CN105792539A - High-speed surface mounting machine - Google Patents
High-speed surface mounting machine Download PDFInfo
- Publication number
- CN105792539A CN105792539A CN201610173816.3A CN201610173816A CN105792539A CN 105792539 A CN105792539 A CN 105792539A CN 201610173816 A CN201610173816 A CN 201610173816A CN 105792539 A CN105792539 A CN 105792539A
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- Prior art keywords
- mounting head
- conveyer belt
- lifting platform
- pcb board
- surface mounting
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- 239000002699 waste material Substances 0.000 claims abstract description 14
- 230000003028 elevating effect Effects 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 230000007423 decrease Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention belongs to the technical field of surface mounting, and provides a high-speed surface mounting machine, which comprises a parallel two-layer single-track working table, a nozzle replacement platform device, a waste material box, a trolley assembly, surface mounting heads, X positioning systems, Y positioning systems and a base, wherein the parallel two-layer single-track working table is transversely fixed in the middle of two longitudinal sides of the base and can convey PCBs to predetermined surface mounting positions in a staggered mode; the two Y positioning systems are fixed at two longitudinal sides of the base; the two X positioning systems are transversely arranged side by side on the two Y positioning systems in a sliding mode; the two surface mounting heads are arranged on X crossbeams of the two X positioning systems in a sliding mode respectively; and the trolley assembly is detachably fixed at two longitudinal sides of the base. The surface mounting heads can work without rest, and the production efficiency is improved; and the high-speed surface mounting machine has the advantages of high precision, high configuration, flexibility, modularization of the surface mounting heads, wide applicability and the like.
Description
Technical field
The invention belongs to surface mounting technology field, particularly relate to a kind of high speed placement system.
Background technology
At present, along with the big step of hyundai electronics components and parts develops to microminiaturized, integrated and high reliability direction, particularly in the face of the day by day fierce market competition, the production of electronic product and manufacture equipment just towards at a high speed, in high precision, intelligent, multi-functional etc. complete develop from changing direction.The assembling of electronics and IT products especially critical component printed panel needs to produce through attachment process.In recent years, along with the development of LED industry, new challenge was brought to the overall performance of LED chip mounter.
Chip mounter is one of key equipment in SMT (SurfaceMountedTechnology) industry, and its major function is exactly be placed with rapidly and accurately by integrated electronic component on pad corresponding on pcb board.In contemporary electronic industry, the key technical indexes weighing chip mounter performance is speed and precision.
But, the invalid action of existing chip mounter is big, particularly, the absorption path of electronic component is big, and meanwhile, the workbench of chip mounter requires time for when pcb board is changed, mounting head can not the work of Non-intermittent continuously, cause that the mechanical efficiency of chip mounter is low, and under this kind of condition, the requirement of mechanical hardware is higher, increase cost.
Summary of the invention
In view of there is above-mentioned technical problem in prior art, the present invention provides a kind of high speed placement system, and described chip mounter has double layer single rail workbench side by side, it is possible to continual pcb board is transported to mounting position；Also there is material-storing box structure, it is possible to be quickly transported near pcb board by electronic component, decrease the absorption path of suction nozzle.The technical solution used in the present invention is as described below:
The present invention provides a kind of high speed placement system, and described chip mounter includes, side by side double layer single rail workbench 1, replacing nozzle platform device 2, waste material box 3, go-cart assembly 4, mounting head 5, X alignment system 7, Y alignment system 8 and base 9.Wherein, the described workbench of double layer single rail side by side 1 is secured transverse to the centre of longitudinal both sides of base 9, and can alternately by mounting position predetermined for pcb board conveyer belt.Two Y alignment systems 8 are fixed on longitudinal both sides of base 9, two X alignment systems 7 are slidably arranged in two Y alignment systems 8 laterally side by side, said two mounting head 5 is slidably disposed on the X crossbeam 6 of two X alignment systems 7 respectively, and described alignment system 7 and 8 can control movement and the location of mounting head 5.Described go-cart assembly 4 is removably attached to longitudinal two ends of base 9, and electronic component can be transported to mounting head absorption position.Described replacing nozzle platform 2 and waste material box 3 are disposed side by side on side by side between double layer single rail workbench 1 and go-cart assembly 4.
Described go-cart assembly 4 includes material-storing box 10 and flies up to module 11, and described material-storing box 10 is positioned at the lower section flying up to module 11.The material-storing box 10 of described go-cart assembly 4 is used for storing material roller, it is provided with several wheel below, the described module 11 that flies up to is horizontally installed on above material-storing box 10 and flies up to module 11 is formed by several device parallel combinations that fly up to, its one end and material-storing box 10 structure are fixed together, the other end crosses out, and electronic component delivers to mounting head absorption position successively by flying up to module.
The described workbench of double layer single rail side by side 1, including the first lifting platform 101 and the second lifting platform 102, the first lifting platform 101 and the second lifting platform 102 all include support, the connecting gear that is arranged on support, is arranged at frame bottom and for controlling the elevating mechanism 103 of transfer structure lifting and 104 and clamp the clamp system 105 and 106 of pcb board to be mounted；Transfer structure includes upper strata conveyer belt, lower floor's conveyer belt.
Before chip mounter works, the first lifting platform 101 of double layer single rail workbench 1 and the second lifting platform 102 are in down position side by side, upper strata conveyer belt all with transmit pcb board enter plate conveyer belt and ejecting plate conveyer belt to it.X crossbeam 6 and mounting head 5 are all in initial position.Described go-cart assembly is arranged on predetermined position.
When chip mounter works, enter plate conveyer belt successively by incoming for multiple pcb boards to be mounted, when mounting first pcb board, enter plate conveyer belt and first pcb board is delivered to the upper strata conveyer belt of the first lifting platform 101, clamp system 105 clamps first pcb board, by the elevating mechanism 103 of the first lifting platform, upper strata conveyer belt being risen to mounting position, lower floor's conveyer belt of the first lifting platform 101 aligns with the upper strata conveyer belt of the second lifting platform 102 simultaneously.In this process, the mounting head 5 of the first lifting platform 101 side is under the control of X alignment system and Y alignment system, the mobile position to electronic component place to be mounted, namely the position that electronic component is sent to by go-cart assembly 4, and sucking up electronic components, then move the mounting position to first pcb board.When first pcb board is mounted by mounting head 5, second pcb board is sent to the upper strata conveyer belt of the second lifting platform 102 by lower floor's conveyer belt of the first lifting platform 101, clamp system 106 clamps second pcb board, elevating mechanism 104 drives upper strata conveyer belt to rise, meanwhile, lower floor's conveyer belt of the 102 of the second lifting platform and the first lifting platform 101 lower floor's conveyer belt, enter plate conveyer belt and ejecting plate conveyer belt aligns.In this process, the mounting head 5 of the second lifting platform 102 side is under the control of X alignment system and Y alignment system, the mobile position to electronic component place to be mounted, namely the position that electronic component is sent to by go-cart assembly 4, and sucking up electronic components, then move the mounting position to second pcb board.
When mounting second pcb board, after first pcb board completes paster, elevating mechanism 103 drives the upper strata conveyer belt of the first lifting platform 101 to decline, clamp system 105 unclamps, mounted first pcb board is sent by ejecting plate conveyer belt, the mounting head 5 of the first lifting platform 101 side carries out the suction process of next electronic component, and meanwhile, second pcb board is carried out paster by the mounting head 5 of the second lifting platform 102 side.Then, entering plate conveyer belt and mount on the upper strata conveyer belt being sent to the first lifting platform 101 by the 3rd pcb board, clamp system 105 clamps the 3rd pcb board, and elevating mechanism 103 drives upper strata conveyer belt to rise.After second pcb board completes paster, elevating mechanism 104 drives the upper strata conveyer belt of the second lifting platform 102 to decline, clamp system 106 unclamps, and mounted second pcb board is sent by ejecting plate conveyer belt, and the mounting head 5 of the second lifting platform 101 side carries out the suction process of next electronic component.So far chip mounter completes a cycle of operation.
After completing a cycle of operation, chip mounter will constantly repeat above-mentioned cycle of operation, thus realizing the work of mounting head Non-intermittent, improves production efficiency.
The present invention has double; two gantry system, and two X alignment systems 7 are oppositely arranged, and is separately installed with a mounting head 5.Two mounting heads 5 have the mounting position each determined respectively, and first PCB is in attachment in workbench, second pcb board be in workbench etc. to be mounted in.
In attachment process, electronic component is quickly delivered to fixing element absorption position by flying up to module 11, pcb board is delivered to fixing mounting position by what workbench interlocked, and mounting head 5 is under X alignment system and Y alignment system jointly control, movement rapidly and efficiently between, completes extracting elements and mount components two operation.This makes the attachment efficiency of chip mounter be substantially improved.Formed by several device parallel combinations that fly up to owing to flying up to module 11, and be fixed on above material-storing box, vibration will not be produced when chip mounter works, even if electronic component little again can also accurately be drawn.When attachment, pcb board maintains static so that component mounter will not produce skew.
The present invention can be orderly control X alignment system 7, Y alignment system 8 and mounting head 5, it is achieved two processes of suction and patch material.Allow mounting head 5 Non-intermittent work, and can use with other coordinative composition of equipments of chip mounter, improve production efficiency, it is achieved efficiently produce.
There is advantages that 1, pcb board is changed and is not needed the time, make mounting head 5 can Non-intermittent work, improve production efficiency；2, adopting the pay-off of cart structure, fly up to module friction, electronic component can be drawn fast and accurately；3, there is the advantages such as high accuracy, high configuration flexibility, mounting head modularity, the suitability be wide.
Accompanying drawing explanation
Fig. 1 is the high speed placement system axonometric chart in the embodiment of the present invention；
Fig. 2 is the high speed placement system top view (omitting a gantry structure) in the embodiment of the present invention；
Fig. 3 is the workbench axonometric chart of double layer single rail side by side of the high speed placement system in the embodiment of the present invention；
Fig. 4 is the workbench cut-away view of double layer single rail side by side of the high speed placement system in the embodiment of the present invention；
Fig. 5 is the gantry structure schematic diagram of the high speed placement system in the embodiment of the present invention；
Fig. 6 is the go-cart component diagram of the high speed placement system in the embodiment of the present invention.
Wherein, 1 is double layer single rail workbench side by side, and 2 for changing nozzle platform device, 3 be waste material box, 4 for go-cart assembly, 5 is mounting head, and 6 is X crossbeam, 7 is X alignment system, and 8 is Y alignment system, and 9 is base, 10 is material-storing box, 11 for flying up to module, and 101 is the first lifting platform, and 102 is the second lifting platform, 103,104 is elevating mechanism, and 105,106 is clamp system.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is described in further detail.Should be appreciated that specific embodiment described herein is used only for explaining the present invention, be not intended to limit the present invention.
Embodiment 1
As shown in Figure 1, Figure 2 with shown in Fig. 5, a kind of high speed placement system includes, side by side double layer single rail workbench 1, replacing nozzle platform device 2, waste material box 3, go-cart assembly 4, mounting head 5, X alignment system 7, Y alignment system 8 and base 9.Wherein, the described workbench of double layer single rail side by side 1 is secured transverse to the centre of longitudinal both sides of base 9.Two Y alignment systems 8 are fixed on longitudinal both sides of base 9, and two X alignment systems 7 are slidably arranged in two Y alignment systems 8 laterally side by side, and said two mounting head 5 is slidably disposed on the X crossbeam 6 of two X alignment systems 7 respectively.Described go-cart assembly 4 is removably attached to longitudinal two ends of base 9.Described replacing nozzle platform 2 and waste material box 3 are disposed side by side on side by side between double layer single rail workbench 1 and go-cart assembly 4.
The present invention has double; two gantry system, and two X alignment systems 7 are oppositely arranged, and is separately installed with a mounting head 5.Two mounting heads 5 have the mounting position each determined respectively, and first PCB is in attachment in workbench, second pcb board be in workbench etc. to be mounted in.
Described replacing nozzle platform device 2 is the platform having several multiple rows of suction nozzle storing position, wherein houses new suction nozzle in order in part suction nozzle storing position, and another part suction nozzle storing position is empty, for depositing old suction nozzle.Described replacing nozzle platform device 2 vertical lift under the control of motor, when chip mounter works, is in down position, and when suction nozzle changed by needs, described replacing nozzle platform device 2 rises under the driving of motor.
As shown in Figure 4 and Figure 5, the described workbench of double layer single rail side by side 1, including the first lifting platform 101 and the second lifting platform 102, the first lifting platform 101 and the second lifting platform 102 all include support, the connecting gear that is arranged on support, is arranged at frame bottom and for controlling the elevating mechanism 103 of transfer structure lifting and 104 and clamp the clamp system 105 and 106 of pcb board to be mounted；Transfer structure includes upper strata conveyer belt, lower floor's conveyer belt.
As shown in Figure 6, described go-cart assembly 4 includes material-storing box 10 and flies up to module 11, and described material-storing box 10 is positioned at the lower section flying up to module 11.The material-storing box 10 of described go-cart assembly 4 is used for storing material roller, it is provided with several wheel below, the described module 11 that flies up to is horizontally installed on above material-storing box 10 and flies up to module 11 is formed by several device parallel combinations that fly up to, its one end and material-storing box 10 structure are fixed together, the other end crosses out, and electronic component delivers to mounting head absorption position successively by flying up to module.
Before chip mounter works, the first lifting platform 101 of double layer single rail workbench 1 and the second lifting platform 102 are in down position side by side, upper strata conveyer belt all with transmit pcb board enter plate conveyer belt and ejecting plate conveyer belt to it.X crossbeam 6 and mounting head 5 are all in initial position.Described go-cart assembly is arranged on predetermined position.
When chip mounter works, enter plate conveyer belt successively by incoming for multiple pcb boards to be mounted, when mounting first pcb board, enter plate conveyer belt and first pcb board is delivered to the upper strata conveyer belt of the first lifting platform 101, clamp system 105 clamps first pcb board, by the elevating mechanism 103 of the first lifting platform, upper strata conveyer belt being risen to mounting position, lower floor's conveyer belt of the first lifting platform 101 aligns with the upper strata conveyer belt of the second lifting platform 102 simultaneously.In this process, the mounting head 5 of the first lifting platform 101 side is under the control of X alignment system and Y alignment system, the mobile position to electronic component place to be mounted, namely the position that electronic component is sent to by go-cart assembly 4, and sucking up electronic components, then move the mounting position to first pcb board.When first pcb board is mounted by mounting head 5, second pcb board is sent to the upper strata conveyer belt of the second lifting platform 102 by lower floor's conveyer belt of the first lifting platform 101, clamp system 106 clamps second pcb board, elevating mechanism 104 drives upper strata conveyer belt to rise, meanwhile, lower floor's conveyer belt of the 102 of the second lifting platform and the first lifting platform 101 lower floor's conveyer belt, enter plate conveyer belt and ejecting plate conveyer belt aligns.In this process, the mounting head 5 of the second lifting platform 102 side is under the control of X alignment system and Y alignment system, the mobile position to electronic component place to be mounted, namely the position that electronic component is sent to by go-cart assembly 4, and sucking up electronic components, then move the mounting position to second pcb board.
When mounting second pcb board, after first pcb board completes paster, elevating mechanism 103 drives the upper strata conveyer belt of the first lifting platform 101 to decline, clamp system 105 unclamps, mounted first pcb board is sent by ejecting plate conveyer belt, the mounting head 5 of the first lifting platform 101 side carries out the suction process of next electronic component, and meanwhile, second pcb board is carried out paster by the mounting head 5 of the second lifting platform 102 side.Then, entering plate conveyer belt and mount on the upper strata conveyer belt being sent to the first lifting platform 101 by the 3rd pcb board, clamp system 105 clamps the 3rd pcb board, and elevating mechanism 103 drives upper strata conveyer belt to rise.After second pcb board completes paster, elevating mechanism 104 drives the upper strata conveyer belt of the second lifting platform 102 to decline, clamp system 106 unclamps, and mounted second pcb board is sent by ejecting plate conveyer belt, and the mounting head 5 of the second lifting platform 101 side carries out the suction process of next electronic component.So far chip mounter completes a cycle of operation.
After completing a cycle of operation, chip mounter will constantly repeat above-mentioned cycle of operation, thus realizing the work of mounting head Non-intermittent, improves production efficiency.
Described mounting head 5 is vertical rotary type tower structure, can have several suction nozzle, for instance 12, promptly fixing with cylinder between suction nozzle and mounting head 5 main body of mounting head 5.After mounting head works long hours, it is necessary to when changing suction nozzle, mounting head 5 moves to the top changing 2 first empty suction nozzle storing positions of nozzle platform device, changes nozzle platform device 2 simultaneously and rises to reservation position under the driving of motor.Then first suction nozzle of mounting head 5 extend in first empty suction nozzle storing position, and under the effect of cylinder, first suction nozzle of mounting head 5 departs from and be positioned in first empty suction nozzle storing position.The top that mounting head 5 rotates and moves to second empty suction nozzle storing position, then second suction nozzle of mounting head 5 extend in second empty suction nozzle storing position, under the effect of cylinder, second suction nozzle of mounting head 5 departs from and is positioned in second empty suction nozzle storing position.So successively all suction nozzles are all positioned in suction nozzle storing position.Then, mounting head 5 moves to above first suction nozzle storing position housing new suction nozzle and stretches into, under the effect of cylinder, make new suction nozzle fix with mounting head 5 to be connected, mounting head 5 rotates and moves above the suction nozzle storing position housing new suction nozzle to second and stretch into, under the effect of cylinder, make new suction nozzle fix with mounting head 5 and be connected.It is connected all fixing with mounting head 5 for all new suction nozzles so successively.After suction nozzle replacing completes, mounting head 5 moves to reservation position, and starts to mount work.
When mounting head 5 is drawn to waste material, induction installation judges that, when it is waste material, mounting head 5 will be moved into above waste material box 3, and is unclamped by waste material, and waste material is lost in waste material box 3.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent replacement and improvement etc. made within the spirit and principles in the present invention, should be included within protection scope of the present invention.
Claims (4)
1. a high speed placement system, it is characterised in that described chip mounter includes, side by side double layer single rail workbench, replacing nozzle platform device, waste material box, go-cart assembly, mounting head, X alignment system, Y alignment system and base；Wherein, the described workbench of double layer single rail side by side is secured transverse to the centre of longitudinal both sides of base, and can alternately by mounting position predetermined for pcb board conveyer belt；Two Y alignment systems are fixed on longitudinal both sides of base, two X alignment systems are slidably arranged in two Y alignment systems laterally side by side, said two mounting head is slidably disposed on the X crossbeam of two X alignment systems respectively, described alignment system and can control movement and the location of mounting head；Described go-cart assembly is removably attached to longitudinal two ends of base, and electronic component can be transported to mounting head absorption position；Described replacing nozzle platform and waste material box are disposed side by side on side by side between double layer single rail workbench and go-cart assembly.
2. chip mounter according to claim 1, it is characterised in that described go-cart assembly includes material-storing box and flies up to module, and described material-storing box is positioned at the lower section flying up to module；The material-storing box of described go-cart assembly is used for storing material roller, it is provided with several wheel below, the described module that flies up to is horizontally installed on above material-storing box, fly up to module formed by several device parallel combinations that fly up to, its one end and material-storing box structure are fixed together, the other end crosses out, and electronic component delivers to mounting head absorption position successively by flying up to module.
3. chip mounter according to claim 1, it is characterized in that, the described workbench of double layer single rail side by side 1, including the first lifting platform 101 and the second lifting platform 102, the first lifting platform 101 and the second lifting platform 102 all include support, the connecting gear that is arranged on support, is arranged at frame bottom and for controlling the elevating mechanism 103 of transfer structure lifting and 104 and clamp the clamp system 105 and 106 of pcb board to be mounted；Transfer structure includes upper strata conveyer belt, lower floor's conveyer belt.
4. chip mounter according to claim 1, it is characterised in that have double; two gantry system, two X alignment systems are oppositely arranged, and are separately installed with a mounting head；Two mounting heads have the mounting position each determined respectively, and first PCB is in attachment in workbench, second pcb board be in workbench etc. to be mounted in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610173816.3A CN105792539B (en) | 2016-03-24 | 2016-03-24 | A kind of high speed placement system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610173816.3A CN105792539B (en) | 2016-03-24 | 2016-03-24 | A kind of high speed placement system |
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| CN105792539A true CN105792539A (en) | 2016-07-20 |
| CN105792539B CN105792539B (en) | 2018-05-15 |
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| CN201610173816.3A Active CN105792539B (en) | 2016-03-24 | 2016-03-24 | A kind of high speed placement system |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108323152A (en) * | 2018-01-24 | 2018-07-24 | 宁波禹泰自动化科技有限公司 | Point tin cream chip mounter |
| CN108323153A (en) * | 2018-02-07 | 2018-07-24 | 中山市鸿菊自动化设备制造有限公司 | A kind of attaching method of four module SMT chip mounters of double-station |
| CN108394710A (en) * | 2018-03-14 | 2018-08-14 | 吕家环 | A kind of mobile phone processing automatic chip mounting device |
| CN110446344A (en) * | 2019-04-25 | 2019-11-12 | 珠海奇川精密设备有限公司 | Point-to-point 3D mends material make-up machine |
| CN110519981A (en) * | 2019-08-23 | 2019-11-29 | 河南省酷美智能科技有限公司 | SMT mobile phone double parallel production line full-automatic paster device |
| CN110996548A (en) * | 2019-11-22 | 2020-04-10 | 深圳市易通自动化设备有限公司 | Intelligent bidirectional chip mounter |
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| CN114698366A (en) * | 2022-05-31 | 2022-07-01 | 广上科技(广州)有限公司 | Suction mounting equipment and method for electronic components |
| CN116588636A (en) * | 2023-07-13 | 2023-08-15 | 合肥安迅精密技术有限公司 | Single track multi-section type transmission control method and system and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323152A (en) * | 2018-01-24 | 2018-07-24 | 宁波禹泰自动化科技有限公司 | Point tin cream chip mounter |
| CN108323152B (en) * | 2018-01-24 | 2024-01-23 | 宁波禹泰自动化科技有限公司 | Point tin cream chip mounter |
| CN108323153A (en) * | 2018-02-07 | 2018-07-24 | 中山市鸿菊自动化设备制造有限公司 | A kind of attaching method of four module SMT chip mounters of double-station |
| CN108394710A (en) * | 2018-03-14 | 2018-08-14 | 吕家环 | A kind of mobile phone processing automatic chip mounting device |
| CN112262620A (en) * | 2018-06-13 | 2021-01-22 | 株式会社富士 | Substrate working machine |
| CN110446344A (en) * | 2019-04-25 | 2019-11-12 | 珠海奇川精密设备有限公司 | Point-to-point 3D mends material make-up machine |
| CN110519981A (en) * | 2019-08-23 | 2019-11-29 | 河南省酷美智能科技有限公司 | SMT mobile phone double parallel production line full-automatic paster device |
| CN110996548A (en) * | 2019-11-22 | 2020-04-10 | 深圳市易通自动化设备有限公司 | Intelligent bidirectional chip mounter |
| CN114698366A (en) * | 2022-05-31 | 2022-07-01 | 广上科技(广州)有限公司 | Suction mounting equipment and method for electronic components |
| CN116588636A (en) * | 2023-07-13 | 2023-08-15 | 合肥安迅精密技术有限公司 | Single track multi-section type transmission control method and system and storage medium |
| CN116588636B (en) * | 2023-07-13 | 2023-09-26 | 合肥安迅精密技术有限公司 | Single track multi-section type transmission control method and system and storage medium |
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|---|---|
| CN105792539B (en) | 2018-05-15 |
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