CN218585944U - Chip feeding mechanism and ejector pin module - Google Patents
Chip feeding mechanism and ejector pin module Download PDFInfo
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- CN218585944U CN218585944U CN202222488498.3U CN202222488498U CN218585944U CN 218585944 U CN218585944 U CN 218585944U CN 202222488498 U CN202222488498 U CN 202222488498U CN 218585944 U CN218585944 U CN 218585944U
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- module
- thimble
- ejector pin
- chip
- axis moving
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- 230000001360 synchronised effect Effects 0.000 claims abstract description 16
- 241000748087 Hymenothrix Species 0.000 claims description 29
- 239000011148 porous material Substances 0.000 claims description 11
- 239000012528 membrane Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides a chip feeding mechanism and a thimble module, which relate to the technical field of chip processing.A chip is adhered above a blue film; the outer periphery of the outer ring is provided with a connecting part, the outer periphery of the connecting part is connected with one end of a first synchronous belt, the other end of the first synchronous belt is provided with a first synchronous wheel, the lower end of the first synchronous wheel is provided with a rotating shaft, and the lower part of the rotating shaft is connected with a first rotating motor; the connecting part is fixed on the fixing plate, a Y-axis moving mechanism is arranged below the fixing plate, and an X-axis moving mechanism is arranged below the Y-axis moving mechanism. The fixed plate moves left and right along the Y-axis moving mechanism, the X-axis moving mechanism drives the Y-axis moving mechanism to move back and forth, the blue film on the wafer expanding ring module can move in the left, right, front and back directions along with the Y-axis moving mechanism and the X-axis moving mechanism while rotating, and the position of a chip on the blue film can be adjusted to a proper position, so that the chip can be conveniently and accurately obtained.
Description
Technical Field
The utility model relates to a chip processing technology field especially relates to a chip feed mechanism and thimble module.
Background
At present, the patent with application number CN202011605839X, named as the wafer blue film crystal taking and fixing device, specifically discloses: the device comprises a conveying rail, wherein the conveying rail is used for conveying material sheets to be subjected to die bonding; the mounting table is used for placing a wafer blue film to be subjected to die bonding; the wafer taking suction nozzle is arranged on the fixed rack through a position adjusting mechanism, the position adjusting mechanism can drive the wafer taking suction nozzle to move between the mounting table and the conveying rail, and the wafer taking suction nozzle can take out and mount the wafer on the wafer blue film on the material sheet. This patent drives the suction nozzle to move between the mounting table and the conveying rail by means of a position adjusting mechanism, which takes up a large space.
SUMMERY OF THE UTILITY MODEL
For the great technical problem in device occupation space who exists among the solution prior art, the utility model provides a chip feed mechanism:
the chip feeding mechanism is internally provided with a wafer expanding ring module (1) and an ejector pin module (2) which are used for adjusting the position of a chip, an inner ring (3), an outer ring (4) and a blue film (5) are arranged in the wafer expanding ring module (1), the blue film (5) covers the inner ring (3), the edge of the blue film (5) is clamped between the outer ring (4) and the inner ring (3), and the chip is adhered above the blue film (5); a connecting part (6) is arranged on the periphery of the outer ring (4), the peripheral part of the connecting part (6) is connected with one end of a first synchronous belt (7), a first synchronous wheel (8) is arranged at the other end of the first synchronous belt (7), a rotating shaft is installed at the lower end of the first synchronous wheel (8), and a first rotating motor (9) is connected below the rotating shaft; the connecting part (6) is fixed on the fixing plate (13), a Y-axis moving mechanism (15) is arranged below the fixing plate (13), and an X-axis moving mechanism (16) is arranged below the Y-axis moving mechanism (15).
Optionally, the bottom of the blue film (5) is provided with a thimble module (2), a crank mechanism (10) is arranged in the thimble module (2), the crank mechanism (10) is connected with a second rotating motor (12), and a thimble head (11) is arranged above the crank mechanism (10). Optionally, the ejector pin head (11) is of a hollow structure, a fine hole is formed above the ejector pin head, and the ejector pin head (11) is connected with the air exhaust pipeline (14). Optionally, the Y-axis moving mechanism (15) and the X-axis moving mechanism (16) are linear motors.
A chip feeding mechanism is provided with a wafer expanding ring module (1) and a thimble module (2) which are used for adjusting the position of a chip, and the chip is adhered above a blue film (5) of the wafer expanding ring module (1); blue below of membrane (5) is equipped with thimble module (2), be equipped with thimble head (11) in thimble module (2), thimble head (11) are hollow structure, open the top of thimble head (11) has the pore, the pore is used for adsorbing blue membrane (5).
Optionally, the ejector pin module (2) is provided with a crank mechanism (10), the crank mechanism (10) is connected with a second rotating motor (12), and an ejector pin head (11) is connected above the crank mechanism (10).
The utility model provides a thimble module, be equipped with thimble head (11) in thimble module (2), thimble head (11) are hollow structure, it has the pore to open the upper end of thimble head (11), the one end of thimble head (11) is used for connecting vacuum component, on the other end the pore is used for adsorbing blue membrane (5).
Optionally, the ejector pin module (2) is provided with a crank mechanism (10), the crank mechanism (10) is connected with a second rotating motor (12), and an ejector pin head (11) is arranged above the crank mechanism (10).
Optionally, the number of the fine holes is one or more.
Optionally, a vision camera (17) is arranged above the thimble module (2), and a central line of the vision camera (17) coincides with a central line of the thimble head (11).
The utility model has the advantages that: the device is provided with a Y-axis moving mechanism (15) and an X-axis moving mechanism (16), a fixed plate (13) moves left and right along the Y-axis moving mechanism (15), the X-axis moving mechanism (16) drives the Y-axis moving mechanism (15) to move back and forth, the blue film on the wafer expansion ring module (1) can move in the left, right, front and back directions along with the Y-axis moving mechanism (15) and the X-axis moving mechanism (16) while rotating, and the position of a chip on the blue film can be adjusted to a proper position, so that the chip can be acquired more accurately.
Drawings
Fig. 1 is a schematic view of a partial structure of a wafer expanding ring module according to the present invention;
fig. 2 is another schematic partial structure diagram of the wafer expanding ring module of the present invention;
fig. 3 is a schematic view of a partial cross-sectional structure of the wafer expanding ring module according to the present invention;
fig. 4 is a schematic diagram of the structure of the thimble module of the present invention.
Fig. 5 is a schematic view of the vision camera of the present invention.
Detailed Description
The present invention will be further described with reference to the following detailed description. A chip feeding mechanism is provided:
referring to fig. 1-4, in an embodiment, a wafer expanding ring module (1) and an ejector pin module (2) for adjusting the position of a chip are arranged in the chip feeding mechanism, an inner ring (3), an outer ring (4) and a blue film (5) are arranged in the wafer expanding ring module (1), the blue film (5) covers the inner ring (3), the edge of the blue film (5) is clamped between the outer ring (4) and the inner ring (3), and a chip is adhered above the blue film (5); a connecting part (6) is arranged on the periphery of the outer ring (4), the peripheral part of the connecting part (6) is connected with one end of a first synchronous belt (7), a first synchronous wheel (8) is arranged at the other end of the first synchronous belt (7), a rotating shaft is installed at the lower end of the first synchronous wheel (8), and a first rotating motor (9) is connected below the rotating shaft; the connecting part (6) is fixed on the fixing plate (13), a Y-axis moving mechanism (15) is arranged below the fixing plate (13), and an X-axis moving mechanism (16) is arranged below the Y-axis moving mechanism (15).
In the embodiment, the wafer expanding ring module (1) is provided with a wafer expanding ring, and the wafer expanding ring drives the chips on the white film or the blue film (5) to move by using the tension generated by the white film or the blue film (5) during wafer expanding so as to separate the chips which are originally closely arranged and facilitate the subsequent thimble operation. The prior art wafer expanding ring generally comprises an inner ring and an outer ring which are arranged concentrically, a blue film (5) covers the inner ring, and the edge of the blue film (5) is clamped between the outer ring and the inner ring. The Y-axis moving mechanism (15) and the X-axis moving mechanism (16) can be linear motors, the fixing plate (13) moves left and right along the Y-axis moving mechanism (15), and the X-axis moving mechanism (16) drives the Y-axis moving mechanism (15) to move back and forth.
Referring to fig. 1-4, in an embodiment, a thimble module (2) is disposed at the bottom of the blue film (5), a crank mechanism (10) is disposed in the thimble module (2), the crank mechanism (10) is connected to a second rotating motor (12), and a thimble head (11) is disposed above the crank mechanism (10).
In this embodiment, the thimble head (11) is a hollow structure, a pore is arranged above the thimble head, the thimble head (11) is connected with an air exhaust pipeline (14), the second rotating motor (12) drives the cam to rotate, so that the thimble head (11) ascends or descends, when the thimble head (11) ascends, a chip on the blue film (5) is jacked up, in order to prevent the blue film (5) from greatly changing in position when jacked up, the air can be exhausted through the air exhaust pipeline (14), the blue film (5) is adsorbed at the pore position, and the chip can be conveniently taken away by the first chip carrying module (6).
Referring to fig. 1-4, in one embodiment, the ejector pin head (11) is a hollow structure with a fine hole on the top, and the ejector pin head (11) is connected with the air exhaust pipeline (14).
Referring to fig. 1-4, in one embodiment, the Y-axis movement mechanism (15) and the X-axis movement mechanism (16) are linear motors. Referring to fig. 1-4, in an embodiment, a chip loading mechanism is provided with a wafer expanding ring module (1) and an ejector pin module (2) for adjusting a chip position, and a chip is adhered above a blue film (5) of the wafer expanding ring module (1); the below of blue membrane (5) is equipped with thimble module (2), be equipped with thimble head (11) in thimble module (2), thimble head (11) are hollow structure, and the top is equipped with the pore, and the hollow structure and the exhaust duct (14) of thimble head (11) are connected, when bleeding through evacuating device to hollow structure, blue membrane (5) can be adsorbed on the pore, can avoid blue membrane (5) to cross the pine and influence the precision of getting the wafer.
Referring to fig. 1-4, in one embodiment, the ejector pin module (2) is provided with a crank mechanism (10), the crank mechanism (10) is connected with a second rotating motor (12), and an ejector pin head (11) is connected above the crank mechanism (10).
Referring to fig. 1-4, in an embodiment, a thimble module is provided, wherein a thimble head (11) is disposed in the thimble module (2), the thimble head (11) is of a hollow structure, a fine hole is formed at an upper end of the thimble head (11), one end of the thimble head (11) is used for connecting a vacuum component, and the fine hole at the other end is used for adsorbing a blue membrane (5).
In this embodiment, the blue film is adsorbed through one or more adsorption holes at the end of the thimble head, so that the blue film is prevented from being deformed when the thimble ejects the chip, so as to prevent the thimble from extending out.
Referring to fig. 1-4, in an embodiment, the ejector pin module (2) is provided with a crank mechanism (10), the crank mechanism (10) is connected with a second rotating motor (12), and an ejector pin head (11) is arranged above the crank mechanism (10).
Referring to fig. 1-4, in one embodiment, the number of pores is one or more.
Referring to fig. 1-4, in an embodiment, a vision camera (17) is disposed above the ejector pin module (2), and a central line of the vision camera (17) coincides with a central line of the ejector pin head (11).
The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and it is not to be understood that the specific embodiments of the present invention are limited to these descriptions. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (10)
1. The chip feeding mechanism is characterized in that a wafer expanding ring module (1) and an ejector pin module (2) which are used for adjusting the position of a chip are arranged in the chip feeding mechanism, an inner ring (3), an outer ring (4) and a blue film (5) are arranged in the wafer expanding ring module (1), the blue film (5) covers the inner ring (3), the edge of the blue film (5) is clamped between the outer ring (4) and the inner ring (3), and the chip is adhered to the upper side of the blue film (5); a connecting part (6) is arranged on the periphery of the outer ring (4), the peripheral part of the connecting part (6) is connected with one end of a first synchronous belt (7), a first synchronous wheel (8) is arranged at the other end of the first synchronous belt (7), a rotating shaft is installed at the lower end of the first synchronous wheel (8), and a first rotating motor (9) is connected below the rotating shaft; the connecting part (6) is fixed on the fixing plate (13), a Y-axis moving mechanism (15) is arranged below the fixing plate (13), and an X-axis moving mechanism (16) is arranged below the Y-axis moving mechanism (15).
2. The chip feeding mechanism according to claim 1, wherein a thimble module (2) is disposed at the bottom of the blue film (5), a crank mechanism (10) is disposed in the thimble module (2), the crank mechanism (10) is connected to a second rotating motor (12), and a thimble head (11) is disposed above the crank mechanism (10).
3. The chip loading mechanism according to claim 2, wherein the ejector pin head (11) is a hollow structure with a fine hole at the top, and the ejector pin head (11) is connected with the air exhaust pipeline (14).
4. The chip feeding mechanism according to claim 1 or 3, wherein the Y-axis moving mechanism (15) and the X-axis moving mechanism (16) are linear motors.
5. The chip feeding mechanism is characterized in that a wafer expanding ring module (1) and an ejector pin module (2) for adjusting the position of a chip are arranged in the chip feeding mechanism, and the chip is adhered above a blue film (5) of the wafer expanding ring module (1); blue below of membrane (5) is equipped with thimble module (2), be equipped with thimble head (11) in thimble module (2), thimble head (11) are hollow structure, open the top of thimble head (11) has the pore, the pore is used for adsorbing blue membrane (5).
6. The chip feeding mechanism according to claim 5, wherein the ejector pin module (2) is provided with a crank mechanism (10), the crank mechanism (10) is connected with a second rotating motor (12), and an ejector pin head (11) is connected above the crank mechanism (10).
7. The ejector pin module is characterized in that an ejector pin head (11) is arranged in the ejector pin module (2), the ejector pin head (11) is of a hollow structure, a fine hole is formed in the upper end of the ejector pin head (11), one end of the ejector pin head (11) is used for being connected with a vacuum component, and the fine hole in the other end of the ejector pin head is used for adsorbing a blue film (5).
8. A thimble module according to claim 7, characterized in that the thimble module (2) is provided with a crank mechanism (10), said crank mechanism (10) being connected to a second rotating electrical machine (12), and above said crank mechanism (10) is a thimble head (11).
9. The ejector pin module of claim 7, wherein the plurality of fine holes is one or more.
10. A thimble module according to any one of claims 7-9, characterized in that a vision camera (17) is provided above the thimble module (2), and the center line of the vision camera (17) coincides with the center line of the thimble head (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222488498.3U CN218585944U (en) | 2022-09-20 | 2022-09-20 | Chip feeding mechanism and ejector pin module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222488498.3U CN218585944U (en) | 2022-09-20 | 2022-09-20 | Chip feeding mechanism and ejector pin module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218585944U true CN218585944U (en) | 2023-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222488498.3U Active CN218585944U (en) | 2022-09-20 | 2022-09-20 | Chip feeding mechanism and ejector pin module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218585944U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116230620A (en) * | 2023-05-09 | 2023-06-06 | 上海陛通半导体能源科技股份有限公司 | Horizontal adjusting device of thimble mechanism |
-
2022
- 2022-09-20 CN CN202222488498.3U patent/CN218585944U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116230620A (en) * | 2023-05-09 | 2023-06-06 | 上海陛通半导体能源科技股份有限公司 | Horizontal adjusting device of thimble mechanism |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Peng Guangqiang Inventor after: Pang Jian Inventor after: Huang Wenbin Inventor before: Peng Guangqiang Inventor before: Pang Jian Inventor before: Huang Yongbin |