CN218362817U - Cutting platform and cutting device - Google Patents

Abstract

The embodiment of the application provides a cutting platform and a cutting device, wherein the cutting platform comprises a base and a cutting guide piece; the bearing platform comprises a cutting area and an adsorption area, and the adsorption area is used for adsorbing a piece to be cut; the cutting guide piece comprises a first guide strip and a second guide strip which are detachably arranged in the cutting area, and the first guide strip and the second guide strip are arranged at intervals to form a cutting groove corresponding to the cutting path between the first guide strip, the second guide strip and the bearing surface of the bearing table. The technical scheme of this application embodiment can freely select the cutting guide that corresponds in a flexible way according to the specification of the product of waiting to cut of difference to satisfy and wait to cut the product to cut different, extensive applicability is extensive, is favorable to reduction in production cost.

Description

Cutting platform and cutting device

Technical Field

The application relates to the technical field of cutting, especially, relate to a cutting platform and cutting device.

Background

Laser cutting techniques are typically used to cut the display panel to the desired size and shape. Because the size, the shape of the display panel used by each electronic product have differences, the cutting platform needing to be adapted is used for bearing the corresponding products to be cut, and the products can only be used in a one-to-one manner in a matching way, so that a large number of cutting platforms with different specifications are needed when different products are cut, one cutting platform cannot be used universally, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a cutting platform and a cutting device, which are used for solving or relieving one or more technical problems in the prior art.

According to a first aspect of embodiments of the present application, there is provided a cutting platform comprising:

the bearing table comprises a cutting area and an adsorption area, and the adsorption area is used for adsorbing a piece to be cut;

the cutting guide piece comprises a first guide strip and a second guide strip which are detachably arranged in a cutting area, wherein the first guide strip and the second guide strip are arranged at intervals so as to form a cutting groove corresponding to a cutting path between the first guide strip, the second guide strip and the bearing surface of the bearing table.

In one embodiment, the first guide strip and the second guide strip each comprise a plurality of chain links connected in sequence, the cutting area is provided with a plurality of positioning holes, and the chain links are installed in the corresponding positioning holes.

In one embodiment, adjacent links are connected by a support post, and the support post is installed in the positioning hole.

In one embodiment, the device further comprises a mounting column, one end of the mounting column is connected with the supporting column, and the other end of the mounting column is inserted into the positioning hole.

In one embodiment, the device further comprises a positioning member, and the positioning member is sleeved at one end of the mounting column close to the support column.

In one embodiment, the links include a top link and a bottom link, and the support post has one end connected to the top link and another end connected to the bottom link.

In one embodiment, the first guide strip and the second guide strip are arranged higher than the bearing surface of the bearing table.

In one embodiment, the carrier includes a first adsorption region, a second adsorption region and a third adsorption region in the adsorption region, the second adsorption region semi-surrounds the first adsorption region, and the third adsorption region semi-surrounds the second adsorption region.

In one embodiment, the first adsorption zone, the second adsorption zone, and the third adsorption zone are each provided with a plurality of vacuum holes.

In one embodiment, the cutting platform further comprises a limiting strip, and the limiting strip is arranged on the outer side of the cutting area far away from the adsorption area.

According to a second aspect of embodiments herein, there is provided a cutting apparatus comprising a cutting platform as in any one of the embodiments above.

The cutting platform of this application embodiment adopts above-mentioned technical scheme, can freely select the cutting guide that corresponds in a flexible way according to the specification of the product of waiting to cut of difference to satisfy and wait to cut the product of difference, extensive applicability is extensive, is favorable to reduction in production cost.

The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present application will be readily apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are therefore not to be considered limiting of its scope.

Fig. 1 shows a schematic structural diagram of a cutting platform according to an embodiment of the present application.

Fig. 2 illustrates a schematic structural diagram of a cutting guide according to an embodiment of the present application.

Fig. 3 shows a schematic structural diagram of a cutting zone and a cutting guide in a cutting platform according to an embodiment of the present application.

Fig. 4 shows a schematic structural view of a link in a cutting deck according to an embodiment of the present application.

FIG. 5 illustrates a schematic diagram of a cutting guide for use in cutting a mobile phone product according to one embodiment of the present application.

Fig. 6 shows a schematic view of a cutting guide for cutting a folded product according to an embodiment of the present application.

Fig. 7 shows a schematic view of a cutting guide for cutting an on-board product according to yet another embodiment of the present application.

Description of the reference numerals:

10. a bearing table; 11. a cutting zone; 12. an adsorption zone; 121. a first adsorption zone; 122. a second adsorption zone; 123. a third adsorption zone;

20. a cutting guide; 21. a first guide bar; 211. a chain link; 2111. a top link; 2112. a bottom link; 22. a second guide bar; 23. cutting a groove; 24. a support column; 25. mounting a column; 26. a positioning member; 27. A protrusion;

30. a vacuum hole;

40. a limiting strip;

50. and (7) positioning the holes.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present application. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

In the correlation technique, when utilizing laser cutting knife to cut the piece of waiting to cut of placing on cutting platform, need set up the cutting guide on cutting platform to make laser cutting knife can remove according to the cutting route of cutting guide, thereby can treat that the piece of cutting cuts out corresponding shape. However, different types of products have different requirements on the cutting shape, so that the corresponding cutting guide pieces are required to guide the laser to cut and move, and the cutting platform cannot be used for cutting different types of pieces to be cut, so that the production cost is increased. Accordingly, the present application provides a cutting platform.

Referring to fig. 1 to 5, the cutting platform includes: a carrier table 10 and a cutting guide 20.

The bearing table 10 comprises a cutting area 11 and an adsorption area 12, the adsorption area 12 is used for adsorbing a piece to be cut, and the cutting area 11 is used for cutting one end of the piece to be cut; the cutting guide 20 includes a first guide strip 21 and a second guide strip 22 detachably disposed in the cutting area 11, and the first guide strip 21 and the second guide strip 22 are disposed at an interval to form a cutting groove 23 corresponding to the cutting path between the first guide strip 21, the second guide strip 22 and the carrying surface of the carrier table 10.

In this embodiment, divide into cutting area 11 and adsorption zone 12 with plummer 10 for when waiting to cut the piece and placing to plummer 10 on, the adsorption zone treats that the piece of cutting exerts the adsorption affinity, so that it fixes on plummer 10 to wait to cut the piece, the part of waiting to cut the piece this moment stretches to cutting area 11, and covers to cutting groove 23, later utilizes laser cutting knife to stretch into to cutting groove 23 in, and move along the cutting path of cutting groove 23, thereby accomplish the cutting of treating the piece of cutting. In addition, when the workpiece to be cut is placed between the bearing tables 10, the laser device can photograph the shape or position of the cutting groove 23 in advance and align the shape or position to be recorded on the control device, so that when the workpiece to be cut is placed on the bearing tables 10, the laser cutting knife can be controlled to move along the cutting path of the cutting groove 23.

Exemplarily, since the cutting groove 23 is formed by the first guide strip 21, the second guide strip 22 and the carrying surface of the carrying table 10, and the first guide strip 21 and the second guide strip 22 are detachably connected to the cutting area 11, the first guide strip 21 and the second guide strip 22 can flexibly form the cutting grooves 23 with different shapes according to the cutting shapes of the cutting products, and then the corresponding cutting guide 20 can be freely and flexibly selected according to the specifications of different products to be cut, so as to meet the requirement of cutting different products to be cut, and the applicability is wide, thereby being beneficial to reducing the production cost.

Illustratively, the first guide strip 21 and the second guide strip 22 are flexible articles (e.g., chain links), so that different cutting grooves can be flexibly formed according to different cutting shapes of the to-be-cut piece, so as to meet the requirements of cutting different to-be-cut products.

In one embodiment, each of the first guide strip 21 and the second guide strip 22 includes a plurality of sequentially connected links 211, the cutting region 11 is provided with a plurality of positioning holes 50, and the links 211 are installed in the corresponding positioning holes 50.

Illustratively, the first guide strip 21 and the second guide strip 22 are composed of sequentially connected chain links 211, and the sequentially connected chain links 211 are installed in corresponding positioning holes 50 by using a plurality of positioning holes 50 on the cutting area 11, so that the first guide strip 21 and the second guide strip 22 can be quickly installed in the cutting area 11, and can be quickly replaced into cutting grooves 23 of different shapes according to the type of a piece to be cut.

Illustratively, the length of the single link 211 is between 8mm and 10mm (inclusive); the height of the individual links 211 is between 3mm and 4mm inclusive. Specifically, if the length of a single link 211 is less than 8mm, more links 211 are required to be connected in sequence, which is not favorable for saving cost; if the length of the single-link chain link 211 is greater than 10mm, the stability between the single-link chain links 211 is poor, and the shape of the cutting groove 23 is changed during cutting, which affects the cutting effect.

In one embodiment, adjacent links 211 are connected by support posts 24, and the support posts 24 are mounted in the positioning holes 50.

In one embodiment, the device further comprises a mounting post 25, one end of the mounting post 25 is connected to the supporting post 24, and the other end of the mounting post 25 is inserted into the positioning hole 50. It should be noted that, in this embodiment, one end of the mounting post 25 is connected to the supporting post 24, and then the other end of the mounting post 25 is inserted into the positioning hole 50, so as to install the adjacent chain link 211 on the bearing table 10, thereby forming a cutting groove for the movement of the laser cutting knife, and the structure is simple and the assembly and disassembly are convenient.

In order to quickly achieve the connection between the mounting post 25 and the supporting post 24, in one embodiment, a positioning member 26 is further included, and the positioning member 26 is sleeved on one end of the mounting post 25 close to the supporting post 24. When the erection column 25 is required to be connected with the support column 24, the positioning piece 26 arranged at one end of the erection column close to the support column 24 is prepositioned with the support column 24, and then one end of the erection column 25 is convenient to stretch into the support column 24 for fixed installation, so that the purpose of quick installation is achieved.

In one embodiment, link 211 includes a top link 2111 and a bottom link 2112, and support post 24 is connected to top link 2111 at one end and to bottom link 2112 at the other end.

Illustratively, one end of a supporting column 24 is connected with the top link 2111, and the other end of the supporting column 24 is connected with the bottom link 2112, so that the assembly of the single link 211 is completed, and then the single links 211 are sequentially connected, so that a first guide strip 21 or a second guide strip 22 is formed, and the structure is simple and the assembly and disassembly are convenient; at the same time, due to the flexibility between the links 211, it is possible to combine the cutting grooves 23 into corresponding shapes according to the type of piece to be cut, for example: the shape of the cutting groove 23 may be linear, curved or other irregular shapes, and is not limited herein.

In addition, the top link 2111 and the bottom link 2112 are connected to the two ends of the supporting column 24, respectively, and may be integrally fixed or detachably connected. In this embodiment, the top link 2111 and the bottom link 2112 are respectively provided with mounting holes (not shown), and the two ends of the supporting column 24 are respectively provided with protrusions 27 adapted to the mounting holes, so as to realize the fixed mounting of the top link 2111 and the bottom link 2112.

In one embodiment, the first guide strip 21 and the second guide strip 22 are disposed higher than the carrying surface of the carrier table 10.

For example, when the first guide strip 21 and the second guide strip 22 are installed in the positioning hole 50, the first guide strip 21 and the second guide strip 22 are required to be higher than the bearing surface of the bearing table 10, so that when the laser cutting head extends into the cutting groove formed between the first guide strip 21, the second guide strip 22 and the bearing surface of the bearing table 10, the laser cutting head can be prevented from cutting the bearing surface of the bearing table 10.

Wherein, the distance between the bottom surface of the first guide strip 21 and the bottom surface of the second guide strip 22 and the bearing surface of the bearing table 10 is between 15mm and 20mm (inclusive).

In one embodiment, the carrier 10 includes a first absorption region 121, a second absorption region 122 and a third absorption region 123 in the absorption region 12, the second absorption region 122 semi-surrounds the first absorption region 121, and the third absorption region 123 semi-surrounds the second absorption region 122.

Illustratively, the second adsorption region 122 is half-enclosed by the first adsorption region 121, and the third adsorption region 123 is half-enclosed by the second adsorption region 122. That is to say, the area of the first adsorption region 121 is smaller than that of the second adsorption region 122, and the area of the second adsorption region 122 is smaller than that of the third adsorption region 123, so that when the pieces to be cut of different sizes are cut, the pieces to be cut can be adsorbed by the corresponding adsorption regions, so that the pieces to be cut can be fixed on the bearing table 10, and the situation that the pieces to be cut move randomly in the cutting process is prevented from affecting the cutting effect.

For example: when the small-sized workpiece is cut, the small-sized workpiece is placed in the first suction area 121, and the first suction area 121 provides a suction force to the small-sized workpiece, so that the small-sized workpiece is fixed on the carrier table 10. If the medium-sized piece to be cut is cut, the medium-sized piece to be cut is placed in the second adsorption area 122, and the second adsorption area 122 gives adsorption force to the piece to be cut so that the medium-sized piece to be cut is fixed on the bearing table 10; if the large-sized piece to be cut is cut, the large-sized piece to be cut is placed in the third adsorption area 123, and at the moment, the third adsorption area 123 provides adsorption force for the piece to be cut, so that the large-sized piece to be cut is fixed on the bearing table 10; therefore, an operator can conveniently select the corresponding adsorption area according to the pieces to be cut with different sizes, and the application range is wide.

In addition, for the suction force in the first adsorption zone 121, the second adsorption zone 122, and the third adsorption zone 123, an external suction device for applying a suction force to the work piece placed in the first adsorption zone 121, the second adsorption zone 122, or the third adsorption zone 123 may be used, and a specific type of the suction device is not limited.

In one embodiment, the first adsorption zone 121, the second adsorption zone 122, and the third adsorption zone 123 are each provided with a plurality of vacuum holes 30. Specifically, a plurality of vacuum holes 30 are formed in the first adsorption region 121, the second adsorption region 122 and the third adsorption region 123, so that a suction pipe of the vacuum adsorption device can be used to extend into the vacuum holes 30, and the adsorption force of the vacuum adsorption device can act on the workpiece to be cut through the vacuum holes 30, thereby fixing the workpiece to be cut on the carrier table 10.

In one embodiment, the cutting platform further comprises a limiting strip 40, and the limiting strip 40 is arranged on the outer side of the cutting area 11 far away from the adsorption area 12.

Exemplarily, the limiting strip 40 is arranged on the outer side of the cutting area 11 far away from the adsorption area 12, so that one end, extending to the cutting area, of the to-be-cut piece adsorbed on the bearing table 10 is limited by the limiting strip 40, and then the laser cutting head moves along the cutting path of the cutting groove 23, thereby avoiding the to-be-cut piece from moving in the cutting process to affect the cutting quality, and improving the cutting accuracy. It should be noted that the position-limiting bar 40 can be connected to the platform 10 by an integral molding method, or can be connected to the platform 10 by a detachable connection method. The material of the stopper bar 40 may be one of metal, alloy, plastic, and the like, but is not limited thereto.

In another aspect of the embodiments of the present application, a cutting device is provided, which includes the cutting platform in any one of the above embodiments.

Other configurations of the cutting platform of the above embodiments may be adopted by various technical solutions known by those skilled in the art now and in the future, and will not be described in detail herein.

Application scene overview

The cutting platform of the embodiment of the disclosure can be applied to the technical field of liquid crystal display manufacturing, can be used as a bearing platform of a laser cutting machine, and is used for bearing a piece to be cut. The to-be-cut piece can comprise a mobile phone, a folding product, a vehicle-mounted product, a computer and the like.

It can be understood that the cutting platform can be applied to liquid crystal display cutting, and can also be applied to any other scenes in which a workpiece to be cut needs to be borne by the cutting platform, such as automobile manufacturing industry, kitchenware manufacturing industry, sheet metal machining manufacturing industry and the like.

Application example

A cutting platform according to an exemplary embodiment of the present disclosure is described with reference to fig. 1 to 7. It should be noted that the above application scenarios are merely illustrated for the convenience of understanding the spirit and principles of the embodiments of the present disclosure, and the embodiments of the present disclosure are not limited in this respect. Rather, implementations of embodiments of the disclosure may be applied to any scenario where applicable.

As shown in fig. 5, when the cutting platform is used for cutting a mobile phone product, the first guide bar 21 and the second guide bar 22 in the cutting guide 20 are installed in the positioning hole 50, the chain links 211 in the first guide bar 21 and the second guide bar 22 are combined according to the cutting shape of the mobile phone to be cut, so as to form a cutting groove 23 corresponding to the cutting shape, then the mobile phone product to be cut is placed in the first adsorption area 121, so that the mobile phone product to be cut is fixed on the bearing table 10, at this time, one end of the mobile phone product extends to the cutting area 11, and finally the mobile phone product is moved along the cutting path of the cutting groove 23 by the laser cutting knife, so as to cut the mobile phone product.

As shown in fig. 6, when the cutting platform is used for cutting a folded product, the first guide strip 21 and the second guide strip 22 in the cutting guide 20 are installed in the positioning hole 50, the chain links 211 in the first guide 21 and the second guide 22 are combined according to the cutting shape of the folded product to be cut, so as to form a cutting groove 23 corresponding to the cutting shape, then the folded product to be cut is placed in the second adsorption area 122, so that the folded product to be cut is fixed on the bearing table 10, at this time, one end of the folded product extends to the cutting area 11, and finally, the laser cutting knife moves along the cutting path of the cutting groove 23, so as to cut the folded product.

As shown in fig. 7, when the cutting platform is used for cutting a vehicle-mounted product, the first guide strip 21 and the second guide strip 22 in the cutting guide 20 are installed in the positioning hole 50, the links 211 in the first guide 21 and the second guide 22 are combined according to the cutting shape of the vehicle-mounted product to be cut, so as to form a cutting groove 23 corresponding to the cutting shape, then the vehicle-mounted product to be cut is placed in the third adsorption area 123, so that the vehicle-mounted product to be cut is fixed on the bearing table 10, at this time, one end of the vehicle-mounted product extends to the cutting area 11, and finally the vehicle-mounted product is cut by moving along the cutting path of the cutting groove 23 through the laser cutting knife.

In the description of the present specification, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integral parts thereof; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. The first feature being "under," "beneath," and "under" the second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application. Further, the present application may repeat reference numerals and/or reference letters in the various examples for simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or arrangements discussed.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various changes or substitutions within the technical scope of the present application, and these should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (11)

1. A cutting platform, comprising:

the bearing surface of the bearing platform comprises a cutting area and an adsorption area, and the adsorption area is used for adsorbing a piece to be cut;

the cutting guide piece comprises a first guide strip and a second guide strip which are detachably arranged in a cutting area, wherein the first guide strip and the second guide strip are arranged at intervals, so that a cutting groove corresponding to a cutting path is formed between the first guide strip and the bearing surface of the bearing table.

2. The cutting platform of claim 1, wherein the first guide strip and the second guide strip each comprise a plurality of sequentially connected chain links, the cutting zone is provided with a plurality of positioning holes, and the chain links are mounted in the corresponding positioning holes.

3. The cutting platform of claim 2, wherein adjacent links are connected by a support post, the support post being mounted in the locating hole.

4. The cutting platform of claim 3, further comprising a mounting post, one end of the mounting post being connected to the support post, the other end of the mounting post being inserted into the locating hole.

5. The cutting platform of claim 4, further comprising a positioning member, wherein the positioning member is sleeved on one end of the mounting post close to the supporting post.

6. A cutting platform according to any one of claims 3 to 5, wherein the links comprise a top link and a bottom link, the support posts being connected at one end to the top link and at the other end to the bottom link.

7. The cutting platform of claim 1, wherein the first and second guide strips are disposed above the load-supporting surface.

8. The cutting platform of claim 1, wherein the suction zones comprise a first suction zone, a second suction zone and a third suction zone, the second suction zone semi-surrounding the first suction zone, the third suction zone semi-surrounding the second suction zone.

9. The cutting platform of claim 8, wherein a plurality of vacuum holes are disposed on each of the first, second and third suction zones.

10. The cutting platform of claim 1, further comprising a limiting strip disposed on an outer side of the cutting region away from the adsorption region.

11. A cutting device comprising a cutting platform according to any one of claims 1 to 10.

Images