 and wafer seat 61 through the transmission assembly this moment and transmit.
The material taking plate 22 is arranged at the top of the movable seat 2; the electric cylinder 23 is arranged at the bottom of the movable seat 2. Space can be effectively saved through the above arrangement.
In the automatic wafer conveying system according to this embodiment, the loading base 3 is provided with a loading lifting plate 32; the feeding seat 3 is provided with a feeding lifting piece 33 for driving the feeding lifting plate 32 to lift; the plurality of loading placing plates 31 are arranged at intervals along the height direction of the loading lifting plate 32; a loading opening 34 is formed at one side of the loading lifting plate 32. Wherein the material loading lifting member 33 can be a motor screw rod, a linear module and the like.
Specifically, by providing the loading opening 34, after the wafer seat 61 of the loading placing plate 31 is jacked up by the material taking plate 22, the material taking plate 22 drives the wafer seat 61 to transport from the loading opening 34, and leaves the loading placing plate 31.
In the automatic wafer conveying system according to this embodiment, the blanking seat 4 is provided with a blanking lifting plate 42 in a lifting manner; the blanking seat 4 is provided with a blanking lifting piece 43 for driving the blanking lifting plate 42 to lift; a plurality of blanking placing plates 41 are arranged at intervals along the height direction of the blanking lifting plate 42; a blanking opening 44 is formed in one side of the blanking lifting plate 42. Wherein the blanking lifting plate 42 can be a motor screw and a linear module.
Specifically, through setting up unloading opening 44, after wafer 62 of wafer seat 61 is processed at all stations 5 and is accomplished, the transmission assembly drives to remove seat 2 and removes the bottom that places board 41 to the unloading to drive and get flitch 22 and wafer seat 61 and get into the unloading from unloading opening 44 and place the top of board 41, then get the driving piece and drive and get flitch 22 and descend, thereby make wafer seat 61 place and place board 41 in the unloading, first fixed block 26 separates with first fixed orifices 63 simultaneously, thereby accomplishes the unloading of wafer.
In the automatic wafer conveying system according to this embodiment, the second fixing blocks 45 are disposed on the top of the loading placing plate 31 and the top of the unloading placing plate 41. Specifically, a second fixing hole 64 corresponding to the second fixing block 45 is provided on the wafer seat 61; with the above arrangement, the wafer stage 61 can be fixed.
In the automatic wafer transferring system of this embodiment, the clamping driving assembly includes a left cylinder 53 and a right cylinder 54; the output end of the left air cylinder 53 is connected with the left clamping plate 51; the output end of the right air cylinder 54 is connected with the right clamping plate 52; specifically, when the material taking driving member drives the material taking plate 22 to ascend, so as to ascend the wafer seat 61 between the left clamp plate 51 and the right clamp plate 52, the left air cylinder 53 and the right air cylinder 54 operate, so as to approach the left clamp plate 51 and the right clamp plate 52, and fix the wafer seat 61 between the left clamp plate 51 and the right clamp plate 52.
The clamping drive assembly further comprises a clamping slide 55; and clamping sliding blocks 56 which are connected with the clamping sliding rails 55 in a sliding manner are arranged at the bottom of the left clamping plate 51 and the bottom of the right clamping plate 52. The movement of the left and right clamp plates 51 and 52 is guided by the above arrangement.
In the automatic wafer transferring system of the present embodiment, the top of the left clamping plate 51 and the top of the right clamping plate 52 are both provided with a third fixing block 57. The third fixing block 57 and the second fixing block 45 have the same structure, that is, the second fixing hole 64 of the wafer seat 61 can be clamped with the third fixing block 57;
specifically, get the flitch 22 and rise when getting the material driving piece drive to rise wafer seat 61 to between left splint 51 and the right splint 52, left cylinder 53 and right cylinder 54 work make left splint 51 and right splint 52 be close to the back, get the material driving piece drive and get flitch 22 and descend, thereby fix the second of wafer seat 61 in third fixed block 57, thereby accomplish the transmission of wafer seat 61.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. An automated wafer transfer system, comprising: comprises a transmission seat (1), a feeding mechanism and a discharging mechanism; the feeding mechanism and the discharging mechanism are respectively arranged on two sides of the transmission seat (1);
the transmission seat (1) is provided with a moving seat (2) and a transmission assembly for driving the moving seat (2) to move; the moving seat (2) is provided with a material taking plate (22) and a material taking driving piece for driving the material taking plate (22) to lift;
the feeding mechanism comprises a feeding seat (3); the feeding seat (3) is provided with a plurality of feeding placing plates (31); the blanking mechanism comprises a blanking seat (4); the blanking seat (4) is provided with a plurality of blanking placing plates (41);
the wafer transmission system also comprises a plurality of positioning and supporting components; the positioning support assembly comprises a left clamping plate (51), a right clamping plate (52) and a clamping driving assembly for driving the left clamping plate (51) and the right clamping plate (52) to approach or separate;
the transmission assembly is used for driving the moving seat (2) to move among the feeding placing plate (31), the left clamping plate (51) and the right clamping plate (52) and the feeding placing plate (41).
2. The automated wafer transfer system of claim 1, wherein: the transmission assembly comprises a first synchronizing wheel (11) arranged on one side of the transmission seat (1), a second synchronizing wheel (12) arranged on the other side of the transmission seat (1), a synchronizing belt (13) arranged between the first synchronizing wheel (11) and the second synchronizing wheel (12), and a stepping motor (14) used for driving the second synchronizing wheel (12) to rotate; the movable seat (2) is provided with a connecting block (21) connected with the synchronous belt (13).
3. The automated wafer transfer system of claim 2, wherein: the transmission assembly further comprises a guide track (15) arranged on the transmission seat (1) and a guide sliding block (16) connected with the guide track (15) in a sliding manner; the guide sliding block (16) is arranged on the moving seat (2).
4. The automated wafer transfer system of claim 1, wherein: the material taking driving piece comprises an electric cylinder (23) arranged on the moving seat (2); the output end of the electric cylinder (23) is connected with the material taking plate (22);
the material taking driving part also comprises a guide sleeve (24) arranged on the moving seat (2) and a sliding column (25) arranged in the guide sleeve (24) in a sliding manner; the sliding column (25) is connected with the material taking plate (22).
5. The automated wafer transfer system of claim 4, wherein: the top of the material taking plate (22) is provided with a first fixed block (26);
the material taking plate (22) is arranged at the top of the moving seat (2); the electric cylinder (23) is arranged at the bottom of the movable seat (2).
6. The automated wafer transfer system of claim 1, wherein: the feeding seat (3) is provided with a feeding lifting plate (32) in a lifting way; the feeding seat (3) is provided with a feeding lifting piece (33) for driving the feeding lifting plate (32) to lift; the plurality of loading placing plates (31) are arranged at intervals along the height direction of the loading lifting plate (32); and a feeding opening (34) is formed in one side of the feeding lifting plate (32).
7. The automated wafer transfer system of claim 1, wherein: the blanking seat (4) is provided with a blanking lifting plate (42) in a lifting way; the blanking seat (4) is provided with a blanking lifting piece (43) for driving the blanking lifting plate (42) to lift; a plurality of blanking placing plates (41) are arranged at intervals along the height direction of the blanking lifting plate (42); one side of the blanking lifting plate (42) is provided with a blanking opening (44).
8. The automated wafer transfer system of claim 1, wherein: and second fixed blocks (45) are arranged on the top of the feeding placing plate (31) and the top of the discharging placing plate (41).
9. The automated wafer transfer system of claim 1, wherein: the clamping driving assembly comprises a left air cylinder (53) and a right air cylinder (54); the output end of the left air cylinder (53) is connected with a left clamping plate (51); the output end of the right air cylinder (54) is connected with a right clamping plate (52);
the clamping driving assembly further comprises a clamping slide rail (55); the bottom of the left clamping plate (51) and the bottom of the right clamping plate (52) are both provided with clamping sliding blocks (56) which are in sliding connection with the clamping sliding rails (55).
10. The automated wafer transfer system of claim 1, wherein: and third fixing blocks (57) are arranged at the top of the left clamping plate (51) and the top of the right clamping plate (52).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223057655.1U CN218585948U (en) | 2022-11-17 | 2022-11-17 | Automatic wafer transmission system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223057655.1U CN218585948U (en) | 2022-11-17 | 2022-11-17 | Automatic wafer transmission system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218585948U true CN218585948U (en) | 2023-03-07 |
Family
ID=85378882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223057655.1U Active CN218585948U (en) | 2022-11-17 | 2022-11-17 | Automatic wafer transmission system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218585948U (en) |
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2022
- 2022-11-17 CN CN202223057655.1U patent/CN218585948U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 101, Building 5, No. 2 Fangda Road, Huangpu District, Guangzhou City, Guangdong Province, 510000 (Location: Room 601) Patentee after: Nami Semiconductor Equipment (Guangzhou) Co.,Ltd. Address before: Room 108, Unit 2, Building 1, No. 17, Qinyuan Road, Songshanhu Park, Dongguan, Guangdong 523000 Patentee before: Nami Semiconductor Equipment (Dongguan) Co.,Ltd. |