CN218388380U - A controllable pressure immersion type phase change cooling device - Google Patents

Abstract

The utility model discloses a controllable pressure immersion type phase change cooling device, which comprises a closed pressurized cabinet, on which an evaporation generating end, a condensation generating end, a pressure control module and a cooling medium are arranged; the evaporation generating end It includes the heat source of the electronic device, and also includes the heat dissipation fin, the heat dissipation fin is arranged on the electronic device, the cooling medium is placed in the pressurized chassis and completely submerged in the electronic device and the heat dissipation fin; the condensation generation end is located at The top side inside the pressurized case includes a serpentine cooling coil, the cooling coil includes an inlet pipe and an outlet pipe, both of which are set through the pressurized case; the utility model utilizes the latent heat of the cooling medium to dissipate heat The cooling medium boils and vaporizes on the surface of the electronic components to take away the heat. Compared with the prior art, it has a stronger heat dissipation effect, and does not require accessories such as fans and pipelines in the traditional heat dissipation process, which is conducive to saving space.

Description

A controllable pressure immersion type phase change cooling device

technical field

The utility model relates to the technical field of phase change heat dissipation of electronic devices, in particular to a controllable pressure immersion type phase change cooling device.

Background technique

The rapid development of the Internet promotes the continuous expansion of the scale of the data center. The integration of its internal electronic components is getting higher and higher, and the power consumption is also rising sharply. How to effectively and quickly dissipate the internal heat of the server and reduce the cost of electricity has become a concern of the industry. According to relevant forecasts, by 2025, the power consumption of data centers will reach 3390TWh (1TWh is about 1 billion kWh), and its power consumption may account for 4.5% of global power consumption, which has brought enormous pressure to the environment.

The cooling method of the existing heating equipment cannot fully dissipate heat according to its heat dissipation requirements. When the temperature of the electronic components in the server exceeds 70°C, the computing speed drops rapidly, and the aging of the equipment is accelerated, which increases the maintenance cost. At the same time, with the increase of the heat flux density, the heat dissipation method adopted by the existing equipment has increasingly obvious problems, such as hot spots, noise, uneven heat dissipation, etc., which requires the development of a more efficient heat dissipation method. In order to solve the problems existing in the above heat dissipation process, researchers began to explore new heat dissipation methods,

Utility model content

The purpose of the utility model is to provide an immersion type phase change cooling system with controllable pressure of high heat flux electronic devices, and further improve the heat exchange efficiency of the original immersion type phase change cooling system.

In order to solve the above-mentioned technical problems, the technical solution provided by the utility model is: a controllable pressure immersion type phase change cooling device, including a closed pressure-bearing chassis, and the pressure-bearing chassis is equipped with an evaporation generating end, a condensation generating end, a pressure control Module, cooling medium;

The evaporation generating end includes a heat source of the electronic device, and also includes a heat dissipation fin, the heat dissipation fin is arranged on the electronic device, and the cooling medium is placed in a pressurized chassis and completely submerged in the electronic device and the heat dissipation fin;

The condensation generating end is located on the top side of the pressurized cabinet, and includes a serpentine cooling coil, the cooling coil includes an inlet pipe and an outlet pipe, and both the inlet pipe and the outlet pipe are arranged through the pressurized cabinet;

The pressure control module is used to maintain a constant pressure in the pressurized enclosure, including an air inlet and a pressure relief valve arranged on the top of the pressurized enclosure.

Further, the cooling coil is a copper tube with an inner diameter of 6mm and a wall thickness of 1mm, including an inlet pipe and an outlet pipe, both of which are located on the same side of the serpentine condensing coil; the serpentine The condensing coil is connected to the external circulation system through the outlet pipe and the inlet pipe.

Further, the external circulation system includes a water pump and a circulation pipeline, and the circulation pipeline is respectively connected with an inlet pipe and an outlet pipe.

Further, the cooling medium is fluorinated liquid.

Further, at least one temperature sensor is provided on the pressure-bearing chassis, and the side wall of the pressure-bearing chassis is provided with an installation hole for the temperature sensor.

Further, the pressure control module further includes a pressure sensor, an intake control valve and an alarm, and the intake control valve is arranged at the end of the intake hole.

Compared with the prior art, the utility model has the advantages that: the utility model utilizes the latent heat of the cooling medium to dissipate heat, and the heat is taken away by boiling and vaporizing the cooling medium on the surface of the electronic component. It needs accessories such as fans and pipelines in the traditional heat dissipation process, which is beneficial to save space.

Description of drawings

Fig. 1 is a structural schematic diagram of the pressurized cabinet of the present invention.

Fig. 2 is a structural schematic diagram of the practical cooling coil.

Fig. 3 is a structural schematic diagram of a controllable pressure immersion type phase change cooling device of the present invention.

As shown in the figure: 1. Pressurized chassis; 2. Cooling medium; 3. Electronic devices; 4. Radiating fins; 5. Inlet pipe; 6. Outlet pipe; 7. Air intake hole; 8. Pressure relief valve; 9 1. Cooling coil; 10. Water pump; 11. Circulation pipeline; 12. Mounting hole; 13. Temperature sensor; 14. Air intake control valve.

Detailed ways

The specific embodiment of the utility model will be further described below in conjunction with the accompanying drawings. Wherein the same components are denoted by the same reference numerals.

In describing the present invention, it should be understood that the terms "central", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying Any device or element must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present utility model, unless otherwise specified, "plurality" means two or more. Additionally, the term "comprise" and any variations thereof, are intended to cover a non-exclusive inclusion.

The traditional heat dissipation method of the electronic device 3 is air cooling or subsequent water cooling. This device breaks the traditional immersion water cooling method and effectively cools the relatively large electronic device 3 .

Immersion liquid cooling is divided into single-phase immersion cooling and two-phase immersion cooling according to whether the coolant has a phase change during the heat dissipation process. There are two types of cooling liquids commonly used in immersion phase change cooling, mineral oil and fluorinated liquid. This technology uses the latent heat of phase change of the coolant to immerse the server in a cooling medium 2 with a low boiling point and stable characteristics. When the boiling point of the cooling medium 2 is reached, a boiling phase change occurs on the surface of the electronic device 3 to take away heat. In this process, the thermal resistance of heat transfer is reduced, so the heat dissipation efficiency is higher than that of traditional heat dissipation methods. Within a certain range, increasing the pressure will increase the boiling intensity and improve the heat transfer efficiency.

The device is a controllable pressure immersion type phase-change cooling device, which includes a closed pressure-bearing chassis 1. The pressure-bearing chassis 1 is provided with an evaporation generating end, a condensation generating end, a pressure control module, and a cooling medium 2. The heat dissipation device used in this embodiment The principle of the method is to use the latent heat of phase change of the cooling medium 2 to dissipate heat;

The evaporation generating end includes the heat source of the electronic device 3, and also includes the heat dissipation fin 4, the heat dissipation fin 4 is arranged on the electronic device 3, and the cooling medium 2 is placed in the pressure-bearing chassis 1 and completely submerged in the electronic device 3 and cooling fins 4;

The condensation generating end is located on the top side of the pressurized cabinet 1, and includes a serpentine cooling coil 9. The cooling coil 9 includes an inlet pipe 5 and an outlet pipe 6. Both the inlet pipe 5 and the outlet pipe 6 pass through the pressurized The chassis 1 is set; wherein, the electronic device 3 is placed in the pressure-bearing chassis 1, and the cooling medium 2 is submerged to cool the electronic device 3; the cooling fins 4 can improve the cooling effect of the electronic device 3. When the cooling medium 2 is heated to the boiling point, the vaporized gas rises to the top side of the pressurized cabinet 1, and when the condensation occurs, it condenses into a liquid and falls back to the cooling medium 2 under the action of gravity.

The pressure control module is used to maintain a constant pressure in the pressurized cabinet 1 , and includes an air inlet 7 and a pressure relief valve 8 arranged on the top of the pressurized cabinet 1 .

The cooling coil 9 is a copper tube with an inner diameter of 6mm and a wall thickness of 1mm, including an inlet pipe 5 and an outlet pipe 6, and the inlet pipe 5 and the outlet pipe 6 are all located on the same side of the serpentine condensing coil; The serpentine condensing coil is connected to the external circulation system through the outlet pipe 6 and the inlet pipe 5 .

The external circulation system includes a water pump 10 and a circulation pipeline 11, the circulation pipeline 11 is connected to the inlet pipe 5 and the outlet pipe 6 respectively, and the cooling water of the external circulation system passes through the inlet pipe under the drive of the external water pump 10 5 flows into the cooling coil 9, and flows out of the pressurized cabinet 1 from the outlet pipe 6 after heat exchange, and the cooling coil 9 condenses the steam transformed by the phase change of the cooling medium 2 at the top of the pressurized cabinet 1.

In this embodiment, the cooling water after heat exchange is externally cooled by the compressor and flows into the water tower to wait for the next cycle; the water pump 10 and the compressor are connected to the external water tower circulation system.

Cooling medium 2 is 3M 7100 electronic fluorinated liquid, 3M 7100 has a low boiling point (61°C) and a high latent heat value, has good insulation and chemical stability, and is environmentally friendly and harmless.

The pressure-bearing cabinet 1 is also provided with at least one temperature sensor 13, and the side wall of the pressure-bearing cabinet 1 is provided with a mounting hole 12 for the temperature sensor 13. The temperature sensor 13 is placed in the pressure-bearing cabinet 1 for use It is used to monitor the temperature change and distribution in the pressurized cabinet 1 .

The pressure control module also includes a pressure sensor, an air intake control valve 14 and an alarm. The air intake control valve 14 is arranged at the end of the air intake hole 7. In the pressure control module, one end is connected to the airtight chassis cover, and the other end is connected to Nitrogen, increase the pressure value in the box body by feeding nitrogen gas into the airtight box body, in this embodiment, the pressure sensor is used to monitor the pressure change in the pressure-bearing cabinet 1, when the internal pressure value is higher, the alarm will It will alarm and output the signal to the pressure sensor at the same time, the pressure sensor will adjust the intake control valve 14 to reduce the intake air volume and at the same time will open the pressure relief valve 8 to release the pressure; when the internal pressure value is low, the pressure sensor will adjust the intake control Valve 14 increases the intake air.

The utility model and its implementation have been described above. This description is not restrictive. What is shown in the specific implementation is only a part of the implementation of the utility model, rather than all embodiments. The actual structure is not limited to this. All in all, if a person of ordinary skill in the art is inspired by it, without departing from the purpose of the utility model, without creatively designing a structural method and embodiment similar to the technical solution, it shall be protected by the utility model scope.

Claims (6)

1. A controllable pressure immersion type phase change cooling device is characterized in that it comprises an airtight pressure-bearing cabinet (1), and the pressure-bearing cabinet (1) is provided with an evaporation generation end, a condensation generation end, a pressure control module, a cooling medium(2); The evaporation generating end includes an electronic device (3) heat source, and also includes a heat dissipation fin (4), the heat dissipation fin (4) is arranged on the electronic device (3), and the cooling medium (2) is placed on a bearing In the press box (1) and completely submerged in electronic devices (3) and cooling fins (4); The condensation generating end is located on the inner top side of the pressurized cabinet (1), and includes a serpentine cooling coil (9). The cooling coil (9) includes an inlet pipe (5) and an outlet pipe (6), and the inlet pipe (5), the outlet pipe (6) is set through the pressure-bearing chassis (1); The pressure control module is used to maintain a constant pressure in the pressurized cabinet (1), and includes an air inlet (7) and a pressure relief valve (8) arranged on the top of the pressurized cabinet (1). 2. A kind of controllable pressure immersion type phase change cooling device according to claim 1, is characterized in that, described cooling coil pipe (9) is the copper tube that internal diameter is 6mm, wall thickness 1mm, comprises inlet pipe (5 ) and outlet pipe (6), the inlet pipe (5) and the outlet pipe (6) are all located on the same side of the serpentine condensing coil; the serpentine condensing coil passes through the outlet pipe (6) and the inlet pipe ( 5) Connected with the external circulation system. 3. A controllable pressure immersion type phase change cooling device according to claim 2, characterized in that, the external circulation system includes a water pump (10) and a circulation pipeline (11), and the circulation pipeline (11 ) are respectively connected with the inlet pipe (5) and the outlet pipe (6). 4. A controllable pressure immersion type phase change cooling device according to claim 1, characterized in that the cooling medium (2) is a fluorinated liquid. 5. A controllable pressure immersion type phase change cooling device according to claim 1, characterized in that at least one temperature sensor (13) is further provided on the pressure-bearing chassis (1), and the pressure-bearing chassis (1) (1) The side wall is provided with a mounting hole (12) for the temperature sensor (13). 6. A controllable pressure immersion type phase change cooling device according to claim 1, characterized in that the pressure control module also includes a pressure sensor, an air intake control valve (14) and an alarm, and the air intake The control valve (14) is arranged at the air inlet (7) end.

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