CN218388380U - Pressure-controllable immersed phase-change cooling device - Google Patents
Pressure-controllable immersed phase-change cooling device Download PDFInfo
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- CN218388380U CN218388380U CN202221227075.XU CN202221227075U CN218388380U CN 218388380 U CN218388380 U CN 218388380U CN 202221227075 U CN202221227075 U CN 202221227075U CN 218388380 U CN218388380 U CN 218388380U
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Abstract
The utility model discloses a controllable pressure immersion type phase change cooling device, which comprises an airtight pressure-bearing case, wherein the pressure-bearing case is provided with an evaporation end, a condensation end, a pressure control module and a cooling medium; the evaporation generating end comprises an electronic device heating source and a radiating fin, the radiating fin is arranged on the electronic device, and the cooling medium is arranged in the pressure bearing machine box and completely passes through the electronic device and the radiating fin; the condensation generating end is positioned on the top side in the pressure-bearing case and comprises a serpentine cooling coil, the cooling coil comprises an inlet pipe and an outlet pipe, and the inlet pipe and the outlet pipe both penetrate through the pressure-bearing case; the utility model discloses utilize coolant's latent heat to dispel the heat, take away the heat through coolant at electronic component surface boiling vaporization, it is strong to compare in prior art to have a radiating effect to do not need annexes such as fan and pipeline among the traditional heat dissipation process, be favorable to saving space.
Description
Technical Field
The utility model relates to an electron device phase transition heat dissipation technical field specifically indicates a controllable pressure submergence formula phase transition cooling device.
Background
The rapid development of the internet promotes the scale of a data center to be continuously enlarged, the integration level of electronic components in the data center is higher and higher, the power consumption is also rapidly increased, and the problem of how to effectively and rapidly dissipate the heat in a server and reduce the power consumption cost becomes a concern in the industry. According to the relevant predictions, the power consumption of the data center will reach 3390TWh (about 10 hundred million kWh for 1 TWh) by 2025 years, which may account for 4.5% of the global power consumption, and thus, the environment is under tremendous pressure.
The existing cooling mode of the heating equipment can not fully dissipate heat according to the heat dissipation requirement, when the temperature of an electronic device in a server exceeds 70 ℃, the operation speed is rapidly reduced, the aging of the equipment is accelerated, and the maintenance cost is increased. Meanwhile, the heat dissipation mode adopted by the existing equipment has increasingly obvious problems along with the increase of heat flux density, such as: hot spots, noise, uneven heat dissipation, etc., which requires more efficient heat dissipation methods to be developed. In order to solve the above problems in the heat dissipation process, researchers have searched for new heat dissipation methods,
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a but the submergence formula phase transition cooling system of high heat flux density electron device controlled pressure further improves its heat exchange efficiency on original submergence formula phase transition cooling system.
In order to solve the technical problem, the utility model provides a technical scheme does: a pressure-controllable immersed phase-change cooling device comprises a closed pressure-bearing case, wherein an evaporation generation end, a condensation generation end, a pressure control module and a cooling medium are arranged on the pressure-bearing case;
the evaporation generating end comprises an electronic device heating source and a radiating fin, the radiating fin is arranged on the electronic device, and the cooling medium is arranged in the pressure bearing machine box and completely passes through the electronic device and the radiating fin;
the condensation generating end is positioned on the top side in the pressure-bearing case and comprises a serpentine cooling coil, the cooling coil comprises an inlet pipe and an outlet pipe, and the inlet pipe and the outlet pipe both penetrate through the pressure-bearing case;
the pressure control module is used for maintaining constant pressure in the pressure-bearing case and comprises an air inlet and a pressure release valve which are arranged at the top of the pressure-bearing case.
Further, the cooling coil is a copper pipe with the inner diameter of 6mm and the wall thickness of 1mm, and comprises an inlet pipe and an outlet pipe, wherein the inlet pipe and the outlet pipe are both positioned on the same side of the snake-shaped condensing coil; the snakelike condensing coil is connected with an external circulating system through an outlet pipe and an inlet pipe.
Furthermore, the external circulation system comprises a water pump and a circulation pipeline, and the circulation pipeline is respectively connected with the inlet pipe and the outlet pipe.
Further, the cooling medium is a fluorinated liquid.
Furthermore, the pressure-bearing case is also provided with at least one temperature sensor, and the side wall of the pressure-bearing case is provided with a mounting hole for the temperature sensor to be arranged.
Furthermore, the pressure control module further comprises a pressure sensor, an air inlet control valve and an alarm, wherein the air inlet control valve is arranged at the end of the air inlet hole.
Compared with the prior art, the utility model the advantage lie in: the utility model discloses utilize coolant's latent heat to dispel the heat, take away the heat through coolant in the vaporization of electronic component surface boiling, it is strong to compare in prior art to have a radiating effect to do not need annexes such as fan and pipeline among the traditional radiating process, be favorable to saving space.
Drawings
Fig. 1 is a schematic structural diagram of the pressure-bearing case of the present invention.
Fig. 2 is a schematic view of the structure of the cooling coil of the present invention.
Fig. 3 is a schematic structural diagram of the pressure-controllable immersion type phase-change cooling device of the present invention.
As shown in the figure: 1. a pressure-bearing chassis; 2. a cooling medium; 3. an electronic device; 4. a heat dissipating fin; 5. an inlet pipe; 6. an outlet pipe; 7. an air inlet; 8. a pressure relief valve; 9. a cooling coil; 10. a water pump; 11. a circulation line; 12. mounting holes; 13. a temperature sensor; 14. an air intake control valve.
Detailed Description
The following describes the present invention with reference to the accompanying drawings. In which like parts are designated by like reference numerals.
In the description of the present invention, it is to be understood that the terms "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. Furthermore, the term "comprises" and any variations thereof are intended to cover non-exclusive inclusions.
The traditional heat dissipation mode of the electronic device 3 is an air cooling heat dissipation mode or a subsequent water cooling mode, and the device breaks through the traditional immersed water cooling mode and effectively cools the relatively large electronic device 3.
The immersion liquid cooling is divided into single-phase immersion cooling and two-phase immersion cooling according to whether the coolant has phase change in the heat dissipation process. The cooling liquid commonly used for the immersion type phase change cooling comprises two main types of mineral oil and fluoridized liquid. The technology utilizes the phase change latent heat of the coolant to soak the server in the cooling medium 2 with low boiling point and stable characteristics, and when the phase change latent heat reaches the boiling point of the cooling medium 2, the boiling phase change occurs on the surface of the electronic device 3 to take away heat. In the process, heat exchange thermal resistance is reduced, so that the heat dissipation efficiency is higher compared with the traditional heat dissipation mode. Within a certain range, the boiling intensity can be enhanced by increasing the pressure, and the heat exchange efficiency is improved.
The device is a controllable pressure immersion type phase change cooling device, which comprises a closed pressure-bearing case 1, wherein an evaporation generation end, a condensation generation end, a pressure control module and a cooling medium 2 are arranged on the pressure-bearing case 1, and the principle of a heat dissipation mode used in the embodiment is that the heat dissipation is carried out by utilizing the phase change latent heat of the cooling medium 2;
the evaporation generating end comprises an electronic device 3 heating source and a heat radiating fin 4, the heat radiating fin 4 is arranged on the electronic device 3, and the cooling medium 2 is arranged in the pressure-bearing case 1 and completely passes through the electronic device 3 and the heat radiating fin 4;
the condensation generating end is positioned on the top side in the pressure-bearing case 1 and comprises a serpentine cooling coil 9, the cooling coil 9 comprises an inlet pipe 5 and an outlet pipe 6, and the inlet pipe 5 and the outlet pipe 6 both penetrate through the pressure-bearing case 1; the electronic device 3 is arranged in the pressure-bearing case 1, and the cooling medium 2 submerges the electronic device 3 to be cooled; the heat radiation fins 4 can improve the cooling effect on the electronic device 3. When the cooling medium 2 is heated to reach the boiling point, the vaporized gas rises to the top side in the pressure-bearing case 1, and the gas is condensed into liquid at the condensation generating end and falls back to the cooling medium 2 under the action of gravity.
The pressure control module is used for maintaining constant pressure in the pressure-bearing case 1 and comprises an air inlet 7 and a pressure release valve 8 which are arranged at the top of the pressure-bearing case 1.
The cooling coil 9 is a copper pipe with the inner diameter of 6mm and the wall thickness of 1mm, and comprises an inlet pipe 5 and an outlet pipe 6, wherein the inlet pipe 5 and the outlet pipe 6 are both positioned on the same side of the snake-shaped condensation coil; the serpentine condenser coil is connected to the external circulation system by means of an outlet pipe 6 and an inlet pipe 5.
The external circulation system comprises a water pump 10 and a circulation pipeline 11, the circulation pipeline 11 is respectively connected with an inlet pipe 5 and an outlet pipe 6, cooling water of the external circulation system flows into a cooling coil 9 through the inlet pipe 5 under the driving of the external water pump 10, the cooling water flows out of the pressure-bearing case 1 from the outlet pipe 6 after heat exchange, and the cooling coil 9 condenses steam which is formed by phase change of a cooling medium 2 at the top in the pressure-bearing case 1.
In this embodiment, the cooling water after heat exchange is cooled by the compressor and flows into the water tower to wait for the next circulation; the water pump 10 and the compressor are connected with an external water tower circulation system.
The cooling medium 2 is 3M 7100 electronic fluorinated liquid, and the 3M 7100 has a lower boiling point (61 ℃) and a higher latent heat value, has good insulativity and chemical stability, and is environment-friendly and harmless.
The temperature-sensing device is characterized in that the pressure-bearing case 1 is further provided with at least one temperature sensor 13, the side wall of the pressure-bearing case 1 is provided with a mounting hole 12 for the temperature sensor 13 to be arranged, and the temperature sensor 13 is arranged in the pressure-bearing case 1 and used for monitoring temperature change and distribution conditions in the pressure-bearing case 1.
The pressure control module further comprises a pressure sensor, an air inlet control valve 14 and an alarm, wherein the air inlet control valve 14 is arranged at the end of the air inlet 7, one end of the pressure control module is connected to the cover body of the closed case, the other end of the pressure control module is connected with nitrogen, and the pressure value in the case is increased by introducing the nitrogen into the closed case; when the internal pressure value is low, the pressure sensor will regulate the intake air control valve 14 to increase the intake air amount.
The present invention and the embodiments thereof have been described above, but the present invention is not limited thereto, and the embodiments shown in the detailed description are only some examples, not all examples, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.
Claims (6)
1. A pressure-controllable immersed phase-change cooling device is characterized by comprising a closed pressure-bearing case (1), wherein an evaporation generation end, a condensation generation end, a pressure control module and a cooling medium (2) are arranged on the pressure-bearing case (1);
the evaporation generating end comprises an electronic device (3) heating source and a radiating fin (4), the radiating fin (4) is arranged on the electronic device (3), and the cooling medium (2) is arranged in the pressure-bearing case (1) and completely does not pass through the electronic device (3) and the radiating fin (4);
the condensation generating end is positioned on the top side in the pressure-bearing case (1) and comprises a snake-shaped cooling coil (9), the cooling coil (9) comprises an inlet pipe (5) and an outlet pipe (6), and the inlet pipe (5) and the outlet pipe (6) penetrate through the pressure-bearing case (1);
the pressure control module is used for maintaining constant pressure in the pressure-bearing case (1) and comprises an air inlet (7) and a pressure release valve (8) which are arranged at the top of the pressure-bearing case (1).
2. A controlled pressure immersion type phase change cooling device as claimed in claim 1, wherein the cooling coil (9) is a copper pipe with an inner diameter of 6mm and a wall thickness of 1mm, and comprises an inlet pipe (5) and an outlet pipe (6), and the inlet pipe (5) and the outlet pipe (6) are both positioned on the same side of the serpentine condensation coil; the snakelike condensing coil is connected with an external circulating system through an outlet pipe (6) and an inlet pipe (5).
3. A controlled pressure immersion phase change cooling device as claimed in claim 2, characterized in that the external circulation system comprises a water pump (10) and a circulation line (11), the circulation line (11) being connected to the inlet pipe (5) and the outlet pipe (6), respectively.
4. A controlled pressure immersion type phase change cooling device as claimed in claim 1, wherein the cooling medium (2) is a fluorinated liquid.
5. A controlled pressure immersion type phase change cooling device as claimed in claim 1, wherein at least one temperature sensor (13) is further provided on the pressure-bearing cabinet (1), and a mounting hole (12) for the temperature sensor (13) is provided on the side wall of the pressure-bearing cabinet (1).
6. A controllable pressure immersion type phase-change cooling device as claimed in claim 1, wherein said pressure control module further comprises a pressure sensor, an air inlet control valve (14) and an alarm, said air inlet control valve (14) is disposed at the air inlet hole (7) end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221227075.XU CN218388380U (en) | 2022-05-20 | 2022-05-20 | Pressure-controllable immersed phase-change cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221227075.XU CN218388380U (en) | 2022-05-20 | 2022-05-20 | Pressure-controllable immersed phase-change cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218388380U true CN218388380U (en) | 2023-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221227075.XU Active CN218388380U (en) | 2022-05-20 | 2022-05-20 | Pressure-controllable immersed phase-change cooling device |
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| Country | Link |
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| CN (1) | CN218388380U (en) |
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- 2022-05-20 CN CN202221227075.XU patent/CN218388380U/en active Active
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