CN108323153A - A kind of attaching method of four module SMT chip mounters of double-station - Google Patents
A kind of attaching method of four module SMT chip mounters of double-station Download PDFInfo
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- CN108323153A CN108323153A CN201810121686.8A CN201810121686A CN108323153A CN 108323153 A CN108323153 A CN 108323153A CN 201810121686 A CN201810121686 A CN 201810121686A CN 108323153 A CN108323153 A CN 108323153A
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000012544 monitoring process Methods 0.000 claims abstract description 6
- 230000004913 activation Effects 0.000 claims abstract description 4
- 238000006243 chemical reaction Methods 0.000 claims description 29
- 230000008569 process Effects 0.000 claims description 18
- 230000001960 triggered effect Effects 0.000 claims description 15
- 230000009471 action Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 230000001887 anti-feedant effect Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000013507 mapping Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 102100031503 Barrier-to-autointegration factor-like protein Human genes 0.000 description 23
- 101000729827 Homo sapiens Barrier-to-autointegration factor-like protein Proteins 0.000 description 23
- 230000035611 feeding Effects 0.000 description 21
- 101000674742 Homo sapiens Transcription initiation factor TFIID subunit 5 Proteins 0.000 description 12
- 102100021230 Transcription initiation factor TFIID subunit 5 Human genes 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0495—Mounting of components, e.g. of leadless components having a plurality of work-stations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention relates to SMT mount technologies field, more particularly to a kind of attaching method of four module SMT chip mounters of double-station includes the following steps：Activation system starts attachment job command, and system is followed successively by disengaging pallet BA, disengaging pallet BB is executed for plate operation；System monitoring first mounts station or whether the second attachment station completes attachment operation；System continues to be followed successively by disengaging pallet BB execution for plate operation, attachment operation, ejecting plate operation, with this cycle operation, until system is out of service.The present invention has the beneficial effect that：The pcb board of the present invention is using single-entry single-out into ejecting plate mode；Present invention optimizes attachments to send plate flow, with feeding method carry out mapping device, can both improve the SMT patch production lines of automation, realize the efficient quick attachment of SMT chip mounters, and equipment volume and floor space can be reduced.
Description
Technical field
The present invention relates to SMT mount technologies field, more particularly to a kind of attaching method of four module SMT chip mounters of double-station.
Background technology
Existing SMT chip mounters mainly have following three kinds of structures：
The first structure is single mode group SMT chip mounters, as shown in Figure 1, the chip mounter is that single patch is arranged on a rack A1
Head A2 is filled, mounting head A2 is mounted in feeding region A3 feedings, in pasting area A4, that is, the attachment for using front feeding to mount below
Mode, this is simple in structure, but inefficiency.
Second of structure is bimodulus group SMT chip mounters, as shown in Fig. 2, the chip mounter is to be arranged two on a rack A1
It is a be mutually parallel, independently operated mounting head A2；One mounting head A2 is pasted in the first feeding region A3 feedings, in pasting area A4
Dress, that is, the mounting method for using front feeding to mount below；Another mounting head A2 in the second feeding region A3 feedings, mounting
Region A4 is mounted, i.e., using the mounting method that feeding front mounts below；Two mounting head A2 cross-pairs pcb boards carry out attachment work
Industry, compared with the first structure, which improves, but the volume of equipment and floor space are multiplied.
The third structure is four module SMT chip mounters, as shown in figure 3, the chip mounter includes two strip transmission line A5, along conveying
The direction of line A5 is arranged two bimodulus patch group framves, which includes rack A1, be fixed on rack A1 two
It is mutually parallel, independently operated mounting head A2, different conveyings is located at two mounting head A2 on double-mold patch group frame
The upper end of line A5.The attachment flow of each bimodulus patch group frame is similar to second of structure, but the attachment flow of complete machine is not
Together.The attachment flow of the equipment is mainly：Pcb board on pipeline A1 is introduced into the patch region A4 of the first bimodulus patch group frame
It is mounted, is mounted subsequently into the patch region A4 of the second bimodulus patch group frame；Into plate and go out per strip transmission line A5
Plate is all independent, and is typically by the way of going with each other all the time.The equipment is compared with two kinds of front, it more efficient, but
What is gone with each other all the time is complicated into ejecting plate mode, so volume also bigger.
Therefore, SMT chip mounter production efficiencys how are improved, how to optimize attachment and send plate flow to reduce equipment volume and account for
The problems such as ground area, has become the hot spot studied in industry.
Invention content
In view of the defects and deficiencies of the prior art, the present invention intends to provide one kind can automatically for plate, be conducive to
Improve the attaching method of the four module SMT chip mounters of double-station of attachment efficiency, reduction equipment volume and floor space.
To achieve the above object, the technical solution adopted by the present invention is：
A kind of attaching method of four module SMT chip mounters of double-station of the present invention, includes the following steps：
A, activation system, all disengaging pallets and mounting head revert to initial position, and mounting coordinates volume is carried out to the pcb board of production
Journey is set；
B, start attachment job command, disengaging pallet BA is moved to pcb board conversion station E and waits for into plate；
C, system is that disengaging pallet BA is executed for plate operation；
D, after system detectio enters disengaging pallet BA to pcb board, disengaging pallet BA, which is moved on the first attachment station, executes attachment
Operation；
E, while the first attachment station starts to mount operation, disengaging pallet BB is moved to pcb board conversion station E and waits for into plate；
F, system is that disengaging pallet BB is executed for plate operation；
G, after system detectio enters disengaging pallet BB to pcb board, disengaging pallet BB, which is moved on the second attachment station, executes attachment
Operation；
H, system monitoring first mounts station or whether the second attachment station completes attachment operation；
If executing following steps after the completion of the attachment operation on h1, the first attachment station：
H11, disengaging pallet BA are moved to pcb board conversion station E and execute ejecting plate operation；
H12, system continue to be followed successively by disengaging pallet BA and execute for plate operation, attachment operation, ejecting plate operation, with this cycle operation,
Until system is out of service；
If executing following steps after the completion of the attachment operation on h2, the second attachment station：
H21, disengaging pallet BB are moved to pcb board conversion station E and execute ejecting plate operation；
H22, system continue to be followed successively by disengaging pallet BB and execute for plate operation, attachment operation, ejecting plate operation, with this cycle operation,
Until system is out of service.
Further, described to include the following steps for plate operation：
Gb1, system are disengaging pallet BA or disengaging pallet BB sends out to disengaging pallet A and wants partitioned signal；
Whether there is pcb board on gb2, system detectio disengaging pallet A,
If having pcb board on disengaging pallet A and signal being fed back to system；
If passing in and out no pcb board on pallet A and signal being fed back to system；Then just the equipment of process sends out and wants system forward
Partitioned signal, the equipment of preceding process is connected to want partitioned signal after execute into plate operation；
Pcb board is conveyed to disengaging pallet BA or disengaging pallet BB by gb3, disengaging pallet A.
Further, the both sides of the first attachment station are respectively arranged with mounting head TA and mounting head TB；Described second
The both sides of attachment station are respectively arranged with mounting head TA and mounting head TB；
The attachment operation includes the following steps：
Pcb board on tg1, TA pairs first attachment station of mounting head or the second attachment station mounts, until mounting head TA is complete
At attachment；
Pcb board on tg2, TB pairs first attachment station of mounting head or the second attachment station mounts, until mounting head TB is complete
At attachment；
Whether tg3, mounting head TA and mounting head TB continue alternately operating,
If mounting head TA and mounting head TB continue alternately operating and signal fed back to system, system is repeated in execution step
The action of tg1 and step tg2；
If mounting head TA and mounting head TB feed back to system without alternately operating and by signal；
Whether the pcb board on tg4, the first attachment station or the second attachment station completes attachment operation,
If the pcb board on the first attachment station or the second attachment station completes attachment operation and signal is fed back to system；
If the pcb board on the first attachment station or the second attachment station does not complete attachment operation and signal is fed back to system；
The pcb board that system control mounting head TA or mounting head TB continues as the first and second attachment station is mounted, until attachment operation is complete
System is fed back at and by signal.
Further, the ejecting plate operation includes the following steps：
Whether there is disengaging pallet on cb1, system detectio pcb board conversion station E；
If having disengaging pallet on pcb board conversion station E and signal being fed back to system；Pass in and out pallet BA or disengaging pallet BB just
It is waited on attachment station；
If without disengaging pallet and signal is fed back to system on pcb board conversion station E；
Cb2, disengaging pallet BA or disengaging pallet BB are moved on pcb board conversion station E；
Whether there is pcb board on cb3, system detectio disengaging pallet C,
If having pcb board on disengaging pallet C and signal being fed back to system, passes in and out pallet BA or disengaging pallet BB just turns in pcb board
It changes on station E and waits for；
If passing in and out no pcb board on pallet C and signal being fed back to system；
Cb4, disengaging pallet BA or disengaging pallet BB convey pcb board toward disengaging pallet C.
Further, the one end the disengaging pallet A is provided with first sensor, and the disengaging pallet A other ends are provided with second
Sensor；It is provided with 3rd sensor on the disengaging pallet BA, the 4th sensor is provided on the disengaging pallet BB, passes in and out
The 5th sensor is provided on pallet C.
Further, described to include the following steps into plate operation：The equipment of preceding process conveys pcb board to disengaging pallet A,
Pcb board is triggered to first sensor after entering disengaging pallet A and signal is fed back to system, and system starts the defeated of disengaging pallet A
Belt is sent to run, pcb board is in the conveying direction movement for passing in and out the belt conveyor of pallet A or pcb board to be conveyed is waited to leave into ejecting plate
Platform A.
Further, step gb3 is specially：
Pcb board is conveyed to disengaging pallet BA and included the following steps by disengaging pallet A：When pcb board is triggered to second sensor, the
Two sensors output signal to system, and the belt conveyor of system control disengaging pallet BA starts feeding, and pcb board is by passing in and out pallet
The belt conveyor of A is sent on the belt conveyor of disengaging pallet BA, and pcb board continues on defeated on the belt conveyor of disengaging pallet BA
Direction is sent to move；When pcb board is triggered to 3rd sensor, 3rd sensor outputs signal to system, and system is controlled into ejecting plate
The belt conveyor of platform BA stops feeding, and pcb board is parked on the belt conveyor of disengaging pallet BA；
Pcb board is conveyed to disengaging pallet BB and included the following steps by disengaging pallet A：When pcb board is triggered to second sensor, the
Two sensors output signal to system, and the belt conveyor of system control disengaging pallet BB starts feeding, and pcb board is by passing in and out pallet
The belt conveyor of A is sent on the belt conveyor of disengaging pallet BB, and pcb board continues on defeated on the belt conveyor of disengaging pallet BB
Direction is sent to move；When pcb board is triggered to four sensors, the 4th sensor outputs signal to system, and system is controlled into ejecting plate
The belt conveyor of platform BB stops feeding, and pcb board is parked on the belt conveyor of disengaging pallet BB.
Further, step gb2 is specially：Whether there is pcb board on first sensor detection disengaging pallet A,
If first sensor, which detects, to be had pcb board on disengaging pallet A and signal is fed back to system；
If first sensor detects no pcb board on disengaging pallet A and signal is fed back to system；Then system is just forward
The equipment of process, which is sent out, wants partitioned signal, the equipment of preceding process is connected to want partitioned signal after execute into plate operation.
The pcb board of the present invention is using single-entry single-out into ejecting plate mode；The both sides setting first of pcb board conversion station E
Station and the second attachment station are mounted, disengaging pallet BA is that the pcb board that the first attachment station supply does not mount and output have mounted
Pcb board, disengaging pallet BB is the pcb board that the second attachment station supply does not mount and the pcb board that output has mounted；Into ejecting plate
Platform BA and disengaging pallet BB periods that are staggered respectively take the pcb board not mounted to disengaging pallet A, disengaging pallet BA and disengaging pallet BB
Period that is staggered respectively conveys the pcb board that has mounted to disengaging pallet C；Therefore, present invention optimizes attachments to send plate flow, utilization
Feeding method carrys out mapping device, can both improve the SMT patch production lines of automation, realizes the efficient quick of SMT chip mounters
Attachment, and equipment volume and floor space can be reduced.
Description of the drawings
Fig. 1 is the schematic diagram of single mode group SMT chip mounters in the prior art；
Fig. 2 is the schematic diagram of bimodulus group SMT chip mounters in the prior art；
Fig. 3 is the schematic diagram of four modules SMT chip mounters in the prior art；
Fig. 4 is the schematic diagram of the present invention；
Fig. 5 is the flow chart of the present invention；
Fig. 6 is the present invention for plate operation process chart；
Fig. 7 is the attachment operation process chart of the present invention；
Fig. 8 is the ejecting plate operation process chart of the present invention.
A1, rack；A2, mounting head；A3, feeding region；A4, pasting area；A5, pipeline；
F1, disengaging pallet A；F2, disengaging pallet BA；F3, disengaging pallet BB；F4, disengaging pallet C；
F5, mounting head TA；F6, mounting head TB；
F7, the first attachment station；F8, the second attachment station；F9, pcb board conversion station E.
Specific implementation mode
The present invention will be further described below with reference to the drawings.
As shown in Fig. 4 to Fig. 8, a kind of attaching method of four module SMT chip mounters of double-station of the present invention, including with
Lower step：
A, activation system, all disengaging pallets and mounting head revert to initial position, and mounting coordinates volume is carried out to the pcb board of production
Journey is set；
B, start attachment job command, disengaging pallet BAF2 is moved to pcb board conversion station EF9 and waits for into plate；
C, system is that disengaging pallet BAF2 is executed for plate operation；
D, after system detectio enters disengaging pallet BAF2 to pcb board, disengaging pallet BAF2, which is moved on the first attachment station F7, to be held
Row attachment operation；Judgement just is executed by step h for the job scheduling monitoring on the first attachment station F7；
E, while the first attachment station F7 starts to mount operation, disengaging pallet BBF3 is moved to pcb board conversion station EF9 and waits for
Into plate；It should be noted that：It is moved to the moment of the first attachment station F7, disengaging pallet BBF3 in disengaging pallet BAF2
It is moved into pcb board conversion station EF9, is easy to implement seamless alternately operating；
F, system is that disengaging pallet BBF3 is executed for plate operation；
G, after system detectio enters disengaging pallet BBF3 to pcb board, disengaging pallet BBF3, which is moved on the second attachment station F8, to be held
Row attachment operation；Judgement just is executed by step h for the job scheduling monitoring on the second attachment station F8；
H, system monitoring first mounts whether the attachments of station F7 or second station F8 completes attachment operation；
If executing following steps after the completion of the attachment operation on h1, the first attachment station F7：
H11, disengaging pallet BAF2 are moved to pcb board conversion station EF9 and execute ejecting plate operation；
H12, system continue to be followed successively by disengaging pallet BAF2 execution for plate operation, attachment operation, ejecting plate operation, with this circulation industrial
Make, until system is out of service；
If executing following steps after the completion of the attachment operation on h2, the second attachment station F8：
H21, disengaging pallet BBF3 are moved to pcb board conversion station EF9 and execute ejecting plate operation；
H22, system continue to be followed successively by disengaging pallet BBF3 execution for plate operation, attachment operation, ejecting plate operation, with this circulation industrial
Make, until system is out of service.
By being arranged on SMT chip mounters there are two mounting station to carry out alternately mounting operation, by being alternately two works
Position for plate operation, by alternately carrying out ejecting plate operation for two attachment stations, be easy to implement two stations and simultaneously, alternately paste
Dress；This system is defaulted as the first attachment station F7 and first supplies pcb board to be mounted after starting, and waits for that the first attachment station F7 attachments are opened
It is that the second attachment station F8 supply pcb boards are mounted again when the beginning.
It is described to include the following steps for plate operation as a kind of preferred embodiment of the present invention：
Gb1, system are disengaging pallet BAF2 or disengaging pallet BBF3 sends out to disengaging pallet AF1 and wants partitioned signal；
Whether there is pcb board on gb2, system detectio disengaging pallet AF1,
If having pcb board on disengaging pallet AF1 and signal being fed back to system, hereafter system is just automatic executes step gb3；
If passing in and out no pcb board on pallet AF1 and signal being fed back to system；Then just the equipment of process is sent out system forward
Want partitioned signal, the equipment of preceding process is connected to want partitioned signal after execute into plate operation, hereafter system is just automatic executes step gb3；
Pcb board is conveyed to disengaging pallet BAF2 or disengaging pallet BBF3 by gb3, disengaging pallet AF1.
For plate operation mainly to disengaging pallet BAF2 or disengaging pallet BBF3 for plate；If not stored up on disengaging pallet AF1
Pcb board is deposited, then being carried out into plate operation, pallet AF1 is as passed in and out into plate, there can be pcb board to ensure to pass in and out pallet AF1
To being fed into out pallet BAF2 or disengaging pallet BBF3.
As a kind of preferred embodiment of the present invention, the both sides of the first attachment station F7 are respectively arranged with mounting head
TAF5 and mounting head TBF6；The both sides of the second attachment station F8 are respectively arranged with mounting head TAF5 and mounting head TBF6；
The attachment operation includes the following steps：
Pcb board on tg1, TAF5 couples first attachment station F7 of mounting head or the second attachment station F8 mounts, until attachment
Head TAF5 completes attachment；
Pcb board on tg2, TBF6 couples first attachment station F7 of mounting head or the second attachment station F8 mounts, until attachment
Head TBF6 completes attachment；
Whether tg3, mounting head TAF5 and mounting head TBF6 continue alternately operating,
If mounting head TAF5 and mounting head TBF6 continue alternately operating and signal fed back to system, system is repeated in execution
The action of step tg1 and step tg2；
If mounting head TAF5 and mounting head TBF6 feed back to system without alternately operating and by signal；
Tg4, the first attachment station F7 or second mount whether the pcb board on station F8 completes attachment operation,
If the pcb board on the first attachment station F7 or the second attachment station F8 completes attachment operation and signal is fed back to system；
If the pcb board on the first attachment station F7 or the second attachment station F8 does not complete attachment operation and feeds back to signal
System；The pcb board that system control mounting head TAF5 or mounting head TBF6 continues as first and second attachment station F7, F8 is mounted,
Until attachment operation is completed and signal is fed back to system.
By the way that mounting head TAF5 and mounting head TBF6 is arranged on same attachment station, using double mounting heads, alternately attachment is made
Industry greatlys improve attachment efficiency.
Step tg3 is selective step：First way is that mounting head TAF5 and mounting head TBF6 continue alternately operating, is
System can repeat the action of step tg1 and step tg2 automatically；The second way is without alternately operating, and system automatically can be then
Execute step tg4.
Step tg4 is selective step：First way is that attachment operation is completed on attachment station, and system can execute automatically
Mount post-job step；The second way is not complete attachment operation and do not continue to use mounting head TAF5 and mounting head TBF6
Alternately operating, but mounting head TAF5 or mounting head TBF6 is arbitrarily selected to carry out individually attachment operation to attachment station by system,
Until individually attachment operation is completed just to complete entire attachment operation, hereafter system can execute the post-job step of attachment automatically.
As a kind of preferred embodiment of the present invention, the ejecting plate operation includes the following steps：
Whether there is disengaging pallet on cb1, system detectio pcb board conversion station EF9, disengaging pallet herein refers to disengaging pallet
BAF2 or disengaging pallet BBF3；
If having disengaging pallet on pcb board conversion station EF9 and signal being fed back to system；Pass in and out pallet BAF2 or disengaging pallet
BBF3 is just waited on attachment station；Attachment station herein refers to the attachment stations of the first attachment station F7 or second F8；
If feeding back to system without disengaging pallet on pcb board conversion station EF9 and by signal, system carries out in next step；
Cb2, disengaging pallet BAF2 or disengaging pallet BBF3 are moved on pcb board conversion station EF9；
Whether there is pcb board on cb3, system detectio disengaging pallet CF4,
If having pcb board on disengaging pallet CF4 and signal being fed back to system, passes in and out pallet BAF2 or disengaging pallet BBF3 just exists
It is waited on pcb board conversion station EF9；
If passing in and out no pcb board on pallet CF4 and signal being fed back to system, system carries out in next step；
Cb4, disengaging pallet BAF2 or disengaging pallet BBF3 convey pcb board toward disengaging pallet CF4.
As a kind of preferred embodiment of the present invention, the one end the disengaging pallet AF1 is provided with first sensor, passes in and out pallet
The AF1 other ends are provided with second sensor；3rd sensor, the disengaging pallet BBF3 are provided on the disengaging pallet BAF2
On be provided with the 4th sensor, be provided with the 5th sensor on disengaging pallet CF4.
It is described to include the following steps into plate operation as a kind of preferred embodiment of the present invention：The equipment of preceding process is to disengaging
Pallet AF1 conveys pcb board, and pcb board is triggered to first sensor after entering disengaging pallet AF1 and signal is fed back to system, is
System starts the belt conveyor operation of disengaging pallet AF1, pcb board the conveying direction of the belt conveyor of disengaging pallet AF1 it is mobile or
Disengaging pallet AF1 is left etc. pcb board to be conveyed.
As a kind of preferred embodiment of the present invention, step gb3 is specially：
Pcb board is conveyed to disengaging pallet BAF2 and included the following steps by disengaging pallet AF1：When pcb board is triggered to second sensor
When, second sensor outputs signal to system, and the belt conveyor of system control disengaging pallet BAF2 starts feeding, and pcb board passes through
The belt conveyor of disengaging pallet AF1 is sent on the belt conveyor of disengaging pallet BAF2, conveying skin of the pcb board in disengaging pallet BAF2
It takes and continues on conveying direction movement；When pcb board is triggered to 3rd sensor, 3rd sensor outputs signal to system,
The belt conveyor of system control disengaging pallet BAF2 stops feeding, and pcb board is parked on the belt conveyor of disengaging pallet BAF2；
Pcb board is conveyed to disengaging pallet BBF3 and included the following steps by disengaging pallet AF1：When pcb board is triggered to second sensor
When, second sensor outputs signal to system, and the belt conveyor of system control disengaging pallet BBF3 starts feeding, and pcb board passes through
The belt conveyor of disengaging pallet AF1 is sent on the belt conveyor of disengaging pallet BBF3, conveying skin of the pcb board in disengaging pallet BBF3
It takes and continues on conveying direction movement；When pcb board is triggered to four sensors, the 4th sensor outputs signal to system,
The belt conveyor of system control disengaging pallet BBF3 stops feeding, and pcb board is parked on the belt conveyor of disengaging pallet BBF3.
As a kind of preferred embodiment of the present invention, step gb2 is specially：It is on first sensor detection disengaging pallet AF1
It is no to have pcb board,
If first sensor, which detects, to be had pcb board on disengaging pallet AF1 and signal is fed back to system；
If first sensor detects no pcb board on disengaging pallet AF1 and signal is fed back to system；Then system just to
The equipment of preceding process, which is sent out, wants partitioned signal, the equipment of preceding process is connected to want partitioned signal after execute into plate operation.
The present invention has the beneficial effect that：The pcb board of the present invention is using single-entry single-out into ejecting plate mode；Pcb board converts work
The the first attachment station of both sides setting and the second attachment station of position E, disengaging pallet BA are that the first attachment station supply does not mount
The pcb board that pcb board and output have mounted, disengaging pallet BB are that the pcb board that the second attachment station supply does not mount and output have been pasted
The pcb board of dress；Disengaging pallet BA and disengaging pallet BB be staggered respectively the period to disengaging pallet A take the pcb board not mounted, pass in and out
Pallet BA and disengaging pallet BB periods that are staggered respectively convey the pcb board that has mounted to disengaging pallet C；Therefore, present invention optimizes
Attachment send plate flow, with feeding method carry out mapping device, can both improve the SMT patch production lines of automation, realize
The efficient quick attachment of SMT chip mounters, and equipment volume and floor space can be reduced.
The above is only the better embodiment of the present invention, therefore all constructions according to described in present patent application range,
The equivalent change or modification that feature and principle are done, is included within the scope of present patent application.
Claims (8)
1. a kind of attaching method of four module SMT chip mounters of double-station, it is characterised in that：Include the following steps：
A, activation system, all disengaging pallets and mounting head revert to initial position, and mounting coordinates volume is carried out to the pcb board of production
Journey is set；
B, start attachment job command, disengaging pallet BA（F2）It is moved to pcb board conversion station E（F9）It waits for into plate；
C, system is disengaging pallet BA（F2）It executes for plate operation；
D, system detectio enters disengaging pallet BA to pcb board（F2）Afterwards, disengaging pallet BA（F2）It is moved to the first attachment station
（F7）Upper execution mounts operation；
E, the first attachment station（F7）While starting to mount operation, pallet BB is passed in and out（F3）It is moved to pcb board conversion station E
（F9）It waits for into plate；
F, system is disengaging pallet BB（F3）It executes for plate operation；
G, system detectio enters disengaging pallet BB to pcb board（F3）Afterwards, disengaging pallet BB（F3）It is moved to the second attachment station
（F8）Upper execution mounts operation；
H, system monitoring first mounts station（F7）Or second attachment station（F8）Whether completion mounts operation；
If h1, the first attachment station（F7）On attachment operation after the completion of execute following steps：
H11, disengaging pallet BA（F2）It is moved to pcb board conversion station E（F9）Execute ejecting plate operation；
H12, system continue to be followed successively by disengaging pallet BA（F2）It executes for plate operation, attachment operation, ejecting plate operation, with this circulation industrial
Make, until system is out of service；
If h2, the second attachment station（F8）On attachment operation after the completion of execute following steps：
H21, disengaging pallet BB（F3）It is moved to pcb board conversion station E（F9）Execute ejecting plate operation；
H22, system continue to be followed successively by disengaging pallet BB（F3）It executes for plate operation, attachment operation, ejecting plate operation, with this circulation industrial
Make, until system is out of service.
2. a kind of attaching method of four module SMT chip mounters of double-station according to claim 1, it is characterised in that：It is described
Include the following steps for plate operation：
Gb1, system are disengaging pallet BA（F2）Or disengaging pallet BB（F3）To disengaging pallet A（F1）It sends out and wants partitioned signal；
Gb2, system detectio disengaging pallet A（F1）On whether have pcb board,
If passing in and out pallet A（F1）On have pcb board and signal fed back into system；
If passing in and out pallet A（F1）Signal is simultaneously fed back to system by upper no pcb board；Then system just send out forward by the equipment of process
Go out to want partitioned signal, the equipment of preceding process is connected to want partitioned signal after execute into plate operation；
Gb3, disengaging pallet A（F1）Pcb board is conveyed to disengaging pallet BA（F2）Or disengaging pallet BB（F3）.
3. a kind of attaching method of four module SMT chip mounters of double-station according to claim 1, it is characterised in that：It is described
First attachment station（F7）Both sides be respectively arranged with mounting head TA（F5）With mounting head TB（F6）；The second attachment station
（F8）Both sides be respectively arranged with mounting head TA（F5）With mounting head TB（F6）；
The attachment operation includes the following steps：
Tg1, mounting head TA（F5）To the first attachment station（F7）Or second attachment station（F8）On pcb board mounted, directly
To mounting head TA（F5）Complete attachment；
Tg2, mounting head TB（F6）To the first attachment station（F7）Or second attachment station（F8）On pcb board mounted, directly
To mounting head TB（F6）Complete attachment；
Tg3, mounting head TA（F5）With mounting head TB（F6）Whether alternately operating is continued,
If mounting head TA（F5）With mounting head TB（F6）Continue alternately operating and signal is fed back into system, system is repeated in
Execute the action of step tg1 and step tg2；
If mounting head TA（F5）With mounting head TB（F6）System is fed back to without alternately operating and by signal；
Tg4, the first attachment station（F7）Or second attachment station（F8）On pcb board whether complete attachment operation,
If the first attachment station（F7）Or second attachment station（F8）On pcb board complete attachment and operation and feed back to signal
System；
If the first attachment station（F7）Or second attachment station（F8）On pcb board do not complete attachment operation and signal is anti-
Feeding system；System controls mounting head TA（F5）Or mounting head TB（F6）Continue as the first and second attachment station（F7、F8）PCB
Plate is mounted, until attachment operation is completed and signal is fed back to system.
4. a kind of attaching method of four module SMT chip mounters of double-station according to claim 1, it is characterised in that：It is described
Ejecting plate operation includes the following steps：
Cb1, system detectio pcb board conversion station E（F9）On whether have disengaging pallet；
If pcb board conversion station E（F9）On there is disengaging pallet and signal to be fed back to system；Pass in and out pallet BA（F2）Or disengaging
Pallet BB（F3）Just waited on attachment station；
If pcb board conversion station E（F9）Signal is simultaneously fed back to system by upper no disengaging pallet；
Cb2, disengaging pallet BA（F2）Or disengaging pallet BB（F3）It is moved to pcb board conversion station E（F9）On；
Cb3, system detectio disengaging pallet C（F4）On whether have pcb board,
If passing in and out pallet C（F4）On have pcb board and signal fed back into system, disengaging pallet BA（F2）Or disengaging pallet BB
（F3）Just in pcb board conversion station E（F9）Upper waiting；
If passing in and out pallet C（F4）Signal is simultaneously fed back to system by upper no pcb board；
Cb4, disengaging pallet BA（F2）Or disengaging pallet BB（F3）Toward disengaging pallet C（F4）Convey pcb board.
5. a kind of attaching method of four module SMT chip mounters of double-station according to claim 1, it is characterised in that：It is described
Pass in and out pallet A（F1）One end is provided with first sensor, disengaging pallet A（F1）The other end is provided with second sensor；It is described into
Go out pallet BA（F2）On be provided with 3rd sensor, the disengaging pallet BB（F3）On be provided with the 4th sensor, disengaging pallet C
（F4）On be provided with the 5th sensor.
6. according to a kind of attaching method of any four module SMT chip mounters of double-station of claim 2 or 5, feature exists
In：
It is described to include the following steps into plate operation：The equipment of preceding process to disengaging pallet A（F1）Convey pcb board, pcb board enter into
Go out pallet A（F1）After be triggered to first sensor and signal fed back into system, system starts disengaging pallet A（F1）Conveying
Belt is run, and pcb board is in disengaging pallet A（F1）Belt conveyor conveying direction it is mobile or pcb board to be conveyed is waited to leave disengaging
Pallet A（F1）.
7. according to a kind of attaching method of any four module SMT chip mounters of double-station of claim 2 or 5, feature exists
In：Step gb3 is specially：
Pass in and out pallet A（F1）Pcb board is conveyed to disengaging pallet BA（F2）Include the following steps：When pcb board is triggered to the second biography
When sensor, second sensor outputs signal to system, system control disengaging pallet BA（F2）Belt conveyor start feeding, PCB
Plate is by passing in and out pallet A（F1）Belt conveyor be sent to disengaging pallet BA（F2）Belt conveyor on, pcb board disengaging pallet BA
（F2）Belt conveyor on continue on conveying direction movement；When pcb board is triggered to 3rd sensor, 3rd sensor output
Signal is to system, system control disengaging pallet BA（F2）Belt conveyor stop feeding, pcb board is parked in disengaging pallet BA（F2）
Belt conveyor on；
Pass in and out pallet A（F1）Pcb board is conveyed to disengaging pallet BB（F3）Include the following steps：When pcb board is triggered to the second biography
When sensor, second sensor outputs signal to system, system control disengaging pallet BB（F3）Belt conveyor start feeding, PCB
Plate is by passing in and out pallet A（F1）Belt conveyor be sent to disengaging pallet BB（F3）Belt conveyor on, pcb board disengaging pallet BB
（F3）Belt conveyor on continue on conveying direction movement；When pcb board is triggered to four sensors, the output of the 4th sensor
Signal is to system, system control disengaging pallet BB（F3）Belt conveyor stop feeding, pcb board is parked in disengaging pallet BB（F3）
Belt conveyor on.
8. according to a kind of attaching method of any four module SMT chip mounters of double-station of claim 2 or 5, feature exists
In：Step gb2 is specially：First sensor detection disengaging pallet A（F1）On whether have pcb board,
If first sensor detects disengaging pallet A（F1）On have pcb board and signal fed back into system；
If first sensor detects disengaging pallet A（F1）Signal is simultaneously fed back to system by upper no pcb board；Then system is just
The equipment of process, which is sent out, forward wants partitioned signal, the equipment of preceding process is connected to want partitioned signal after execute into plate operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810121686.8A CN108323153A (en) | 2018-02-07 | 2018-02-07 | A kind of attaching method of four module SMT chip mounters of double-station |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810121686.8A CN108323153A (en) | 2018-02-07 | 2018-02-07 | A kind of attaching method of four module SMT chip mounters of double-station |
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| CN108323153A true CN108323153A (en) | 2018-07-24 |
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ID=62903132
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810121686.8A Pending CN108323153A (en) | 2018-02-07 | 2018-02-07 | A kind of attaching method of four module SMT chip mounters of double-station |
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Cited By (1)
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Effective date of registration: 20220923 Address after: 323000 No.1 shanha Road, nanmingshan street, Liandu District, Lishui City, Zhejiang Province (Lijing National Industrial Park) Applicant after: Zhejiang Huaqi Zhengbang Automation Technology Co.,Ltd. Address before: 528415 1-2 / F, building B, 30 Jucheng Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Applicant before: ZHONGSHAN HONGJU AUTOMATION EQUIPMENT MANUFACTURING Co.,Ltd. |
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Application publication date: 20180724 |