CN211509633U - Cooling device and switching power supply system - Google Patents

Abstract

The utility model relates to a power electronic equipment's cooling technology field, concretely relates to cooling device and switching power supply system. The utility model discloses the manufacturing cost and the running cost that aim at solving current cooling device existence are higher, the radiating efficiency is lower to and there is the potential safety hazard scheduling problem. The heating device is completely or partially immersed into the liquid phase-change heat exchange working medium, the phase-change heat exchange working medium absorbs heat of the heating device and changes into gas in a phase mode, the gas is condensed and releases heat when contacting with the surface of the shell or the heat dissipation device and changes into liquid in a phase mode, and the circulation is carried out in the way, so that the cooling of the heating device is realized. The structure and the heat exchange process of the utility model are simple; the phase-change heat exchange working medium has high latent heat of vaporization and few system heat exchange links, and the phase-change rate of the phase-change heat exchange working medium can be automatically adjusted according to different heating degrees of the heating device, so that the heat dissipation efficiency of the heating device is improved; and the phase-change heat exchange working medium is not conductive, and the safety of the cooling device is not affected.

Description

Cooling device and switching power supply system

Technical Field

The utility model relates to a power electronic equipment's cooling technology field, concretely relates to cooling device and switching power supply system.

Background

The switch power supply is a high-frequency electric energy conversion device and is widely applied to the fields of industrial automation control, computer cases, digital products and the like. The switching power supply is provided with heating elements such as switching tubes, diodes and transformers densely, and has the characteristics of high working frequency, small volume, high power density and the like, so that the switching power supply is easy to heat and raise temperature.

Patent application with publication number CN108036285A discloses an LED driving power supply with a cooling device, which connects a driving power supply body with a cooling mechanism, wherein the cooling mechanism comprises a ceramic heat exchanger, a heat sink, a condenser, an evaporator, a compressor and a cooling water pipe; the ceramic heat exchanger transfers the absorbed heat generated by the driving power supply body to the radiating fins; one end of the cooling water pipe is attached to the radiating fin, and the other end of the cooling water pipe is attached to the condenser; the compressor pressurizes the steam from the evaporator and then sends the steam into the condenser, the steam is liquefied in the condenser to reduce the temperature of the water in the cooling water pipe, the liquefied steam enters the evaporator to be vaporized to form a refrigeration cycle, and the driving power supply body is refrigerated by reducing the temperature of the water in the cooling water pipe.

However, the structure of the cooling device is complicated, and the devices such as the compressor and the evaporator need to consume extra electric energy, so that the manufacturing and operating costs of the cooling device are high; moreover, as the heat exchange links are more, and the water flow speed in the cooling water pipe cannot be automatically adjusted according to the heating power of the driving power supply body, the heat dissipation efficiency is lower; in addition, the safety and reliability of the cooling device can be affected if the cooling water pipe leaks.

Accordingly, there is a need in the art for a new cooling device and switching power supply system that addresses the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

In order to solve the above-mentioned problem among the prior art, the cost of making and the operation that exists for solving current cooling device is higher, the radiating efficiency is lower to and there is the potential safety hazard scheduling problem, the utility model provides a cooling device and switching power supply system.

The utility model provides a cooling device, which comprises a shell, wherein a closed cavity is formed in the shell, an insulated phase-change heat exchange working medium is filled in the closed cavity, and a heating device is wholly or partially immersed in the liquid phase-change heat exchange working medium; and a gaseous phase-change heat exchange working medium space is formed between the liquid level of the phase-change heat exchange working medium and the shell.

As the utility model provides a cooling device's preferred technical scheme, this cooling device still includes and carries out the heat abstractor of heat exchange with gaseous phase transition heat transfer working medium.

As a preferred technical solution of the cooling device provided by the present invention, the heating device is disposed at the bottom of the housing; the heat sink device is disposed on a top surface of the housing.

As the utility model provides a cooling device's preferred technical scheme, the heat abstractor includes at least one in radiating fin, fan, cooling water coil pipe and the condenser. If the natural heat dissipation of the shell is utilized to meet the requirement, an additional heat dissipation device can be omitted.

As a preferred technical solution of the cooling device provided by the present invention, the heat dissipation device includes a heat dissipation fin and a fan, the heat dissipation fin is disposed on an outer surface of the housing, and the fan is mounted on the heat dissipation fin; or the heat dissipation device comprises a cooling water coil pipe, and the cooling water coil pipe is arranged inside the shell; alternatively, the heat dissipating device includes a condenser disposed at an outer surface of the case.

As a preferred technical solution of the cooling device provided by the present invention, the cooling device further includes a first adapter, the first adapter is disposed on the housing, and the first adapter and the housing are sealed; the first adapter is used for electrically connecting the heat generating device with a power supply and/or a load outside the shell.

As a preferred technical solution of the cooling device provided by the present invention, the cooling device further includes a temperature sensor and a second adapter; the temperature sensor is arranged in the closed chamber; the second adapter is arranged on the shell in a penetrating mode, and the second adapter and the shell are sealed; the temperature sensor is electrically connected with a temperature monitoring system outside the shell through the second adapter.

As a preferred technical solution of the cooling device provided by the present invention, the cooling device further comprises a pressure gauge disposed on the housing, the pressure gauge being used for monitoring the internal pressure of the housing; and/or the pressure regulating valve is arranged on the shell and used for regulating the internal pressure of the shell. If no monitoring requirement exists, the pressure gauge, the pressure regulating valve, the temperature sensor and the monitoring system connected with the pressure gauge, the pressure regulating valve and the temperature sensor in the system can be removed.

As the utility model provides a cooling device's preferred technical scheme, the phase transition heat transfer working medium that uses in the system has the characteristics of high insulation, low boiling point, stable physicochemical properties, flow property is good, latent heat of vaporization is high, the environmental protection, and the boiling point temperature of phase transition heat transfer working medium can be selected according to the best operating temperature of heating device, generally chooses the boiling point at 30-70 degrees centigrade. The phase change heat exchange medium comprises at least one or more of hydrofluoroether, hydrofluorocarbon and alcohol compounds; or the boiling point of the phase-change heat exchange working medium is 30-70 ℃.

In addition, the utility model also provides a switching power supply system, which comprises a switching power supply and any one of the cooling devices; the switching power supply forms the heat generating device.

The utility model provides a cooling device and switching power supply system, through will generate heat the device whole or partially dip in liquid phase transition heat engineering medium, the heat phase transition that the heat engineering medium absorbs the device that generates heat becomes gaseous phase transition, gaseous phase transition heat engineering medium and shell surface or heat dissipation device contact time condensation heat release phase transition become liquid, so circulate, realize the cooling to the device that generates heat. The structure and the heat exchange process of the cooling device of the utility model are simple, the system is self-circulating, and external electric energy is not required to be consumed; the phase-change heat exchange working medium is directly contacted with the surface of the heating device, so that the heat exchange links are few; the phase-change heat exchange working medium has high latent heat of vaporization and high system heat exchange efficiency; the phase change rate of the phase change heat exchange working medium can be automatically adjusted according to different heating degrees of the heating device, so that the heat dissipation efficiency of the heating device is further improved; and the phase-change heat exchange working medium is not conductive, and the safety and the reliability of the cooling device cannot be influenced.

Drawings

The cooling device and the switching power supply system of the present invention will be described with reference to the drawings. In the drawings:

fig. 1 is a schematic structural diagram of a first cooling device provided in this embodiment;

fig. 2 is a schematic structural diagram of a second cooling device provided in this embodiment;

fig. 3 is a schematic structural diagram of a third cooling device provided in this embodiment;

fig. 4 is a schematic structural diagram of a fourth cooling device provided in this embodiment;

fig. 5 is a schematic view of a cooling water coil in the cooling device provided in this embodiment.

List of reference numerals

1-a shell; 2-a heat generating device; 3-phase change heat exchange working medium; 301-liquid level; 302-bubbles; 4-radiating fins; 5-a fan; 6-cooling water coil pipe; 71-a first adapter; 72-a second adapter; 8-a pressure gauge; 9-pressure regulating valve; 10-gaseous phase-change heat exchange working medium space.

Detailed Description

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention. For example, although the present embodiment is described in connection with a switching power supply, this is not intended to limit the scope of the present invention, and those skilled in the art may apply the present invention to other application scenarios without departing from the principles of the present invention. For example, the cooling device of the present invention can also be used for heating devices such as transformers and frequency converters.

It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate directions or positional relationships based on those shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In order to solve the problems that the existing cooling device is high in manufacturing cost and running cost, low in heat dissipation efficiency, potential safety hazards exist and the like, the embodiment provides the cooling device and the switching power supply system.

As shown in fig. 1, the cooling device provided by this embodiment includes a housing 1, a sealed chamber is formed inside the housing 1, the sealed chamber is filled with an insulating phase-change heat-exchange medium, and a heat generating device 2 is wholly or partially immersed in the liquid phase-change heat-exchange medium; and a gaseous phase-change heat-exchange medium space 10 is formed between the liquid level 301 of the phase-change heat-exchange medium 3 and the shell 1.

Illustratively, the phase-change heat exchange medium 3 of the present embodiment refers to a liquid having high insulation, low boiling point, stable physicochemical properties, good flow properties, high latent heat of vaporization, environmental protection, and the like. The heating device 2 can be completely arranged in the closed cavity, so that the periphery of the heating device 2 is filled with the liquid phase-change heat-exchange working medium 3, and the liquid phase-change heat-exchange working medium is evaporated into gas to cool the heating device; or the heating device 2 is completely arranged in the closed cavity and can be completely or partially immersed in the liquid phase-change heat exchange medium 3.

The cooling device of this embodiment is at the during operation, and the liquid phase transition heat transfer working medium 3 in the airtight cavity directly contacts with the surface of the device 2 that generates heat, and the heat that generates heat the device 2 during operation and gives off directly transmits for liquid phase transition heat transfer working medium 3. At the initial stage of operation of the heating device 2, the heating device 2 absorbs sensible heat and carries away heat through natural convection by the liquid phase-change heat exchange working medium 3, the liquid phase-change heat exchange working medium 3 adjacent to the heating device 2 absorbs heat and heats up at first, so that the temperature distribution in the liquid phase-change heat exchange working medium 3 is uneven, and an uneven density field is caused by the uneven temperature field, thereby buoyancy is generated to enable the liquid phase-change heat exchange working medium 3 close to a heating surface and the surrounding liquid phase-change heat exchange working medium 3 to generate heat convection, and the main flow temperature of the liquid phase-change heat exchange working medium in the sealed cavity is raised until the saturation temperature under.

Then the liquid phase-change heat exchange working medium 3 enters a saturated nuclear boiling working condition of the large container from a natural convection working condition, and the heat generating device 2 absorbs heat by the phase change heat exchange working medium 3 through phase change to take away heat. Along with the increase of the superheat degree of the surface of the heating device 2, bubbles 302 begin to be generated at the vaporization core of the surface of the heating device 2, and then the bubbles 302 break away from the surface of the heating device 2 and grow continuously in the movement process until the bubbles escape out of the liquid level 301 of the phase-change heat exchange working medium 3 and enter the gaseous phase-change heat exchange working medium space 10 above the closed cavity. The high-temperature gaseous phase-change heat exchange working medium 3 continuously rises, transfers heat to the shell 1 at the top of the closed cavity, then condenses again, and drops to the area of the liquid phase-change heat exchange working medium 3. In this way, a self-circulation closed phase-change liquid cooling system is formed.

The cooling device that this embodiment provided is through in the liquid phase transition heat transfer working medium with heating device whole or partial submergence to phase transition heat transfer working medium 3 covers the surface at heating device 2, phase transition heat transfer working medium 3 absorbs the heat phase transition of heating device 2 and becomes gaseous, and the heat phase transition that releases is become liquid to the condensation when gaseous and the surface contact of casing 1, so circulation, the realization is to the cooling of heating device 2. The phase-change heat exchange working medium 3 is fully and directly contacted with the heating device 2, no intermediate heat transfer link exists, the system absorbs the heat of the heating device by utilizing the latent heat of vaporization of the phase-change heat exchange working medium, the cooling efficiency is high, the temperature rise of the heating device 2 is low, and no local hot spot exists on the surface of the heating device, so that the uniform heat dissipation of the heating device 2 is facilitated; the phase change rate of the phase change heat exchange working medium 3 can be automatically adjusted according to different heating degrees of the heating device 2, so that the heat dissipation efficiency of the heating device 2 is improved; the structure and the heat exchange process of the cooling device of the embodiment are simple, and external electric energy is not required to be consumed; and the phase-change heat exchange medium 3 is not conductive, and cannot affect the safety and reliability of the cooling device.

The cooling device that this embodiment provided does not have middle heat transfer link, and the system utilizes phase change heat transfer working medium latent heat of vaporization to absorb the heat of generating heat device, and is self-regulating, therefore cooling efficiency is high. The temperature of the heating device is low, and no local hot spot exists.

As a preferred embodiment of the cooling apparatus of the present embodiment, the cooling apparatus further includes a heat dissipating device that exchanges heat with the gaseous phase-change heat exchange medium.

Illustratively, if natural heat dissipation by the housing is sufficient, no additional heat dissipation device may be included. When the heating power of the heating device 2 is larger, the heat dissipation part can be arranged on the outer surface of the shell 1, and the heat dissipation of the outer surface of the shell 1 is accelerated to ensure the heat exchange effect between the gaseous phase-change heat exchange working medium 3 and the surface of the shell 1, so that the refrigerating effect of the cooling device is further improved; or, the cooling water coil is arranged in the gaseous phase-change heat-exchange working medium space 10, and the gaseous phase-change heat-exchange working medium directly radiates heat to the secondary cooling water in the cooling water coil.

As a preferable embodiment of the cooling apparatus of the present embodiment, the heat generating device 2 is provided at the bottom of the casing 1; the heat sink device is disposed on the top surface of the housing 1.

Illustratively, the phase-change heat-exchange working medium 3 is positioned at the bottom of the closed chamber, and in order to make the phase-change heat-exchange working medium 3 fully contact with the surface of the heat generating device 2, the heat generating device 2 can be arranged at the bottom of the shell 1; because the phase-change heat exchange working medium 3 rises and contacts with the top surface of the casing 1 after changing into gas phase, heat dissipation devices such as heat dissipation fins, fans and the like can be arranged on the top surface of the casing 1, and heat dissipation is mainly carried out on the top surface of the casing 1.

As a preferred embodiment of the cooling apparatus of the present embodiment, the heat radiating means includes at least one of a heat radiating fin 4, a fan 5, a cooling water coil 6, and a condenser.

For example, as shown in fig. 2, heat dissipation fins 4 may be disposed on the surface of the housing 1, and the heat dissipation fins 4 may be made of a steel-aluminum composite material, which can fully utilize the efficient heat conduction performance of aluminum to dissipate heat of the housing 1; and the heat radiating fins 4 increase the contact area of the housing 1 with the outside air, thereby being beneficial to increasing the heat radiating performance of the cooling device.

For example, a fan 5 may be further disposed on the surface of the casing 1 to accelerate the air circulation on the surface of the casing 1 to timely take away the heat on the surface of the casing 1, thereby facilitating to increase the heat dissipation performance of the cooling device.

For example, as shown in fig. 4, a cooling water coil 6 may be further disposed inside the casing 1, a water inlet end and a water outlet end of the cooling water coil extend to the outside of the casing 1, a cold water pump is connected to the water inlet end of the cooling water coil 6, and heat of the gaseous phase-change heat exchange medium is taken away through circulation of cooling water, thereby facilitating increase of heat dissipation performance of the cooling device.

It will be understood by those skilled in the art that the above embodiments are described in the form of providing the heat dissipating fins 4 and the fan 5 on the surface of the casing 1, for example, to dissipate heat from the surface of the casing 1, and providing the cooling water coil 6 inside the casing 1 to directly exchange heat with the gaseous phase-change heat exchange medium. However, the protection scope of the present invention is not limited to the disclosure of the above embodiments, and under the premise that the heat dissipation performance of the refrigeration device is improved by dissipating heat from the surface of the casing 1, the technical personnel in the field can perform various adjustments and combinations on the above setting modes, so that the present invention can be applied to more specific application scenarios.

For example, as shown in fig. 3, as a preferred embodiment of the cooling device of the present embodiment, the heat dissipating means includes both the heat dissipating fins 4 and the fan 5, the heat dissipating fins 4 are provided on the outer surface of the housing 1, and the fan 5 is mounted on the heat dissipating fins 4.

For example, the heat dissipation efficiency of the refrigeration device can be further improved by providing the heat dissipation fins 4 on the outer surface of the housing 1 to increase the heat dissipation area of the housing 1 and further installing the fan 5 on the heat dissipation fins 4.

As shown in fig. 1 to 4, as a preferred embodiment of the cooling device of the present embodiment, the cooling device further includes a first adapter 71, the first adapter 71 is disposed on the housing 1, and the first adapter 71 is sealed with the housing 1; the first adapter 71 is used for electrically connecting the heat generating device 2 with a power supply and/or a load outside the housing 1.

For example, when the heat generating device 2 is disposed in the sealed chamber, the heat generating device 2 may be electrically connected to a first adapter 71 disposed on the housing 1, and then electrically connected to an external power supply or a load through the first adapter 71. A seal may be provided between the first adapter 71 and the housing 1 to prevent the phase change heat exchange medium 3 in the sealed chamber from leaking in the form of gas or liquid.

As shown in fig. 1 to 4, as a preferred embodiment of the cooling device of the present embodiment, the cooling device further includes a temperature sensor and a second adapter 72; the temperature sensor is arranged in the closed cavity; the second adapter 72 is arranged on the shell 1 in a penetrating way, and the second adapter 72 and the shell 1 are sealed; the temperature sensor is electrically connected to a temperature monitoring system external to the housing 1 via a second adapter 72.

Illustratively, the temperature sensor may be a thermocouple or other temperature measuring element. The temperature sensor is arranged at one end of the closed cavity close to the heating device 2 and used for monitoring the temperature of the heating device 2 or monitoring the temperature of the phase-change heat exchange working medium 3 around the heating device 2.

Can set up second adapter 72 on casing 1, this temperature sensor passes through second adapter 72 and is connected with the outside temperature monitoring system electricity of casing 1 to let people know the temperature rise condition and the cooling system refrigeration effect of device 2 that generate heat.

As shown in fig. 2 to 4, as a preferred embodiment of the cooling device of the present embodiment, the cooling device further includes a pressure gauge 8, the pressure gauge 8 is disposed on the housing 1, and the pressure gauge 8 is used for monitoring the internal pressure of the housing 1; and/or, the cooling device further comprises a pressure regulating valve 9, the pressure regulating valve 9 being provided on the housing 1 for regulating the internal pressure of the housing 1.

Exemplarily, the larger the pressure in the sealed chamber is, the higher the boiling point of the insulating refrigerant liquid is, and the certain influence is exerted on the refrigerating effect of the heating device 2, so that the pressure in the sealed chamber can be used as an index for measuring the actual refrigerating effect, when the pressure in the sealed chamber is larger, the heat dissipation device on the surface of the shell 1 can be adjusted to dissipate heat of the shell 1, so as to control the pressure in the sealed chamber within a certain range, and further ensure the heat dissipation effect of the refrigerating device.

When the refrigerating device is just started to be used, the temperature of air in the closed cavity rises to enable the pressure in the closed cavity to rise, the pressure regulating valve 9 can be opened to discharge all or part of the air in the closed cavity, and the discharged air in the closed cavity is beneficial to reducing the internal pressure of the closed cavity and is beneficial to phase change of the phase-change heat exchange medium 3 into gas. Thereby, the phase-change heat exchange working medium 3 is beneficial to evaporating in time to refrigerate the heating device 2.

As a preferred embodiment of the cooling device of the present embodiment, the phase change heat exchange medium 3 includes at least one or a combination of more of hydrofluoroether, hydrofluorocarbon, and alcohol compounds; or the boiling point of the phase-change heat exchange medium 3 is 30-70 ℃.

The phase-change heat-exchange medium 3 in the refrigeration apparatus of the present embodiment may be, for example, hydrofluoroether, hydrofluorocarbon, alcohol compound, and the like, and it will be understood by those skilled in the art that the phase-change heat-exchange medium 3 of the present embodiment is exemplified by hydrofluoroether, hydrofluorocarbon, and alcohol compound in the above embodiments. However, the protection scope of the present invention is not limited to the disclosure of the above embodiments, and on the premise that the phase-change heat-exchange working medium 3 required by the present embodiment has the properties of insulation, low boiling point, stable physical and chemical properties, good flow performance, high latent heat of vaporization, etc., those skilled in the art can select other types of phase-change heat-exchange working mediums 3, or a mixture of multiple phase-change heat-exchange working mediums 3, so that the present invention can be applied to more specific application scenarios.

In addition, the boiling point temperature of the transformation thermal working medium can be selected according to the optimal working temperature of the heating device, and in order to ensure the refrigerating effect of the phase transformation thermal working medium 3 on the heating device 2, the boiling point of the phase transformation liquid is preferably between 30 and 70 ℃.

In addition, the utility model also provides a switching power supply system, which comprises a switching power supply and any cooling device as above; the switching power supply forms the heat generating device 2.

For example, the refrigeration apparatus provided in the present embodiment is particularly suitable for a switching power supply for an LED driving power supply, a data center power supply, a server, a workstation, a PC, and the like, and the switching power supply may be provided in the refrigeration apparatus of the present embodiment to form a switching power supply system. The switching power supply system ensures that the temperature of the switching power supply in the switching power supply system is not too high due to the cooling effect of the phase-change heat exchange working medium 3, and the temperature rise is uniform, so that the working reliability of the switching power supply system is further improved. The cooling device provided by the embodiment is not only suitable for various switching power supplies, but also suitable for power electronic devices/equipment such as transformers and frequency converters, and power electronic devices such as IGBTs and MOSFETs.

Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims of the present invention, any of the claimed embodiments may be used in any combination.

So far, the technical solution of the present invention has been described with reference to the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, a person skilled in the art can make equivalent changes or substitutions to the related technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims (10)

1. A cooling device, characterized by:

the heat-exchange device comprises a shell, wherein a closed cavity is formed in the shell, an insulated phase-change heat-exchange working medium is filled in the closed cavity, and a heating device is completely or partially immersed in the liquid phase-change heat-exchange working medium; and a gaseous phase-change heat exchange working medium space is formed between the liquid level of the phase-change heat exchange working medium and the shell.

2. The cooling apparatus according to claim 1, wherein:

the heat dissipation device exchanges heat with the gaseous phase-change heat exchange medium.

3. The cooling apparatus according to claim 2, wherein:

the heating device is arranged at the bottom of the shell;

the heat sink device is disposed on a top surface of the housing.

4. The cooling apparatus according to claim 2, wherein:

the heat dissipation device includes at least one of a heat dissipation fin, a fan, a cooling water coil, and a condenser.

5. The cooling apparatus according to claim 4, wherein:

the heat dissipation device comprises heat dissipation fins which are arranged on the outer surface of the shell;

or the heat dissipation device comprises heat dissipation fins and a fan, wherein the heat dissipation fins are arranged on the outer surface of the shell, and the fan is mounted on the heat dissipation fins;

or the heat dissipation device comprises a cooling water coil pipe, and the cooling water coil pipe is arranged inside the shell;

alternatively, the heat dissipating device includes a condenser disposed at an outer surface of the case.

6. The cooling apparatus according to claim 1, wherein:

the first adapter is arranged on the shell in a penetrating mode, and the first adapter and the shell are sealed;

the first adapter is used for electrically connecting the heat generating device with a power supply and/or a load outside the shell.

7. The cooling apparatus according to claim 1, wherein:

the device also comprises a temperature sensor and a second adapter;

the temperature sensor is arranged in the closed chamber;

the second adapter is arranged on the shell in a penetrating mode, and the second adapter and the shell are sealed;

the temperature sensor is electrically connected with a temperature monitoring system outside the shell through the second adapter.

8. The cooling apparatus according to claim 1, wherein:

the pressure gauge is arranged on the shell and used for monitoring the internal pressure of the shell;

and/or the pressure regulating valve is arranged on the shell and used for regulating the internal pressure of the shell.

9. The cooling apparatus according to claim 1, wherein:

the boiling point of the phase-change heat exchange working medium is 30-70 ℃.

10. A switching power supply system characterized in that:

comprising a switching power supply and a cooling device according to any one of claims 1 to 9;

the switching power supply forms the heat generating device.

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