CN218388404U

CN218388404U - High-performance heat conducting fin

Info

Publication number: CN218388404U
Application number: CN202222103834.8U
Authority: CN
Inventors: 孙秀娟
Original assignee: Ningbo Dongshun Electronic Technology Co ltd
Current assignee: Ningbo Dongshun Electronic Technology Co ltd
Priority date: 2022-08-09
Filing date: 2022-08-09
Publication date: 2023-01-24
Anticipated expiration: 2032-08-09

Abstract

The utility model discloses a high-effect conducting strip, include: a heat conducting fin body and a sticking frame; the upper surface of the heat conducting fin body is provided with a plurality of heat radiating grooves which are all arranged in parallel; a heat dissipation block is arranged between every two adjacent heat dissipation grooves, a plurality of heat dissipation holes are formed in each heat dissipation block, the heat dissipation holes are arranged in parallel, and the axial direction of each heat dissipation hole is perpendicular to the length direction of each heat dissipation groove; the pasting frame is arranged on the outer edge of the heat conducting fin body, and one side, far away from the heat conducting fin body, of the pasting frame is provided with an adhesive layer. Through right the utility model discloses an use, provide a high-effect conducting strip, be provided with radiating groove and louvre on the conducting strip, increased conducting strip and external area of contact, strengthened the heat dispersion and the cooling effect of conducting strip.

Description

High-performance heat conducting fin

Technical Field

The utility model relates to a silica gel conducting strip technical field especially relates to a high-effect conducting strip.

Background

The silica gel heat conducting sheet is a heat conducting medium material synthesized by a special process by taking silica gel as a base material and adding various auxiliary materials such as metal oxide, and is also called a heat conducting silica gel pad, a heat conducting silica gel sheet, a soft heat conducting pad, a heat conducting silica gel gasket and the like in the industry. But traditional silica gel conducting strip is mostly planar structure when dispelling the heat to the chip upper surface and sets for, and the planar structure upper end is less with external contact surface, and then less with external heat-transfer face for the effect of heat transfer is relatively poor, and the effect of cooling is relatively poor.

SUMMERY OF THE UTILITY MODEL

In view of this, in order to solve the above problem, the present invention provides a high-performance heat conducting fin, including:

a heat conducting fin body and a sticking frame;

the upper surface of the heat conducting fin body is provided with a plurality of heat radiating grooves which are all arranged in parallel;

a heat dissipation block is arranged between every two adjacent heat dissipation grooves, a plurality of heat dissipation holes are formed in each heat dissipation block, the heat dissipation holes are arranged in parallel, and the axial direction of each heat dissipation hole is perpendicular to the length direction of each heat dissipation groove;

the pasting frame is arranged on the outer edge of the heat conducting fin body, and an adhesive layer is arranged on one side, away from the heat conducting fin body, of the pasting frame.

In the above high-performance thermally conductive sheet, the thermally conductive sheet body is rectangular.

In the above high-performance thermally conductive sheet, the plurality of heat dissipation grooves are all arranged along the width direction of the thermally conductive sheet body.

In the above high-performance heat conducting fin, each of the heat dissipating holes is communicated with a heat dissipating groove.

The high performance thermal conductive sheet described above, wherein the thermal conductive sheet body further includes: the heat conducting strip comprises two heat conducting strip bodies, wherein two adjacent ends of each heat conducting strip body are respectively provided with two convex blocks, the other two ends of each heat conducting strip body are respectively provided with two grooves, and the outer contours of the two convex blocks are respectively matched with the inner contours of the two grooves.

In the above high-performance heat conducting fin, the cross sections of the two bumps and the two grooves in the vertical direction are both in a T shape.

Compared with the prior art, the technical scheme has the positive effects that:

through right the utility model discloses an use, provide a high-effect conducting strip, be provided with radiating groove and louvre on the conducting strip, increased conducting strip and external area of contact, strengthened the heat dispersion and the cooling effect of conducting strip.

Drawings

Fig. 1 is a schematic view of a high-performance heat conducting fin of the present invention;

fig. 2 is a top view of a high-performance heat conducting fin according to the present invention.

1. A thermally conductive sheet body; 2. a heat sink; 3. a heat dissipating block; 4. heat dissipation holes; 5. pasting a frame; 6. a bump; 7. and (6) a groove.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.

The structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention does not have the substantial technical significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the efficacy that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.

As shown in fig. 1 to 2, a preferred embodiment is shown, comprising: a heat-conducting fin body 1 and a sticking frame 5.

The upper surface of the heat conducting strip body 1 is provided with a plurality of heat dissipation grooves 2, the heat dissipation grooves 2 are all arranged in parallel, a heat dissipation block 3 is formed between every two adjacent heat dissipation grooves 2, each heat dissipation block 3 is provided with a plurality of heat dissipation holes 4, the heat dissipation holes 4 are all arranged in parallel, and the axial direction of each heat dissipation hole 4 is perpendicular to the length direction of each heat dissipation groove 2; the pasting frame 5 is arranged on the outer edge of the lower surface of the heat conducting fin body 1, and one side, away from the heat conducting fin body 1, of the pasting frame 5 is provided with an adhesive layer.

In the actual use process, the lower surface of the heat conducting fin body 1 is pasted on the part of the chip needing heat dissipation through the pasting frame 5.

The utility model discloses still have following embodiment on above-mentioned basis:

further, a high-performance heat conducting fin, wherein the heat conducting fin body 1 is rectangular.

Further, a high-performance conducting strip, wherein, a plurality of radiating grooves 2 all set up along the width direction of conducting strip body 1.

Further, a high-performance heat conducting fin, wherein each heat dissipation hole 4 is communicated with a heat dissipation groove 2. Further, the arrangement of the heat dissipation groove 2 increases the contact area between the upper surface of the heat conducting fin body 1 and the outside, and the heat dissipation holes 4 are communicated with the heat dissipation groove 2, so that heat can be conveniently discharged through the heat dissipation holes 4.

Further, a high-effect conducting strip, wherein, conducting strip body 1 still includes: two adjacent ends of the heat conducting strip body 1 are respectively provided with two convex blocks 6, two residual ends of the heat conducting strip body 1 are respectively provided with two grooves 7, and the outer contours of the two convex blocks 6 are respectively matched with the inner contours of the two grooves 7. Specifically, when the chip which needs heat dissipation is large, the plurality of radiating fins can be spliced together through the convex blocks 6 and the grooves 7, so that the contact area between the whole area of the heat conducting fin body 1 and the chip is increased, and the heat dissipation performance of the chip is enhanced.

Further, the cross sections of the two projections 6 and the two grooves 7 along the vertical direction are both arranged in a T shape. Further, when needing to connect polylith conducting strip body 1, insert lug 6 and locate in recess 7 and can connect polylith conducting strip body 1 for conducting strip body 1 between adjacent connects more firmly, can not scatter easily, and need not other instruments and assist.

The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and those skilled in the art should be able to realize the equivalent alternatives and obvious variations of the present invention.

Claims

1. A high performance thermally conductive sheet, comprising:

a heat conducting fin body and a sticking frame;

a heat dissipation block is arranged between every two adjacent heat dissipation grooves, a plurality of heat dissipation holes are formed in each heat dissipation block and are arranged in parallel, and the axial direction of each heat dissipation hole is perpendicular to the length direction of each heat dissipation groove;

the pasting frame is arranged on the outer edge of the heat conducting fin body, and one side, far away from the heat conducting fin body, of the pasting frame is provided with an adhesive layer.

2. The thermally conductive sheet as claimed in claim 1, wherein the thermally conductive sheet has a rectangular shape.

3. The thermally conductive sheet as claimed in claim 1, wherein a plurality of the heat dissipating grooves are formed along a width direction of the thermally conductive sheet body.

4. The thermally conductive sheet as claimed in claim 1, wherein each of the heat dissipating holes is connected to a heat dissipating groove.

5. The high performance thermally conductive sheet as claimed in claim 1, wherein the thermally conductive sheet body further comprises: the heat conducting strip comprises two heat conducting strip bodies, wherein two adjacent ends of each heat conducting strip body are respectively provided with two convex blocks, the other two ends of each heat conducting strip body are respectively provided with two grooves, and the outer contours of the two convex blocks are respectively matched with the inner contours of the two grooves.

6. The thermally conductive sheet as claimed in claim 5, wherein the two protrusions and the two grooves are disposed in a T-shape in vertical cross section.