CN217825748U - Thermal management device - Google Patents

Abstract

The application relates to the technical field of temperature control, and discloses a heat management device which comprises a sealed cabin and a heat exchange tube, wherein the sealed cabin is constructed with an accommodating space, the accommodating space is filled with a refrigerant, the accommodating space is a gas phase region and a liquid phase region from top to bottom in sequence, and a heat management object is at least partially positioned in the liquid phase region; the heat exchange tube penetrates through the sealed cabin and is positioned in the gas phase area of the accommodating space, a heat exchange working medium is arranged inside the heat exchange tube, and the gaseous refrigerant in the accommodating space is condensed into a liquid state after exchanging heat with the heat exchange tube. By using the thermal management device provided by the embodiment of the disclosure, the temperature of the thermal management object can be continuously and efficiently reduced.

Description

Thermal management device

Technical Field

The present application relates to the field of temperature regulation, for example, to a thermal management device.

Background

Some electrical devices need to work normally within a certain temperature range. For example, for a commercial grade chip circuit, the operating temperature range is 0 to 70 degrees centigrade, and the chip circuit is likely to be out of control or even damaged when the temperature exceeds the first preset temperature range; for the new energy automobile battery, the working temperature range is 0-40 ℃, if the temperature is too high, the activity of the battery core can be influenced, irreversible damage is caused, and the battery cannot be normally charged due to too low temperature.

The shell is of a sealing structure, a refrigerant is contained in the shell, the liquid level of the refrigerant does not need to be full of the shell, the server mainboard is completely immersed below the liquid level of the refrigerant, and the temperature of the server mainboard is reduced through heat exchange between the server mainboard and the refrigerant.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:

the liquid refrigerant absorbs heat and evaporates, the volume is reduced continuously, and the heat dissipation of the server mainboard can be continuously performed only by supplementing the liquid refrigerant into the shell. The liquid refrigerant supplement needs special equipment, the structure is complex, the cost is high, and the use is inconvenient.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The disclosed embodiments provide a thermal management device to solve the problem of how to better control the temperature of a thermal management object.

In some embodiments, the heat management device comprises a sealed cabin and a heat exchange tube, wherein the sealed cabin is configured with an accommodating space, the accommodating space is filled with a refrigerant, the accommodating space is a gas phase region and a liquid phase region from top to bottom, and the heat management object is at least partially positioned in the liquid phase region; the heat exchange tube penetrates through the sealed cabin and is positioned in the gas phase area of the accommodating space, a heat exchange working medium is arranged inside the heat exchange tube, and the gaseous refrigerant in the accommodating space is condensed into a liquid state after exchanging heat with the heat exchange tube.

In the embodiment of the disclosure, the thermal management device is used for enabling the thermal management object to be in the preset working temperature range, and the thermal management object can be a chip circuit or a new-energy automobile battery. The sealed cabin is a hollow structure, and the inside of the sealed cabin is filled with a refrigerant. The filling amount of the refrigerant is less than the capacity of the accommodating space of the sealed cabin. Because the sealed cabin is a sealed structure, the refrigerant is in a state of gas-liquid two-phase coexistence and two-phase balance in the accommodating space. The density of the liquid is greater than that of the gas, and the liquid refrigerant is in the lower space of the accommodating space, namely the liquid phase area. The gaseous refrigerant is in the upper space of the accommodating space, namely the gas phase area. In addition, the liquid phase region and the gas phase region are not fixed regions, and are divided according to the state of the refrigerant in the accommodating space. The boundary between the liquid phase region and the gas phase region is the current level plane of the liquid refrigerant. When the liquid refrigerant is converted into the gaseous refrigerant, the current liquid level plane is lowered, and the volume of the liquid phase area is reduced, and the volume of the gas phase area is increased. When the gaseous refrigerant is converted into the liquid refrigerant, the current liquid level rises, and the volume of the liquid phase region increases and the volume of the gas phase region decreases. The thermal management object is at least partially located in the liquid phase region. The heat exchange efficiency of the heat management object and the liquid refrigerant is higher, so that the refrigerant in the accommodating space can perform better heat exchange with the heat management object. Preferably, the thermal management object is submerged in the refrigerant. The heat management object is immersed in the refrigerant, and all positions of the heat management object can fully exchange heat with the liquid refrigerant, so that the condition that the local temperature of the heat management object is too low or too low is avoided. The heat exchange tube penetrates through the sealed cabin and is positioned in the gas phase area of the accommodating space. The gaseous refrigerant in the accommodating space contacts with the outer wall of the heat exchange tube to exchange heat. The heat exchange working medium is arranged inside the heat exchange tube, and the heat exchange working medium enables the heat exchange tube to keep a lower temperature. The gaseous refrigerant of accommodation space contacts the outer wall of heat exchange tube, and the heat transfer that it carried is for the heat exchange tube, and self temperature reduces, and the condensation is liquid refrigerant, then falls under the effect of gravity, gets back to the liquid phase district. The heat exchange working medium in the heat exchange tube can be air, water or a refrigerant as long as the heat exchange tube can continuously keep low temperature. Thus, as the thermal management object generates heat, the heat is absorbed by the liquid refrigerant. The liquid refrigerant in the liquid phase region absorbs heat and evaporates to become a gaseous refrigerant, the gaseous refrigerant is contacted with the heat exchange tube, the heat is absorbed and taken away by the heat exchange tube, and the gaseous refrigerant is condensed to be in a gaseous state and returns to the liquid phase region. Through such a setting form, the refrigerant carries out the gas-liquid two-phase circulation in the accommodation space, constantly carries the heat that the heat management device sent to the heat exchange tube, has realized the continuous cooling to the heat management object.

In some embodiments, the number of the heat exchange tubes is multiple, and the heat exchange tubes are connected end to end in series to form a heat exchange coil.

In some embodiments, the heat exchange working medium in the heat exchange tube is a refrigerant, and the evaporation temperature of the refrigerant is higher than the evaporation temperature of the refrigerant.

In some embodiments, the heat management device further includes a heat dissipation portion, a hollow cavity is formed inside the heat dissipation portion, and the heat dissipation portion is connected to the first port and the second port of the heat exchange coil to form a circulation loop, and the gaseous refrigerant in the heat exchange coil is condensed into a liquid state in the heat dissipation portion.

In some embodiments, the heat exchange tubes are arranged at an inclination such that liquid refrigerant condensed at the heat exchange tubes slides along the heat exchange tubes to the side walls of the capsule.

In some embodiments, the heat management device further includes a heating device disposed in the accommodating space for increasing the temperature of the liquid refrigerant.

In some embodiments, the thermal management apparatus further comprises a control section configured to activate the heating apparatus if the thermal management object temperature is below a first preset temperature; wherein the first preset temperature is lower than an evaporation temperature of the refrigerant.

In some embodiments, the heating device is at least partially submerged in liquid refrigerant.

In some embodiments, the heat exchange coil is located at the top of the vapor phase zone.

In some embodiments, the heat management device further includes a cooling plate attached to a top plate and/or a side plate of the sealed cabin, and the gaseous refrigerant in the accommodating space is further heat-exchanged with the cooling plate and condensed into a liquid state.

The thermal management device provided by the embodiment of the disclosure can realize the following technical effects:

1. the heat management object exchanges heat with the liquid refrigerant, so that the heat exchange efficiency is high;

2. the refrigerant is self-circulated in the sealed cabin, and the liquid refrigerant does not need to be supplemented, so that the use is convenient.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated in the accompanying drawings, which correspond to the accompanying drawings and not in a limiting sense, in which elements having the same reference numeral designations represent like elements, and in which:

FIG. 1 is a schematic structural diagram of a thermal management device provided by embodiments of the present disclosure;

FIG. 2 is a schematic structural diagram of another thermal management device provided by an embodiment of the present disclosure;

FIG. 3 is a schematic structural view of another thermal management device provided by an embodiment of the present disclosure;

FIG. 4 is a schematic structural view of another thermal management device provided by an embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of another thermal management device provided by an embodiment of the present disclosure;

fig. 6 is a schematic diagram of a heat pipe of a thermal management device according to an embodiment of the disclosure forming a heat exchange coil.

Reference numerals:

110: a top plate; 120: a side plate; 130: a base plate; 140: a gas phase zone; 150: a liquid phase region; 200: a thermal management object; 300: a heat exchange pipe; 400: a heating device; 500: and (6) cooling the plate.

Detailed Description

So that the manner in which the features and advantages of the embodiments of the present disclosure can be understood in detail, a more particular description of the embodiments of the disclosure, briefly summarized above, may be had by reference to the appended drawings, which are included to illustrate, but are not intended to limit the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The terms "first," "second," and the like in the description and claims of the embodiments of the disclosure and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged as appropriate for the embodiments of the disclosure described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

In the embodiments of the present disclosure, terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their examples and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the disclosed embodiments can be understood by those of ordinary skill in the art according to specific situations.

The term "plurality" means two or more, unless otherwise specified.

In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. For example, a and/or B, represents: a or B, or A and B.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

With reference to fig. 1 to 6, an embodiment of the present disclosure provides a thermal management apparatus, which includes a sealed cabin and a heat exchange tube 300, wherein the sealed cabin is configured with an accommodating space, the accommodating space is filled with a refrigerant, the accommodating space is a gas phase region 140 and a liquid phase region 150 from top to bottom, and a thermal management object 200 is at least partially located in the liquid phase region 150; the heat exchange tube 300 penetrates through the sealed cabin and is located in the gas phase area 140 of the accommodating space, a heat exchange working medium is arranged inside the heat exchange tube 300, and a gaseous refrigerant in the accommodating space exchanges heat with the heat exchange working medium inside the heat exchange tube 300 through the heat exchange tube 300.

In the embodiment of the present disclosure, the thermal management device is used to keep the thermal management object 200 in its preset operating temperature range, and the thermal management object 200 may be a chip circuit or a new-energy automobile battery. The sealed cabin is a hollow structure, and the inside of the sealed cabin is filled with a refrigerant. The filling amount of the refrigerant is less than the capacity of the accommodating space of the sealed cabin. Because the sealed cabin is a sealed structure, the refrigerant is in a state of gas-liquid two-phase coexistence and two-phase balance in the accommodating space. The liquid has a density greater than that of the gas, and the liquid refrigerant is in a lower space of the accommodating space, i.e., the liquid phase region 150. The gaseous refrigerant is in the upper space of the accommodating space, i.e., the vapor phase region 140. In addition, the liquid phase region 150 and the gas phase region 140 are not fixed regions, and are divided according to the state of the refrigerant in the accommodation space. The boundary between liquid phase region 150 and vapor phase region 140 is the current level plane of the liquid refrigerant. As liquid refrigerant is converted to gaseous refrigerant, the front liquid level drops and the volume of liquid phase region 150 decreases and the volume of vapor phase region 140 increases. As the gaseous refrigerant is converted to liquid refrigerant, the front liquid level rises and the volume of the liquid phase region 150 increases and the volume of the gaseous phase region 140 decreases. The thermal management object 200 is at least partially located in the liquid phase region 150. The thermal management object 200 has a relatively high heat exchange efficiency with the liquid refrigerant, such that the refrigerant in the receiving space can exchange heat with the thermal management object 200 better. Preferably, the thermal management object 200 is submerged in the refrigerant. The thermal management object 200 is immersed in the refrigerant, and all positions of the thermal management object 200 can fully exchange heat with the liquid refrigerant, so that the condition that the local temperature of the thermal management object 200 is too low or too low is avoided. The heat exchange tube 300 penetrates the sealed cabin and is located in the gas phase area 140 of the accommodating space. The gaseous refrigerant of the accommodating space contacts the outer wall of the heat exchange pipe 300 to perform heat exchange. The inside of the heat exchange tube 300 is a heat exchange working medium, and the heat exchange working medium keeps the heat exchange tube 300 at a lower temperature. The gaseous refrigerant in the accommodating space contacts the outer wall of the heat exchange tube 300, the heat carried by the gaseous refrigerant is transferred to the heat exchange tube 300, the temperature of the gaseous refrigerant is reduced, the gaseous refrigerant is condensed into a liquid refrigerant, and the liquid refrigerant falls down under the action of gravity and returns to the liquid phase region 150. The heat exchange working medium in the heat exchange tube 300 may be air, water or refrigerant, as long as the heat exchange tube 300 can continuously maintain a low temperature. Thus, as the thermal management object 200 generates heat, the heat is absorbed by the liquid refrigerant. The liquid refrigerant in the liquid region 150 absorbs heat and evaporates into a gaseous refrigerant, and the gaseous refrigerant contacts the heat exchange tube 300, and the heat is absorbed and taken away by the heat exchange tube 300, and is condensed into a gaseous state to return to the liquid region 150. Through such a setting form, the refrigerant carries out the gas-liquid two-phase circulation in the accommodation space, constantly carries the heat that the heat management device sent to heat exchange tube 300, has realized the continuous cooling to thermal management object 200.

By using the heat management device provided by the embodiment of the disclosure, the heat management object 200 exchanges heat with the liquid refrigerant, so that the heat exchange efficiency is high; the refrigerant is self-circulated in the sealed cabin, and the liquid refrigerant does not need to be supplemented, so that the use is convenient.

Optionally, the thermal management device further includes a heating device 400 disposed in the accommodating space for increasing the temperature of the liquid refrigerant.

Some electrical devices cannot work normally even in a low-temperature environment, for example, a battery has a greatly reduced capacity in the low-temperature environment and cannot be charged normally in the low-temperature environment. For a battery for a new energy automobile, the charging efficiency is lower as the temperature is lower, and normal charging cannot be performed when the temperature is below 0 ℃. The heating device 400 is used to increase the temperature of the liquid refrigerant. The liquid refrigerant has a relatively high heat exchange efficiency with the thermal management object 200, and the temperature of the thermal management object 200 may be increased by increasing the temperature of the liquid refrigerant. In addition, the heating device 400 increases the temperature of the liquid refrigerant to a temperature equal to or lower than the evaporation temperature of the liquid refrigerant. That is, the heating temperature does not exceed the evaporation temperature of the liquid refrigerant during the process of increasing the temperature of the liquid refrigerant, and the liquid refrigerant is mainly increased in temperature during the heating process. For example, the evaporation temperature of the liquid refrigerant is 45 degrees celsius, the current temperature of the thermal management object 200 is 0 degrees celsius, the temperature of the liquid refrigerant is increased to 40 degrees celsius during the heating process, and the temperature of the thermal management object 200 will soon approach 40 degrees celsius through the heat exchange with the liquid refrigerant. When the heat is dissipated to the heat management object 200, the temperature of the heat management object 200 exceeds 45 ℃, the temperature of the liquid refrigerant cannot rise continuously when the temperature of the liquid refrigerant rises to 45 ℃, and the liquid refrigerant evaporates and takes away heat. The provision of the heating device 400 may enable the thermal management device to achieve a temperature increase and decrease for the thermal management object 200, such that the temperature of the thermal management object 200 is within its designed operating temperature range. Such an arrangement improves the temperature control effect of the thermal management device on the thermal management object 200.

Optionally, the heating device 400 is electrically heated.

The electric heating mode has simple structure and high heating efficiency.

Optionally, the thermal management apparatus further comprises a control part configured to activate the heating apparatus 400 if the temperature of the thermal management object 200 is lower than a first preset temperature; wherein the first preset temperature is lower than the evaporation temperature of the refrigerant.

The control section may be configured to cause the thermal management device to automatically control the temperature of the thermal management object 200. Specifically, the thermal management object 200 is at a temperature below a first preset temperature and the heating device 400 is activated. For example, when the temperature of the battery for the new energy automobile is 0 degrees celsius or lower, the amount of stored electricity is greatly reduced and normal charging cannot be performed, and when the temperature of the thermal management target 200 is lower than 0 degrees celsius, the auxiliary heating device 400 is turned on, and the temperature of the thermal management target 200 is indirectly raised by raising the temperature of the liquid refrigerant. The first predetermined temperature is lower than the evaporation temperature of the refrigerant because the increase in temperature of the liquid refrigerant is below the evaporation temperature of the refrigerant, during which the liquid refrigerant is in a warm position with little to no evaporation of the refrigerant taking place.

Optionally, the control is further configured to turn off the heating device 400 if the temperature of the thermal management object 200 is greater than or equal to a second preset temperature.

The temperature of the thermal management object 200 is greater than or equal to the second preset temperature, indicating that the thermal management object 200 is already in a temperature range suitable for its operation, at which point it is not necessary to continue to increase the temperature of the thermal management object 200. Taking a new energy automobile battery as an example, the second preset temperature is 10 ℃, at this time, the charging and discharging of the battery can be better performed, and the energy can be saved by turning off the heating device 400.

Optionally, the heating device 400 is at least partially submerged in the refrigerant.

The partial immersion of the heating device 400 in the refrigerant may improve the heat exchange efficiency of the heating device 400 with the liquid refrigerant. Preferably, the heating device 400 is completely submerged in the liquid refrigerant.

Optionally, the capsule includes a floor 130, the floor 130 being angled to form a recess in which the thermal management object 200 is located.

With such an arrangement, the liquid level of the liquid refrigerant is higher under the same refrigerant charge, and a larger contact area with the thermal management object 200 can be obtained, so that the heat exchange efficiency between the liquid refrigerant and the thermal management object 200 is improved.

Alternatively, the number of the heat exchange tubes 300 is plural, and the plural heat exchange tubes 300 are arranged in parallel to form an array tube.

The plurality of heat exchange pipes 300 are arranged in parallel, so that the space occupied by the heat exchange pipes 300 in the accommodating space can be reduced. The plurality of heat exchange tubes 300 creates a low temperature environment that facilitates condensing the gaseous refrigerant into a liquid state.

Optionally, the thermal management device comprises an air driving device for driving air to flow in the array tubes.

In this arrangement, air acts as the heat exchange medium in the heat exchange tube 300. Typically, the temperature of the air is ambient and the evaporation temperature of the refrigerant is between 40 and 50 degrees celsius. Air is used as a heat exchange working medium, so that the temperature of the heat exchange tube 300 is close to the ambient temperature, the refrigerant is liquid at the ambient temperature, and the gaseous refrigerant in the sealed cabin can be condensed into liquid refrigerant by contacting with the heat exchange tube 300. The air as the heat exchange working medium has low cost and is easy to realize, so that the heat management device can obtain better heating effect.

Optionally, the number of the heat exchange tubes 300 is multiple, and the multiple heat exchange tubes 300 are connected end to end in series to form a heat exchange coil.

The plurality of heat exchange tubes 300 are connected end to end and connected in series in the form of a heat exchange coil. Under the condition, the circulation of the heat exchange working medium in the heat exchange coil is favorably realized. As long as one end of the heat exchange coil is set as a heat exchange working medium inlet and the other end of the heat exchange coil is set as a heat exchange working medium outlet, the heat exchange working medium can be driven to flow in all the heat exchange tubes 300 by the heat exchange working medium driving device, so that the temperature of each heat exchange tube 300 is reduced.

Optionally, the heat management device further comprises a water tank and a water pump, the water tank is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively connected to two ends of the heat exchange coil. The water pump is used for driving water to circularly flow in the water tank and the heat exchange coil.

The water used as the heat exchange working medium has low cost and is easy to obtain. Meanwhile, the specific heat capacity of water is high, and the effect of reducing the temperature of the heat exchange tube 300 through water circulation is good. In addition, the water used as the refrigerant is environment-friendly, convenient to install and maintain, and can not cause pollution to the environment even if leakage occurs.

Optionally, the heat exchange working medium in the heat exchange tube 300 is a refrigerant, and the evaporation temperature of the refrigerant is less than or equal to the evaporation temperature of the refrigerant.

The refrigerant can efficiently realize heat transfer by depending on gas-liquid two-phase change of the refrigerant. The heat exchange tube 300 is filled with a refrigerant, so that heat carried by the gaseous refrigerant can be quickly absorbed. The evaporation temperature of the refrigerant is less than or equal to the evaporation temperature of the refrigerant, that is, less than or equal to the temperature of the gaseous refrigerant, so that the liquid refrigerant can be evaporated after exchanging heat with the gaseous refrigerant through the heat exchange tube 300, and compared with the temperature of the liquid refrigerant, the phase change process of the liquid refrigerant evaporation can absorb more heat in a short time. With such an arrangement, the heat carrying capacity of the refrigerant is improved, and the cooling effect on the thermal management object 200 can be improved.

Optionally, the heat management device further includes a heat dissipation portion, the interior of the heat dissipation portion is configured with a hollow inner cavity and is connected to the first interface and the second interface of the heat exchange coil to form a circulation loop, and a gaseous refrigerant in the heat exchange coil is condensed into a liquid state in the heat dissipation portion.

The refrigerant in the heat exchange tube 300 absorbs heat carried by the gaseous refrigerant and evaporates into a gaseous state. The heat carried by the gaseous refrigerant is transferred to the external environment at the heat dissipation part. The liquid refrigerant returns to the heat exchange tube 300, and the refrigerant in the heat exchange tube 300 is evaporated into a gas state and enters the heat dissipation portion. The heat carried by the gaseous refrigerant in the sealed cabin is transferred to the external environment by the reciprocating circulation. With this arrangement, the cooling effect of the heat exchange tube 300 with respect to the gaseous refrigerant can be improved.

Optionally, the heat dissipation portion is disposed obliquely and at a position higher than the heat exchange tube 300, so that the condensed liquid refrigerant flows toward the first interface under the action of gravity. The heat exchange pipe 300 is obliquely disposed to allow the gaseous refrigerant to ascend to the second connection port. Therefore, the refrigerant can realize self-circulation under the action of gas-liquid two-phase density difference so as to cool the gaseous refrigerant in the sealed cabin.

Optionally, the heat management device further includes a coolant pump for driving coolant to flow in the heat exchange tube 300 according to a preset direction.

By adopting the arrangement mode, the flowing speed of the refrigerant can be improved, the absorption speed of the heat exchange tube 300 to the heat carried by the gaseous refrigerant in the sealed cabin is also improved, and further, the cooling effect of the heat management object 200 is improved.

Optionally, the thermal management device further comprises a compressor, the air inlet is connected to the coil of the heat exchange tube 300, and the air outlet is connected to the heat dissipation part. The gaseous refrigerant in the heat exchange coil is compressed by the compressor, the temperature of the gaseous refrigerant rises, and after the gaseous refrigerant enters the heat dissipation part, the gaseous refrigerant has higher temperature difference with the external environment, so that better heat exchange efficiency can be obtained. In addition, the compressor can also provide power for the circulating flow of the refrigerant.

Optionally, the heat management device further comprises a throttling device, wherein the liquid inlet is connected to the heat dissipation portion, and the liquid outlet is connected to the heat exchange coil.

The throttling device is arranged to facilitate the establishment of the pressure difference of the suction and exhaust of the pressure machine. And moreover, the throttling device is arranged, so that the gaseous refrigerant in the heat dissipation part can release heat and condense into a liquid state, and then the gaseous refrigerant enters the tube replacement to continuously perform gas-liquid two-phase circulation.

Alternatively, the heat exchange tube 300 is obliquely disposed such that the liquid refrigerant condensed at the heat exchange tube 300 flows along the heat exchange tube 300 to the side wall of the hermetic container.

With such an arrangement, the circulation efficiency of the refrigerant in the sealed cabin can be improved.

Optionally, the heat exchange tube 300 is a gravity heat tube.

The heat exchange tube 300 is a closed tube, and a gas-liquid two-phase refrigerant is filled in a cavity inside the tube. The heat exchange tube 300 is disposed obliquely with a first end higher than a second end and the liquid refrigerant in the lower space. The second end of the heat exchange tube 300 is a cold end, and exchanges heat with the gaseous refrigerant in the sealed cabin, and the liquid refrigerant evaporates into the gaseous refrigerant and rises. The first end of the heat exchange tube 300 is a hot end, and performs heat exchange with the external environment or other auxiliary cooling devices, so that the gaseous refrigerant is condensed into a liquid state and returns to the lower space of the heat exchange tube 300. The heat pipe transfers heat by means of the gas-liquid two-phase change of the refrigerant, and the heat conduction efficiency is high. The heat exchange tube 300 is obliquely arranged, so that not only can the refrigerant inside the heat conduction tube self-circulation be realized, but also the liquid refrigerant condensed on the outer wall of the heat exchange tube 300 can fall into the liquid phase region 150 of the accommodating space more quickly along the obliquely arranged heat exchange tube 300. With this arrangement, heat emitted by the thermal management object 200 is transferred through the refrigerant to the heat exchange tubes 300, and is transferred from the inside of the capsule to the outside of the capsule through the heat exchange tubes 300. Heat dissipation to the thermal management object 200 may be accomplished by dissipating heat from the hot end of the heat pipe. Even if the heat management object 200 generates heat seriously in a short time, a large amount of heat may be absorbed by the liquid refrigerant of the accommodating space and continuously transferred to the first end of the heat exchange pipe 300.

Optionally, a heat exchange coil is located at the top of the vapor phase zone 140.

The gaseous refrigerant, which has a higher temperature and a lower density, is located at the top of the gaseous phase region 140. The heat exchange coil is located at the top of the gas phase zone 140, which can increase the temperature difference between the heat exchange coil and the gaseous refrigerant, thereby improving the heat exchange efficiency between the gaseous refrigerant and the heat exchange coil.

Optionally, the heat management device further includes a cooling plate 500 attached to the top plate 110 and/or the side plate 120 of the sealed cabin, and the gaseous refrigerant in the accommodating space is further heat-exchanged with the cooling plate 500 and condensed into a liquid state.

The gaseous refrigerant in the accommodating space contacts the cooling plate 500, and the heat carried by the gaseous refrigerant is absorbed by the cooling plate 500 and condensed into a liquid state. The cooling plate 500 is provided, so that the cooling effect on the gas refrigerator in the hermetic chamber can be further improved, and the heat dissipation effect on the heat management object 200 can be further improved.

The above description and the drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and illustrated in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A thermal management device, comprising:

the sealed cabin is constructed with an accommodating space, the accommodating space is filled with a refrigerant, the accommodating space sequentially comprises a gas phase region and a liquid phase region from top to bottom, and the thermal management object is at least partially positioned in the liquid phase region;

the heat exchange tube penetrates through the sealed cabin and is located in a gas phase area of the accommodating space, a heat exchange working medium is arranged inside the heat exchange tube, and a gaseous refrigerant in the accommodating space and the heat exchange tube are condensed into a liquid state after heat exchange.

2. The thermal management device of claim 1, further comprising:

and the heating device is arranged in the accommodating space and used for increasing the temperature of the liquid refrigerant.

3. The thermal management device of claim 2, further comprising:

a control section configured to activate the heating device if the thermal management object temperature is lower than a first preset temperature;

wherein the first preset temperature is lower than an evaporation temperature of the refrigerant.

4. The thermal management device of claim 3,

the heating device is at least partially submerged in liquid refrigerant.

5. The thermal management device according to any of claims 1 to 4,

the heat exchange tube is obliquely arranged, so that liquid refrigerant condensed on the heat exchange tube slides to the side wall of the sealed cabin along the heat exchange tube.

6. The thermal management device according to any of claims 1 to 4,

the heat exchange coil is positioned at the top of the gas phase zone.

7. The thermal management device according to any of claims 1 to 4,

the heat exchange tubes are connected in series end to form a heat exchange coil.

8. The thermal management device according to any of claims 1 to 4,

the heat exchange working medium in the heat exchange tube is a refrigerant, and the evaporation temperature of the refrigerant is less than or equal to the evaporation temperature of the refrigerant.

9. The thermal management device of claim 6, further comprising:

the heat dissipation part is internally provided with a hollow inner cavity and is connected with the first interface and the second interface of the heat exchange coil pipe so as to form a circulation loop, and gaseous refrigerants in the heat exchange coil pipe are condensed into liquid in the heat dissipation part.

10. The thermal management device according to any of claims 1 to 4, further comprising:

and the cooling plate is attached to the top plate and/or the side plate of the sealed cabin, and the gaseous refrigerant in the accommodating space exchanges heat with the cooling plate and is condensed into liquid.

Images